JP4431543B2 - Ag−Pd合金ナノ粒子を用いる配線基板製造方法 - Google Patents
Ag−Pd合金ナノ粒子を用いる配線基板製造方法 Download PDFInfo
- Publication number
- JP4431543B2 JP4431543B2 JP2006031730A JP2006031730A JP4431543B2 JP 4431543 B2 JP4431543 B2 JP 4431543B2 JP 2006031730 A JP2006031730 A JP 2006031730A JP 2006031730 A JP2006031730 A JP 2006031730A JP 4431543 B2 JP4431543 B2 JP 4431543B2
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- Prior art keywords
- wiring
- conductive ink
- wiring board
- alloy
- manufacturing
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- Expired - Fee Related
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
- A45D40/20—Pencil-like cosmetics; Simple holders for handling stick-shaped cosmetics or shaving soap while in use
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
- A45D40/24—Casings for two or more cosmetics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
- A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
- A45D40/20—Pencil-like cosmetics; Simple holders for handling stick-shaped cosmetics or shaving soap while in use
- A45D2040/201—Accessories
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
(1)Ag+OH−→AgOH+e−
(2)2AgOH→Ag2O+H2O
(3)Ag2O+H2O?2Ag++2OH−
陽極での反応
(4)Ag++e−→Ag
銀アセテート前駆体(Silver acetate precursor)を0.1Mソジウムドデシルサルフェート(sodium dodecyl sulfate、SDS)水溶液50mLに溶解させて4.5x10−4mol濃度に製造し、上記溶液をoil bathで徐徐に加温させて、130℃で9時間反応させ、粒子の大きさが1−50nmに分散されたAgインクを製造した。
パラジウムアセテート(Palladium acetate)、銀アセテート(silver acetate)2種の前駆体を0.1Mソジウムドデシルサルフェート(sodium dodecyl sulfate、SDS)水溶液50mLに溶解させて前駆体濃度を4.5x10−4molに製造し、上記溶液をoil bathで徐徐に加温させて、130℃で9時間反応させる。上記合成法を通して粒子が1−50nmに分散されたAg−Pd合金形態のインクを製造した。Ag−Pd合金内のPdの重量%を5重量%(実施例1)、10重量%(実施例2)、20重量%(実施例3)、30重量%(実施例4)及び40重量%(実施例5)に変化させて製造した。
基板上に、インクジェット装置を利用して比較例1から製造したAgナノインクをL/S100ミクロンで噴射した後、250℃で焼成工程を行って配線を形成した後、温度85℃、湿度85%の条件下で2.5Vの電圧を60秒間加えて絶縁抵抗値の変化を観察したのを図5に示した。その結果、初期絶縁抵抗値対比60時間まで、絶縁抵抗値の変化なしに初期絶縁抵抗値を維持した。60時間が経過するとイオン移動が発生することになって比抵抗が急速に低下された。
基板上に、インクジェット装置を利用して実施例1ないし5から製造したAg−Pd合金ナノインクをL/S100ミクロンで噴射した後、250℃で焼成工程を行って配線を形成した後、伝導度を測定して、温度85℃、湿度85%の条件下で2.5Vの電圧を60秒間加えて絶縁抵抗値の変化を観察し、初期絶縁抵抗値対比、絶縁抵抗値の変化なしに初期絶縁抵抗値を維持する時間(dendrite形成時間)を測定して比較例2とともに表1に現わしたし、この中、Ag−Pd合金中Pdの含量が30重量%の場合の絶縁抵抗値変化を図6に示した。
Claims (7)
- パラジウムアセテート(Palladium acetate)及び銀アセテート(Ag acetate)をソジウムドデシルサルフェート(SDS)水溶液に溶解させた後、加熱反応させて製造される導電性インクであって、
1ないし50nmの大きさを有するAg−Pd合金のナノ粒子を含んでおり、
上記Ag−Pd合金の中、Pdの含量が5重量%超過40重量%未満である導電性インク。 - 上記Ag−Pd合金の中、Pdの含量が10ないし30重量%である
請求項1に記載の導電性インク。 - 上記導電性インクは
パラジウムアセテート(Palladium acetate)及び銀アセテート(Ag acetate)をソジウムドデシルサルフェート(SDS)水溶液に溶解させた後、オイルバス(oil bath)内で、130℃で9時間反応させて製造される
請求項1または請求項2に記載の導電性インク。 - 請求項1から請求項3までの何れか一項に記載の導電性インクを製造する段階、及び
上記導電性インクを基板上に噴射した後、焼成して配線を形成する段階
を含む
配線基板の製造方法。 - 上記配線を形成する段階は、インクジェット方式で基板上にパターンを有する配線を形成する
請求項4に記載の配線基板の製造方法。 - 請求項4または請求項5に記載の製造方法によって製造される配線基板。
- 上記配線基板に形成された配線は、前記焼成して配線を形成する段階を経た後の配線幅及び配線間隔が100ミクロン以下である、
請求項6に記載の配線基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20050022606A KR100653251B1 (ko) | 2005-03-18 | 2005-03-18 | Ag-Pd 합금 나노입자를 이용한 배선기판 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006257403A JP2006257403A (ja) | 2006-09-28 |
JP4431543B2 true JP4431543B2 (ja) | 2010-03-17 |
Family
ID=37009374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006031730A Expired - Fee Related JP4431543B2 (ja) | 2005-03-18 | 2006-02-08 | Ag−Pd合金ナノ粒子を用いる配線基板製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060208230A1 (ja) |
JP (1) | JP4431543B2 (ja) |
KR (1) | KR100653251B1 (ja) |
CN (1) | CN100537677C (ja) |
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KR20090012605A (ko) * | 2007-07-30 | 2009-02-04 | 삼성전기주식회사 | 금속 나노입자의 제조방법 |
DE102008018939A1 (de) | 2008-04-15 | 2009-10-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen einer elektrisch leitenden Struktur auf einem temperaturempfindlichen Foliensubstrat |
JP5129077B2 (ja) * | 2008-09-30 | 2013-01-23 | 富士フイルム株式会社 | 配線形成方法 |
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-
2005
- 2005-03-18 KR KR20050022606A patent/KR100653251B1/ko not_active IP Right Cessation
-
2006
- 2006-02-08 JP JP2006031730A patent/JP4431543B2/ja not_active Expired - Fee Related
- 2006-03-09 US US11/371,101 patent/US20060208230A1/en not_active Abandoned
- 2006-03-17 CN CNB2006100651239A patent/CN100537677C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100653251B1 (ko) | 2006-12-01 |
US20060208230A1 (en) | 2006-09-21 |
KR20060100792A (ko) | 2006-09-21 |
CN100537677C (zh) | 2009-09-09 |
JP2006257403A (ja) | 2006-09-28 |
CN1840592A (zh) | 2006-10-04 |
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