SG168412A1 - Synthesis of a functionally graded pad for chemical mechanical planarization - Google Patents
Synthesis of a functionally graded pad for chemical mechanical planarizationInfo
- Publication number
- SG168412A1 SG168412A1 SG200802604-9A SG2008026049A SG168412A1 SG 168412 A1 SG168412 A1 SG 168412A1 SG 2008026049 A SG2008026049 A SG 2008026049A SG 168412 A1 SG168412 A1 SG 168412A1
- Authority
- SG
- Singapore
- Prior art keywords
- pad
- erosion
- grading
- compliances
- asperities
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
Abstract
The material removal rate, defectivity, erosion, and dishing and the effective planarization length of a CMP process depend on the local tribology (hardness, compliances) and physical properties (pore size & density, asperities) of the pad material. Graded pads exhibit spatial modulation in various material/tribological properties customized to planarize:(i) Dissimilar material stacks such as metal/barrier or oxide/nitride [STI] with minimum dishing, erosion, over polish and nanotopography.(ii) Specialized materials (low-k, strain silicon and SOI) with minimum erosion and slurry selectivity. (iii) Devices with complex design and architecture (system-on a- chip and vertical gate) with varying pattern density and chip sizes. Several types of grading described here include annular, island, step and continuous grading. The pad grading design for a CMP process for a particular slurry chemistry and wafer sweep over the pad is based on local pad material (hardness, compliances, pore size and asperities) properties. Such functionally graded polymeric pads are expected to have significant impact in planarizing scaled (sub-100 nm) silicon ICs, disk drive, micromachine (MEMs) and nanocomposite substrates. (No suitable figure)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47530703P | 2003-06-03 | 2003-06-03 | |
US47530503P | 2003-06-03 | 2003-06-03 | |
US47528303P | 2003-06-03 | 2003-06-03 | |
US47537403P | 2003-06-03 | 2003-06-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG168412A1 true SG168412A1 (en) | 2011-02-28 |
Family
ID=33556644
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200802604-9A SG168412A1 (en) | 2003-06-03 | 2004-06-03 | Synthesis of a functionally graded pad for chemical mechanical planarization |
SG2012073722A SG2012073722A (en) | 2003-06-03 | 2004-06-03 | Synthesis of a functionally graded pad for chemical mechanical planarization |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2012073722A SG2012073722A (en) | 2003-06-03 | 2004-06-03 | Synthesis of a functionally graded pad for chemical mechanical planarization |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP4746540B2 (en) |
KR (1) | KR101108024B1 (en) |
CN (1) | CN1816422B (en) |
SG (2) | SG168412A1 (en) |
WO (1) | WO2005000529A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI385050B (en) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
KR101616535B1 (en) * | 2005-02-18 | 2016-04-29 | 넥스플래너 코퍼레이션 | Customized polishing pads for cmp and methods of fabrication and use thereof |
CN100445037C (en) * | 2007-09-21 | 2008-12-24 | 南京航空航天大学 | Laminated freezing abrasive material polishing pad used for chemico-mechanical polishing and method of producing the same |
WO2010016486A1 (en) * | 2008-08-08 | 2010-02-11 | 株式会社クラレ | Polishing pad and method for manufacturing the polishing pad |
US8883034B2 (en) | 2009-09-16 | 2014-11-11 | Brian Reiss | Composition and method for polishing bulk silicon |
US8697576B2 (en) | 2009-09-16 | 2014-04-15 | Cabot Microelectronics Corporation | Composition and method for polishing polysilicon |
US8815110B2 (en) | 2009-09-16 | 2014-08-26 | Cabot Microelectronics Corporation | Composition and method for polishing bulk silicon |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US9731456B2 (en) | 2013-03-14 | 2017-08-15 | Sabic Global Technologies B.V. | Method of manufacturing a functionally graded article |
EP3126092B1 (en) * | 2014-04-03 | 2022-08-17 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
TWI689406B (en) * | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | Polishing pad and method of fabricating the same |
CN105397609B (en) * | 2015-11-03 | 2017-06-27 | 大连理工大学 | A kind of modification processing of optical element high precision plane |
CN110815038B (en) * | 2018-08-08 | 2021-06-04 | 湖北鼎龙控股股份有限公司 | Polishing pad and preparation method and application thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010001756A1 (en) * | 1998-04-24 | 2001-05-24 | Applied Materials, Inc. A Delaware Corporation | Chemical mechanical polishing with multiple polishing pads |
US6413153B1 (en) * | 1999-04-26 | 2002-07-02 | Beaver Creek Concepts Inc | Finishing element including discrete finishing members |
US20030148614A1 (en) * | 2002-02-04 | 2003-08-07 | Simpson Alexander William | Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63297416A (en) * | 1987-05-28 | 1988-12-05 | Dainippon Ink & Chem Inc | Thermosetting urethane elastomer composition |
JPH01257018A (en) * | 1988-04-07 | 1989-10-13 | Fuji Heavy Ind Ltd | Simultaneous monolithic molding method for different kind of foam |
US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
JPH09262759A (en) * | 1996-03-28 | 1997-10-07 | Naoetsu Seimitsu Kako Kk | Surface processing device |
US6062958A (en) * | 1997-04-04 | 2000-05-16 | Micron Technology, Inc. | Variable abrasive polishing pad for mechanical and chemical-mechanical planarization |
JPH11226861A (en) * | 1998-02-13 | 1999-08-24 | Toshiba Mach Co Ltd | Abrasive cloth and surface polishing device |
JPH11333699A (en) * | 1998-03-24 | 1999-12-07 | Sony Corp | Polishing pad, polishing device and polishing method |
JPH11347919A (en) * | 1998-06-09 | 1999-12-21 | Oki Electric Ind Co Ltd | Device and method for abrading and flattening semi-conductor element |
JP2000158325A (en) * | 1998-11-26 | 2000-06-13 | Promos Technol Inc | Device and method for chemical and mechanical polishing |
JP2000176829A (en) * | 1998-12-18 | 2000-06-27 | Tdk Corp | Polishing device |
JP3425894B2 (en) * | 1999-05-27 | 2003-07-14 | ロデール ホールディングス インコーポレイテッド | How to flatten the surface of a processed product |
US6234875B1 (en) * | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
JP2001100545A (en) * | 1999-09-30 | 2001-04-13 | Ricoh Co Ltd | Intermediate transfer body and image forming device using the intermediate transfer body |
US6257973B1 (en) * | 1999-11-04 | 2001-07-10 | Norton Company | Coated abrasive discs |
KR100394572B1 (en) * | 2000-12-28 | 2003-08-14 | 삼성전자주식회사 | multi characterized CMP pad structure and method for fabricating same |
US6632259B2 (en) * | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
-
2004
- 2004-06-03 SG SG200802604-9A patent/SG168412A1/en unknown
- 2004-06-03 SG SG2012073722A patent/SG2012073722A/en unknown
- 2004-06-03 KR KR1020057022758A patent/KR101108024B1/en active IP Right Grant
- 2004-06-03 JP JP2006515172A patent/JP4746540B2/en not_active Expired - Lifetime
- 2004-06-03 WO PCT/US2004/017638 patent/WO2005000529A1/en active Application Filing
- 2004-06-03 CN CN2004800188570A patent/CN1816422B/en not_active Expired - Lifetime
-
2010
- 2010-03-18 JP JP2010063374A patent/JP5448177B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010001756A1 (en) * | 1998-04-24 | 2001-05-24 | Applied Materials, Inc. A Delaware Corporation | Chemical mechanical polishing with multiple polishing pads |
US6413153B1 (en) * | 1999-04-26 | 2002-07-02 | Beaver Creek Concepts Inc | Finishing element including discrete finishing members |
US20030148614A1 (en) * | 2002-02-04 | 2003-08-07 | Simpson Alexander William | Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
Also Published As
Publication number | Publication date |
---|---|
WO2005000529A8 (en) | 2005-03-17 |
JP2006526902A (en) | 2006-11-24 |
CN1816422A (en) | 2006-08-09 |
WO2005000529A1 (en) | 2005-01-06 |
JP2010135861A (en) | 2010-06-17 |
JP5448177B2 (en) | 2014-03-19 |
CN1816422B (en) | 2011-06-22 |
JP4746540B2 (en) | 2011-08-10 |
KR101108024B1 (en) | 2012-01-25 |
SG2012073722A (en) | 2016-11-29 |
KR20060017824A (en) | 2006-02-27 |
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