JP4746540B2 - 化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て - Google Patents

化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て Download PDF

Info

Publication number: JP4746540B2
Authority: JP; Japan
Prior art keywords: pad; areas; polishing; polishing pad; polymer
Prior art date: 2003-06-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP2006515172A

Other languages

English (en)

Japanese (ja)

Other versions

JP2006526902A (ja

Inventor

ズートハンシュミスラ，

プラディップケー．ローイ，

マニッシュデオプラ，

Original Assignee

ネクスプラナーコーポレイション

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-06-03

Filing date

2004-06-03

Publication date

2011-08-10

2004-06-03 Application filed by ネクスプラナーコーポレイション filed Critical ネクスプラナーコーポレイション

2006-11-24 Publication of JP2006526902A publication Critical patent/JP2006526902A/ja

2011-08-10 Application granted granted Critical

2011-08-10 Publication of JP4746540B2 publication Critical patent/JP4746540B2/ja

2024-06-03 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

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Images

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Porous Artificial Stone Or Porous Ceramic Products (AREA)

JP2006515172A 2003-06-03 2004-06-03 化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て Expired - Lifetime JP4746540B2 (ja)

Applications Claiming Priority (9)

Application Number	Priority Date	Filing Date	Title
US47530703P	2003-06-03	2003-06-03
US47530503P	2003-06-03	2003-06-03
US47528303P	2003-06-03	2003-06-03
US47537403P	2003-06-03	2003-06-03
US60/475,283		2003-06-03
US60/475,305		2003-06-03
US60/475,307		2003-06-03
US60/475,374		2003-06-03
PCT/US2004/017638 WO2005000529A1 (en)	2003-06-03	2004-06-03	Synthesis of a functionally graded pad for chemical mechanical planarization

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2010063374A Division JP5448177B2 (ja)	2003-06-03	2010-03-18	化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て

Publications (2)

Publication Number	Publication Date
JP2006526902A JP2006526902A (ja)	2006-11-24
JP4746540B2 true JP4746540B2 (ja)	2011-08-10

Family

ID=33556644

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
JP2006515172A Expired - Lifetime JP4746540B2 (ja)	2003-06-03	2004-06-03	化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て
JP2010063374A Expired - Lifetime JP5448177B2 (ja)	2003-06-03	2010-03-18	化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
JP2010063374A Expired - Lifetime JP5448177B2 (ja)	2003-06-03	2010-03-18	化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て

Country Status (5)

Country	Link
JP (2)	JP4746540B2 (zh)
KR (1)	KR101108024B1 (zh)
CN (1)	CN1816422B (zh)
SG (2)	SG168412A1 (zh)
WO (1)	WO2005000529A1 (zh)

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* Cited by examiner, † Cited by third party
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TWI385050B (zh) *	2005-02-18	2013-02-11	Nexplanar Corp	用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR101616535B1 (ko) *	2005-02-18	2016-04-29	넥스플래너 코퍼레이션	화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그 연마 패드의 제조 및 사용 방법
CN100445037C (zh) *	2007-09-21	2008-12-24	南京航空航天大学	用于化学机械抛光的分层冷冻磨料抛光垫及其制备方法
WO2010016486A1 (ja) *	2008-08-08	2010-02-11	株式会社クラレ	研磨パッド及び研磨パッドの製造方法
US8883034B2 (en)	2009-09-16	2014-11-11	Brian Reiss	Composition and method for polishing bulk silicon
US8697576B2 (en)	2009-09-16	2014-04-15	Cabot Microelectronics Corporation	Composition and method for polishing polysilicon
US8815110B2 (en)	2009-09-16	2014-08-26	Cabot Microelectronics Corporation	Composition and method for polishing bulk silicon
US9156124B2 (en)	2010-07-08	2015-10-13	Nexplanar Corporation	Soft polishing pad for polishing a semiconductor substrate
US9731456B2 (en)	2013-03-14	2017-08-15	Sabic Global Technologies B.V.	Method of manufacturing a functionally graded article
EP3126092B1 (en) *	2014-04-03	2022-08-17	3M Innovative Properties Company	Polishing pads and systems and methods of making and using the same
TWI689406B (zh) *	2014-10-17	2020-04-01	美商應用材料股份有限公司	研磨墊及製造其之方法
CN105397609B (zh) *	2015-11-03	2017-06-27	大连理工大学	一种光学零件高精度平面的修形加工方法
CN110815038B (zh) *	2018-08-08	2021-06-04	湖北鼎龙控股股份有限公司	抛光垫及其制备方法、应用

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JPH09262759A (ja) *	1996-03-28	1997-10-07	Naoetsu Seimitsu Kako Kk	面加工装置
JPH11226861A (ja) *	1998-02-13	1999-08-24	Toshiba Mach Co Ltd	研磨布及び平面研磨装置
JPH11333699A (ja) *	1998-03-24	1999-12-07	Sony Corp	研磨パッド、研磨装置および研磨方法
US6062958A (en) *	1997-04-04	2000-05-16	Micron Technology, Inc.	Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
JP2000176829A (ja) *	1998-12-18	2000-06-27	Tdk Corp	研磨装置
JP2003501820A (ja) *	1999-06-09	2003-01-14	スリーエムイノベイティブプロパティズカンパニー	構造化ウェハの表面修正方法

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JPS63297416A (ja) *	1987-05-28	1988-12-05	Dainippon Ink & Chem Inc	熱硬化型ウレタンエラストマ−組成物
JPH01257018A (ja) *	1988-04-07	1989-10-13	Fuji Heavy Ind Ltd	異種発泡体の同時一体成形法
US5197999A (en) *	1991-09-30	1993-03-30	National Semiconductor Corporation	Polishing pad for planarization
US5897426A (en) *	1998-04-24	1999-04-27	Applied Materials, Inc.	Chemical mechanical polishing with multiple polishing pads
JPH11347919A (ja) *	1998-06-09	1999-12-21	Oki Electric Ind Co Ltd	半導体素子の研磨平坦化装置及び研磨平坦化方法
JP2000158325A (ja) *	1998-11-26	2000-06-13	Promos Technol Inc	化学機械研磨の装置と方法
US6413153B1 (en) *	1999-04-26	2002-07-02	Beaver Creek Concepts Inc	Finishing element including discrete finishing members
JP3425894B2 (ja) *	1999-05-27	2003-07-14	ロデールホールディングスインコーポレイテッド	加工品の表面を平坦化する方法
JP2001100545A (ja) *	1999-09-30	2001-04-13	Ricoh Co Ltd	中間転写体及び該中間転写体を用いた画像形成装置
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KR100394572B1 (ko) *	2000-12-28	2003-08-14	삼성전자주식회사	복합특성을 가지는 씨엠피 패드구조와 그 제조방법
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US6841480B2 (en) *	2002-02-04	2005-01-11	Infineon Technologies Ag	Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate
US20040171339A1 (en) *	2002-10-28	2004-09-02	Cabot Microelectronics Corporation	Microporous polishing pads

2004
- 2004-06-03 SG SG200802604-9A patent/SG168412A1/en unknown
- 2004-06-03 SG SG2012073722A patent/SG2012073722A/en unknown
- 2004-06-03 KR KR1020057022758A patent/KR101108024B1/ko active IP Right Grant
- 2004-06-03 JP JP2006515172A patent/JP4746540B2/ja not_active Expired - Lifetime
- 2004-06-03 WO PCT/US2004/017638 patent/WO2005000529A1/en active Application Filing
- 2004-06-03 CN CN2004800188570A patent/CN1816422B/zh not_active Expired - Lifetime
2010
- 2010-03-18 JP JP2010063374A patent/JP5448177B2/ja not_active Expired - Lifetime

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH09262759A (ja) *	1996-03-28	1997-10-07	Naoetsu Seimitsu Kako Kk	面加工装置
US6062958A (en) *	1997-04-04	2000-05-16	Micron Technology, Inc.	Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
JPH11226861A (ja) *	1998-02-13	1999-08-24	Toshiba Mach Co Ltd	研磨布及び平面研磨装置
JPH11333699A (ja) *	1998-03-24	1999-12-07	Sony Corp	研磨パッド、研磨装置および研磨方法
JP2000176829A (ja) *	1998-12-18	2000-06-27	Tdk Corp	研磨装置
JP2003501820A (ja) *	1999-06-09	2003-01-14	スリーエムイノベイティブプロパティズカンパニー	構造化ウェハの表面修正方法

Also Published As

Publication number	Publication date
WO2005000529A8 (en)	2005-03-17
JP2006526902A (ja)	2006-11-24
CN1816422A (zh)	2006-08-09
WO2005000529A1 (en)	2005-01-06
JP2010135861A (ja)	2010-06-17
JP5448177B2 (ja)	2014-03-19
CN1816422B (zh)	2011-06-22
KR101108024B1 (ko)	2012-01-25
SG168412A1 (en)	2011-02-28
SG2012073722A (en)	2016-11-29
KR20060017824A (ko)	2006-02-27

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Publication	Publication Date	Title
JP5448177B2 (ja)	2014-03-19	化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て
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