CN2540685Y - 高效率大功率发光二极管 - Google Patents
高效率大功率发光二极管 Download PDFInfo
- Publication number
- CN2540685Y CN2540685Y CN02236692U CN02236692U CN2540685Y CN 2540685 Y CN2540685 Y CN 2540685Y CN 02236692 U CN02236692 U CN 02236692U CN 02236692 U CN02236692 U CN 02236692U CN 2540685 Y CN2540685 Y CN 2540685Y
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- chip
- backlight unit
- high power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000011159 matrix material Substances 0.000 claims description 22
- 239000004332 silver Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 238000005286 illumination Methods 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000007812 deficiency Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN02236692U CN2540685Y (zh) | 2002-06-03 | 2002-06-03 | 高效率大功率发光二极管 |
AU2002367196A AU2002367196A1 (en) | 2001-12-29 | 2002-12-30 | A led and led lamp |
PCT/CN2002/000930 WO2003056636A1 (en) | 2001-12-29 | 2002-12-30 | A led and led lamp |
KR1020047010358A KR100991830B1 (ko) | 2001-12-29 | 2002-12-30 | Led 및 led램프 |
CNB028261275A CN100373638C (zh) | 2001-12-29 | 2002-12-30 | 发光二极管及其发光二极管灯 |
JP2003557050A JP2005513815A (ja) | 2001-12-29 | 2002-12-30 | 発光ダイオード及び発光ダイオード・ランプ |
KR1020097019924A KR100991829B1 (ko) | 2001-12-29 | 2002-12-30 | Led 및 led램프 |
KR1020097019923A KR100991827B1 (ko) | 2001-12-29 | 2002-12-30 | Led 및 led램프 |
EP02790249A EP1467414A4 (en) | 2001-12-29 | 2002-12-30 | LED AND LED LAMP |
US10/500,315 US7497596B2 (en) | 2001-12-29 | 2002-12-30 | LED and LED lamp |
KR1020097019925A KR20090115810A (ko) | 2001-12-29 | 2002-12-30 | Led 및 led램프 |
US11/430,914 US7347589B2 (en) | 2001-12-29 | 2006-05-10 | LED and LED lamp |
US12/265,911 US7736027B2 (en) | 2001-12-29 | 2008-11-06 | LED and LED lamp |
JP2009241101A JP2010050473A (ja) | 2001-12-29 | 2009-10-20 | 発光ダイオード平面光源 |
JP2009241098A JP2010050472A (ja) | 2001-12-29 | 2009-10-20 | 発光ダイオード・ランプ及び発光ダイオード交通灯 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN02236692U CN2540685Y (zh) | 2002-06-03 | 2002-06-03 | 高效率大功率发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2540685Y true CN2540685Y (zh) | 2003-03-19 |
Family
ID=33710878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN02236692U Expired - Lifetime CN2540685Y (zh) | 2001-12-29 | 2002-06-03 | 高效率大功率发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2540685Y (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005098971A1 (fr) * | 2004-04-08 | 2005-10-20 | Yu-Chao Wu | Dispositif a diode electroluminescente, dispositif de dispersion de chaleur a diode electroluminescente et appareil d'eclairage comprenant le dispositif precite |
CN100375300C (zh) * | 2003-11-25 | 2008-03-12 | 葛世潮 | 大功率发光二极管 |
CN100444415C (zh) * | 2004-07-06 | 2008-12-17 | 旭山光电股份有限公司 | 气密式高导热芯片封装组件 |
CN100452455C (zh) * | 2005-01-31 | 2009-01-14 | 三星电机株式会社 | Led封装框架和具有该led封装框架的led封装 |
CN101232063B (zh) * | 2007-01-26 | 2011-06-29 | 深圳市方大国科光电技术有限公司 | 一种大功率led台灯组装方法 |
CN102280564A (zh) * | 2011-08-19 | 2011-12-14 | 华南师范大学 | 具有荧光粉散热层的发光二极管 |
CN101297153B (zh) * | 2005-10-28 | 2012-07-04 | 飞利浦拉米尔德斯照明设备有限责任公司 | 多件式反射角变换器 |
US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
WO2013020330A1 (zh) * | 2011-08-09 | 2013-02-14 | 深圳市瑞丰光电子股份有限公司 | 一种led模组及照明装置 |
CN104990020A (zh) * | 2015-08-04 | 2015-10-21 | 苏州晶品新材料股份有限公司 | 一种双面出光薄片式led汽车大灯 |
-
2002
- 2002-06-03 CN CN02236692U patent/CN2540685Y/zh not_active Expired - Lifetime
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100375300C (zh) * | 2003-11-25 | 2008-03-12 | 葛世潮 | 大功率发光二极管 |
WO2005098971A1 (fr) * | 2004-04-08 | 2005-10-20 | Yu-Chao Wu | Dispositif a diode electroluminescente, dispositif de dispersion de chaleur a diode electroluminescente et appareil d'eclairage comprenant le dispositif precite |
CN100444415C (zh) * | 2004-07-06 | 2008-12-17 | 旭山光电股份有限公司 | 气密式高导热芯片封装组件 |
US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
CN100452455C (zh) * | 2005-01-31 | 2009-01-14 | 三星电机株式会社 | Led封装框架和具有该led封装框架的led封装 |
US7968894B2 (en) | 2005-01-31 | 2011-06-28 | Samsung Electro-Mechanics Co., Ltd. | LED package frame and LED package having the same |
US7592631B2 (en) | 2005-01-31 | 2009-09-22 | Samsung Electro-Mechanics Co., Ltd. | LED package frame and LED package having the same |
CN101297153B (zh) * | 2005-10-28 | 2012-07-04 | 飞利浦拉米尔德斯照明设备有限责任公司 | 多件式反射角变换器 |
US8231251B2 (en) | 2005-10-28 | 2012-07-31 | Philips Lumileds Lighting Company Llc | Multiple piece reflective angle transformer |
CN101232063B (zh) * | 2007-01-26 | 2011-06-29 | 深圳市方大国科光电技术有限公司 | 一种大功率led台灯组装方法 |
WO2013020330A1 (zh) * | 2011-08-09 | 2013-02-14 | 深圳市瑞丰光电子股份有限公司 | 一种led模组及照明装置 |
CN102280564A (zh) * | 2011-08-19 | 2011-12-14 | 华南师范大学 | 具有荧光粉散热层的发光二极管 |
CN104990020A (zh) * | 2015-08-04 | 2015-10-21 | 苏州晶品新材料股份有限公司 | 一种双面出光薄片式led汽车大灯 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HANGZHOU FUYANG NOVELTY ELECTRONICS CO., LTD. Free format text: FORMER OWNER: GE SHICHAO Effective date: 20040109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20040109 Address after: 311404 Hangzhou Fuyang New Economic Development Zone Patentee after: Hangzhou Fuyang Novel Electronics Co., Ltd. Address before: Two road 310012 Zhejiang city in Hangzhou Province, the Qiuzhi Lane room 2-203 Patentee before: Ge Shichao |
|
C56 | Change in the name or address of the patentee |
Owner name: ZHEJIANG MANELUX LIGHTING CO., LTD. Free format text: FORMER NAME: HANGZHOU FUYANG XINYING ELECTRONICS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: China Fuyang New Economic Development Zone, Hangzhou: 311404 Patentee after: Zhejiang Manelux Lighting Co., Ltd. Address before: China Fuyang New Economic Development Zone, Hangzhou: 311404 Patentee before: Hangzhou Fuyang Novel Electronics Co., Ltd. |
|
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20120603 Granted publication date: 20030319 |