JP4815245B2 - ロウ付け式で配設された端子要素を有するパワー半導体モジュール - Google Patents
ロウ付け式で配設された端子要素を有するパワー半導体モジュール Download PDFInfo
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- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
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- H01L2924/30107—Inductance
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
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- H05K2201/10818—Flat leads
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
20 ベースプレート
30 ハウジング
40 端子要素
42 端子要素の部分
44、44a、44b 端子要素の穴
46、48 狭窄部
50 基板
52 絶縁材料ボディ
53 金属性の積層部
54 金属性の積層部(導体パス)
56 パワー半導体素子
60 補助端子
70 接続要素
72 接続要素の部分
74、74a、74b 接続要素の穴
76、78 狭窄部
80 ワイヤボンディング接続部
100 導体プレート(プリント回路板)
120 導体パス
220 ケーブル接続部
400、420 接触面
402 部分接触面
404 第1主面
406 第2主面
700、720 接触面
702 部分接触面
Claims (5)
- ベースプレート(20)を備えた又は冷却体上に直接的に取り付けるパワー半導体モジュール(10)であって、このパワー半導体モジュール(10)が、少なくとも、ハウジング(30)と、外部負荷接触部のための外へと通じる端子要素(40)と、ハウジング(30)内に配設されている電気絶縁式の少なくとも1つの基板(50)とを有し、この基板(50)の方が、絶縁材料ボディ(52)と、ベースプレート(20)又は冷却体とは反対側にある絶縁材料ボディ(52)の第1主面上に設けられていて互いに電気絶縁されている複数の金属性の接続パス(54)と、これらの接続パス(54)上に設けられているパワー半導体素子(56)と、2つの接続パス(54)の間及び/又は接続パス(54)とパワー半導体素子(56)との間の接続要素(70)とを有する、前記パワー半導体モジュール(10)において、
少なくとも1つの端子要素(40)及び/又は接続要素(70)が、少なくとも1つの端部を備えた金属成形部品として形成されていて、各々の端部は関連する接続パス(54)と垂直に延在し、少なくとも1つの接触面によりこの接続パス(54)にロウ付けされ、
これらの接触面が複数の部分接触面(402、702)として形成されていて、各部分接触面(402、702)が20mm2の最大面積を有し、各々2つの部分接触面(402、702)が互いに5mmの最大間隔を有し、
端子要素(40)及び/又は接続要素(70)の端部は、その延在経過において接触面の近くに隣接し且つ僅かな間隔で配設されている2つの狭窄部(48、78)を有し、狭窄部(48、78)は、オーバーラップする互いに離間された2つのスリットから形成され、
これらの狭窄部及びスリットを有する構造が端子要素(40)及び/又は接続要素(70)のための緊張軽減部を形成することを特徴とするパワー半導体モジュール(10)。 - 端子要素(40)及び/又は接続要素(70)が、錫又は銀から成る表面を備えた銅から成る金属成形部品として形成されていることを特徴とする、請求項1に記載のパワー半導体モジュール(10)。
- 部分接触面(402、702)が互いに1mmから5mmまでの間隔を有することを特徴とする、請求項1に記載のパワー半導体モジュール(10)。
- 端子要素(40)及び/又は接続要素(70)が部分接触面(402、702)の間に穴(44a)を有し、これらの穴(44a)が、接触面に底辺をもって三角形状で形成されていることを特徴とする、請求項3に記載のパワー半導体モジュール(10)。
- 端子要素(40)及び/又は接続要素(70)が部分接触面(402、702)の間に穴(44b)を有し、これらの穴(44b)がスリットとして垂直に接触面から出発して形成されていることを特徴とする、請求項3に記載のパワー半導体モジュール(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102005016650.4 | 2005-04-12 | ||
DE102005016650A DE102005016650B4 (de) | 2005-04-12 | 2005-04-12 | Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen |
Publications (2)
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JP2006295158A JP2006295158A (ja) | 2006-10-26 |
JP4815245B2 true JP4815245B2 (ja) | 2011-11-16 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006087934A Active JP4815245B2 (ja) | 2005-04-12 | 2006-03-28 | ロウ付け式で配設された端子要素を有するパワー半導体モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US7948007B2 (ja) |
EP (1) | EP1713124B1 (ja) |
JP (1) | JP4815245B2 (ja) |
CN (1) | CN100565871C (ja) |
AT (1) | ATE450890T1 (ja) |
DE (2) | DE102005016650B4 (ja) |
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JP4338620B2 (ja) * | 2004-11-01 | 2009-10-07 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
DE102005016650B4 (de) | 2005-04-12 | 2009-11-19 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen |
DE102006058692A1 (de) * | 2006-12-13 | 2008-06-26 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Kontaktfedern |
DE102006058695B4 (de) * | 2006-12-13 | 2009-06-25 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit stumpf gelötetem Anschlusselement |
EP1936687A1 (en) * | 2006-12-22 | 2008-06-25 | ABB Technology AG | Electrical terminal |
FR2921520B1 (fr) | 2007-09-20 | 2014-03-14 | Saint Gobain | Element de connexion electrique et vitrage pourvu d'un tel element |
DE102007059818B3 (de) | 2007-12-11 | 2009-04-09 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Fensterscheibe mit einem elektrischen Flachanschlusselement |
DE102008030101A1 (de) * | 2007-12-11 | 2009-06-25 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Lötanschlusselement |
DE102008005547B4 (de) | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
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JPH07221263A (ja) * | 1994-01-28 | 1995-08-18 | Hitachi Ltd | 半導体装置 |
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JP3521651B2 (ja) * | 1996-10-18 | 2004-04-19 | 株式会社日立製作所 | パワー半導体装置 |
JP3013794B2 (ja) * | 1996-12-10 | 2000-02-28 | 富士電機株式会社 | 半導体装置 |
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JP4226200B2 (ja) * | 2000-07-25 | 2009-02-18 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
DE10103084B4 (de) * | 2001-01-24 | 2006-08-03 | Infineon Technologies Ag | Halbleitermodul und Verfahren zu seiner Herstellung |
JP2003045920A (ja) * | 2001-07-31 | 2003-02-14 | Mitsubishi Electric Corp | 電力用半導体装置及び電力用半導体装置の製造方法 |
JP4331993B2 (ja) * | 2002-10-11 | 2009-09-16 | 三菱電機株式会社 | 電力用半導体装置 |
DE10258565B3 (de) * | 2002-12-14 | 2004-08-12 | Semikron Elektronik Gmbh | Schaltungsanordnung für Halbleiterbauelemente und Verfahren zur Herstellung |
JP4244723B2 (ja) * | 2003-06-26 | 2009-03-25 | 三菱マテリアル株式会社 | パワーモジュール及びその製造方法 |
DE102004019568B4 (de) * | 2004-04-22 | 2019-06-13 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Substrat |
DE102005016650B4 (de) | 2005-04-12 | 2009-11-19 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen |
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2005
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- 2006-04-01 EP EP06007011A patent/EP1713124B1/de active Active
- 2006-04-01 AT AT06007011T patent/ATE450890T1/de active
- 2006-04-01 DE DE502006005482T patent/DE502006005482D1/de active Active
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DE102005016650B4 (de) | 2009-11-19 |
US20070235860A1 (en) | 2007-10-11 |
EP1713124A3 (de) | 2008-08-13 |
DE502006005482D1 (de) | 2010-01-14 |
CN1848425A (zh) | 2006-10-18 |
CN100565871C (zh) | 2009-12-02 |
EP1713124A2 (de) | 2006-10-18 |
ATE450890T1 (de) | 2009-12-15 |
DE102005016650A1 (de) | 2006-11-02 |
US7948007B2 (en) | 2011-05-24 |
EP1713124B1 (de) | 2009-12-02 |
JP2006295158A (ja) | 2006-10-26 |
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