JP4855403B2 - 中空部を含む粘着シートおよびこれらの製造方法 - Google Patents
中空部を含む粘着シートおよびこれらの製造方法 Download PDFInfo
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- JP4855403B2 JP4855403B2 JP2007527006A JP2007527006A JP4855403B2 JP 4855403 B2 JP4855403 B2 JP 4855403B2 JP 2007527006 A JP2007527006 A JP 2007527006A JP 2007527006 A JP2007527006 A JP 2007527006A JP 4855403 B2 JP4855403 B2 JP 4855403B2
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- Prior art keywords
- adhesive sheet
- pressure
- sensitive adhesive
- electronic component
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000001070 adhesive effect Effects 0.000 title claims description 56
- 239000000853 adhesive Substances 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 32
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 96
- 229920000642 polymer Polymers 0.000 claims description 54
- 229920000058 polyacrylate Polymers 0.000 claims description 32
- 239000000203 mixture Substances 0.000 claims description 27
- 239000000178 monomer Substances 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 19
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- 239000010409 thin film Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
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- 238000000576 coating method Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 4
- 150000004692 metal hydroxides Chemical class 0.000 claims description 4
- 239000006188 syrup Substances 0.000 claims description 4
- 235000020357 syrup Nutrition 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
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- 239000010935 stainless steel Substances 0.000 claims description 3
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- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
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- 150000001247 metal acetylides Chemical class 0.000 claims 1
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- -1 diazonium salt compound Chemical class 0.000 description 8
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
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- 239000000126 substance Substances 0.000 description 3
- OMQMPWLBYLSPIA-UHFFFAOYSA-N 2-hydroxy-2-methoxy-1-phenylethanone Chemical compound COC(O)C(=O)C1=CC=CC=C1 OMQMPWLBYLSPIA-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
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- 239000005020 polyethylene terephthalate Substances 0.000 description 2
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- NKYRAXWYDRHWOG-UHFFFAOYSA-N 12-hydroxydodecyl prop-2-enoate Chemical compound OCCCCCCCCCCCCOC(=O)C=C NKYRAXWYDRHWOG-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JUVLPJNXBKOSFH-UHFFFAOYSA-N 2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C1=CC(C(=O)C(N(C)C)CC)=CC=C1N1CCOCC1 JUVLPJNXBKOSFH-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 238000007718 adhesive strength test Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- 150000001875 compounds Chemical class 0.000 description 1
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- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
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- 229920006267 polyester film Polymers 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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Description
硬化したアクリル系高分子と、
硬化したアクリル系高分子中に分散している破裂した高分子微小中空球と、
前記高分子微小中空球が硬化したアクリル系高分子中に分散した状態で破裂することにより形成された中空部とを含む粘着シートを提供する。
a)アクリル系高分子および高分子微小中空球を混合して、アクリル系高分子中に高分子微小中空球を分散させるステップと、
b)前記a)ステップで得た組成物を基材の一面または両面上にコーティングするステップと、
c)前記b)ステップで得た基材上にコーティングされた組成物を硬化させるステップと、
d)前記c)ステップで得た硬化した組成物内に分散している高分子微小中空球を破裂させるステップと、
を含む粘着シートの製造方法を提供する。
本発明では、中空部を含む粘着シートをさらに柔軟に製造するために、アクリル系高分子に高分子微小中空球を分散して硬化させた後、高分子微小中空球を人為的に破裂させることを特徴とする。このように硬化したアクリル系高分子中に分散している高分子微小中空球が破裂する場合、微小中空球内に存在したガスは粘着シートの表面に移動して除去され、すでに硬化していたアクリル系高分子には前記微小中空球が占めていた部分に中空部が形成される。この中空部は、工程条件に応じて前記微小中空球が破裂する前に有していた形態をそのまま保持することもできるが、多少変形された形態を有することもできる。
[実施例]
〔実施例1〕
2−エチルヘキシルアクリレート95重量部と極性単量体アクリル酸5重量部を1リットルガラス反応器で熱重合させ、粘度4500cPアクリル高分子を得た。得られたアクリル高分子100重量部に対して光開始剤としてイガキュア(Igacure)−651(α、α−メトキシ−α−ヒドロキシアセトフェノン)0.2重量部、架橋剤として1,6−ヘキサンジオールジアクリレート(HDDA)0.35重量部を添加した後、十分に攪拌した。ここに高分子微小中空球として平均粒径が40μmである微小中空球(Expancel 092 DE 40 d30、Akzo Nobel社製)0.5重量部および平均粒径が120μmである微小中空球(Expancel 092 DET 120 d30、Akzo Nobel社製)0.5重量部と、熱伝導性充填剤として平均粒径が70μmである水酸化アルミニウム(H−100、Showa Denko社製)100重量部を添加して組成物が均一になるまで十分に攪拌した。
上記にて得た混合物を真空ポンプを用いて減圧脱泡した後、ナイフコーティングを用いてポリエステル離型フィルム上に厚さ1mmでコーティングした。この時、酸素を遮断するためにコーティング層上にポリエステルフィルムを被せた後、ブラック蛍光灯ランプを用いて3分間照射して硬化させた。続いて、200℃で90秒間加熱して高分子微小中空球を破裂させることによって、本発明に係る粘着シートを得た。
高分子微小中空球を破裂させるための熱処理を200℃で180秒間行ったことを除いては、実施例1と同一の方法によって粘着シートを得た。
高分子微小中空球として平均粒径が40μmである微小中空球(Expancel 092 DE 40 d30、Akzo Nobel社製)0.7重量部および平均粒径が120μmである微小中空球(Expancel 092 DET 120 d30、Akzo Nobel社製)0.3重量部を用いたことを除いて、実施例1と同一の方法によって粘着シートを得た。
高分子微小中空球として平均粒径が40μmである微小中空球(Expancel 092 DE 40 d30、Akzo Nobel社製)0.3重量部および平均粒径が120μmである微小中空球(Expancel 092 DET 120 d30、Akzo Nobel社製)0.7重量部を用いたことを除いて、実施例1と同一の方法によって粘着シートを得た。
実施例1のように調製した粘着剤組成物をポリエステル離型フィルム上に塗布せずに厚さ50μmのAl薄膜の上面と下面に各々0.5mmの厚さで塗布したことを除いて、実施例1と同一の方法によって粘着シートを得た。
Al薄膜の代わりにCu薄膜を用いたことを除いては、実施例5と同一の方法によって粘着シートを得た。
Al薄膜の一面には微小中空球を含まずに、微小中空球破裂のための熱処理をしなかった非発泡粘着剤層を25μmの厚さで形成し、Al薄膜の他の一面には実施例1で製造した粘着シートを貼着させて粘着シートを得た。
高分子微小中空球を添加せずに微小中空球破裂のための熱処理をしなかったことを除いては、実施例1と同一の方法によって粘着シートを得た。
高分子微小中空球を添加したが、微小中空球破裂のための熱処理をしなかったことを除いては、実施例1と同一の方法によって粘着シートを得た。
1.貼着面積試験
前記の各例で得られたシートを90mm×160mmの大きさに切断し、粘着シートの片面をアルミニウム基材上に積層させた後で厚さ3mmのガラス板をサンプル上に載置した後、200gの荷重を有する錘を2つ載置する。30秒経過後、ガラスと粘着シートが貼着された面積をデジタルカメラで撮ってからイメージを分析して測定する。
2.接着力試験
前記の各例において、シートのアルミニウム板に対する接着力をJISZ1541に基づいて測定した。但し、粘着シートをアルミニウム板に塗布後、180度方向の接着力を測定する前までの常温における放置時間は30分であった。
3.熱伝導率試験
前記の各例から得られたシートを約60mm×120mmの大きさで切断し、このサンプルの熱伝導率を京都電子工業(株)製の迅速熱伝導率測定機QTM−500を用いて測定した。
実施例および比較例の粘着シートの特性評価の結果を下記表2に示した。
Claims (16)
- バルク状態の単量体を光重合または熱重合方法を用いて部分重合した、粘度が1,000〜10,000cPsであるシロップを含む組成物が硬化したアクリル系高分子;
前記硬化したアクリル系高分子中に分散している破裂した高分子微小中空球;
前記高分子微小中空球が硬化したアクリル系高分子中に分散した状態で破裂することにより形成された中空部;及び
酸化金属、水酸化金属、窒化金属、炭化金属、ホウ化金属および金属からなる群より選択される熱伝導性充填剤を含み、
前記熱伝導性充填剤が、前記アクリル系高分子100重量部に対し50〜200重量部で含まれており、
前記破裂した高分子微小中空球と前記中空部を含む状態で電子部品素子の接着ができる、電子部品素子の接着用粘着シート。 - 前記高分子微小中空球が、アクリル系高分子100重量部に対し0.1〜10重量部で含まれている請求項1に記載の電子部品素子の接着用粘着シート。
- 前記高分子微小中空球が、アクリル系、塩化ビニリデン系およびスチレン系の高分子から選択される高分子シェル内に常温で気体のガスを含んでいる請求項1に記載の電子部品素子用粘着シート。
- 前記高分子微小中空球の粒径が1〜350μmである請求項1に記載の電子部品素子の接着用粘着シート。
- 前記高分子微小中空球の密度が0.01〜0.5g/cm3である請求項1に記載の電子部品素子の接着用粘着シート。
- 前記高分子微小中空球のシェルの厚さが0.01〜1μmである請求項1に記載の電子部品素子の接着用粘着シート。
- 前記高分子微小中空球が、粒径が異なる2種類以上の高分子微小中空球を含む請求項1に記載の電子部品素子の接着用粘着シート。
- 前記熱伝導性充填剤は、粒径が1〜200μmである請求項1に記載の電子部品素子の接着用粘着シート。
- 前記粘着シートが、光開始剤、光架橋剤、熱開始剤、熱架橋剤、顔料、酸化防止剤、紫外線安定剤、分散剤、消泡剤、増粘剤、可塑剤、粘着付与樹脂、シランカップリング剤、光沢剤からなる群より選択される1種以上の添加剤をさらに含む請求項1に記載の電子部品素子の接着用粘着シート。
- 前記粘着シートが、50μm〜2mmの厚さを有する請求項1に記載の電子部品素子の接着用粘着シート。
- 前記粘着シートが、この粘着シートによって少なくとも一面がコーティングされた熱伝導性薄膜を含む請求項1に記載の電子部品素子の接着用粘着シート。
- 前記熱伝導性薄膜が、厚さが1〜1000μmであり、アルミニウム、銅、ステンレス鋼、ガラスおよび熱伝導性不織布からなる群より選択される材料からなる請求項11に記載の電子部品素子の接着用粘着シート。
- a)バルク状態の単量体を光重合または熱重合方法を用いて部分重合した、粘度が1,000〜10,000cPsであるシロップを含む組成物、高分子微小中空球及び熱伝導性充填剤を混合して、前記組成物中に高分子微小中空球を分散させるステップ;
b)前記a)ステップで得た組成物を基材の一面または両面上にコーティングするステップ;
c)前記b)ステップで得た基材上にコーティングされた組成物を硬化させて硬化したアクリル系高分子を形成させるステップ;及び
d)前記c)ステップで得た硬化した組成物内に分散している高分子微小中空球を破裂させるステップ
を含み、
前記熱伝導性充填剤は酸化金属、水酸化金属、窒化金属、炭化金属、ホウ化金属および金属からなる群より選択され、前記熱伝導性充填剤が、前記アクリル系高分子100重量部に対し50〜200重量部で含まれている、請求項1に記載の電子部品素子の接着用粘着シートの製造方法。 - 前記d)ステップは、100〜250℃温度で10秒〜30分の間、熱処理することによって行う請求項13に記載の電子部品素子の接着用粘着シートの製造方法。
- 前記基材が、熱伝導性薄膜または離型フィルムである請求項13に記載の電子部品素子の接着用粘着シートの製造方法。
- 前記粘着シートは、JISZ1541に基づいて測定したアルミニウム板に対する接着力が901〜1152g/in(354.7〜453.5g/cm)である請求項1に記載の電子部品素子の接着用粘着シート。
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KR100957785B1 (ko) * | 2006-08-07 | 2010-05-12 | (주)엘지하우시스 | 자동차용 폼테이프 기재 조성물,이를 포함하는 폼테이프및 그의 제조방법 |
KR101384951B1 (ko) * | 2006-10-27 | 2014-04-14 | (주)엘지하우시스 | 인테리어용 폼 테이프 및 그의 제조방법 |
DE102007023982B4 (de) * | 2007-05-11 | 2012-10-25 | Jowat Ag | Füllstoffhaltige Schmelzklebstoffe mit geringer Dichte und deren Verwendung |
KR20090043633A (ko) * | 2007-10-30 | 2009-05-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 열전도성 점착제 및 이를 이용하는 점착테이프 |
US8440312B2 (en) | 2009-03-12 | 2013-05-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
JP5647576B2 (ja) * | 2010-08-05 | 2015-01-07 | 日東電工株式会社 | 接着テープ |
JP5707077B2 (ja) * | 2010-09-24 | 2015-04-22 | アサヒゴム株式会社 | マスチック接着剤 |
KR101523817B1 (ko) * | 2012-07-10 | 2015-05-28 | (주)엘지하우시스 | 기포 안정성이 향상된 난연용 점착제 조성물 및 그의 제조방법 |
KR101438397B1 (ko) * | 2012-10-12 | 2014-09-17 | 두성산업 주식회사 | 고열전도성 방열 테이프 및 이를 포함하는 고열전도성 방열테이프 물품 |
US9765199B2 (en) * | 2012-10-31 | 2017-09-19 | Topasol, LLC | Non-yellowing easy-to-clean antimicrobial plastic |
DE102012112606B4 (de) | 2012-12-19 | 2020-07-09 | Surteco Gmbh | Verfahren zur Herstellung einer Kantenleiste, Kantenleiste und Verwendung einer Kantenleiste |
KR101598658B1 (ko) * | 2013-02-18 | 2016-02-29 | (주)엘지하우시스 | 아크릴 폼 점착 테이프 및 이를 적용한 평판 디스플레이 |
JP6207868B2 (ja) * | 2013-04-11 | 2017-10-04 | 日本カーバイド工業株式会社 | 積層シート |
KR101878505B1 (ko) * | 2013-05-07 | 2018-07-13 | 주식회사 엘지화학 | 아크릴 폼 점착 테이프 및 이를 적용한 평판 디스플레이 |
KR20160035704A (ko) * | 2014-09-23 | 2016-04-01 | (주)엘지하우시스 | 아크릴 폼 점착 테이프 |
WO2016103783A1 (ja) * | 2014-12-26 | 2016-06-30 | リンテック株式会社 | 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス |
DE102015208792A1 (de) * | 2015-05-12 | 2016-11-17 | Tesa Se | Haftklebemasse |
KR101746062B1 (ko) * | 2015-07-24 | 2017-06-13 | (주)트러스 | 도전성 쿠션볼을 이용한 도전성 점착테이프와 이의 제조방법 |
DE102017123342A1 (de) | 2017-10-09 | 2019-04-11 | Schott Ag | TO-Gehäuse mit hoher Reflexionsdämpfung |
CN112760052B (zh) * | 2019-11-04 | 2022-08-05 | 北京小米移动软件有限公司 | 复合胶带、复合胶带的加工方法和柔性屏幕模组 |
KR102144075B1 (ko) * | 2020-06-05 | 2020-08-12 | 주식회사 아이델 | 태양전지가 적용된 방음터널용 패널 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5661469A (en) * | 1979-10-23 | 1981-05-26 | Matsumoto Yushi Seiyaku Kk | Hot-bonding adhesive |
JPH03268345A (ja) * | 1990-03-16 | 1991-11-29 | Nitto Denko Corp | ダイ接着用シート及び半導体チップ固着キャリアの製造方法 |
JPH0832435B2 (ja) * | 1986-08-21 | 1996-03-29 | ミネソタ マイニング アンド マニユフアクチユアリング カンパニ− | 感圧接着剤被覆シ−ト材料 |
JP2698881B2 (ja) * | 1989-05-19 | 1998-01-19 | 日東電工株式会社 | 膨脹型粘着部材 |
JPH11322999A (ja) * | 1998-05-11 | 1999-11-26 | Soken Chem & Eng Co Ltd | 発泡シート類、発泡粘着シート類およびそれらの製造方法 |
JP2000211055A (ja) * | 1999-01-26 | 2000-08-02 | Furukawa Electric Co Ltd:The | 導電性と熱伝導性を備えたシ―ト |
JP2001047762A (ja) * | 1999-08-10 | 2001-02-20 | Sumitomo Rubber Ind Ltd | 印刷ブランケットとその製造方法 |
JP2001279196A (ja) * | 2000-03-30 | 2001-10-10 | Sliontec Corp | 無基材熱伝導性粘着テープ・シート及びその製造方法 |
JP2002148988A (ja) * | 1999-09-30 | 2002-05-22 | Canon Inc | 加熱装置、画像形成装置、および、シリコーンゴムスポンジおよびローラの製造方法 |
JP3418430B2 (ja) * | 1993-08-11 | 2003-06-23 | 日東電工株式会社 | マイクロカプセルの処理方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS581684B2 (ja) | 1978-12-28 | 1983-01-12 | 日東電工株式会社 | 感圧接着性発泡体の製造方法 |
US4855170A (en) * | 1986-08-21 | 1989-08-08 | Minnesota Mining And Manufacturing Company | Pressure-sensitive tape construction incorporating resilient polymeric microspheres |
JP2608713B2 (ja) | 1987-03-13 | 1997-05-14 | 日東電工株式会社 | アクリル系発泡粘着剤層 |
JP3417596B2 (ja) | 1993-04-07 | 2003-06-16 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 弾性微小球を含有する粘着フィルム |
JPH0832435A (ja) | 1994-07-18 | 1996-02-02 | Hitachi Ltd | 半導体装置 |
JPH09221639A (ja) | 1996-02-19 | 1997-08-26 | Sekisui Chem Co Ltd | 難燃性粘着フィルムおよびテープ |
JPH10316953A (ja) * | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類 |
DE19730854A1 (de) * | 1997-07-18 | 1999-01-21 | Beiersdorf Ag | Selbstklebeband enthaltend Mikroballons in der Trägerschicht |
JPH11269438A (ja) * | 1998-03-25 | 1999-10-05 | Dainippon Ink & Chem Inc | 熱伝導難燃性感圧接着剤及び感圧接着テープ |
US6459878B1 (en) * | 1999-09-30 | 2002-10-01 | Canon Kabushiki Kaisha | Heating assembly, image-forming apparatus, and process for producing silicone rubber sponge and roller |
JP2001323228A (ja) | 2000-05-15 | 2001-11-22 | Nitto Denko Corp | 加熱剥離型粘着シート |
JP2002080817A (ja) | 2000-09-04 | 2002-03-22 | Three M Innovative Properties Co | 架橋型発泡粘着剤及びその製造方法 |
JP2002294192A (ja) * | 2001-03-29 | 2002-10-09 | Three M Innovative Properties Co | 熱伝導性難燃性感圧接着剤及びシート |
KR100487026B1 (ko) | 2002-05-31 | 2005-05-10 | 주식회사 루밴틱스 | 자외선 경화형 발포체의 제조방법 |
JP3998548B2 (ja) | 2002-09-25 | 2007-10-31 | 日東電工株式会社 | 粘着除塵クリーナー |
-
2005
- 2005-06-09 WO PCT/KR2005/001731 patent/WO2005121267A1/en not_active Application Discontinuation
- 2005-06-09 JP JP2007527006A patent/JP4855403B2/ja active Active
- 2005-06-09 CN CN2005800190039A patent/CN1965045B/zh active Active
- 2005-06-09 EP EP05750738.6A patent/EP1753834B1/en active Active
- 2005-06-09 KR KR1020050049168A patent/KR100635210B1/ko active IP Right Grant
- 2005-06-10 US US11/149,272 patent/US8067475B2/en active Active
- 2005-06-10 TW TW94119339A patent/TWI304435B/zh active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5661469A (en) * | 1979-10-23 | 1981-05-26 | Matsumoto Yushi Seiyaku Kk | Hot-bonding adhesive |
JPH0832435B2 (ja) * | 1986-08-21 | 1996-03-29 | ミネソタ マイニング アンド マニユフアクチユアリング カンパニ− | 感圧接着剤被覆シ−ト材料 |
JP2698881B2 (ja) * | 1989-05-19 | 1998-01-19 | 日東電工株式会社 | 膨脹型粘着部材 |
JPH03268345A (ja) * | 1990-03-16 | 1991-11-29 | Nitto Denko Corp | ダイ接着用シート及び半導体チップ固着キャリアの製造方法 |
JP3418430B2 (ja) * | 1993-08-11 | 2003-06-23 | 日東電工株式会社 | マイクロカプセルの処理方法 |
JPH11322999A (ja) * | 1998-05-11 | 1999-11-26 | Soken Chem & Eng Co Ltd | 発泡シート類、発泡粘着シート類およびそれらの製造方法 |
JP2000211055A (ja) * | 1999-01-26 | 2000-08-02 | Furukawa Electric Co Ltd:The | 導電性と熱伝導性を備えたシ―ト |
JP2001047762A (ja) * | 1999-08-10 | 2001-02-20 | Sumitomo Rubber Ind Ltd | 印刷ブランケットとその製造方法 |
JP2002148988A (ja) * | 1999-09-30 | 2002-05-22 | Canon Inc | 加熱装置、画像形成装置、および、シリコーンゴムスポンジおよびローラの製造方法 |
JP2001279196A (ja) * | 2000-03-30 | 2001-10-10 | Sliontec Corp | 無基材熱伝導性粘着テープ・シート及びその製造方法 |
Also Published As
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TW200610799A (en) | 2006-04-01 |
US8067475B2 (en) | 2011-11-29 |
KR20060048300A (ko) | 2006-05-18 |
WO2005121267A1 (en) | 2005-12-22 |
CN1965045B (zh) | 2012-08-29 |
EP1753834B1 (en) | 2017-11-01 |
EP1753834A4 (en) | 2010-08-25 |
JP2008501848A (ja) | 2008-01-24 |
US20050276963A1 (en) | 2005-12-15 |
EP1753834A1 (en) | 2007-02-21 |
CN1965045A (zh) | 2007-05-16 |
KR100635210B1 (ko) | 2006-10-16 |
TWI304435B (en) | 2008-12-21 |
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