JP4674158B2 - Ledパッケージフレーム並びにこれを採用するledパッケージ - Google Patents
Ledパッケージフレーム並びにこれを採用するledパッケージ Download PDFInfo
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- JP4674158B2 JP4674158B2 JP2005376056A JP2005376056A JP4674158B2 JP 4674158 B2 JP4674158 B2 JP 4674158B2 JP 2005376056 A JP2005376056 A JP 2005376056A JP 2005376056 A JP2005376056 A JP 2005376056A JP 4674158 B2 JP4674158 B2 JP 4674158B2
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- 230000002093 peripheral effect Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 5
- 238000002310 reflectometry Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 description 15
- 229910052709 silver Inorganic materials 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
102、202、302、402 LEDチップ
110、110-1、110-2、210、210-1、310、410 熱伝達部材
118、218、318、418a、418b 収納部
120、220、320、420 リード-被服結合体
122、222、322、422 リード
124、224、324、424 絶縁被服
150、200、200-1 LEDパッケージ
Claims (9)
- LEDチップ、
上記LEDチップが一面に装着される柱と、上記柱の側面から外側へと延長される外周部とを含み、"L"字形の空間である収納部が形成された熱伝達部材、
一端側が上記熱伝達部材の収納部に収容されて上記LEDチップと電気的に連結されたリード、及び
上記熱伝達部材と上記リードを互いに電気的に隔離させるようにこれらの間に密着して提供された電気絶縁層を含み、
上記熱伝達部材の収納部は、前記リードの一端側が前記外周部の側面側から挿入して嵌め込まれる収納領域と、上記熱伝達部材を貫通して上記収納領域と連結される開放領域とを含む高出力LEDパッケージに用いられるLEDパッケージフレーム。 - 上記熱伝達部材は第2の上記収納部が更に形成され、
上記LEDパッケージフレームは上記第2の収納部に直接挿入された第2の上記リードを含むことを特徴とする請求項1に記載のLEDパッケージフレーム。 - 上記熱伝達部材は上記電気絶縁層を介して上記リードの一端を取り囲むことを特徴とする請求項1または2に記載のLEDパッケージフレーム。
- 上記熱伝達部材は上記LEDチップの周りに空洞を形成するよう上記熱伝達部材の縁から上記LEDチップの向こう側に延長された反射鏡を具備することを特徴とする請求項1から3のいずれか1項に記載のLEDパッケージフレーム。
- 上記熱伝達部材の縁と上記リードの一端側を封止するように上記熱伝達部材周囲に射出された基部をさらに含むことを特徴とする請求項4に記載のLEDパッケージフレーム。
- 請求項1から3のいずれか1項に記載のLEDパッケージフレーム、及び
上記熱伝達部材の上記LEDチップが装着される反対側の他面が少なくとも一部が外部に露出され、上記リードの他端が突出するよう上記LEDパッケージフレームを封止する樹脂からなったパッケージ本体を含むLEDパッケージ。 - 請求項1から請求項3のいずれか1項に記載のLEDパッケージフレーム、
上記熱伝達部材の縁及びそれに隣接した上記リードの一部を封止ながら内側に空洞を形成するよう射出された外壁、及び
上記空洞内に埋め込まれた透明樹脂を含むLEDパッケージ。 - 上記外壁の内面には高反射率材料の層が形成されたことを特徴とする請求項7に記載のLEDパッケージ。
- 請求項4又は5に記載のLEDパッケージフレーム、及び
上記空洞内に埋め込まれた透明な樹脂を含むLEDパッケージ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050008773A KR100631901B1 (ko) | 2005-01-31 | 2005-01-31 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006210904A JP2006210904A (ja) | 2006-08-10 |
JP4674158B2 true JP4674158B2 (ja) | 2011-04-20 |
Family
ID=36755587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005376056A Active JP4674158B2 (ja) | 2005-01-31 | 2005-12-27 | Ledパッケージフレーム並びにこれを採用するledパッケージ |
Country Status (4)
Country | Link |
---|---|
US (2) | US7592631B2 (ja) |
JP (1) | JP4674158B2 (ja) |
KR (1) | KR100631901B1 (ja) |
CN (1) | CN100452455C (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006048230B4 (de) * | 2006-10-11 | 2012-11-08 | Osram Ag | Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung |
TWI363432B (en) * | 2007-02-26 | 2012-05-01 | Everlight Electronics Co Ltd | A structure of a light emitting diode and a method to assemble thereof |
KR101365621B1 (ko) | 2007-09-04 | 2014-02-24 | 서울반도체 주식회사 | 열 방출 슬러그들을 갖는 발광 다이오드 패키지 |
TW200915597A (en) * | 2007-09-17 | 2009-04-01 | Everlight Electronics Co Ltd | Light emitting diode device |
KR100978574B1 (ko) | 2008-12-17 | 2010-08-27 | 삼성엘이디 주식회사 | 엘이디 패키지 |
KR101615497B1 (ko) * | 2009-11-27 | 2016-04-27 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
KR101109754B1 (ko) * | 2010-04-15 | 2012-02-21 | 김경태 | 발광 다이오드 패키지의 제조방법 |
EP2565951B1 (en) * | 2010-04-26 | 2019-07-31 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting unit and illuminating apparatus |
KR101130137B1 (ko) * | 2010-07-02 | 2012-03-28 | 연세대학교 산학협력단 | 발광다이오드 모듈 |
JP5049382B2 (ja) | 2010-12-21 | 2012-10-17 | パナソニック株式会社 | 発光装置及びそれを用いた照明装置 |
DE102011013277A1 (de) * | 2011-03-07 | 2012-09-13 | Schott Ag | Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System" |
WO2012119750A1 (de) | 2011-03-07 | 2012-09-13 | Schott Ag | Glassystem zum hermetischen verbund von cu bauteilen sowie gehäuse für elektronische bauteile |
US8405181B2 (en) * | 2011-03-16 | 2013-03-26 | Intellectual Discovery Co., Ltd. | High brightness and high contrast plastic leaded chip carrier LED |
JP6201617B2 (ja) | 2013-10-17 | 2017-09-27 | 日亜化学工業株式会社 | 発光装置 |
USD765902S1 (en) | 2014-04-01 | 2016-09-06 | Xicato, Inc. | Thin LED module |
USD744963S1 (en) | 2014-04-01 | 2015-12-08 | Xicato, Inc. | LED module |
US10514131B2 (en) * | 2016-07-06 | 2019-12-24 | Epistar Corporation | Light-emitting apparatus |
JP2017076809A (ja) * | 2016-12-05 | 2017-04-20 | 大日本印刷株式会社 | 樹脂付リードフレーム、半導体装置、照明装置 |
KR102037357B1 (ko) | 2018-06-21 | 2019-11-26 | (주)라이타이저 | 색변환 다이오드의 제조방법 |
CN110233192A (zh) * | 2018-08-30 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | 一种发光器件及其制作方法、引线框架、支架、发光装置 |
KR102125837B1 (ko) | 2018-08-30 | 2020-06-23 | (주)라이타이저 | 광확산형 색변환 다이오드 및 이의 제조방법 |
TWI781738B (zh) * | 2021-08-24 | 2022-10-21 | 鴻海精密工業股份有限公司 | 發光陣列基板、發光陣列基板的製備方法及顯示面板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347588A (ja) * | 2002-05-28 | 2003-12-05 | Sumitomo Electric Ind Ltd | 白色発光素子 |
JP2004071771A (ja) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | 発光ダイオード |
JP2005019662A (ja) * | 2003-06-26 | 2005-01-20 | Nichia Chem Ind Ltd | 発光装置 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4026008A (en) * | 1972-10-02 | 1977-05-31 | Signetics Corporation | Semiconductor lead structure and assembly and method for fabricating same |
US5208467A (en) * | 1988-07-28 | 1993-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a film-covered packaged component |
DE58909875D1 (de) * | 1989-05-31 | 2000-08-31 | Osram Opto Semiconductors Gmbh | Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements |
JPH0749815Y2 (ja) * | 1990-07-23 | 1995-11-13 | シャープ株式会社 | 表面実装型光結合装置 |
JPH0961245A (ja) * | 1995-08-29 | 1997-03-07 | Matsushita Electric Ind Co Ltd | 非接触温度計 |
KR0159986B1 (ko) * | 1995-09-04 | 1998-12-01 | 아남산업주식회사 | 히트싱크 내장형 반도체 패키지의 제조방법 및 그 구조 |
JP3830583B2 (ja) * | 1996-08-15 | 2006-10-04 | 富士通株式会社 | 光半導体アセンブリ |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
JP2000173947A (ja) * | 1998-12-07 | 2000-06-23 | Tokai Rika Co Ltd | プラスティックパッケージ |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
JP2002232013A (ja) * | 2001-02-02 | 2002-08-16 | Rohm Co Ltd | 半導体発光素子 |
US6541800B2 (en) * | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
DE10117889A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
CN2540685Y (zh) | 2002-06-03 | 2003-03-19 | 葛世潮 | 高效率大功率发光二极管 |
US7497596B2 (en) * | 2001-12-29 | 2009-03-03 | Mane Lou | LED and LED lamp |
JP2003309313A (ja) | 2002-04-15 | 2003-10-31 | Chichibu Fuji Co Ltd | 半導体レーザユニット |
TW558803B (en) * | 2002-04-16 | 2003-10-21 | Yuan Lin | Flexible light-emitting device and the manufacturing method |
JP3910144B2 (ja) * | 2003-01-06 | 2007-04-25 | シャープ株式会社 | 半導体発光装置およびその製造方法 |
CN2617039Y (zh) * | 2003-02-21 | 2004-05-19 | 游尚桦 | 粘着型led引线架 |
JP4174823B2 (ja) * | 2003-03-27 | 2008-11-05 | サンケン電気株式会社 | 半導体発光装置 |
CN2617939Y (zh) | 2003-04-11 | 2004-05-26 | 陈政雄 | 引擎空气催化器 |
JP4138586B2 (ja) * | 2003-06-13 | 2008-08-27 | スタンレー電気株式会社 | 光源用ledランプおよびこれを用いた車両用前照灯 |
TWI240423B (en) * | 2004-03-12 | 2005-09-21 | Opto Tech Corp | Light emitting device with high heat dissipation efficiency |
EP1794808B1 (en) * | 2004-09-10 | 2017-08-09 | Seoul Semiconductor Co., Ltd. | Light emitting diode package having multiple molding resins |
US7119422B2 (en) * | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
WO2006065007A1 (en) * | 2004-12-16 | 2006-06-22 | Seoul Semiconductor Co., Ltd. | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
US7763478B2 (en) * | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
US7852015B1 (en) * | 2006-10-11 | 2010-12-14 | SemiLEDs Optoelectronics Co., Ltd. | Solid state lighting system and maintenance method therein |
CN101539279B (zh) * | 2008-03-19 | 2010-09-29 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
-
2005
- 2005-01-31 KR KR1020050008773A patent/KR100631901B1/ko active IP Right Grant
- 2005-12-27 JP JP2005376056A patent/JP4674158B2/ja active Active
- 2005-12-28 US US11/319,101 patent/US7592631B2/en active Active
- 2005-12-30 CN CNB2005101339860A patent/CN100452455C/zh active Active
-
2009
- 2009-08-27 US US12/549,252 patent/US7968894B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347588A (ja) * | 2002-05-28 | 2003-12-05 | Sumitomo Electric Ind Ltd | 白色発光素子 |
JP2004071771A (ja) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | 発光ダイオード |
JP2005019662A (ja) * | 2003-06-26 | 2005-01-20 | Nichia Chem Ind Ltd | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
US7592631B2 (en) | 2009-09-22 |
US20060169999A1 (en) | 2006-08-03 |
US20090321773A1 (en) | 2009-12-31 |
US7968894B2 (en) | 2011-06-28 |
JP2006210904A (ja) | 2006-08-10 |
KR20060087900A (ko) | 2006-08-03 |
CN1822401A (zh) | 2006-08-23 |
KR100631901B1 (ko) | 2006-10-11 |
CN100452455C (zh) | 2009-01-14 |
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