JP4849908B2 - リジッド基板の接続構造 - Google Patents
リジッド基板の接続構造 Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims description 178
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 22
- 239000010410 layer Substances 0.000 description 18
- 239000012790 adhesive layer Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- -1 SEM3 Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/06—Vegetal fibres
- B32B2262/062—Cellulose fibres, e.g. cotton
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Description
図1〜図3は、本発明の第1の実施の形態に係るリジッド基板の接続構造を示している。なお、図1はリジッド基板の接続構造を示す平面図、図2は図1のA−A断面図、図3は屈曲した状態を示す断面図である。
以下、リジッド基板の接続構造の説明に先駆けて、各部材の構成について説明する。図2および図3に示すように、第1リジッド基板10は、絶縁基板(基材)11と、絶縁基板11の一方の表面にパターン形成された複数の配線パターン12と、絶縁基板11の他方の表面にパターン形成された複数の配線パターン13と、これらの配線パターン12,13が形成された絶縁基板11のそれぞれの面に図示しない接着層を介して設けられたレジスト層(カバー層)14,15と、を備えて大略構成されている。
本実施の形態に係るリジッド基板の接続構造では、図2に示すように、第1リジッド基板10と第2リジッド基板20の対応する接続領域同士(表面と裏面)を、第1フレキシブル基板30および第2フレキシブル基板40で接続したものである。
以下、リジッド基板の接続構造の実施例の具体的な材料および寸法例を以下に説明する。リジッド基板10,20の絶縁基板11,21の厚さは、例えば、0.4mm、0.6mm、0.8mm、1.0mm、1.2mm、1.6mm、2.0mm、2.4mm等を採用することができる。これら絶縁基板11,21は、ガラスエポキシ、SEM−3等の材料でなる。また、第1フレキシブル基板30,40における絶縁基板31,41の厚さは、25μmを基本にして、その1/2、1/3、1/4を用いることができる。そして、絶縁基板31,41上に形成された配線パターン32,42の厚さは、35μmを基本に、その1/2、1/3、1/4等を採用することができる。
ここで、図4を用いて、フレキシブル基板に応力集中が発生するメカニズムを説明し、加えて、第1および第2フレキシブル基板30,40同士の間隔を第1および第2リジッド基板10,20の厚さよりも狭く設定した場合に屈曲させたときに応力集中が起こりにくくなる理由を説明する。
L1=2・π・√((a12+b12)/2)
であり、
L2x=2・π・√((a22+b22)/2)
仮に、フレキシブル基板30,40の厚さを無視すれば、
b1=b2
リジッド基板10,20の厚さをtとすれば、
a2=a1−t
であり、L1とL2xとの差であるΔは、
Δ=2・π・√((a12+b12)/2)
−2・π・√(((a1−t)2+b12)/2)
但し、a1−t>0
となり、a1、b1が決まった状態、すなわちL1が決まった状態では、tが大きいほどΔは大きくなることが分かる。したがって、第1および第2リジッド基板10,20の厚みtが厚いほど、第2フレキシブル基板40の自然な曲線を描いた移動が阻止される度合いが強くなると言える。
次に、図5を用いて本発明の第2の実施の形態に係るリジッド基板の接続構造を説明する。なお、図5は本実施の形態のリジッド基板の接続構造を示す部分断面斜視図である。
次に、図6を用いて本発明の第3の実施の形態に係るリジッド基板の接続構造を説明する。なお、図6は本実施の形態のリジッド基板の接続構造を示す断面図である。
11 絶縁基板
12,13,22,23,32,42 配線パターン
12A,13A,22A,23A,32A,32B,42A,42B 接続用端
14,15 レジスト層
20 第2リジッド基板
21 絶縁基板
30 第1フレキシブル基板
31,41 絶縁基板
33,43 カバー層
40 第2フレキシブル基板
50 接着層
51 補強板
52 樹脂層
Claims (3)
- 一対のリジッド基板の対応した接続部同士の、表面側同士および裏面側同士がそれぞれフレキシブル基板で連結され、前記フレキシブル基板同士が対向するように設けられたリジッド基板の接続構造であって、
前記フレキシブル基板同士が前記リジッド基板の前記接続部の近傍で、前記リジッド基板の厚さよりも狭い間隔となるように貼り合わされており、
前記フレキシブル基板同士は、前記接続部の近傍で、両面に接着剤が設けられた補強板を介して貼り合わされていることを特徴とするリジッド基板の接続構造。 - 前記フレキシブル基板同士を貼り合わせた状態で、前記リジッド基板の前記接続部の近傍にある前記フレキシブル基板同士の間の間隙に樹脂が充填されていることを特徴とする請求項1に記載されたリジッド基板の接続構造。
- 前記フレキシブル基板は、絶縁性基材の片方の面のみに配線パターンが形成されたものであり、
前記一対のフレキシブル基板は、互いに前記配線パターンが対向内側となるように配置されていることを特徴とする請求項1又は2に記載されたリジッド基板の接続構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006050233A JP4849908B2 (ja) | 2006-02-27 | 2006-02-27 | リジッド基板の接続構造 |
CN2007100843089A CN101031185B (zh) | 2006-02-27 | 2007-02-27 | 用于刚性基板的连接结构 |
KR1020070019775A KR100868010B1 (ko) | 2006-02-27 | 2007-02-27 | 리지드 기판의 접속 구조 |
TW096106848A TWI332370B (en) | 2006-02-27 | 2007-02-27 | Connection configuration for rigid substrates |
US11/679,733 US7642466B2 (en) | 2006-02-27 | 2007-02-27 | Connection configuration for rigid substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006050233A JP4849908B2 (ja) | 2006-02-27 | 2006-02-27 | リジッド基板の接続構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007227855A JP2007227855A (ja) | 2007-09-06 |
JP4849908B2 true JP4849908B2 (ja) | 2012-01-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006050233A Expired - Fee Related JP4849908B2 (ja) | 2006-02-27 | 2006-02-27 | リジッド基板の接続構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7642466B2 (ja) |
JP (1) | JP4849908B2 (ja) |
KR (1) | KR100868010B1 (ja) |
CN (1) | CN101031185B (ja) |
TW (1) | TWI332370B (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG170744A1 (en) * | 2006-03-20 | 2011-05-30 | Sumitomo Bakelite Co | Circuit board and connection substrate |
US7982135B2 (en) * | 2006-10-30 | 2011-07-19 | Ibiden Co., Ltd. | Flex-rigid wiring board and method of manufacturing the same |
WO2008102795A1 (ja) * | 2007-02-20 | 2008-08-28 | Hitachi Chemical Company, Ltd. | フレキシブル多層配線板 |
US8178789B2 (en) * | 2007-07-17 | 2012-05-15 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
JPWO2009141929A1 (ja) * | 2008-05-19 | 2011-09-29 | イビデン株式会社 | 配線板とその製造方法 |
EP2301065A4 (en) * | 2008-07-17 | 2013-06-12 | Autoliv Asp Inc | METHOD FOR MANUFACTURING ELECTRONIC ASSEMBLY |
JPWO2010013366A1 (ja) | 2008-07-30 | 2012-01-05 | イビデン株式会社 | フレックスリジッド配線板及びその製造方法 |
JP2010105640A (ja) * | 2008-10-31 | 2010-05-13 | Nsk Ltd | 電動パワーステアリング装置 |
DE102009055857A1 (de) * | 2009-11-26 | 2011-06-16 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Kontaktieren einer Leiterplatte mit einem Flachbandkabel und Leiterplatte |
US8493747B2 (en) * | 2010-02-05 | 2013-07-23 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
TW201130405A (en) * | 2010-02-23 | 2011-09-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
US8279613B2 (en) * | 2010-11-16 | 2012-10-02 | Tyco Electronics Corporation | Flexible circuit assemblies with stacked flex interconnects and connector assemblies having the same |
TW201233264A (en) * | 2011-01-20 | 2012-08-01 | Unitech Printed Circuit Board Corp | Method for manufacturing flexible and hard composite printed circuit board |
TWI458404B (zh) * | 2012-05-30 | 2014-10-21 | Mektec Corp | 雙面可撓性基板片連接成捲之製程與結構 |
CN103458624B (zh) * | 2012-06-01 | 2017-05-17 | 旗胜科技股份有限公司 | 双面可挠性基板片连接成卷的工艺 |
US20140069696A1 (en) * | 2012-09-11 | 2014-03-13 | Apple Inc. | Methods and apparatus for attaching multi-layer flex circuits to substrates |
CN103152980A (zh) * | 2013-03-23 | 2013-06-12 | 广州安费诺诚信软性电路有限公司 | 一种书夹式软硬结合线路板及其制作方法 |
CN103594432B (zh) * | 2013-10-31 | 2016-03-16 | 中国科学院微电子研究所 | 一种刚柔结合板的三维封装散热结构 |
CN103594433B (zh) * | 2013-10-31 | 2016-02-10 | 中国科学院微电子研究所 | 一种制作刚柔结合板的三维封装散热结构的方法 |
US20150373830A1 (en) * | 2014-06-19 | 2015-12-24 | Kabushiki Kaisha Toshiba | Composite substrate including foldable portion |
GB2537885B (en) * | 2015-04-29 | 2017-04-05 | Eureco Tech Ltd | Deployable radio frequency transmission line |
CN105957846B (zh) * | 2016-06-28 | 2019-06-14 | 青岛海信宽带多媒体技术有限公司 | 光模块 |
KR102541317B1 (ko) * | 2016-08-29 | 2023-06-09 | 삼성전자주식회사 | 커버레이를 포함하는 리지드-플렉스 기판 |
JP6414652B1 (ja) * | 2016-12-27 | 2018-10-31 | 株式会社村田製作所 | 多層基板および電子機器 |
CN109688701B (zh) * | 2018-06-26 | 2021-08-03 | 上海嘉捷通电路科技股份有限公司 | 一种刚挠结合pcb板 |
CN111093316B (zh) * | 2018-10-24 | 2021-08-24 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
US11095075B2 (en) * | 2019-01-17 | 2021-08-17 | TE Connectivity Services Gmbh | Electrical device with a plug connector having a flexible section |
WO2024077529A1 (zh) * | 2022-10-12 | 2024-04-18 | 锐捷网络股份有限公司 | 一种芯片到面板的线缆组件及pcb板电路 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4026011A (en) * | 1975-08-28 | 1977-05-31 | Burroughs Corporation | Flexible circuit assembly |
GB1568964A (en) * | 1975-11-05 | 1980-06-11 | Nat Res Dev | Oriented polymer materials |
JPS57174875A (en) * | 1981-04-20 | 1982-10-27 | Hitachi Ltd | Connector for circuit board |
JPS61111173A (ja) * | 1984-11-05 | 1986-05-29 | Canon Inc | 曲面成形方法 |
US4687695A (en) * | 1985-09-27 | 1987-08-18 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
US4931134A (en) * | 1989-08-15 | 1990-06-05 | Parlex Corporation | Method of using laser routing to form a rigid/flex circuit board |
US5206463A (en) * | 1990-07-24 | 1993-04-27 | Miraco, Inc. | Combined rigid and flexible printed circuits and method of manufacture |
US5144742A (en) * | 1991-02-27 | 1992-09-08 | Zycon Corporation | Method of making rigid-flex printed circuit boards |
JP3155565B2 (ja) * | 1991-08-12 | 2001-04-09 | シャープ株式会社 | プリント配線板の製造方法 |
JP2715767B2 (ja) * | 1991-12-17 | 1998-02-18 | 日本電気株式会社 | フレックスリジット基板 |
JPH05275821A (ja) * | 1992-03-24 | 1993-10-22 | Sony Corp | フレキシブル基板の接続装置及び電子機器 |
JPH05275814A (ja) * | 1992-03-27 | 1993-10-22 | Nec Corp | フレックスリジット配線板 |
US5419038A (en) * | 1993-06-17 | 1995-05-30 | Fujitsu Limited | Method for fabricating thin-film interconnector |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5877940A (en) * | 1993-12-02 | 1999-03-02 | Teledyne Industries Inc. | Fabrication multilayer combined rigid/flex printed circuit board |
DE69433411T2 (de) * | 1994-03-08 | 2004-10-14 | Teledyne Technologies Inc., Los Angeles | Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte |
US6162996A (en) * | 1994-03-23 | 2000-12-19 | Dyconex Patente Ag | Insulating foil circuit board with rigid and flexible sections |
JPH08116147A (ja) * | 1994-10-14 | 1996-05-07 | Toshiba Corp | リジット基板の接続構造 |
US6274225B1 (en) * | 1996-10-05 | 2001-08-14 | Nitto Denko Corporation | Circuit member and circuit board |
US6350387B2 (en) * | 1997-02-14 | 2002-02-26 | Teledyne Industries, Inc. | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
DE19817354A1 (de) * | 1998-04-18 | 1999-10-28 | Freudenberg Carl Fa | Flexible Leiterplatte |
KR100278609B1 (ko) * | 1998-10-08 | 2001-01-15 | 윤종용 | 인쇄회로기판 |
US6603079B2 (en) * | 1999-02-05 | 2003-08-05 | Mack Technologies Florida, Inc. | Printed circuit board electrical interconnects |
JP4276740B2 (ja) | 1999-07-22 | 2009-06-10 | 日東電工株式会社 | 多層配線基板 |
CN2479712Y (zh) | 2001-03-27 | 2002-02-27 | 安捷利(番禺)电子实业有限公司 | 分段粘接的柔性印刷电路板 |
JP3992470B2 (ja) * | 2001-09-27 | 2007-10-17 | 日本メクトロン株式会社 | ケーブル部を有するフレキシブルプリント基板 |
TWI233771B (en) | 2002-12-13 | 2005-06-01 | Victor Company Of Japan | Flexible rigid printed circuit board and method of fabricating the board |
US7378596B2 (en) * | 2003-04-18 | 2008-05-27 | Ibiden Co., Ltd. | Rigid-flex wiring board |
JP2005338699A (ja) * | 2004-05-31 | 2005-12-08 | Kawaguchiko Seimitsu Co Ltd | 液晶表示装置 |
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2007
- 2007-02-27 US US11/679,733 patent/US7642466B2/en not_active Expired - Fee Related
- 2007-02-27 CN CN2007100843089A patent/CN101031185B/zh not_active Expired - Fee Related
- 2007-02-27 TW TW096106848A patent/TWI332370B/zh not_active IP Right Cessation
- 2007-02-27 KR KR1020070019775A patent/KR100868010B1/ko not_active IP Right Cessation
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KR100868010B1 (ko) | 2008-11-10 |
TWI332370B (en) | 2010-10-21 |
TW200740314A (en) | 2007-10-16 |
US20070202306A1 (en) | 2007-08-30 |
CN101031185A (zh) | 2007-09-05 |
KR20070089095A (ko) | 2007-08-30 |
US7642466B2 (en) | 2010-01-05 |
CN101031185B (zh) | 2010-08-04 |
JP2007227855A (ja) | 2007-09-06 |
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