JP4767548B2 - 電着砥石及び電着砥石の製造方法 - Google Patents
電着砥石及び電着砥石の製造方法 Download PDFInfo
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- JP4767548B2 JP4767548B2 JP2005030344A JP2005030344A JP4767548B2 JP 4767548 B2 JP4767548 B2 JP 4767548B2 JP 2005030344 A JP2005030344 A JP 2005030344A JP 2005030344 A JP2005030344 A JP 2005030344A JP 4767548 B2 JP4767548 B2 JP 4767548B2
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- Japan
- Prior art keywords
- plating
- electrodeposition
- grindstone
- base
- microcapsule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004070 electrodeposition Methods 0.000 title claims description 89
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000007747 plating Methods 0.000 claims description 109
- 239000003094 microcapsule Substances 0.000 claims description 55
- 239000006061 abrasive grain Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 39
- 239000000314 lubricant Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 23
- 239000010432 diamond Substances 0.000 description 18
- 229910003460 diamond Inorganic materials 0.000 description 18
- 238000005498 polishing Methods 0.000 description 16
- 230000000873 masking effect Effects 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 10
- 238000003756 stirring Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000004575 stone Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002775 capsule Substances 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Images
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- Polishing Bodies And Polishing Tools (AREA)
Description
10:めっき液 11:めっき浴槽 12:ニッケル棒 14:直流電源
100:基台
100a:めっき面 100b:非めっき面 100c:貫通孔
101、102:マスキング 103:ダイヤモンド砥粒
104:マイクロカプセル
104a:潤滑剤 104b:隔膜
105:ニッケルめっき層 106:砥石部 107:ハブ
108:ハブブレード 109:電鋳ブレード
110:基台 111:めっき面 112:ハウジング 113:砥石部
114:砥石部 115:基台 116:電着ブレード
117:外周部 118:マスキング
120:研磨砥石 121:基台 122:砥石部 123:基台 124:めっき面
125:マスキング
126:研磨砥石 127:砥石部 128:ホイール 129:基台
130:めっき面 131:マスキング
Claims (5)
- 基台に砥粒を堆積させると共にめっき層によって該砥粒を固めて砥石部を形成する電着砥石の製造方法であって、
砥粒が混入しためっき液を収容しためっき浴槽に基台をめっき面が上に向いた状態で浸漬し、該めっき面に沈降して堆積する砥粒をめっき層で固める砥粒電着工程と、
潤滑剤が封入されたマイクロカプセルが混入しためっき液を収容しためっき浴槽にめっき面を下にして基台を浸漬し、浮上する該マイクロカプセルを該めっき面で受け止めてめっき層で固めるマイクロカプセル電着工程とから構成され、
該砥粒電着工程と該マイクロカプセル電着工程とを繰り返して電着砥石を形成する電着砥石の製造方法。 - 前記砥粒電着工程を実施した後に前記マイクロカプセル電着工程を実施する請求項1に記載の電着砥石の製造方法。
- 前記基台の全部または一部を除去して砥石部を形成する請求項1または2に記載の電着砥石の製造方法。
- 前記砥粒が混入しためっき液を収容するめっき浴槽と前記マイクロカプセルが混入しためっき液を収容するめっき浴槽とが別個に構成される請求項1、2または3に記載の電着砥石の製造方法。
- 前記砥粒が混入しためっき液を収容するめっき浴槽と前記マイクロカプセルが混入しためっき液を収容するめっき浴槽とが同一のめっき浴槽である請求項1、2または3に記載の電着砥石の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005030344A JP4767548B2 (ja) | 2005-02-07 | 2005-02-07 | 電着砥石及び電着砥石の製造方法 |
CNB200610004514XA CN100513081C (zh) | 2005-02-07 | 2006-01-25 | 电沉积砂轮及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005030344A JP4767548B2 (ja) | 2005-02-07 | 2005-02-07 | 電着砥石及び電着砥石の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006212763A JP2006212763A (ja) | 2006-08-17 |
JP4767548B2 true JP4767548B2 (ja) | 2011-09-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005030344A Active JP4767548B2 (ja) | 2005-02-07 | 2005-02-07 | 電着砥石及び電着砥石の製造方法 |
Country Status (2)
Country | Link |
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JP (1) | JP4767548B2 (ja) |
CN (1) | CN100513081C (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101758463B (zh) * | 2010-02-25 | 2012-05-02 | 浙江工业大学 | 一种自润滑磨具及其制备方法 |
CN103789815B (zh) * | 2014-02-26 | 2016-08-17 | 陈谦 | 一种金属离子穿越沉积和双向约束成形的方法和装置 |
CN103991040B (zh) * | 2014-05-18 | 2018-01-12 | 郑州众邦超硬工具有限公司 | 一种发动机气门成型cbn砂轮的加工方法 |
CN107848051A (zh) * | 2015-07-17 | 2018-03-27 | 本田技研工业株式会社 | 电沉积工具、齿轮磨削用螺旋状磨具、电沉积工具的制造方法以及齿轮磨削用螺旋状磨具的制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04300165A (ja) * | 1991-03-28 | 1992-10-23 | Mitsubishi Materials Corp | レンズ研削用砥石 |
JPH0790468B2 (ja) * | 1991-08-09 | 1995-10-04 | 株式会社利根 | 鋳物切断用カッター |
US5725617A (en) * | 1994-10-07 | 1998-03-10 | Minnesota Mining And Manufacturing Company | Abrasive articles with encapsulated lubricant |
CN2336918Y (zh) * | 1998-10-16 | 1999-09-08 | 黄计高 | 一种金刚石橡胶研磨轮 |
JP2002028872A (ja) * | 2000-07-17 | 2002-01-29 | Ricoh Co Ltd | 砥粒工具およびその製造方法 |
-
2005
- 2005-02-07 JP JP2005030344A patent/JP4767548B2/ja active Active
-
2006
- 2006-01-25 CN CNB200610004514XA patent/CN100513081C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN100513081C (zh) | 2009-07-15 |
JP2006212763A (ja) | 2006-08-17 |
CN1817566A (zh) | 2006-08-16 |
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