JP4668036B2 - 撮像素子のfpcに対する取り付け構造 - Google Patents
撮像素子のfpcに対する取り付け構造 Download PDFInfo
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- JP4668036B2 JP4668036B2 JP2005318983A JP2005318983A JP4668036B2 JP 4668036 B2 JP4668036 B2 JP 4668036B2 JP 2005318983 A JP2005318983 A JP 2005318983A JP 2005318983 A JP2005318983 A JP 2005318983A JP 4668036 B2 JP4668036 B2 JP 4668036B2
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- Prior art keywords
- fpc
- image sensor
- mounting plate
- mounting structure
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000003287 optical effect Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
<比較例>
比較例に係る撮像素子のFPCに対する取り付け構造は、図1に示すように、レンズモジュール10からの出射光が結像する撮像素子20、この撮像素子20に電気的に接続されるFPC30、及び、取り付け板40を備える。レンズモジュール10は、ハウジング(不図示)と、その内部に保持された複数のレンズ11と、を備える。
つづいて、本発明の実施形態について説明する。図3に示す実施形態においては、比較例ではレンズモジュール10側から順に配置した撮像素子20、FPC30、取り付け板40に代えて、レンズモジュール10側から撮像素子120、取り付け板140、FPC130を配置している点が比較例と異なる。その他の構成は比較例と同様であって、同じ部材については同じ参照符号を使用する。
なお、その他の作用、効果、変形例は比較例と同様である。
20 撮像素子
20a 前面
20b 背面
30 FPC
31 前面
32 背面
35 電気部品
40 取り付け板
41 開口部(切り欠き部)
120 撮像素子
120b 背面
130 FPC
131 面
135 電気部品
140 取り付け板
141 開口部(切り欠き部)
142 開口部(切り欠き部)
Claims (6)
- 撮像素子と、
前記撮像素子が実装されるFPCと、
前記FPCの表裏いずれか一方の面において、前記撮像素子が実装される位置に対応する位置に取り付けられる取り付け板と、
からなる撮像素子のFPCに対する取り付け構造であって、
前記撮像素子とFPCの間に、取り付け板を配置し、
該取り付け板に、前記撮像素子をFPCに正射影した部分内に位置させて切り欠き部を形成し、
前記FPCには、その撮像素子側の面に位置させて、上記切り欠き部内に位置する電気部品を設け、
前記撮像素子から延出するコンタクトを、前記取り付け板を避けて前記FPCに固定したことを特徴とする撮像素子のFPCに対する取り付け構造。 - 前記取り付け板は接着によりFPCと一体化される請求項1記載の撮像素子のFPCに対する取り付け構造。
- 前記取り付け板は、紫外線硬化型接着剤により、FPCに接着される請求項2記載の撮像素子のFPCに対する取り付け構造。
- 前記取り付け板は、非導電性接着剤により、FPCに接着される請求項2又は請求項3記載の撮像素子のFPCに対する取り付け構造。
- 前記切り欠き部は、前記取り付け板を板厚方向に貫通している請求項1〜4のいずれか1項記載の撮像素子のFPCに対する取り付け構造。
- 前記撮像素子はCCDである請求項1〜5のいずれか1項記載の撮像素子のFPCに対する取り付け構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005318983A JP4668036B2 (ja) | 2005-11-02 | 2005-11-02 | 撮像素子のfpcに対する取り付け構造 |
TW095140162A TW200728792A (en) | 2005-11-02 | 2006-10-31 | Image pickup device mounting structure |
US11/555,350 US7645981B2 (en) | 2005-11-02 | 2006-11-01 | Image pickup device mounting structure for saving space in an optical device |
KR1020060107663A KR20070047721A (ko) | 2005-11-02 | 2006-11-02 | 촬상 소자 장착 구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005318983A JP4668036B2 (ja) | 2005-11-02 | 2005-11-02 | 撮像素子のfpcに対する取り付け構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007128995A JP2007128995A (ja) | 2007-05-24 |
JP4668036B2 true JP4668036B2 (ja) | 2011-04-13 |
Family
ID=37995149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005318983A Expired - Fee Related JP4668036B2 (ja) | 2005-11-02 | 2005-11-02 | 撮像素子のfpcに対する取り付け構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7645981B2 (ja) |
JP (1) | JP4668036B2 (ja) |
KR (1) | KR20070047721A (ja) |
TW (1) | TW200728792A (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100517612B1 (ko) * | 2003-03-31 | 2005-09-28 | 엘지전자 주식회사 | 증기분사식 드럼세탁기 |
JP5084480B2 (ja) * | 2007-12-10 | 2012-11-28 | キヤノン株式会社 | 光電変換素子ユニット及び撮像装置 |
JP4991644B2 (ja) * | 2008-06-25 | 2012-08-01 | シャープ株式会社 | 回路基板の固定方法および電子部品 |
US8441572B2 (en) * | 2008-07-18 | 2013-05-14 | Panasonic Corporation | Imaging device |
JP5246791B2 (ja) * | 2009-04-22 | 2013-07-24 | 株式会社ジャパンディスプレイウェスト | バックライトユニット |
CN102802497B (zh) * | 2009-06-25 | 2015-03-25 | 奥林巴斯医疗株式会社 | 摄像单元 |
JP5075944B2 (ja) * | 2010-06-10 | 2012-11-21 | 株式会社東芝 | 電子機器 |
JP5584034B2 (ja) * | 2010-07-20 | 2014-09-03 | パナソニック株式会社 | 撮像ユニットおよび撮像素子取付構造 |
JP2012034070A (ja) * | 2010-07-29 | 2012-02-16 | Casio Comput Co Ltd | 基板の接着方法、基板の実装構造、電子機器、及び基板 |
JP5696391B2 (ja) * | 2010-07-29 | 2015-04-08 | カシオ計算機株式会社 | 基板の接着方法、集合部品、電子機器、及び基板 |
KR101149021B1 (ko) * | 2010-10-08 | 2012-05-24 | 엘지이노텍 주식회사 | 3차원 촬상장치와 그 제조방법 |
JP5864890B2 (ja) * | 2011-04-26 | 2016-02-17 | キヤノン株式会社 | 撮像装置 |
TWI558196B (zh) * | 2012-08-16 | 2016-11-11 | 鴻海精密工業股份有限公司 | 影像感測器模組及取像模組 |
CN103813070A (zh) * | 2012-11-14 | 2014-05-21 | 鸿富锦精密工业(深圳)有限公司 | 取像装置 |
KR101454312B1 (ko) * | 2014-03-21 | 2014-10-23 | (주)드림텍 | 모바일 기기의 서브 기판 고정방법 및 그 고정구조 |
CN105137564B (zh) * | 2015-09-24 | 2019-11-12 | 南昌欧菲光电技术有限公司 | 摄像头模组 |
US10268234B2 (en) | 2017-08-07 | 2019-04-23 | Apple Inc. | Bracket assembly for a multi-component vision system in an electronic device |
US11445094B2 (en) | 2017-08-07 | 2022-09-13 | Apple Inc. | Electronic device having a vision system assembly held by a self-aligning bracket assembly |
KR20220165460A (ko) * | 2021-06-08 | 2022-12-15 | 삼성전자주식회사 | 카메라 모듈 및 그것을 포함하는 전자 장치 |
CN116095969A (zh) * | 2023-03-14 | 2023-05-09 | 上海美维电子有限公司 | 补强板和pcb的压合定位用治具 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01140871U (ja) * | 1988-03-23 | 1989-09-27 | ||
JP2002330358A (ja) * | 2001-04-27 | 2002-11-15 | Nippon Avionics Co Ltd | 光学素子とレンズアセンブリとの位置合わせ方法 |
JP2003234557A (ja) * | 2002-02-12 | 2003-08-22 | Toray Eng Co Ltd | 電子部品埋込み実装用基板の製造方法 |
US6628339B1 (en) * | 1999-06-14 | 2003-09-30 | Eastman Kodak Company | Image sensor mount for a digital camera |
JP2004104078A (ja) * | 2002-06-28 | 2004-04-02 | Sanyo Electric Co Ltd | カメラモジュールおよびその製造方法 |
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JP2508107Y2 (ja) * | 1990-06-01 | 1996-08-21 | 旭光学工業株式会社 | レンズ鏡筒 |
US5581412A (en) * | 1993-12-27 | 1996-12-03 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed circuit board supporting structure of lens barrel |
US5826126A (en) * | 1996-01-26 | 1998-10-20 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed circuit board housing structure for a camera |
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JP2003046072A (ja) * | 2001-07-27 | 2003-02-14 | Fuji Photo Optical Co Ltd | 固体撮像素子の取付構造 |
US7043154B2 (en) * | 2002-08-27 | 2006-05-09 | Pentax Corporation | Photographing lens having an optical element retracting mechanism |
JP4204368B2 (ja) * | 2003-03-28 | 2009-01-07 | シャープ株式会社 | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
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-
2005
- 2005-11-02 JP JP2005318983A patent/JP4668036B2/ja not_active Expired - Fee Related
-
2006
- 2006-10-31 TW TW095140162A patent/TW200728792A/zh unknown
- 2006-11-01 US US11/555,350 patent/US7645981B2/en not_active Expired - Fee Related
- 2006-11-02 KR KR1020060107663A patent/KR20070047721A/ko active IP Right Grant
Patent Citations (5)
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JPH01140871U (ja) * | 1988-03-23 | 1989-09-27 | ||
US6628339B1 (en) * | 1999-06-14 | 2003-09-30 | Eastman Kodak Company | Image sensor mount for a digital camera |
JP2002330358A (ja) * | 2001-04-27 | 2002-11-15 | Nippon Avionics Co Ltd | 光学素子とレンズアセンブリとの位置合わせ方法 |
JP2003234557A (ja) * | 2002-02-12 | 2003-08-22 | Toray Eng Co Ltd | 電子部品埋込み実装用基板の製造方法 |
JP2004104078A (ja) * | 2002-06-28 | 2004-04-02 | Sanyo Electric Co Ltd | カメラモジュールおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20070096234A1 (en) | 2007-05-03 |
KR20070047721A (ko) | 2007-05-07 |
TW200728792A (en) | 2007-08-01 |
JP2007128995A (ja) | 2007-05-24 |
US7645981B2 (en) | 2010-01-12 |
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