US7645981B2 - Image pickup device mounting structure for saving space in an optical device - Google Patents
Image pickup device mounting structure for saving space in an optical device Download PDFInfo
- Publication number
- US7645981B2 US7645981B2 US11/555,350 US55535006A US7645981B2 US 7645981 B2 US7645981 B2 US 7645981B2 US 55535006 A US55535006 A US 55535006A US 7645981 B2 US7645981 B2 US 7645981B2
- Authority
- US
- United States
- Prior art keywords
- image pickup
- pickup device
- reinforcing plate
- circuit board
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 230000003287 optical effect Effects 0.000 title description 7
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 110
- 239000007767 bonding agent Substances 0.000 claims description 8
- 230000002452 interceptive effect Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000002787 reinforcement Effects 0.000 claims 1
- MTLMVEWEYZFYTH-UHFFFAOYSA-N 1,3,5-trichloro-2-phenylbenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1 MTLMVEWEYZFYTH-UHFFFAOYSA-N 0.000 description 32
- YFSLABAYQDPWPF-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,3,5-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C(=C(Cl)C(Cl)=CC=2)Cl)=C1 YFSLABAYQDPWPF-UHFFFAOYSA-N 0.000 description 26
- 239000004020 conductor Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Definitions
- the present invention relates to a mounting structure of an image pickup device (installed in an optical device) to which a flexible printed circuit board is mounted.
- Optical devices such as digital cameras and cellular phones in which a flexible printed circuit board (hereinafter referred to as a flexible PCB) to which an image pickup device is mounted are known in the art.
- Electrical components are also mounted to the flexible printed circuit board around the image pickup device as needed.
- transistors, resistors, capacitors, and other specific electrical components it is desirable for transistors, resistors, capacitors, and other specific electrical components, to be arranged in the vicinity of the image pickup device for the sake of noise reduction.
- the image pickup device is superimposed with a reinforcing plate (mounting plate) and the flexible printed circuit board.
- the reinforcing plate possesses high stiffness and is fastened to the back of a portion of the flexible PCB to which the image pickup device is mounted to reinforce this portion of the flexible PCB to prevent the flexible PCB, which is poor in maintaining planarity, from bending.
- An example of such a structure is disclosed in Japanese unexamined patent publication No. 2002-330358.
- the present invention provides a mounting structure of an image pickup device to a flexible printed circuit board, wherein one or more electrical components can be mounted to the flexible printed circuit board in the close vicinity of the image pickup device in a space-saving manner in order to miniaturize the optical device which employs the mounting structure.
- an image pickup device mounting structure including an image pickup device, a reinforcing plate, and a flexible circuit board having at least one electrical component mounted thereon, wherein the reinforcing plate, the image pickup device and a part of the flexible circuit board are superimposed on each other.
- the reinforcing plate includes at least one cutout portion.
- the electrical component is positioned on the part of the flexible circuit board and within the cutout portion.
- the reinforcing plate prefferably be bonded to the flexible printed circuit board to be integral with the flexible printed circuit board.
- the reinforcing plate prefferably be bonded to the flexible printed circuit board with a UV cure adhesive.
- the reinforcing plate prefferably be bonded to the flexible printed circuit board with an electrical insulating bonding agent.
- the electrical component prefferably be mounted on a side of the flexible printed circuit board on which the image pickup device is mounted.
- the electrical component and the image pickup device can be mounted on opposite sides of the flexible printed circuit board, respectively.
- the cutout portion prefferably be a through-hole which extends through the reinforcing plate in a direction of thickness thereof.
- the cutout portion prefferably be a recess which is formed in the reinforcing plate in a direction of thickness thereof.
- the image pickup device prefferably be one of a CCD image sensor and a CMOS image sensor.
- reinforcing plate and the electrical component substantially to lie in a common plane.
- the cutout portion is one of a through-hole and a recess which is formed within the outer edge of the reinforcing plate.
- a mounting structure of an image pickup device to a front surface of a flexible printed circuit board including a reinforcing plate fixed to a back surface of the flexible printed circuit board so that the flexible printed circuit board is sandwiched between the reinforcing plate and the image pickup device, the reinforcing plate including at least one through-hole through which at least a part of the back surface of the flexible printed circuit board is exposed rearwardly; and at least one electrical component mounted on the part of the back surface of the flexible printed circuit board within the through hole in a manner to prevent the electrical component from interfering with the reinforcing plate.
- a mounting structure of an image pickup device to a front surface of the flexible printed circuit board including a reinforcing plate fixed to the front surface of the flexible printed circuit board with the reinforcing plate sandwiched between the image pickup device and the flexible printed circuit board, the reinforcing plate including at least one through-hole through which at least a part of the front surface of the flexible printed circuit board is communicatively connected to a back surface of the image pickup device; and at least one electrical component mounted on the part of the front surface of the flexible printed circuit board so that the electrical component is aligned with the through-hole of the reinforcing plate so as to be prevented from interfering with the reinforcing plate.
- a mounting structure of an image pickup device to a flexible printed circuit board including a reinforcing plate fixed to one of front and back surfaces of the flexible printed circuit board at a position corresponding to a position at which the image pickup device is mounted on the other of the front and back surfaces of the flexible printed circuit board; and at least one electrical component mounted on the flexible printed circuit board.
- the reinforcing plate includes at least one cutout portion which prevents the reinforcing plate from interfering with the electrical component.
- one or more electrical components can be arranged behind the image pickup device, which makes it possible to reduce the surface area of the flexible PCB to thereby achieve miniaturization of the optical device.
- FIG. 1 is an exploded perspective view of a lens unit which adopts a first embodiment of a mounting structure of an image pickup device to a flexible printed circuit board according to the present invention, showing the overall structure of the lens unit;
- FIG. 2A is an exploded perspective view of a portion of the lens unit shown in FIG. 1 which includes an image pickup device, a flexible PCB and a reinforcing plate, showing a state before the image pickup device, the flexible PCB and the reinforcing plate are integrated in a superimposed manner;
- FIG. 2D is an exploded perspective view of the elements shown in FIG. 2A , showing a state where the image pickup device, the flexible PCB and the reinforcing plate have been integrated in a superimposed manner;
- FIG. 3A is an exploded perspective view of a second embodiment of the mounting structure according to the present invention, showing structures of an image pickup device, a flexible PCB and a reinforcing plate of the lens unit;
- FIG. 3B is an exploded perspective view of the elements shown in FIG. 3A , viewed from a different angle;
- FIG. 3C is a perspective view of the elements shown in FIGS. 3A and 3B , showing a state where the image pickup device, the flexible PCB and the reinforcing plate have been integrated in a superimposed manner.
- FIG. 1 shows main elements of a lens unit 100 which adopts a first embodiment of a mounting structure of an image pickup device to a flexible printed circuit board.
- the first embodiment of the mounting structure is provided with an image pickup device 20 , a flexible PCB 30 and a reinforcing plate (mounting plate) 40 .
- Light which emerges from a lens module 10 is incident on the image pickup device 20 to be focused thereon.
- the flexible PCB 30 is fixed to the image pickup device 20 and is electrically connected thereto.
- the lens module 10 is provided with a housing (not shown) and a plurality of lens elements 11 which are housed in the housing and supported thereby.
- a surface-mount type of CCD (charge-coupled device) or CMOS (complementary metal oxide semiconductor), image sensor having a substantially rectangular shape in plan configuration can be adopted as the image pickup device 20 .
- the lens unit 100 is provided, in front of a front surface (imaging surface) 20 a of the image pickup device 20 , with an aperture plate 21 , an optical low-pass filter 22 and a cover frame 23 , in that order from the lens module 10 side.
- the flexible PCB 30 is provided with a flexible substrate made of, e.g., polyester film or a polyimide film, and a plurality of conductor traces formed on one surface (front surface) 31 of the flexible PCB 30 (e.g., a plurality of copper traces bonded to the front surface 31 ).
- a plurality of contacts 25 which project from the image pickup device 20 are soldered to a corresponding plurality of conductor traces of the flexible PCB 30 , respectively, thereby fixing a back surface 20 b of the image pickup device 20 to the front surface 31 of the flexible PCB 30 .
- the strength of this fixation can be enhanced by bonding the image pickup device 20 and the flexible PCB 30 to each other.
- Using the flexible PCB 30 as a printed circuit board in this manner makes it possible to enhance the degree of freedom in placement of the lens module 10 .
- Electrical components (e.g., transistors, resistors and capacitors) 35 which are to be arranged in the vicinity of the image pickup device 20 are mounted to a portion of the other surface (back surface) 32 of the flexible PCB 30 on the opposite side of the flexible PCB 30 from the image pickup device 20 (a portion of the back surface 32 of the flexible PCB 30 on which an orthogonal projection of the image pickup device 20 is formed when the image pickup device 20 and the flexible PCB 30 are positioned parallel to each other).
- each terminal of the electrical components 35 is inserted into a corresponding through hole of the flexible PCB 30 , which is made in the flexible PCB 30 to extend therethrough from the front surface 31 to the back surface 32 , to be electrically connected to a corresponding conductor trace on the front surface 31 of the flexible PCB 30 .
- the electrical components 35 no longer need to be conventionally arranged around the image pickup device 20 on the same side surface of the flexible PCB 30 , which makes it possible to make the outside shape of the flexile PCB 30 smaller than that of the prior art, to thereby achieve miniaturization of the lens unit 100 .
- the reinforcing plate 40 is made of a metal plate which possesses high stiffness (e.g., an aluminum or SUS plate), and is provided with an opening (cutout portion/through-hole) 41 which extends through the reinforcing plate 40 in the direction of the thickness thereof at a substantially central portion of the reinforcing plate 40 .
- the size and shape of the opening 41 are determined so that the electrical components 35 and the reinforcing plate 40 do not interfere with each other when the image pickup device 20 , the flexible PCB 30 and the reinforcing plate 40 are superimposed on each other and fixed to the lens module 10 .
- the reinforcing plate 40 is adhered to the flexible PCB 30 with a bonding agent which is dripped onto an inner edge 41 a of the opening 41 .
- an electrical insulating bonding agent be used as this bonding agent, e.g., a UV cure adhesive can be used.
- the shape and the position of the opening 41 on the reinforcing plate 40 are optional and more than one of the opening 41 can be made in the reinforcing plate 40 so long as the electrical components 35 and the reinforcing plate 40 do not contact each other when the flexible PCB 30 and the reinforcing plate 40 are overlaid on each other.
- the opening 41 of the reinforcing plate 40 can be replaced by a recess or a groove which does not extend completely through the reinforcing plate 40 in the direction of the thickness thereof.
- the opening 41 or such a recess or groove
- the opening 41 not be in the shape of a regular polygon to ensure adequate adhesive strength between the flexible PCB 30 and the reinforcing plate 40 .
- the image pickup device 20 , the flexible PCB 30 and the reinforcing plate 40 are superimposed as shown in FIG. 2B by mounting the image pickup device 20 on the front surface 31 of the flexile PCB 30 and bonding the flexile PCB 30 and the reinforcing plate 40 to each other.
- the image pickup device 20 , the flexible PCB 30 and therein forcing plate 40 which are thus integrated in a superimposed manner are fixed to the lens module 10 with the image pickup device 20 being positioned on the lens module by three set screws (not shown) which are inserted into three through holes 43 , 44 and 45 of the reinforcing plate 40 to be screwed into three female screw holes (not shown) of the aforementioned housing (not shown) of the lens module 10 , respectively, which completes the lens unit 100 .
- the electrical components 35 are arranged on the back surface 32 of the flexible PCB 30 so as to substantially lie in a common plane with that of the reinforcing plate 40 , to thereby achieve miniaturization of the lens unit 100 by providing the reinforcing plate 40 , that supports the image pickup device 20 , with the opening 41 , while the image pickup device 20 , the flexible PCB 30 and the reinforcing plate 40 are superimposed so as to be detachably attached to the lens module 10 , Accordingly, the position of the superimposed combination of the image pickup device 20 , the flexible PCB 30 and the reinforcing plate 40 can be easily readjusted and each of the lens module 10 and the superimposed combination of the image pickup device 20 , the flexible PCB 30 and the reinforcing plate 40 can be easily repaired or replaced. Moreover, the relative positions among the lens module 10 , the image pickup device 20 , the flexible PCB 30 and the reinforcing plate 40 can be easily readjusted.
- FIGS. 3A , 3 B and 3 C A second embodiment of the mounting structure will be discussed hereinafter.
- the second embodiment of the mounting structure shown in FIGS. 3A , 3 B and 3 C is different from the first embodiment of the mounting structure shown in FIGS. 1 , 2 A and 2 B in that the second embodiment of the mounting structure is provided with an image pick up device 120 , a flexible PCB 130 and a reinforcing plate 140 instead of the image pick up device 20 , the flexible PCB 30 and the reinforcing plate 40 that are arranged from the lens module side, respectively.
- the second embodiment of the mounting structure has the same structure as the first embodiment of the mounting structure.
- the flexible PCB 130 is provided with a flexible substrate and a plurality of conductor traces formed on one surface (front surface) 131 of the flexible PCB 130 .
- a plurality of contacts 125 which project from the image pickup device 120 are soldered to a corresponding plurality of conductor traces of the flexible PCB 130 , respectively, thereby fixing a back surface 120 b of the image pickup device 120 to the front surface 131 of the flexible PCB 130 .
- Electrical components 135 which are to be arranged in the vicinity of the image pickup device 120 are mounted to a portion of the front surface 131 of the flexible PCB 130 which faces the back surface 120 b of the image pickup device 120 (a portion of the front surface 131 of the flexible PCB 130 on which an orthogonal projection of the image pickup device 120 is formed when the image pickup device 120 and the flexible PCB 130 are positioned parallel to each other).
- each terminal of the electrical components 135 is soldered to a corresponding conductor trace on the front surface 131 of the flexible PCB 130 to thereby be electrically connected thereto.
- the electrical components 135 By arranging the electrical components 135 on a portion of the front surface 131 which faces the image pickup device 120 in this manner, the electrical components 135 no longer need to be conventionally arranged around the image pickup device 120 on the same side surface of the flexible PCB 130 , which makes it possible to make the outside shape of the flexile PCB 130 smaller than before to thereby achieve miniaturization of the lens unit 100 .
- the reinforcing plate 140 is made of a metal plate which also possesses a high stiffness like that of the reinforcing plate 40 , and is provided with two openings (cutout portions/through-holes) 141 and 142 , each of which extends through the reinforcing plate 140 in the direction of the thickness thereof.
- the shapes and sizes of the two opening 141 and 142 are determined so that the electrical components 135 and the reinforcing plate 140 do not interfere with each other when the image pickup device 120 , the flexible PCB 130 and the reinforcing plate 140 are superimposed on each other and fixed to the lens module 10 .
- the reinforcing plate 140 is further provided at a substantially center thereof with a circular opening (through-hole) 148 which extends through the reinforcing plate 140 in the direction of the thickness thereof.
- the reinforcing plate 140 is adhered to the back surface 120 b of the image pickup device 120 with a bonding agent which is dripped into the circular opening 148 .
- the image pickup device 120 is mounted to the flexible PCB 130 with the reinforcing plate 140 sandwiched between the image pickup device 120 and the flexible PCB 130 .
- an electrical insulating bonding agent be used as the bonding agent, e.g., a UV cure adhesive can be used.
- the shapes and the positions of the two openings 141 and 142 of the reinforcing plate 140 on the reinforcing plate 140 are optional. More than two openings corresponding to the two openings 141 and 142 can be made in the reinforcing plate 140 so long as the electrical components 135 and the reinforcing plate 140 do not contact each other when the flexible PCB 130 and the reinforcing plate 140 are overlaid on each other. For instance, each of the two openings 141 and 142 of the reinforcing plate 140 can be replaced by a recess or a groove which does not extend completely through the reinforcing plate 140 and which is recessed in a direction away from the flexible PCB 130 .
- the image pickup device 120 , the flexible PCB 130 and the reinforcing plate 140 are superimposed on each other as shown in FIG. 3C by bonding the flexile PCB 130 and the reinforcing plate 140 to each other, and subsequently mounting the image pickup device 120 to the flexible PCB 130 .
- the image pickup device 120 , the flexible PCB 130 and the reinforcing plate 140 which are thus integrated in a superimposed manner are fixed to the lens module 10 with the image pickup device 120 being positioned on the lens module by four set screws (not shown) which are inserted into four through holes 133 , 132 , 134 and 136 of the flexible PCB 130 and corresponding four through holes 143 , 144 , 145 and 146 of the reinforcing plate 140 to be screwed into four female screw holes (not shown) of the aforementioned housing (not shown) of the lens module 10 , respectively, which completes the lens unit 100 .
- the electrical components 135 can be arranged on the front surface 131 of the flexible PCB 130 so as to substantially lie in a common plane with that of the reinforcing plate 140 r to thereby achieve miniaturization of the lens unit 100 by providing the reinforcing plate 140 that supports the image pickup device 120 with the two openings 141 and 142 , while the image pickup device 120 , the flexible PCB 130 and the reinforcing plate 140 are superimposed to become capable of being detachably attached to the lens module 10 .
- the position of the superimposed combination of the image pickup device 120 , the flexible PCB 130 and the reinforcing plate 140 can be easily readjusted and each of the lens module 10 and the superimposed combination of the image pickup device 120 , the flexible PCB 130 and the reinforcing plate 140 can be easily repaired or replaced.
- the relative positions among the lens module 10 , the image pickup device 120 , the flexible PCB 130 and the reinforcing plate 140 can be easily readjusted. Note that other effects and functions are identical to those in the first embodiment of the mounting structure.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPP2005-318983 | 2005-11-02 | ||
JP2005318983A JP4668036B2 (ja) | 2005-11-02 | 2005-11-02 | 撮像素子のfpcに対する取り付け構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20070096234A1 US20070096234A1 (en) | 2007-05-03 |
US7645981B2 true US7645981B2 (en) | 2010-01-12 |
Family
ID=37995149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/555,350 Expired - Fee Related US7645981B2 (en) | 2005-11-02 | 2006-11-01 | Image pickup device mounting structure for saving space in an optical device |
Country Status (4)
Country | Link |
---|---|
US (1) | US7645981B2 (ja) |
JP (1) | JP4668036B2 (ja) |
KR (1) | KR20070047721A (ja) |
TW (1) | TW200728792A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120273656A1 (en) * | 2011-04-26 | 2012-11-01 | Canon Kabushiki Kaisha | Imaging apparatus |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100517612B1 (ko) * | 2003-03-31 | 2005-09-28 | 엘지전자 주식회사 | 증기분사식 드럼세탁기 |
JP5084480B2 (ja) * | 2007-12-10 | 2012-11-28 | キヤノン株式会社 | 光電変換素子ユニット及び撮像装置 |
JP4991644B2 (ja) * | 2008-06-25 | 2012-08-01 | シャープ株式会社 | 回路基板の固定方法および電子部品 |
CN101939979B (zh) * | 2008-07-18 | 2013-03-13 | 松下电器产业株式会社 | 摄像器件单元 |
JP5246791B2 (ja) * | 2009-04-22 | 2013-07-24 | 株式会社ジャパンディスプレイウェスト | バックライトユニット |
JP4916595B2 (ja) * | 2009-06-25 | 2012-04-11 | オリンパスメディカルシステムズ株式会社 | 撮像ユニット |
JP5075944B2 (ja) * | 2010-06-10 | 2012-11-21 | 株式会社東芝 | 電子機器 |
JP5584034B2 (ja) * | 2010-07-20 | 2014-09-03 | パナソニック株式会社 | 撮像ユニットおよび撮像素子取付構造 |
JP2012034070A (ja) * | 2010-07-29 | 2012-02-16 | Casio Comput Co Ltd | 基板の接着方法、基板の実装構造、電子機器、及び基板 |
JP5696391B2 (ja) * | 2010-07-29 | 2015-04-08 | カシオ計算機株式会社 | 基板の接着方法、集合部品、電子機器、及び基板 |
KR101149021B1 (ko) | 2010-10-08 | 2012-05-24 | 엘지이노텍 주식회사 | 3차원 촬상장치와 그 제조방법 |
TWI558196B (zh) * | 2012-08-16 | 2016-11-11 | 鴻海精密工業股份有限公司 | 影像感測器模組及取像模組 |
CN103813070A (zh) * | 2012-11-14 | 2014-05-21 | 鸿富锦精密工业(深圳)有限公司 | 取像装置 |
KR101454312B1 (ko) * | 2014-03-21 | 2014-10-23 | (주)드림텍 | 모바일 기기의 서브 기판 고정방법 및 그 고정구조 |
CN105137564B (zh) * | 2015-09-24 | 2019-11-12 | 南昌欧菲光电技术有限公司 | 摄像头模组 |
US10268234B2 (en) | 2017-08-07 | 2019-04-23 | Apple Inc. | Bracket assembly for a multi-component vision system in an electronic device |
US11445094B2 (en) | 2017-08-07 | 2022-09-13 | Apple Inc. | Electronic device having a vision system assembly held by a self-aligning bracket assembly |
KR20220165460A (ko) * | 2021-06-08 | 2022-12-15 | 삼성전자주식회사 | 카메라 모듈 및 그것을 포함하는 전자 장치 |
CN116095969A (zh) * | 2023-03-14 | 2023-05-09 | 上海美维电子有限公司 | 补强板和pcb的压合定位用治具 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5051764A (en) | 1989-05-22 | 1991-09-24 | Asahi Kogaku Kogyo Kabushiki Kaisha | Mounting apparatus of flexible printed circuit board of lens |
US5079577A (en) | 1990-06-01 | 1992-01-07 | Asahi Kogaku Kogyo Kabushiki Kaisha | Supporting apparatus of flexible printed circuit board of lens barrel |
US5581412A (en) | 1993-12-27 | 1996-12-03 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed circuit board supporting structure of lens barrel |
US5826126A (en) | 1996-01-26 | 1998-10-20 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed circuit board housing structure for a camera |
JP2002330358A (ja) | 2001-04-27 | 2002-11-15 | Nippon Avionics Co Ltd | 光学素子とレンズアセンブリとの位置合わせ方法 |
US6493511B2 (en) | 2000-08-31 | 2002-12-10 | Pentax Corporation | FPC (flexible printed circuit) board arrangement structure for zoom lens barrels |
US20030089776A1 (en) * | 1999-10-04 | 2003-05-15 | Hand Held Products, Inc. | Optical reader comprising support post |
US6628339B1 (en) * | 1999-06-14 | 2003-09-30 | Eastman Kodak Company | Image sensor mount for a digital camera |
US6956615B2 (en) * | 2000-01-28 | 2005-10-18 | Pentax Corporation | Structure for mounting a solid-state imaging device |
US7043154B2 (en) | 2002-08-27 | 2006-05-09 | Pentax Corporation | Photographing lens having an optical element retracting mechanism |
US7112864B2 (en) * | 2003-03-28 | 2006-09-26 | Sharp Kabushiki Kaisha | Module for optical device, and manufacturing method therefor |
US20070002546A1 (en) | 2005-06-30 | 2007-01-04 | Pentax Corporation | Flexible printed wiring board arrangement of an imaging device |
US20070019084A1 (en) | 2005-06-30 | 2007-01-25 | Pentax Corporation | Flexible printed wiring board arrangement of an imaging device |
US7199436B2 (en) * | 2001-07-27 | 2007-04-03 | Fujinon Corporation | Attachment structure for solid-state imaging device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01140871U (ja) * | 1988-03-23 | 1989-09-27 | ||
JP2003234557A (ja) * | 2002-02-12 | 2003-08-22 | Toray Eng Co Ltd | 電子部品埋込み実装用基板の製造方法 |
JP2004104078A (ja) * | 2002-06-28 | 2004-04-02 | Sanyo Electric Co Ltd | カメラモジュールおよびその製造方法 |
-
2005
- 2005-11-02 JP JP2005318983A patent/JP4668036B2/ja not_active Expired - Fee Related
-
2006
- 2006-10-31 TW TW095140162A patent/TW200728792A/zh unknown
- 2006-11-01 US US11/555,350 patent/US7645981B2/en not_active Expired - Fee Related
- 2006-11-02 KR KR1020060107663A patent/KR20070047721A/ko active IP Right Grant
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5051764A (en) | 1989-05-22 | 1991-09-24 | Asahi Kogaku Kogyo Kabushiki Kaisha | Mounting apparatus of flexible printed circuit board of lens |
US5079577A (en) | 1990-06-01 | 1992-01-07 | Asahi Kogaku Kogyo Kabushiki Kaisha | Supporting apparatus of flexible printed circuit board of lens barrel |
US5581412A (en) | 1993-12-27 | 1996-12-03 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed circuit board supporting structure of lens barrel |
US5826126A (en) | 1996-01-26 | 1998-10-20 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed circuit board housing structure for a camera |
US6628339B1 (en) * | 1999-06-14 | 2003-09-30 | Eastman Kodak Company | Image sensor mount for a digital camera |
US20030089776A1 (en) * | 1999-10-04 | 2003-05-15 | Hand Held Products, Inc. | Optical reader comprising support post |
US6956615B2 (en) * | 2000-01-28 | 2005-10-18 | Pentax Corporation | Structure for mounting a solid-state imaging device |
US6493511B2 (en) | 2000-08-31 | 2002-12-10 | Pentax Corporation | FPC (flexible printed circuit) board arrangement structure for zoom lens barrels |
JP2002330358A (ja) | 2001-04-27 | 2002-11-15 | Nippon Avionics Co Ltd | 光学素子とレンズアセンブリとの位置合わせ方法 |
US7199436B2 (en) * | 2001-07-27 | 2007-04-03 | Fujinon Corporation | Attachment structure for solid-state imaging device |
US7043154B2 (en) | 2002-08-27 | 2006-05-09 | Pentax Corporation | Photographing lens having an optical element retracting mechanism |
US7112864B2 (en) * | 2003-03-28 | 2006-09-26 | Sharp Kabushiki Kaisha | Module for optical device, and manufacturing method therefor |
US20070002546A1 (en) | 2005-06-30 | 2007-01-04 | Pentax Corporation | Flexible printed wiring board arrangement of an imaging device |
US20070019084A1 (en) | 2005-06-30 | 2007-01-25 | Pentax Corporation | Flexible printed wiring board arrangement of an imaging device |
Non-Patent Citations (2)
Title |
---|
English Language Abstract of JP 2002-330358. |
U.S. Appl. No. 11/459,189 to Tanaka, filed Jul. 21, 2006. |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120273656A1 (en) * | 2011-04-26 | 2012-11-01 | Canon Kabushiki Kaisha | Imaging apparatus |
US9291881B2 (en) * | 2011-04-26 | 2016-03-22 | Canon Kabushiki Kaisha | Imaging apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2007128995A (ja) | 2007-05-24 |
US20070096234A1 (en) | 2007-05-03 |
JP4668036B2 (ja) | 2011-04-13 |
KR20070047721A (ko) | 2007-05-07 |
TW200728792A (en) | 2007-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7645981B2 (en) | Image pickup device mounting structure for saving space in an optical device | |
JP6969595B2 (ja) | 撮像ユニットおよび撮像装置 | |
US7019374B2 (en) | Small-sized image pick up module | |
JP5173298B2 (ja) | プリント配線板およびそれを用いた電子機器 | |
US9215360B2 (en) | Camera module having shield can | |
JP2007243550A (ja) | 電子機器 | |
JP2010074665A (ja) | 電子機器および撮像機能付き電子機器 | |
US20100182498A1 (en) | Solid-state image pickup apparatus | |
US20100053391A1 (en) | Miniaturized image capturing device and method for assembling the same | |
JP4296134B2 (ja) | カメラモジュールおよび電子機器 | |
KR20170082931A (ko) | 인쇄회로기판 및 이를 구비한 카메라 모듈 | |
US7990730B2 (en) | Imaging device | |
US11405540B2 (en) | Camera module | |
JP2003046815A (ja) | ビデオカメラ装置 | |
JPH11261904A (ja) | 撮像装置及びリードレス電気部品実装装置 | |
JP4375939B2 (ja) | 固体撮像装置の製造方法 | |
KR100803275B1 (ko) | 카메라장치 및 그 제조방법 | |
KR100947967B1 (ko) | 카메라 모듈 및 그 제조방법 | |
KR101009147B1 (ko) | 측면 커넥터를 구비한 인쇄회로기판 | |
JP2023106172A (ja) | 撮像装置 | |
JP6628608B2 (ja) | 電子機器及び撮像装置 | |
KR20080006816A (ko) | 카메라 모듈 | |
KR100518726B1 (ko) | 전자카메라 | |
JP2008288518A (ja) | 小型電子機器における電子部品モジュール搭載構造 | |
JP5484148B2 (ja) | 光電変換素子ユニットおよび撮像装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: PENTAX CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TANAKA, HITOSHI;SHIMIZU, KUNIHIKO;OISHI, MAKIO;REEL/FRAME:018464/0648;SIGNING DATES FROM 20061030 TO 20061101 |
|
AS | Assignment |
Owner name: HOYA CORPORATION, JAPAN Free format text: MERGER;ASSIGNOR:PENTAX CORPORATION;REEL/FRAME:021111/0198 Effective date: 20080331 Owner name: HOYA CORPORATION,JAPAN Free format text: MERGER;ASSIGNOR:PENTAX CORPORATION;REEL/FRAME:021111/0198 Effective date: 20080331 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.) |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.) |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20180112 |