KR100631901B1 - Led 패키지 프레임 및 이를 채용하는 led 패키지 - Google Patents
Led 패키지 프레임 및 이를 채용하는 led 패키지 Download PDFInfo
- Publication number
- KR100631901B1 KR100631901B1 KR1020050008773A KR20050008773A KR100631901B1 KR 100631901 B1 KR100631901 B1 KR 100631901B1 KR 1020050008773 A KR1020050008773 A KR 1020050008773A KR 20050008773 A KR20050008773 A KR 20050008773A KR 100631901 B1 KR100631901 B1 KR 100631901B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat transfer
- transfer member
- led package
- lead
- package frame
- Prior art date
Links
- 238000010292 electrical insulation Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 238000002310 reflectometry Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 50
- 238000000576 coating method Methods 0.000 description 50
- 229910052759 nickel Inorganic materials 0.000 description 15
- 229910052709 silver Inorganic materials 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (11)
- LED 칩;상기 LED 칩이 일면에 장착되고 측부에 만입된 수납부가 형성된 열 전달 부재;일단 쪽이 상기 열 전달 부재의 수납부에 수용되어 상기 LED 칩과 전기적으로 연결된 리드; 및상기 열 전달 부재의 수납부와 상기 리드를 서로 격리시키도록 이들 사이에 밀착 제공된 전기 절연층을 포함하는 고출력 LED 패키지에 사용되는 LED 패키지 프레임.
- 제1항에 있어서, 상기 리드 및 이를 수용하는 상기 열 전달 부재의 수납부는 상기 열 전달 부재의 기둥으로부터 “ㄴ”자 형태를 갖는 것을 특징으로 하는 LED 패키지 프레임.
- 제1항에 있어서, 상기 열 전달 부재는 만입된 제2 수납부를 갖고,상기 LED 패키지 프레임은 상기 제2 수납부에 직접 삽입된 제2 리드를 포함하는 것을 특징으로 하는 LED 패키지 프레임.
- 제3항에 있어서, 상기 리드 및 이를 수용하는 상기 열 전달 부재의 수납부는 상기 열 전달 부재의 기둥으로부터 “ㄴ”자 형태를 갖는 것을 특징으로 하는 LED 패키지 프레임.
- 제1항에 있어서, 상기 열 전달 부재는 상기 전기 절연층을 개재하여 상기 리드의 일단을 둘러싸는 것을 특징으로 하는 LED 패키지 프레임.
- 제1항에 있어서, 상기 열 전달 부재는 상기 LED 칩 둘레에 공동을 형성하도록 상기 열 전달 부재의 가장자리로부터 상기 LED 칩 너머로 연장된 반사경을 구비하는 것을 특징으로 하는 LED 패키지 프레임.
- 제6항에 있어서, 상기 열 전달 부재의 가장자리와 상기 리드의 일단 쪽을 봉지하도록 상기 열 전달 부재 둘레에 사출된 기부를 더 포함하는 것을 특징으로 하는 LED 패키지 프레임.
- 제1항 내지 제5항 중의 어느 한 항에 기재된 LED 패키지 프레임; 및상기 열 전달 부재의 상기 LED 칩 반대편의 타면이 적어도 일부가 노출되고 상기 리드의 타단 쪽이 돌출하도록 상기 LED 패키지 프레임을 봉지하는 수지로 된 패키지 본체를 포함하는 LED 패키지.
- 제1항 내지 제5항 중의 어느 한 항에 기재된 LED 패키지 프레임;상기 열 전달 부재의 가장자리 및 이에 인접한 상기 리드의 일부를 봉지하면서 안쪽에 공동을 형성하도록 사출된 외벽; 및상기 공동 내에 채워진 투명 수지를 포함하는 LED 패키지.
- 제9항에 있어서, 상기 외벽의 내면에는 고반사율 재료의 층이 형성된 것을 특징으로 하는 LED 패키지.
- 제6항 또는 제7항에 기재된 LED 패키지 프레임; 및상기 공동 내에 채워진 투명 수지를 포함하는 LED 패키지.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050008773A KR100631901B1 (ko) | 2005-01-31 | 2005-01-31 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
JP2005376056A JP4674158B2 (ja) | 2005-01-31 | 2005-12-27 | Ledパッケージフレーム並びにこれを採用するledパッケージ |
US11/319,101 US7592631B2 (en) | 2005-01-31 | 2005-12-28 | LED package frame and LED package having the same |
CNB2005101339860A CN100452455C (zh) | 2005-01-31 | 2005-12-30 | Led封装框架和具有该led封装框架的led封装 |
US12/549,252 US7968894B2 (en) | 2005-01-31 | 2009-08-27 | LED package frame and LED package having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050008773A KR100631901B1 (ko) | 2005-01-31 | 2005-01-31 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060087900A KR20060087900A (ko) | 2006-08-03 |
KR100631901B1 true KR100631901B1 (ko) | 2006-10-11 |
Family
ID=36755587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050008773A KR100631901B1 (ko) | 2005-01-31 | 2005-01-31 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7592631B2 (ko) |
JP (1) | JP4674158B2 (ko) |
KR (1) | KR100631901B1 (ko) |
CN (1) | CN100452455C (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006048230B4 (de) * | 2006-10-11 | 2012-11-08 | Osram Ag | Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung |
TWI363432B (en) * | 2007-02-26 | 2012-05-01 | Everlight Electronics Co Ltd | A structure of a light emitting diode and a method to assemble thereof |
KR101365621B1 (ko) * | 2007-09-04 | 2014-02-24 | 서울반도체 주식회사 | 열 방출 슬러그들을 갖는 발광 다이오드 패키지 |
TW200915597A (en) * | 2007-09-17 | 2009-04-01 | Everlight Electronics Co Ltd | Light emitting diode device |
KR100978574B1 (ko) | 2008-12-17 | 2010-08-27 | 삼성엘이디 주식회사 | 엘이디 패키지 |
KR101615497B1 (ko) * | 2009-11-27 | 2016-04-27 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
KR101109754B1 (ko) * | 2010-04-15 | 2012-02-21 | 김경태 | 발광 다이오드 패키지의 제조방법 |
WO2011136236A1 (ja) * | 2010-04-26 | 2011-11-03 | パナソニック電工株式会社 | リードフレーム、配線板、発光ユニット、照明装置 |
KR101130137B1 (ko) * | 2010-07-02 | 2012-03-28 | 연세대학교 산학협력단 | 발광다이오드 모듈 |
JP5049382B2 (ja) | 2010-12-21 | 2012-10-17 | パナソニック株式会社 | 発光装置及びそれを用いた照明装置 |
DE102011013277A1 (de) * | 2011-03-07 | 2012-09-13 | Schott Ag | Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System" |
US9807897B2 (en) * | 2011-03-07 | 2017-10-31 | Schott Ag | Glass system for hermetically joining Cu components, and housing for electronic components |
US8405181B2 (en) * | 2011-03-16 | 2013-03-26 | Intellectual Discovery Co., Ltd. | High brightness and high contrast plastic leaded chip carrier LED |
JP6201617B2 (ja) | 2013-10-17 | 2017-09-27 | 日亜化学工業株式会社 | 発光装置 |
USD744963S1 (en) | 2014-04-01 | 2015-12-08 | Xicato, Inc. | LED module |
USD765902S1 (en) | 2014-04-01 | 2016-09-06 | Xicato, Inc. | Thin LED module |
US10514131B2 (en) * | 2016-07-06 | 2019-12-24 | Epistar Corporation | Light-emitting apparatus |
JP2017076809A (ja) * | 2016-12-05 | 2017-04-20 | 大日本印刷株式会社 | 樹脂付リードフレーム、半導体装置、照明装置 |
KR102037357B1 (ko) | 2018-06-21 | 2019-11-26 | (주)라이타이저 | 색변환 다이오드의 제조방법 |
KR102125837B1 (ko) | 2018-08-30 | 2020-06-23 | (주)라이타이저 | 광확산형 색변환 다이오드 및 이의 제조방법 |
CN110233192A (zh) * | 2018-08-30 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | 一种发光器件及其制作方法、引线框架、支架、发光装置 |
TWI781738B (zh) * | 2021-08-24 | 2022-10-21 | 鴻海精密工業股份有限公司 | 發光陣列基板、發光陣列基板的製備方法及顯示面板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003309313A (ja) | 2002-04-15 | 2003-10-31 | Chichibu Fuji Co Ltd | 半導体レーザユニット |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4026008A (en) * | 1972-10-02 | 1977-05-31 | Signetics Corporation | Semiconductor lead structure and assembly and method for fabricating same |
US5208467A (en) * | 1988-07-28 | 1993-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a film-covered packaged component |
DE58909888C5 (de) * | 1989-05-31 | 2017-03-02 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement |
JPH0749815Y2 (ja) * | 1990-07-23 | 1995-11-13 | シャープ株式会社 | 表面実装型光結合装置 |
JPH0961245A (ja) * | 1995-08-29 | 1997-03-07 | Matsushita Electric Ind Co Ltd | 非接触温度計 |
KR0159986B1 (ko) * | 1995-09-04 | 1998-12-01 | 아남산업주식회사 | 히트싱크 내장형 반도체 패키지의 제조방법 및 그 구조 |
JP3830583B2 (ja) * | 1996-08-15 | 2006-10-04 | 富士通株式会社 | 光半導体アセンブリ |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
JP2000173947A (ja) * | 1998-12-07 | 2000-06-23 | Tokai Rika Co Ltd | プラスティックパッケージ |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
JP2002232013A (ja) * | 2001-02-02 | 2002-08-16 | Rohm Co Ltd | 半導体発光素子 |
US6541800B2 (en) * | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
DE10117889A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
KR100991829B1 (ko) * | 2001-12-29 | 2010-11-04 | 항조우 후양 신잉 띠앤즈 리미티드 | Led 및 led램프 |
CN2540685Y (zh) | 2002-06-03 | 2003-03-19 | 葛世潮 | 高效率大功率发光二极管 |
TW558803B (en) * | 2002-04-16 | 2003-10-21 | Yuan Lin | Flexible light-emitting device and the manufacturing method |
JP3707446B2 (ja) * | 2002-05-28 | 2005-10-19 | 住友電気工業株式会社 | 白色発光素子 |
JP2004071771A (ja) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | 発光ダイオード |
JP3910144B2 (ja) * | 2003-01-06 | 2007-04-25 | シャープ株式会社 | 半導体発光装置およびその製造方法 |
CN2617039Y (zh) * | 2003-02-21 | 2004-05-19 | 游尚桦 | 粘着型led引线架 |
JP4174823B2 (ja) * | 2003-03-27 | 2008-11-05 | サンケン電気株式会社 | 半導体発光装置 |
CN2617939Y (zh) | 2003-04-11 | 2004-05-26 | 陈政雄 | 引擎空气催化器 |
JP4138586B2 (ja) * | 2003-06-13 | 2008-08-27 | スタンレー電気株式会社 | 光源用ledランプおよびこれを用いた車両用前照灯 |
JP4661031B2 (ja) * | 2003-06-26 | 2011-03-30 | 日亜化学工業株式会社 | 発光装置 |
TWI240423B (en) * | 2004-03-12 | 2005-09-21 | Opto Tech Corp | Light emitting device with high heat dissipation efficiency |
EP1794808B1 (en) * | 2004-09-10 | 2017-08-09 | Seoul Semiconductor Co., Ltd. | Light emitting diode package having multiple molding resins |
US7119422B2 (en) * | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
EP1825524A4 (en) * | 2004-12-16 | 2010-06-16 | Seoul Semiconductor Co Ltd | CONNECTION GRID COMPRISING A THERMAL DISSIPATOR SUPPORT RING, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE HOUSING USING THE SAME, AND LIGHT-EMITTING DIODE HOUSING MADE THEREBY |
US7763478B2 (en) * | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
US7852015B1 (en) * | 2006-10-11 | 2010-12-14 | SemiLEDs Optoelectronics Co., Ltd. | Solid state lighting system and maintenance method therein |
CN101539279B (zh) * | 2008-03-19 | 2010-09-29 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
-
2005
- 2005-01-31 KR KR1020050008773A patent/KR100631901B1/ko active IP Right Grant
- 2005-12-27 JP JP2005376056A patent/JP4674158B2/ja active Active
- 2005-12-28 US US11/319,101 patent/US7592631B2/en active Active
- 2005-12-30 CN CNB2005101339860A patent/CN100452455C/zh active Active
-
2009
- 2009-08-27 US US12/549,252 patent/US7968894B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003309313A (ja) | 2002-04-15 | 2003-10-31 | Chichibu Fuji Co Ltd | 半導体レーザユニット |
Also Published As
Publication number | Publication date |
---|---|
JP2006210904A (ja) | 2006-08-10 |
US7968894B2 (en) | 2011-06-28 |
US20060169999A1 (en) | 2006-08-03 |
CN100452455C (zh) | 2009-01-14 |
CN1822401A (zh) | 2006-08-23 |
JP4674158B2 (ja) | 2011-04-20 |
KR20060087900A (ko) | 2006-08-03 |
US7592631B2 (en) | 2009-09-22 |
US20090321773A1 (en) | 2009-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100631901B1 (ko) | Led 패키지 프레임 및 이를 채용하는 led 패키지 | |
US6517218B2 (en) | LED integrated heat sink | |
KR100665117B1 (ko) | Led 하우징 및 그 제조 방법 | |
US7271425B2 (en) | Optoelectronic component | |
KR100629496B1 (ko) | Led 패키지 및 그 제조방법 | |
USRE45596E1 (en) | High power light emitting diode package | |
KR101247426B1 (ko) | 발광다이오드 램프 및 발광다이오드 장치 제조 방법 | |
US8344602B2 (en) | Light emitting diode and light source module incorporating the same | |
US20080089072A1 (en) | High Power Light Emitting Diode Package | |
KR101101476B1 (ko) | 발광 장치 및 반도체 장치와 그 제조 방법 | |
US20110157897A1 (en) | Light Emitting Diode Module and Method for Making the Same | |
US8368085B2 (en) | Semiconductor package | |
KR20090002319A (ko) | 발광 다이오드 패키지 및 그 제조방법 | |
JP3632507B2 (ja) | 発光装置 | |
JP2004207367A (ja) | 発光ダイオード及び発光ダイオード配列板 | |
KR100875702B1 (ko) | 고출력 발광 다이오드 패키지 | |
JP2006202894A (ja) | 発光装置 | |
KR20100097039A (ko) | 발광 장치 | |
JP2006344717A (ja) | 発光装置およびその製造方法 | |
KR100735309B1 (ko) | 표면 실장 발광다이오드 패키지 | |
JP2008130735A (ja) | 発光装置の製造方法 | |
KR100579397B1 (ko) | 리드프레임과 직접 연결된 히트싱크를 채택하는 발광다이오드 패키지 | |
TW200905912A (en) | Light emitting diode packaging structure and manufacturing method thereof | |
KR100878398B1 (ko) | 고출력 led 패키지 및 그 제조방법 | |
KR20080045880A (ko) | Led 패키지 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120831 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20130902 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140901 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150831 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20180831 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190830 Year of fee payment: 14 |