JP4541791B2 - 切削砥石の製造方法 - Google Patents
切削砥石の製造方法 Download PDFInfo
- Publication number
- JP4541791B2 JP4541791B2 JP2004212911A JP2004212911A JP4541791B2 JP 4541791 B2 JP4541791 B2 JP 4541791B2 JP 2004212911 A JP2004212911 A JP 2004212911A JP 2004212911 A JP2004212911 A JP 2004212911A JP 4541791 B2 JP4541791 B2 JP 4541791B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- blade
- cutting
- outer peripheral
- ring surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 17
- 230000000873 masking effect Effects 0.000 claims description 13
- 238000004070 electrodeposition Methods 0.000 claims description 9
- 239000006061 abrasive grain Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
Description
10:基台 11、12:円筒部 13:第一のテーパ面 14:第二のテーパ面
15:被装着孔 16:マスキング 17:電鋳ブレード 18:第三のテーパ面
19:突出外周部
20:めっき浴槽 21:めっき液 22:ダイヤモンド砥粒 23:ニッケル棒
24:直流電源 25:スイッチ 26:撹拌器
30:切削砥石
40:切削工具 41:スピンドル 42:ハウジング 43:マウント壁
44:フランジ 45:ノズル 46:超音波振動子 47:超音波
50:切削装置 51:カセット 52:仮置き領域 53:搬出入手段
54:チャックテーブル 55:搬送手段 56:アライメント手段
Claims (1)
- 電着ブレードを基台に固着して切削砥石とする切削砥石の製造方法であって、
底面の外径が異なる2つの円錐台形の底面同士が対面し、該対面部位から外径が大きい方の底面が外周側に突出してリング面が形成された形状を少なくとも有する基台の該リング面以外の面にマスキングを施すマスキング工程と、
該マスキング工程後の基台をめっき液槽に浸漬し、該リング面に砥粒を電着させて電鋳ブレードを形成する電着工程と、
該基台をめっき浴槽から取り出し、該リング面を除去して基台が同型の2つの円錐台形の底面同士が対面し、対面部位の外周部に突出外周部が形成された形状を少なくとも有するように該電着ブレードを露出させるリング面除去工程とから少なくとも構成される切削砥石の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004212911A JP4541791B2 (ja) | 2004-07-21 | 2004-07-21 | 切削砥石の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004212911A JP4541791B2 (ja) | 2004-07-21 | 2004-07-21 | 切削砥石の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006026868A JP2006026868A (ja) | 2006-02-02 |
JP4541791B2 true JP4541791B2 (ja) | 2010-09-08 |
Family
ID=35893796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004212911A Expired - Lifetime JP4541791B2 (ja) | 2004-07-21 | 2004-07-21 | 切削砥石の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4541791B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4970188B2 (ja) * | 2007-08-08 | 2012-07-04 | 株式会社ディスコ | ハブブレード |
JP2010017820A (ja) * | 2008-07-11 | 2010-01-28 | Asahi Diamond Industrial Co Ltd | ハブ付きブレード |
CH714136A1 (fr) * | 2017-09-12 | 2019-03-15 | Robert Renaud Sa | Dispositif motorisé pour machine-outil. |
TWI739684B (zh) * | 2020-12-01 | 2021-09-11 | 李慧玲 | 超音波傳導研磨模組 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6362678A (ja) * | 1986-09-02 | 1988-03-18 | Ube Ind Ltd | 回転砥石 |
JPH03270880A (ja) * | 1990-03-20 | 1991-12-03 | Mitsubishi Materials Corp | ハブ付薄刃砥石の製造方法 |
JP2002210665A (ja) * | 2001-01-19 | 2002-07-30 | Lobtex Co Ltd | 極薄切断ブレード |
JP2003080442A (ja) * | 2001-09-06 | 2003-03-18 | Disco Abrasive Syst Ltd | ダイシング装置 |
-
2004
- 2004-07-21 JP JP2004212911A patent/JP4541791B2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6362678A (ja) * | 1986-09-02 | 1988-03-18 | Ube Ind Ltd | 回転砥石 |
JPH03270880A (ja) * | 1990-03-20 | 1991-12-03 | Mitsubishi Materials Corp | ハブ付薄刃砥石の製造方法 |
JP2002210665A (ja) * | 2001-01-19 | 2002-07-30 | Lobtex Co Ltd | 極薄切断ブレード |
JP2003080442A (ja) * | 2001-09-06 | 2003-03-18 | Disco Abrasive Syst Ltd | ダイシング装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2006026868A (ja) | 2006-02-02 |
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