M335801 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種發光二極體模組，且特別是有關 於設有複數個第二基板的發光二極體模組。 【先前技術】 • 發光二極體（Light Emitting Diode ; LED)具有工作電壓 低，耗電量小，發光效率高，反應時間短，光色純，結構 牢固，抗衝擊，耐振動，性能穩定可靠，重量輕，體積小 及成本低等特點。隨著技術的進步，LED可展現的亮度等 級越來越高，其應用領域也越來越廣泛，例如：大面積圖 文顯示全彩屏，狀態指示、標誌照明、信號顯示、液晶顯 示器的背光源或車内照明。 習用LED模組之製程中，需先將LED個別封裝後，形 成LED封裝結構，再利用表面黏著技術（Surface MountM335801 VIII. New Description: [New Technical Field] The present invention relates to a light-emitting diode module, and more particularly to a light-emitting diode module having a plurality of second substrates. [Prior Art] • Light Emitting Diode (LED) has low operating voltage, low power consumption, high luminous efficiency, short reaction time, pure light color, firm structure, impact resistance, vibration resistance, stable and reliable performance. Light weight, small size and low cost. With the advancement of technology, LEDs can display higher and higher brightness levels, and their application fields are more and more extensive, such as: large-area graphic display full color screen, status indication, logo illumination, signal display, backlight of liquid crystal display Or interior lighting. In the process of customizing LED modules, LEDs must be individually packaged to form an LED package structure, and then surface mount technology (Surface Mount)
Technology ; SMT)將LED之電極焊合於基板上形成電性通Technology; SMT) soldering the electrodes of the LEDs to the substrate to form an electrical communication
路，產生LED模組，其中之基板通常為印刷電路板（Printed I “ Circuit Board ; PCB)。 • 另外，複數個LED晶片亦可直接設置於基板上，再進 行封裝，亦即利用基板來取代LED封裝基座，以形成LED 封裝模組。此時，由於LED晶片可直接透過基板來進行散 熱’其散熱路徑較短’因而具有較佳之散熱效果，並可簡 化LED封裝模組之設計。 然而，由於多個LED晶片係直接設置於單一基板上， 因此，若此些LED晶片的其中一者出現故障或工作效率不 5 M335801 佳的情形時，並無法對個別之LED晶片進行更換，而此LED 封裝模組即視為不良品，影響LED封裝模組之模組品質和 產品良率。 【新型内容】 因此本新型之一方面係在於提供一種發光二極體模 - 組，藉以允許單獨更換損壞之第二基板，而無需更換整組 發光二極體模組。 & 本新型之又一方面係在於提供一種發光二極體模組， 藉以具有預設形狀，並可進行對應組裝，因而提升組裝裕 度。 根據本新型之實施例，本新型之發光二極體模組至少 包含有第一基板、複數個第二基板及複數個發光二極體晶 片。此些第二基板設置於第一基板上，其中每一此些第二 基板設有複數個凹陷部，且此些第二基板與此第一基板之 間的結合方式係允許進行解除。此些發光二極體晶片係設 | 置於每一此些第二基板的此些凹陷部内。 ^ 因此，本新型之發光二極體模組可提升散熱效果，且 ♦ 可節省封裝結構之設計空間和成本。當單一第二基板上之 發光二極體晶片損壞時，即可單獨進行更換，而無需更換 整組發光二極體模組。又，此些第二基板具有預設形狀， 可相互對應組合，因而提升組裝裕度。 【實施方式】 為讓本新型之上述和其他目的、特徵、優點與實施例 6 M335801 能更明顯易懂，本說明書將特舉出一系列實施例來加以說 明。但值得注意的是，此些實施例只是用以說明本新型之 實施方式，而非用以限定本新型。 請參照第1A圖和第1B圖，其係繪示依照本新型之第 一實施例之發光二極體封裝模組的剖面示意圖。本實施例 之發光二極體模組100至少包含有第一基板110、複數個第 二基板120、複數個發光二極體晶片130及封膠體140。此 些第二基板120係設置於第一基板110上，其中此些第二 基板120可允許解除與第一基板110之間的結合設置。此 些發光二極體晶片130係設置於每一此些第二基板120,封 膠體140係用以包覆並密封住此些發光二極體晶片130。 如第1A圖和第1B圖所示，本實施例之第一基板110 係用以承載此些第二基板120,第一基板110之材料可為金 屬或非金屬材料，例如為金屬基板或塑膠基板（Plastic Substrate)，第一基板110亦可配設有電路，例如為印刷電 路板（Printed circuit board ; PCB)或軟性印刷電路板 (Flexible Printed Circuits ; FPC)。再者，第一基板 110 亦可 為複合結構，例如可由導電材料與電性絕緣材料所組成， 例如具有金屬核心的印刷電路板（Metal Core PCB ; MCPCB)，此導電材料可選自於由金屬材料、陶瓷材料、半 導體材料及上述材料之任意組合所組成之一族群。第一基 板110較佳係以良好導熱性材料所製成，例如：銅、鋁或 陶瓷，以提升發光二極體模組100的散熱效果。 如第1A圖和第1B圖所示，本實施例之每一此些第二 基板120可用以直接設置複數個發光二極體晶片130,而可 7 M335801 形成子封裝模組。複數個子封裝模組可組裝於第一基板110 上，而形成本實施例之發光二極體模組100。第二基板120 可配設有電路（未繪示），例如可為印刷電路板（Printed circuit board ; PCB)或軟性印刷電路板（Flexible Printed Circuits ; FPC)。第二基板120亦可為複合結構’例如具有 金屬核心的印刷電路板（Metal Core PCB ; MCPCB)。每一此 些第二基板120設有複數個凹陷部121，以容設此些發光二 極體晶片130。第二基板120之凹陷部121例如係呈圓杯形 凹陷結構，並形成有反射面122於凹陷部121的内周面。 反射面122較佳係形成淺色系的顏色，例如白色，以提升 的光反射效果。再者，反射面122亦可塗佈一高反射率材 料，例如·· A卜 Ag、Cr、Mo、Ti、Pt、Pd、Au、Ti02、Si02、 AINd或上述材料之任意組合，藉以提升反射面122的表面 反射率。 如第1A圖和第1B圖所示，在本實施例中，發光二極 體晶片130可藉由晶粒黏著劑來黏著於凹陷部121的底 部，而凹陷部121的底部設有二電極接墊123，其電性連接 至第二基板120之電路，並藉由二銲線124(例如：金線、 銀線、銅線或鋁線）來電性連接於發光二極體晶片13〇與電 極接墊123之間，其中電極接墊123之材料例如：銀、金、 鉑、鈀、鎳、鎢、銅、鎘、氧化鎘、錫、氧化錫、氧化銦 錫（ITO)、鉬、銥、铑或其合金。然不限於此，發光二極體 晶片130亦可藉由共晶焊接或表面黏著（SMD)的方式來電 性連接於電極接墊123。 又，在本實施例中，第二基板12〇可為複合結構，其 8 M335801 具有金屬基板125(例如：銅、金、銀、鐵、銘或其合金材 料）和絕緣層126，絕緣層126係形成於金屬基板125上， 絕緣層126之材料例如：耐高溫塑膠、環氧樹脂、玻璃纖 維、聚-鄰·苯二甲醯胺（PPA)、氮化硼、氮化鋁、氧化鋁、 氧化鈦、氧化鈣或陶瓷等絕緣材質。此時，絕緣層126可 一體成型有凹陷部121，並形成電極接墊123於凹陷部121 的底部，以電性連接發光二極體晶片130之電極。 請參照第2A圖至第2E圖，其係繪示依照本新型之第 一實施例之發光二極體封裝模組之第二基板的組合俯視示 意圖。本實施例之每一此^第二基板120可具有預設形狀， 例如··矩形、三角形、部分環形、六角形、多邊形或其他 任意形狀。且此些第二基板120之形狀可允許進行相互對 應組合，再設置於第一基板110上。其中此些第二基板120 之間可相互電性串聯或並聯，亦可各別對外電性連接。 如第1A圖和第1B圖所示，當設置此些第二基板120 於第一基板110上時，此些第二基板可選擇利用允許重工 的方式來結合於第一基板110上，例如：螺固、焊錫、嵌 設、緊配或黏著等方式，藉以允許解除第一基板110和第 二基板120之間的結合。因此，當此些第二基板120之其 中任意一者上的發光二極體晶片130出現故障或工作效率 不佳的情形時，即可解除單一第二基板120(其具有不良的 發光二極體晶片130)與第一基板110之間的結合設置，並 進行更換，而不致影響其他第二基板120(其未具有不良的 發光二極體晶片130)。 如第1A圖和第1B圖所示，本實施例之封膠體140的 9 M335801 材質例如為··環氧樹脂、職A、聚碳酸g_yearb_te) 或夕膠用以包覆並密封發光二極體晶片⑽。值得注意的 是，封膠體140可分別形成於每-此些第二基板12〇的複 數個凹陷部121中(如第1A圖所示)；或者，亦可直接覆蓋 於2此些第一基板120上（如第1B圖所示），因而可包覆 並密封住每-此些第二基板12G上的複數個發光二極體晶 片 130 〇 由上述本新型的實施例可知，本新型之發光二極體模 組的多個發光二極體晶片可直接設置於第二基板上，因而 可知:升政熱效果，且可節省封裝結構之設計空間和成本。 再者"由於母此些第二基板可個別進行折卸和更換，因 此，當單一第二基板上之發光二極體晶片損壞時，即可單 獨進行更換，而無需更換整組發光二極體模組，因而可節 省發光一極體模組的汰換成本。又，第一基板上之此些第 二基板具有預設形狀，可相互對應組合，因而提升組裝裕 度。 雖然本新型已以實施例揭露如上，然其並非用以限定 本新型’任何熟習此技藝者，在不脫離本新型之精神和範 圍内’當可作各種之更動與潤飾，因此本新型之保護範圍 當視後附之申請專利範圍所界定者為準。‘ 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1A圖和第1B圖係繪示依照本新型之第一實施例之 M335801 發光二極體封裝模組的剖面示意圖。 第2A圖至第2E圖係繪示依照本新型之第一實施例之 發光二極體封裝模組之第二基板的組合俯視示意圖。 【主要元件符號說明】 100 ： 發光二極體模組 110 ： 第一基板 120 ： 第二基板 121 ： 凹陷部 122 ： 反射面 123 ： 電極接墊 124 ： 銲線 125 ： 金屬基板 126 ： 絕緣層 130 ： 發光二極體晶片 140 ： 封膠體 11The LED module is produced, and the substrate is usually a printed circuit board (Printed I “Circuit Board”; • In addition, a plurality of LED chips can be directly disposed on the substrate and then packaged, that is, replaced by a substrate. The LED package base is used to form an LED package module. At this time, since the LED chip can directly transmit heat through the substrate, the heat dissipation path is shorter, thereby having better heat dissipation effect and simplifying the design of the LED package module. Since a plurality of LED chips are directly disposed on a single substrate, if one of the LED chips fails or the working efficiency is not 5 M335801, the individual LED chips cannot be replaced. The LED package module is regarded as a defective product, which affects the module quality and product yield of the LED package module. [New content] Therefore, one aspect of the present invention is to provide a light-emitting diode module-group, thereby allowing replacement alone. The damaged second substrate does not need to replace the entire set of light emitting diode modules. & Another aspect of the present invention is to provide a light emitting diode module According to an embodiment of the present invention, the LED module of the present invention includes at least a first substrate, a plurality of second substrates, and a plurality of illuminations. The second substrate is disposed on the first substrate, wherein each of the second substrates is provided with a plurality of recesses, and the manner of bonding between the second substrates and the first substrate is allowed The light-emitting diode chip system is placed in the recesses of each of the second substrates. ^ Therefore, the novel light-emitting diode module can improve heat dissipation, and ♦ can save packaging The design space and cost of the structure. When the LEDs on the single second substrate are damaged, they can be replaced separately without replacing the entire group of LED modules. Moreover, the second substrates have presets. The shapes can be combined with each other, thereby increasing the assembly margin. [Embodiment] The above and other objects, features, advantages and embodiments of the present invention can be more clearly understood. The present invention will be described with reference to a series of embodiments, but it should be noted that these embodiments are merely illustrative of the embodiments of the present invention and are not intended to limit the present invention. Please refer to FIG. 1A and FIG. A schematic diagram of a light emitting diode package according to a first embodiment of the present invention is shown. The LED module 100 of the present embodiment includes at least a first substrate 110 and a plurality of second substrates 120. The plurality of LEDs 130 and the encapsulant 140. The second substrate 120 is disposed on the first substrate 110, wherein the second substrates 120 are allowed to be disengaged from the first substrate 110. The LED chips 130 are disposed on each of the second substrates 120. The encapsulant 140 is used to cover and seal the LED chips 130. As shown in FIG. 1A and FIG. 1B, the first substrate 110 of the embodiment is used to carry the second substrate 120. The material of the first substrate 110 may be a metal or non-metal material, such as a metal substrate or a plastic. The first substrate 110 may also be provided with a circuit, such as a printed circuit board (PCB) or a flexible printed circuit board (FPC). Furthermore, the first substrate 110 may also be a composite structure, for example, composed of a conductive material and an electrically insulating material, such as a printed circuit board (Metal Core PCB; MCPCB) having a metal core, which may be selected from metal. A group of materials, ceramic materials, semiconductor materials, and any combination of the foregoing. The first substrate 110 is preferably made of a material having good thermal conductivity, such as copper, aluminum or ceramic, to enhance the heat dissipation effect of the LED module 100. As shown in FIG. 1A and FIG. 1B, each of the second substrates 120 of the present embodiment can be used to directly form a plurality of LED chips 130, and the 7 M335801 can form a sub-package module. A plurality of sub-package modules can be assembled on the first substrate 110 to form the LED module 100 of the present embodiment. The second substrate 120 may be provided with a circuit (not shown), such as a printed circuit board (PCB) or a flexible printed circuit board (FPC). The second substrate 120 may also be a composite structure such as a printed circuit board (Metal Core PCB; MCPCB) having a metal core. Each of the second substrates 120 is provided with a plurality of recesses 121 for accommodating the LED chips 130. The depressed portion 121 of the second substrate 120 has, for example, a round cup-shaped recessed structure, and is formed with a reflecting surface 122 on the inner peripheral surface of the recessed portion 121. The reflective surface 122 preferably forms a light colored color, such as white, for enhanced light reflection. Furthermore, the reflective surface 122 can also be coated with a high reflectivity material, such as Ag, Cr, Mo, Ti, Pt, Pd, Au, Ti02, SiO 2 , AINd or any combination of the above materials, thereby enhancing the reflection. The surface reflectance of the face 122. As shown in FIG. 1A and FIG. 1B, in the present embodiment, the LED wafer 130 can be adhered to the bottom of the recess 121 by a die attaching agent, and the bottom of the recess 121 is provided with a two-electrode connection. The pad 123 is electrically connected to the circuit of the second substrate 120, and is electrically connected to the LED chip 13 and the electrode by a second bonding wire 124 (for example, a gold wire, a silver wire, a copper wire or an aluminum wire). Between the pads 123, wherein the material of the electrode pads 123 is, for example, silver, gold, platinum, palladium, nickel, tungsten, copper, cadmium, cadmium oxide, tin, tin oxide, indium tin oxide (ITO), molybdenum, niobium, Niobium or its alloy. However, the LED chip 130 may be electrically connected to the electrode pad 123 by eutectic soldering or surface adhesion (SMD). In addition, in the embodiment, the second substrate 12A may be a composite structure, and the 8 M335801 has a metal substrate 125 (for example, copper, gold, silver, iron, Ming or its alloy material) and an insulating layer 126, and the insulating layer 126 Formed on the metal substrate 125, the material of the insulating layer 126 is, for example, high temperature resistant plastic, epoxy resin, glass fiber, poly-o-phthalimin (PPA), boron nitride, aluminum nitride, aluminum oxide, Insulating material such as titanium oxide, calcium oxide or ceramics. At this time, the insulating layer 126 may be integrally formed with the recessed portion 121, and the electrode pad 123 is formed at the bottom of the recessed portion 121 to electrically connect the electrodes of the light-emitting diode wafer 130. Referring to FIGS. 2A-2E, a schematic plan view of a second substrate of a light emitting diode package module according to a first embodiment of the present invention is shown. Each of the second substrates 120 of the present embodiment may have a predetermined shape, such as a rectangle, a triangle, a partial ring, a hexagon, a polygon, or any other shape. The shapes of the second substrates 120 are allowed to be combined with each other and then disposed on the first substrate 110. The second substrates 120 may be electrically connected in series or in parallel, or may be electrically connected to each other. As shown in FIG. 1A and FIG. 1B, when the second substrate 120 is disposed on the first substrate 110, the second substrates may be selectively bonded to the first substrate 110 by means of allowing rework, for example: Screwing, soldering, embedding, tight fitting or adhesion, etc., thereby allowing the bonding between the first substrate 110 and the second substrate 120 to be released. Therefore, when the light-emitting diode chip 130 on any one of the second substrates 120 fails or the working efficiency is not good, the single second substrate 120 (which has a poor light-emitting diode) can be released. The bonding between the wafer 130) and the first substrate 110 is disposed and replaced without affecting the other second substrate 120 (which does not have the defective light emitting diode wafer 130). As shown in FIG. 1A and FIG. 1B, the 9 M335801 material of the encapsulant 140 of the present embodiment is, for example, epoxy resin, occupation A, polycarbonate g_yearb_te, or enamel for coating and sealing the LED. Wafer (10). It should be noted that the encapsulant 140 can be formed in each of the plurality of recesses 121 of the second substrate 12A (as shown in FIG. 1A); or, the first substrate can be directly covered on the second substrate. 120 (as shown in FIG. 1B), thereby covering and sealing a plurality of LED chips 130 on each of the second substrates 12G. As can be seen from the above-described embodiments of the present invention, the illumination of the present invention The plurality of LED chips of the diode module can be directly disposed on the second substrate, so that the thermal effect of the thermal insulation can be known, and the design space and cost of the packaging structure can be saved. Furthermore, since the second substrate of the mother can be individually detached and replaced, when the light-emitting diode chip on the single second substrate is damaged, it can be replaced separately without replacing the entire group of light-emitting diodes. The body module can save the replacement cost of the light-emitting one-pole module. Moreover, the second substrates on the first substrate have a predetermined shape and can be combined with each other, thereby increasing the assembly margin. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention to any skilled person, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS [0009] The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. Detailed description of the drawings is as follows: FIG. 1A and FIG. A schematic cross-sectional view of a novel M335801 LED package module of the first embodiment. 2A to 2E are schematic top plan views showing a second substrate of the LED package module according to the first embodiment of the present invention. [Description of Main Components] 100: LED module 110: First substrate 120: Second substrate 121: recess 122: reflective surface 123: electrode pad 124: bonding wire 125: metal substrate 126: insulating layer 130 : Light Emitting Diode Wafer 140 : Sealant 11