JP4839405B2 - コンベアおよび成膜装置とそのメンテナンス方法 - Google Patents
コンベアおよび成膜装置とそのメンテナンス方法 Download PDFInfo
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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Description
本願は、2007年4月16日に、日本に出願された特願2007−106877号に基づき優先権を主張し、その内容をここに援用する。
また、下部支持機構は下部フレームに取り付けられており、キャリアの荷重を下部支持機構で支持しながらキャリアを搬送させるため、下部支持機構の搬送ルートが精度良く位置決めされた状態で、キャリアを精度良く搬送することができる。したがって、キャリアに搭載した基板の割れ、キャリアからのパーティクル発生、搬送トラブルを防止することができる効果がある。
また、第二ローラは収納可能に構成されているため、上部フレームを回動させる際に、下部フレームと干渉するときのみ第二ローラを干渉しない位置まで移動し、その他のときは床面に対して上部フレームを支持するために使用することができ、効率よく使用することができる効果がある。
図1は、成膜装置の全体構成を示す平面図である。
図1に示すように、成膜装置10は、ガラス基板11を縦型保持するキャリア13が配置され、そのキャリア13を大気圧下で搬送するキャリア搬送経路15と、真空状態下でガラス基板11に成膜をする成膜処理経路17とで構成されている。ここで、成膜装置10は、成膜処理経路17においてキャリア13が2列並行して搬送可能に構成されており、後述するスパッタ室34にて両側から成膜可能に構成された両面成膜方式の成膜装置である。
図2に示すように、側面72の下部には脚73が延設されており、脚73の下端近傍において回動軸74を介してスパッタ室34の下部構造体75と接続されている。側面72には、複数本の脚76(本実施形態では4本)が一体形成されている。脚76は、パワーシリンダで構成されており、その軸部82は下部構造体75に回動軸84を介して接続されている。そして、軸部82がパワーシリンダにより伸縮可能に構成されている。
図3に示すように、キャリア13は、アルミニウムなどからなる枠状のキャリアフレーム65と、キャリアフレーム65の上辺に沿うように設けられたマグネット66と、キャリアフレーム65の下辺に沿うように設けられた丸棒からなるスライダ67と、ガラス基板11の荷重を受け、かつガラス基板11の水平度を保持するための基板受け68と、ガラス基板11をキャリア13に保持させるためのクランプ69と、ガラス基板11の周縁の非成膜領域を覆うためのマスク70とを備えている。
図4は、コンベア40の断面図である。
図4に示すように、コンベア40は、鋼製部材で組まれたフレーム41と、キャリア13の荷重を支持しながらキャリア13を搬送可能に構成された下部支持機構43と、キャリア13の上部を非接触で支持可能に構成された上部支持機構45とを備えている。
図5に示すように、下部支持機構43は、モータ51とローラ52とを備えている。モータ51が駆動することで、ローラ52が回転し、ローラ52上をキャリア13が水平移動するように構成されている。具体的には、キャリア13の下部に設けられた後述するスライダ67がローラ52外周の溝部に係合し、キャリア13が水平移動可能に構成されている。ローラ52は、キャリア13が水平移動するのに支障がないように、一つの下部フレーム47内に複数設けられている。
図6に示すように、上部支持機構45は、上部フレーム49の上部で、かつキャリア13の上辺が通過する領域から側方に間隔をあけるように一対のマグネット53a,53bが設けられている。一対のマグネット53a,53bは、お互いのN極とS極が対向するように取り付けられている。また、一対のマグネット53a,53bは上部フレーム49内に複数設けられている。そして、キャリア13の上辺にも後述するマグネット66が取り付けられており、上部フレーム49の一対のマグネット53a,53bの間をマグネット66が通過するように構成され、マグネット53aのN極とマグネット66のN極が対向し、マグネット53bのS極とマグネット66のS極が対向するように配置される。
図7に示すように、上部フレーム49は、下部フレーム47の1本の垂直軸55に対して回動可能に連接されており、下部フレーム47の直上に配置されている。また、上部フレーム49の回動方向手前側の側面56には、上部フレーム49を回動させる際に使用する取手57が設けられている。さらに、取手57に連接するように床面FLに向かって脚58が延出されており、脚58の先端には床面FLと接するように第一ローラ59が設けられている。
図8,図9に示すように、上部フレーム49の側面60側で、下部フレーム47との境界部には荷重受ガイドローラ64が設けられている。荷重受ガイドローラ64は、側面60の両側に設けられ、上部フレーム49が下部フレーム47の上部に位置しているとき(通常状態)に、下部フレーム47から側方へ突出するように一体成形された受部86に接するように構成されている。荷重受ガイドローラ64が、受部86に接することで上部フレーム49の荷重の一部が下部フレーム47側へ伝わり、下部フレーム47に支持されることとなる。このように構成することで、上部フレーム49は通常状態において、その四隅を第一ローラ59、第二ローラ61、垂直軸55および荷重受ガイドローラ64で支持され、安定した状態を保持することができる。
次に、ガラス基板11に成膜する際の作用を図1などに基づいて説明する。
ガラス基板11が他所から水平状態で成膜装置10の入口部21の前まで搬送されてくる。その後、ガラス基板11を垂直状態になるように立ち上げ、ガラス基板11を入口部21に載置されているキャリア13に搭載する。このとき、ガラス基板11をキャリア13の基板受け68に当接するようにした後、クランプ69にてガラス基板11をキャリア13に保持する(図3参照)。
ロードロック室31内が真空状態になった後、ゲートバルブ38bを開状態にして、キャリア13を加熱室32へと搬送する。
スパッタ室34のカソード部材80のメンテナンスを行う際の機構について説明する。
図2に示すように、スパッタ室34の側面72に設けられたカソード部材80をメンテナンスするには、側面72が床面FLに略平行になるように倒す。
側面72を倒すと、側面72は回動軸74を中心に倒れ、側面72が水平状態になるまで倒れるように構成されている。このとき、側面72に一体形成されている脚76に連接されている軸部82が、回動軸84を中心に回動しながら、かつ、パワーシリンダにより伸びながら側面72が倒されていく。脚76の先端が床面FLに位置すると、カソード部材80が配置されている側面72の荷重を支持するとともに、水平に保持することができる。
次に、スパッタ室34のメンテナンス機構71を稼動させる際のフレーム41の動作について図10を用いて説明する。
図10は、コンベアの上部フレーム移動時の概略説明図である。
図10に示すように、フレーム41の上部フレーム49と下部フレーム47とを係止している図示しない係止部を外し、上部フレーム49の取手57を手前側に引くと、上部フレーム49と下部フレーム47との間に連接されている垂直軸55を中心に、上部フレーム49が回動するように移動する。このとき、上部フレーム49は垂直軸55と第一ローラ59にて荷重が支えられている。そして、第二ローラ61が取り付けられている箇所が平面視において下部フレーム47と干渉しない位置まで上部フレーム49を回動させた後、第二ローラ61の図示しないストッパを外し、第二ローラ61が床面FLに接するように回動軸62を中心に回動させる。この状態でさらに上部フレーム49を回動させ、略90度回動させる。このとき上部フレーム49は、垂直軸55、第一ローラ59および第二ローラ61の3点で荷重を支えられており、上部フレーム49が自重でがたつくことなく回動させることができる。
図11に示すように、上部フレーム49を移動させると、下部フレーム47の上方には空間77が形成される。この空間77にスパッタ室34の側面72が倒され、平面視において下部フレーム47と重なるように配置される(図1参照)。さらに、下部フレーム47と側面72が上下方向(垂直方向)において干渉しないよう、つまり下部フレーム47の上方に側面72が配置するように構成する。これにより、倒されたスパッタ室34の側面72とキャリア搬送経路15とが平面視において重ならないように成膜処理経路17とキャリア搬送経路15とを配置する必要がなくなり(図13参照)、成膜処理経路17とキャリア搬送経路15との間の距離を近づけることが可能となる(図1参照)。つまり、成膜装置10に形成される中庭81を狭くすることができるため、成膜装置10の設置面積を狭小化することが可能となる。ここで、パワーシリンダで構成された脚76は、下部フレーム47の下部に入り込むことができるように設計されている(図11参照)。
この場合、下部支持機構43は固定された状態で、上部支持機構45のみを回動させることができる。したがって、下部支持機構43の精度を維持することができる。また、上部フレーム49が下部フレーム47を床面FLに固定する垂直軸55を中心に回動可能に構成されているため、下部フレーム47の上方に容易に空間77を形成することができるとともに、上部フレーム49を下部フレーム47の上方まで簡単に復帰させて位置決めすることができる。
このように構成したため、上部フレーム49(上部支持機構45)の位置が若干ずれてもキャリア13の搬送には影響を及ぼすことがなく、キャリア13を確実に搬送することができる。
例えば、本実施形態において、上部支持機構45を、上部フレーム49に設けたマグネットとキャリア13に設けたマグネットとを反発させる構成にしたが、図12に示すように、上部フレーム49に設けた一つのマグネット53とキャリア13に設けたマグネット66とが垂直方向に対向するように、かつ互いのマグネット53,66が吸着しあうように配置し、キャリア13を略垂直に保持できるようにしてもよい。
また、本実施形態において、成膜処理経路に両面成膜方式のものを採用した場合の説明をしたが、片面成膜方式において、スパッタ室の側面に設けられたカソード部材をキャリア搬送経路側に倒してメンテナンスを行うように構成されている成膜装置に、本発明を適用してもよい。
Claims (7)
- フレームと、
基板が縦型に載置されたキャリアを支持すると共に前記キャリアを搬送する下部支持機構と、
前記キャリアを支持する上部支持機構と、を備えたコンベアにおいて、
前記フレームが、下部フレームと上部フレームとで構成され、
前記下部支持機構が下部フレームに設けられ、前記上部支持機構が上部フレームに設けられ、前記上部フレームが前記下部フレームと分離して移動可能に構成されていることを特徴とするコンベア。 - 前記下部フレームが、床面に支持固定され、
前記上部フレームが、前記下部フレームを床面に支持する垂直軸のいずれか一つと連接されてなり、前記垂直軸を中心に回動可能に構成されている請求項1に記載のコンベア。 - 前記上部支持機構は、前記キャリアを非接触で支持する請求項1に記載のコンベア。
- 前記上部フレームの回動方向手前側に、前記床面に対して前記上部フレームを支持しつつ前記床面に沿って転動する第一ローラが設けられ、
前記上部フレームの回動方向奥側に、前記床面に対して前記上部フレームを支持しつつ前記床面に沿って転動する第二ローラが設けられ、
前記第二ローラは、前記上部フレームの回動時に前記下部フレームと干渉しない位置に移動可能に構成されている請求項1に記載のコンベア。 - 基板を縦型支持して搬送するキャリアと、
前記キャリアに搭載された前記基板に成膜処理を行う成膜処理経路と、
前記成膜処理経路に並列配置されたキャリア搬送経路と、を備え、
前記成膜処理経路の構成部材が、前記キャリア搬送経路に向かって移動可能に構成された成膜装置において、
前記キャリア搬送経路には、請求項1〜4のいずれかに記載のコンベアが設けられ、
前記上部フレームが、移動した前記成膜処理経路の構成部材との干渉を回避しうる位置まで移動可能に構成されている成膜装置。 - 前記成膜処理経路の構成部材は、スパッタ処理装置のターゲットの支持部材である請求項5に記載の成膜装置。
- 請求項5に記載の成膜装置のメンテナンス方法であって、
前記上部フレームを前記下部フレームから退避位置まで分離して移動させる工程と、前記成膜処理経路の構成部材を前記下部フレームの上方に倒して、前記成膜処理経路の構成部材をメンテナンスする工程とを具備するメンテナンス方法。
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- 2008-04-15 KR KR1020097020228A patent/KR101181503B1/ko active IP Right Grant
- 2008-04-15 US US12/596,264 patent/US8740205B2/en active Active
- 2008-04-15 WO PCT/JP2008/057339 patent/WO2008129983A1/ja active Application Filing
- 2008-04-15 CN CN2008800091639A patent/CN101641272B/zh active Active
- 2008-04-15 TW TW097113642A patent/TWI425587B/zh active
- 2008-04-15 JP JP2009510844A patent/JP4839405B2/ja active Active
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Also Published As
Publication number | Publication date |
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WO2008129983A1 (ja) | 2008-10-30 |
US20100126415A1 (en) | 2010-05-27 |
TW200848339A (en) | 2008-12-16 |
KR101181503B1 (ko) | 2012-09-10 |
KR20090117822A (ko) | 2009-11-12 |
JPWO2008129983A1 (ja) | 2010-07-22 |
TWI425587B (zh) | 2014-02-01 |
CN101641272B (zh) | 2011-11-16 |
CN101641272A (zh) | 2010-02-03 |
US8740205B2 (en) | 2014-06-03 |
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