TW569062B

TW569062B - Thermal bonding device and method

Info

Publication number: TW569062B
Application number: TW091136829A
Authority: TW
Inventors: Kiyoyuki Echigodani; Hideki Fuyama; Koichi Ikegami
Original assignee: Toshiba Corp
Priority date: 2001-12-25
Filing date: 2002-12-20
Publication date: 2004-01-01
Also published as: CN1202435C; CN1607425A; KR20030057350A; KR100533766B1; CN1327269C; CN1434329A; TW200301832A

Abstract

The object of the present invention is to provide a thermal bonding device and method, which can surely connect the wiring such as TCP to the display cell even in a liquid crystal display device whose glass substrate has a larger evenness in thickness. The solving means is to provide a thermal bonding device 10 which places the liquid crystal cell 1 on a carrying station 12. The TCP 3 is thermally bonded to the liquid cell 1 by ACF 4. The pressing part 22 is divided into a plurality of heating tools. Each divided pressing part 22 is pressed on the TCP 3.

Description

569062 ⑴ 玖、發明說明 (發明說日繼欠日㈠㈣所紅技術領域、先前技術、内容、實施方式及圖·單說明) [技術領域] 本發明有關之一種熱壓接裝置及方法，其係製造用 TCP(Tape Camer Package)從外部驅動系統向液晶胞進行信號輸入之平面顯示裝置時，將Tcp等緊密裝配於顯示胞周邊部之用者。 [先前技術] 液晶顯示裝置包括：液晶胞，其係將像素排列形成像素顯示區者；及驅動電路，將像素信號其他驅動信號輸入液晶胞者。從驅動電路向液晶胞之驅動電路之輸入，係藉設在液晶胞周邊部之連接部進行。一般於此周邊部配置複數驅動1C晶片，俾以一定時序控制輸入信號產生輸出信號。將驅動1C晶片緊密裝配於液晶胞之方式，雖亦有直接裝載驅動1C晶片之COG(Chip On Glass)方式，惟大多使用用 TCP之方式。如圖1 6、1 7所示，TCP3通常係指將驅動1C晶片6裝載於矩幵> 小片狀可撓印刷基板（F p c)’其係將配線圖型形成於聚醯亞胺等絕緣膜9上者。沿TCP3之矩形狀一邊設有複數輸出側端子7，與此相向之邊設有複數輸入側端子。各TCP3之輸出側端子7，以機械且電連接於液晶胞1周邊之連接塾8。又沿各TCP3之輸入側邊之部分係用錫焊以機械且電連接於驅動輸入用印刷基板（以下稱PCB)2。 T C P 3之輸出側端子7之部分與液晶胞】之連接塾8之連接 -6 569062569062 发明玖, description of the invention (Technical Field, Prior Technology, Content, Embodiments, and Figures · Single Explanation of the Invented Day-to-Day Sunshine Exchange) [Technical Field] A thermocompression device and method related to the present invention, and its system When manufacturing a flat display device in which a TCP (Tape Camer Package) is used to input signals from an external drive system to a liquid crystal cell, a user who tightly mounts Tcp or the like to the peripheral portion of the display cell. [Prior art] A liquid crystal display device includes: a liquid crystal cell that arranges pixels to form a pixel display area; and a driving circuit that inputs pixel signals and other driving signals to the liquid crystal cell. The input from the driving circuit to the driving circuit of the liquid crystal cell is performed by a connection portion provided at the peripheral portion of the liquid crystal cell. Generally, a plurality of driving 1C chips are arranged in this peripheral part, and the input signals are controlled to generate output signals at a certain timing. The method of tightly mounting the driving 1C chip on the liquid crystal cell, although there is also a COG (Chip On Glass) method of directly mounting the driving 1C chip, but most of them use the TCP method. As shown in Figures 16 and 17, TCP3 generally refers to loading the driver 1C chip 6 in a rectangular shape> a small piece of flexible printed circuit board (F pc) ', which forms a wiring pattern in polyimide, etc. The upper part of the insulating film 9. A plurality of output-side terminals 7 are provided along the rectangular side of TCP3, and a plurality of input-side terminals are provided on the opposite side. The output-side terminal 7 of each TCP3 is mechanically and electrically connected to the connection 塾 8 around the liquid crystal cell 1. A portion along the input side of each TCP3 is mechanically and electrically connected to a driving input printed circuit board (hereinafter referred to as a PCB) 2 by soldering. T C P 3 part of the output side terminal 7 and the LCD cell] connection 塾 8 connection -6 569062

(2) ’由於此等端子群之端子節距狹窄，故一般以各向異性導電膜進行。各向異性導電膜係指將導電性粒子分散於熱硬，化性或熱可塑性樹脂膜中者，於接受熱壓接處實現夾樹脂膜之端子間之導電者。各向異性導電膜，為方便作業步驟 · 計，一般使用做為帶狀膜供給之各向異性導電膜（ACf ;(2) 'As the terminal pitch of these terminal groups is narrow, it is generally performed with an anisotropic conductive film. Anisotropic conductive film refers to those in which conductive particles are dispersed in a thermosetting, chemical or thermoplastic resin film, and the conductive between the terminals of the resin film is achieved at the place where the thermocompression bonding is received. Anisotropic conductive film, in order to facilitate the operation of the procedure, it is generally used as an anisotropic conductive film (ACf;

Anisotropic Conductive Film) ° 液晶胞1之玻璃基板5之周邊部，及TCP3對PCB2之緊密裝配，用ACF4時例如依下述（1)〜（5)之步驟進行。圖1丨係此等 · 步驟之模式。 (1) 將ACF4貼於液晶胞1之周邊部。 (2) 用預備加熱頭7 1預熱ACF4。 (3) 如圖 1〇所示用 cCD(Charge Coupled Device)106 等將 TCP3之輸出側端子7與液晶胞丨上之連接墊8定位後，進行 TCP3之預壓接。 (4) 用加熱工具m進行TCp3之正壓接。 (5) 用錫焊加熱頭172，錫焊連接Tcp3之輸入側料群與驅動輸入用PCB2上之端子群。 φ 又即使如上述將TCP3安裝於液晶胞丨而其製品為不良品時，進行拆卸TCP3之修復作業。Anisotropic Conductive Film) ° The peripheral portion of the glass substrate 5 of the liquid crystal cell 1 and the TCP3 to the PCB2 are tightly mounted. When using ACF4, for example, the following steps (1) to (5) are performed. Figure 1 is the pattern of these steps. (1) Apply ACF4 to the periphery of liquid crystal cell 1. (2) Preheat ACF4 with preheating head 71. (3) As shown in Figure 10, use cCD (Charge Coupled Device) 106 to position the terminal 7 on the output side of TCP3 and the connection pad 8 on the LCD cell, and then perform pre-compression bonding on TCP3. (4) Use the heating tool m to perform positive pressure bonding of TCp3. (5) Use a soldering heating head 172 to solder the input side material group of Tcp3 to the terminal group on the drive input PCB2. φ Even if TCP3 is installed in a liquid crystal cell as described above and its product is defective, repair work for disassembling TCP3 is performed.

此作業之方法，係為了以烙鐵加熱acf4剝離MM 後去除剩下之ACF4’使用有機溶劑或擦連接墊8後，擦栻 . 此連接墊8之部分以進行最後加工。、而修復製品之不良部分後，再用h… ^ 丹用上述况明之方法安裝新之 TCP。 (3) [發明内容] [發明欲解決之課題] 於上述（4)之正壓接步驟，為了確實連接tcp3之輸出側端子7與液晶胞丨之連接墊8，需使熱壓接裝置之加熱頭I"與液晶胞1之連接墊8形成之玻璃基板5彼此精密平衡。即需使加熱頭111之壓接面與液晶胞丨之載置台間之平行度有充分之程度。平行度係通常以加熱頭111之壓接面與玻璃基板5 之間隔最小處與最大處間之感覺值之差表示。故其值愈小平订之程度愈高。ACF所用導電粒子直徑典型約為5〜6 pm ’此時平行度之值需在約5 μιη以内。可是，最近之液晶顯示裝置，因要求薄型化，故產生再研磨玻璃製造廠商所交玻璃基板5之需要。即組合液晶胞i 後再研磨液晶胞1之表面及背面，減薄其厚度。具體而言，先前玻璃基板厚度為丨.1爪爪至心^ mm，其厚度之不均率為稍南之5 以下。然而，最近研磨玻璃基板5 之厚度為0.8至0.4 mm。因此，研磨致厚度之不均率加大，其不均率約為4〇 μιτι。故以ACF4將丁 CP3連接於液晶胞1時，因厚度之不均率大，致ACF4成為浮游狀態，而有連接墊8與輸出側端子7之間產生接觸不良之問題。又如上述進行修復作業，再安裝TCP3之液晶胞1 ,有修復作業污染物附著於連接墊8附近，而發生電路斷路或線路缺陷及動作不良等，對圖像品質有不良影響之情形。此理，係於修復作業時，連接墊8上附著作業人員汗水及 -8 . 569062The method of this operation is to remove the remaining ACF4 ′ by peeling off the MM by heating the acf4 with a soldering iron. Use an organic solvent or wipe the connection pad 8 and wipe it. The part of this connection pad 8 is used for final processing. After repairing the defective part of the product, use h ... ^ to install a new TCP using the method described above. (3) [Content of the Invention] [Problems to be Solved by the Invention] In the positive crimping step of the above (4), in order to surely connect the output side terminal 7 of tcp3 and the connection pad 8 of the liquid crystal cell, it is necessary to make a thermocompression device. The glass substrate 5 formed by the heating head I " and the connection pad 8 of the liquid crystal cell 1 is precisely balanced with each other. That is to say, the parallelism between the pressure contact surface of the heating head 111 and the mounting table of the liquid crystal cell must be sufficient. The degree of parallelism is usually expressed by the difference between the minimum and maximum distances between the crimped surface of the heating head 111 and the glass substrate 5. Therefore, the smaller the value, the higher the level of ordering. The diameter of the conductive particles used in ACF is typically about 5 ~ 6 pm ′ At this time, the value of parallelism needs to be within about 5 μm. However, recent liquid crystal display devices have been required to be thinner, so that there is a need for re-polishing the glass substrate 5 handed over by a glass manufacturer. That is, the surface and back of the liquid crystal cell 1 are ground after the liquid crystal cell i is combined to reduce its thickness. Specifically, the thickness of the previous glass substrate was .1 claw to the center ^ mm, and the unevenness of the thickness was slightly less than 5. However, the thickness of the recently ground glass substrate 5 is 0.8 to 0.4 mm. Therefore, the unevenness of the thickness caused by grinding increases, and the unevenness is about 40 μm. Therefore, when DCP CP3 is connected to LCD cell 1 with ACF4, the thickness unevenness is large, so that ACF4 becomes a floating state, and there is a problem of poor contact between the connection pad 8 and the output-side terminal 7. Another repair operation is performed as described above, and then the LCD cell 1 of TCP3 is installed, and there is a case where the repair operation pollutants are attached to the vicinity of the connection pad 8 and a circuit disconnection, a circuit defect, or a poor operation occurs, which may adversely affect the image quality. This reason is that during the repair work, the connection pad 8 is attached with the sweat of the writing staff and -8. 569062

(4) 其他污染物（主要為離子系污染物），其上配置ACF4，疊層 TCP3。用此種含有污染物之ACF4，熱壓接連接墊8與TCP3之輸出端子時’因於殘留溶解之ACF4之連接墊8基部側凝集污染物，故連接墊8之金屬腐蝕比其他部分加快，而有連接墊 8斷路之情形。(4) Other pollutants (mainly ionic pollutants) are equipped with ACF4 and TCP3. With this type of ACF4 containing pollutants, when thermocompression bonding the connection pads 8 and the output terminals of TCP3, 'condensation of pollutants on the base side of the connection pads 8 of the remaining dissolved ACF4, the metal corrosion of the connection pads 8 is faster than other parts. In some cases, the connection pad 8 is disconnected.

故本發明有鑑於上述問題，提供一種熱壓接裝置及方法 ’其係即使使用於平面顯示裝置之玻璃基板厚度不均稍大，亦能將TCP等配線體確實連接於顯示胞者。又本發明提供一種熱壓接裝置及方法，其係即使進行修復作業等，而連接墊表面有污染物存在之狀態下，以 ACF熱壓接TCP等配線體時，亦可避免連接墊發生金屬腐 I虫者。 [解決課題之方法]Therefore, in view of the above problems, the present invention provides a thermocompression bonding device and method, which can reliably connect a wiring body such as TCP to a display cell even if the thickness of the glass substrate used in the flat display device is slightly large. The invention also provides a thermocompression bonding device and method, which can prevent metal from occurring on the connection pad when ACF is used to thermocompress the wiring body such as TCP even if there is a pollutant on the surface of the connection pad even if repair work is performed. Rot I worm. [Methods for solving problems]

本心月之第《明有關之一種熱壓接裝置，其係將平面顯示裝置之顯示胞置於載置台上，藉各向異性導電膜以加熱工具《 Ji S熱壓接上述顯示胞周邊之連接塾群與薄片狀配線體之端子群，其特徵為八宝丨支> 才彳又局/7吾ij為子旻數加壓部，俾加壓於上述加熱工具之上述配線體，設置移動機構，以便將上述分割之各加壓部移動至下方。本發明之第二發明有關之顯示裝置之顯示胞置於載置熱工具從上方熱壓接上述顯配線體之端子群，其特徵為一種熱壓接裝置，其係將平面台上，藉各向異性導電膜以加示胞周邊之連接墊群與薄片狀以輥子體構成加壓部，俾加壓 569062Ben Xinyue's "A related thermocompression device, which is to place a display cell of a flat display device on a mounting table, and an anisotropic conductive film is used to heat the tool" The terminal group that connects the 塾 group and the sheet-shaped wiring body is characterized by eight treasures gt 局局 / / 7ijij is a child number pressing section, which is pressurized on the wiring body of the heating tool, and is provided. A moving mechanism for moving each of the divided pressurizing sections downward. The display cell of the display device related to the second invention of the present invention is placed on a mounting hot tool to thermally crimp the terminal group of the display wiring body from above, which is characterized by a thermal crimping device, which is arranged on a flat surface, An anisotropic conductive film is formed by adding a bonding pad group around a cell and a sheet to form a pressing part by a roller body, and pressurizing 569062

於上述加熱工具之上述配線體。本發明之第三發明有關之-種熱磨接方法，其係將平面顯不裝置之顯示胞置於載置台上’藉各向異性導電模以加熱工具從上方熱壓接上述顯示胞周邊之連接墊群與薄片狀配線組之為子群’其特徵為上述加熱工具之加壓部係沿上料接塾群之排列方向分割，以上述分割之中央部分^加The wiring body on the heating tool. The third invention of the present invention is related to a thermal grinding method, which is to place a display cell of a flat display device on a mounting table. The anisotropic conductive mold is used to heat-compress the periphery of the display cell from above by a heating tool. The connecting pad group and the sheet-shaped wiring group are sub-groups, and are characterized in that the pressing part of the heating tool is divided along the arrangement direction of the feeding connection group, and the divided central part is added.

麼部加屋於上述端子群後以夾上述中央部分之加屢部兩側之加壓部’依序加壓上述端子群。本發明之第四發明有關之—種熱㈣方法，其係將平面顯示裝置之顯示胞置於載置台上，藉各向異性導電膜以加熱工具從上方熱壓接上述顯示胞周邊之連接墊群與薄片狀配、.泉體之端子群，其特徵為上述加熱卫具之加壓部係沿上述連接墊群之長度方向分割，以上述連接墊之基部側加壓部加壓於上述端子群後，上述分割之加壓部向上述連接墊之端部依序加壓。本發明之第五發明有關之一種熱壓接方法，其係將平面顯示裝置之顯示胞置於載置台上，藉各向異性導電膜以加熱工具從上方熱壓接上述顯示胞周邊之連接墊群與薄片狀配線體之端子群，其特徵為由輥子體構成上述加熱工具之加壓部，從上述連接墊之基部側向上述連接墊之端部側，轉動上述輥子體加壓於上述端子群。依本發明之第一發明有關之一種熱壓接裝置，因分割為複數加壓部，俾加壓於配線體，故可控制加熱工具之加壓力分布。被分割為複數加壓部可由彈簧等彈性構件與主加 -10- 569062 (6) 壓部連接。向配線體寬度方向分割加壓部，即可控制寬度方向之加壓力分布，吸收基板彎曲進行熱壓接，即使基板薄型化亦可得良好之連接。又向配線體長度方向分割加壓部，即可控制長度方向之加壓力分布，若從易凝集雜質之連接墊基部側加壓時，雜質即不凝集於此區而可抑制金屬腐I虫。又依本發明之第二發明有關之一種熱壓接裝置，因以輥子體構成加壓部，俾加壓於加熱工具之上述配線體，故從連接塾基部側加壓配線體，即可抑制雜質凝集於連接墊基部側。又依本發明之第三發明有關之一種熱壓接方法，因加熱工具之加壓部係沿連接墊群之排列方向分割，以分割之中央部分之加壓部加壓於端子群後，以夾中央部分之加壓部兩側之加壓部，依序加壓端子群，故可控制配線體寬度方向之加壓力之分布，可吸收基板彎曲進行熱壓接，即使基板薄型化亦可得良好之連接。又依本發明之第四發明有關之一種熱壓接方法，因加熱工具之加壓部係沿連接墊群之長度方向分割，以連接墊之基部側加壓部加壓於端子群後，上述分割之加壓部向上述連接塾之端部依序加壓，故從連接墊基部側加壓配線體，即可抑制雜質凝集於連接墊基部側。又依本發明之第五發明有關之一種熱壓接方法，因由輥子體構成加熱工具之加壓部，從連接墊之基部側向連接墊之端部側’轉動輥子體加壓於端子群，故從連接墊基部側 -11- 569062After adding the housing to the terminal group, the terminal group is sequentially pressurized by pressing portions on both sides of the central portion and the pressing portion. The fourth invention of the present invention is related to a method for thermally drawing a display cell of a flat display device on a mounting table, and an anisotropic conductive film is used to thermally press the connection pads around the display cell from above with a heating tool. The terminal and the spring group terminal group are characterized in that the pressing part of the heating fixture is divided along the length direction of the connection pad group, and the terminal pad is pressurized to the terminal by the pressing part on the base side of the connection pad. After the group, the divided pressing portions are sequentially pressed toward the ends of the connection pads. A fifth aspect of the present invention is a method of thermocompression bonding, in which a display cell of a flat display device is placed on a mounting table, and an anisotropic conductive film is used to thermally crimp a connection pad around the display cell from above by a heating tool. The terminal group of the group and the sheet-shaped wiring body is characterized in that the pressing part of the heating tool is constituted by a roller body, and the roller body is pressed to the terminal from the base side of the connection pad to the end side of the connection pad. group. According to the first aspect of the present invention, a thermocompression bonding device is divided into a plurality of pressurizing portions and is pressurized to the wiring body, so that the pressure force distribution of the heating tool can be controlled. Divided into a plurality of pressure parts, elastic members such as springs can be connected to the main pressure -10- 569062 (6) pressure parts. Dividing the pressing part in the width direction of the wiring body can control the pressure distribution in the width direction, and absorb the bending of the substrate for thermocompression bonding. Even if the substrate is thin, it can be connected well. Dividing the pressurizing section in the lengthwise direction of the wiring body can control the pressure distribution in the lengthwise direction. If the pressure is applied from the base of the connection pad which is easy to aggregate impurities, the impurities will not condense in this area and the metal rot I insects can be suppressed. In accordance with a second aspect of the present invention, a thermocompression bonding device includes a roller body and a pressurized portion of the heating tool to press the wiring body from the side of the base. The impurities are aggregated on the base pad side. According to a third method of the present invention, since the pressing part of the heating tool is divided along the arrangement direction of the connection pad group, the divided central pressing part is pressed to the terminal group, and The pressing parts on both sides of the pressing part of the central part of the clip sequentially press the terminal group, so the distribution of the pressing force in the width direction of the wiring body can be controlled, and the substrate can be bent for thermal compression bonding, even if the substrate is thin. Good connection. According to the fourth method of the present invention, a method of thermocompression bonding is that the pressing part of the heating tool is divided along the length direction of the connection pad group, and the pressing part of the base side of the connection pad is pressed to the terminal group. The divided pressing portions sequentially pressurize the ends of the connection pads. Therefore, by pressing the wiring body from the base portion side of the connection pad, it is possible to suppress the aggregation of impurities on the base portion side of the connection pad. According to a fifth aspect of the present invention, a method of thermocompression bonding, since the pressing part of the heating tool is constituted by the roller body, the roller body is rotated from the base side of the connection pad to the end side of the connection pad to press the terminal group, So from the side of the base of the connection pad

⑺ 加壓配線體，即可抑制雜質凝集於連接墊基部側。 [實施方式] [發明之實施形態] (第1實施例）以下，依圖1至圖6說明本發明第1實施例之熱壓接裝置 10 ° (1)熱壓接裝置10之結構熱壓接裝置10係為了以電及機械連接液晶顯示裝置之液 · 晶胞1之連接墊8與TCP3之輸出側端子7，而藉ACF4熱壓接者。 i 圖1係熱壓接裝置1 〇之透視圖。熱壓接裝置10包括：載置台12，放置液晶胞丨者；支持部 14,從載置台12—邊豎立者；及加熱頭丨6,垂吊於支持部 14者，加熱頭16係由設於支持部14内部之馬達驅動之移動裝置18向下方移動。又以下說明中，如圖丨所示，沿信號線驅動側之方向稱為X軸方向，沿掃描線驅動側之方向稱為γ 軸方向，高度方向稱為Z軸方向。 · 圖2係加熱頭16内部構造，圖3係圖2之八_八線剖面圖。加熱頭丨6每一 TCP3設有加熱工具20 ,各加埶工呈？〇係由複數加壓部22構成。於加熱工具2〇上方配置主加壓部以。主加壓部町面藉壓縮時長度相同，t央長愈向外側愈M . 之^性構件之彈贅，與加熱工具20之各加壓部22連接。 ‘ 彈性構件係例如用同長度構件同-捲數之料而成，而使非壓縮時之彈簧有不同之全長。即使用從中央愈往外側 -12-⑺ Pressing the wiring body can suppress the aggregation of impurities on the base side of the connection pad. [Embodiment] [Embodiment of the invention] (First embodiment) Hereinafter, the thermocompression bonding apparatus 10 according to the first embodiment of the present invention will be described with reference to Figs. 1 to 6. (1) Structure of the thermocompression bonding apparatus 10 The connection device 10 is used to electrically and mechanically connect the connection pad 8 of the liquid crystal display device and the cell 1 with the output-side terminal 7 of TCP3, and is thermocompression-bonded by ACF4. i Figure 1 is a perspective view of a thermocompression bonding device 10. The thermocompression bonding device 10 includes: a mounting table 12 for placing a liquid crystal cell; a support section 14 for erecting from the mounting table 12-a side; and a heating head 6 for hanging from the support section 14. The heating head 16 is provided by the device The motor-driven moving device 18 inside the supporting portion 14 moves downward. In the following description, as shown in Figure 丨, the direction along the drive side of the signal line is called the X-axis direction, the direction along the drive side of the scan line is called the γ-axis direction, and the height direction is called the Z-axis direction. Fig. 2 is the internal structure of the heating head 16, and Fig. 3 is a cross-sectional view taken along line VIII-VIII in Fig. 2. Heating head 丨 6 Each TCP3 is equipped with a heating tool 20, each processing staff presents? 〇 system is composed of a plurality of pressurizing sections 22. A main pressing part is arranged above the heating tool 20. The main pressing part has the same length when compressed, and the central length of the central part becomes more and more M. The elastic member of the flexible member is connected to each pressing part 22 of the heating tool 20. ‘The elastic member is made of, for example, a member of the same length and the same number of windings, so that the non-compressed spring has a different full length. Even from the center to the outside -12-

569062 愈壓縮者。而控制為壓住所有加壓部時成為均等之壓力。各主加壓部24之構造為一體連接支持於移動裝置18之移動柱19’成為一體向下移動者。又加熱工具2〇係以加熱於加熱頭16，而加熱至200t至300°C。即構成由金屬等熱導、體而成之加熱頭16内裝加熱器，與加熱工具2〇之各加壓部 22側面接觸，以加熱加壓部22。又亦可如圖1 〇所示，從加熱頭16本體分離加熱加壓部22之熱源，接觸各加壓部22之側面設置圍成框狀之加熱頭2〇〇〇又亦可於各加壓部22内部 · 内裝加熱器。其次’依圖3說明加壓部2 2之結構。如上述加熱工具20係分割為複數加壓部22，惟其狀態係如圖3所示，沿液晶胞1之連接墊8之排列方向分割。即沿 TCP3之矩形之一邊方向分割之狀態。圖3中為簡化說明，連接墊8僅存在8支，惟實際上有更多之連接墊8存在。圖6係熱壓接裝置10之電氣系統方塊圖。如圖6所示，熱壓接裝置10係將移動裝置18之馬達28、加 | 熱加熱頭16之加熱裝置30及由cCD(Charge Coupled Device)等而成之定位裝置32連接於由電腦而成之控制裝置 26 0 (2)熱壓接方法 * 依圖4及圖5說明於上述結構之熱壓接裝置丨〇，熱壓接之方法。將液晶胞1置於載置台12上。此時，設將液晶胞1之玻璃基板5研磨成0.5 mm膜厚，·而其不均率約存在4〇 μπι。 -13- 569062569062 The more compressed. In addition, the pressure is controlled to be equal when all the pressing portions are pressed. Each of the main pressurizing portions 24 is configured to be integrally connected to a moving column 19 'supported by the moving device 18 to become an integrated downward mover. The heating tool 20 is heated to the heating head 16 and heated to 200t to 300 ° C. That is, a heating head 16 constituted by a thermally conductive body made of metal or the like is built into the heater and is in contact with the side surface of each pressing portion 22 of the heating tool 20 to heat the pressing portion 22. Alternatively, as shown in FIG. 10, the heat source of the heating and pressurizing section 22 may be separated from the heating head 16 body, and a heating head 2000 enclosed in a frame shape may be provided on the side contacting each of the pressing sections 22. Inside the pressure section 22 · A heater is built. Next, the structure of the pressurizing section 22 will be described with reference to FIG. As described above, the heating tool 20 is divided into a plurality of pressing portions 22, but its state is divided along the arrangement direction of the connection pads 8 of the liquid crystal cell 1 as shown in FIG. That is, the state is divided along one side of the rectangle of TCP3. In FIG. 3, for simplicity of explanation, there are only eight connection pads 8, but actually more connection pads 8 exist. FIG. 6 is a block diagram of the electrical system of the thermocompression bonding apparatus 10. As shown in FIG. 6, the thermal crimping device 10 connects a motor 28 of the mobile device 18, a heating device 30 of the heating head 16 and a positioning device 32 made of a cCD (Charge Coupled Device) to a computer. The completed control device 26 0 (2) The thermocompression bonding method * The thermocompression bonding device of the above structure and the method of thermocompression bonding will be described with reference to FIGS. 4 and 5. The liquid crystal cell 1 is placed on the mounting table 12. At this time, it is assumed that the glass substrate 5 of the liquid crystal cell 1 is ground to a thickness of 0.5 mm, and the unevenness thereof is approximately 40 μm. -13- 569062

i其次’如圖4所示，使用定位裝置32等藉ACF4將TCP3之輸出側端子7與液晶胞1之連接墊8以定位狀態預壓接。其次’控制裝置26向下移動移動裝置丨8。則主加壓部24 移動至下方’垂吊於複數彈簧34之各加壓部22亦移動至下方，接觸TCP3上面予以加壓。此時，由於主加壓部24之預壓面係成為愈靠中央部愈突出之狀態，因被分割之加壓部 22之面成為愈靠中央部愈突出之狀態，而被分割之加壓部 22之中’首先位於中央部分之加壓部22使丁(：1>3加壓於液晶胞1 ’故依ACF4以電及機械連接其位置之輸出側端子7與連接墊S。iSecond ', as shown in FIG. 4, using a positioning device 32 or the like using ACF4, the output side terminal 7 of TCP3 and the connection pad 8 of the liquid crystal cell 1 are pre-compressed in a positioning state. Next, the control device 26 moves the mobile device 8 down. Then, the main pressurizing portion 24 moves to the lower position, and each of the pressurizing portions 22 suspended from the plurality of springs 34 also moves to the lower side, and contacts TCP3 to pressurize it. At this time, since the pre-pressing surface of the main pressurizing portion 24 is protruded toward the central portion, the divided pressurizing portion 22 is protruded toward the central portion, and the divided pressurizing is performed. Among the parts 22, the pressurizing part 22 first located in the central part causes Ding (: 1> 3 to pressurize the liquid crystal cell 1), so the output-side terminal 7 and the connection pad S are electrically and mechanically connected to the position according to ACF4.

I 此外，如圖5所示，主加壓部24移動至下方時，此次則加壓部22從中央部依序向兩側加壓tcp3，依序向兩側熱壓接 TCP3之輸出側端子7與液晶胞1之連接墊8。所有加壓部22 加壓TCP3之狀態下，控制加壓部22之壓力為均等。熱壓接元成日^ ’控制裝置2 6使加熱頭1 6上昇，完成熱壓接步驟。上述熱壓接方法，因首先，從中央部分向兩側依序熱壓接’故液晶胞1與丁CP3不致錯位，能以一定位置正確熱壓接。又因加壓部22成被分割狀態，故即使液晶胞1之玻璃基板 5有多少不均，惟因加壓部22個別加壓TCP3之輸出側端子7 ，故壓垮ACF4内之導電粒子，能以電及機械確實進行熱壓接。 (第2實施例） -14- 569062 (ίο) 麵麵鑽貧部24與各加壓於第1實施例係以彈簧34個別連接主加壓部22 ’惟亦有替代之下列構造。 4〇，其係將設被分割之即如圖7所示’於主加壓部24下方設彈性構件流動體38收容於袋體36者，於彈性構件4〇下方加壓部2 2者。此種構造，彈性構件40， (第3實施例）主加壓部24移動至下方時，各加壓部22可藉愈靠中央部分愈先加壓TCP3，予以熱壓接。In addition, as shown in FIG. 5, when the main pressing part 24 moves to the lower side, this time the pressing part 22 presses tcp3 from both sides of the central part in order and thermally presses the output side of TCP3 to both sides in order. The connection pad 8 between the terminal 7 and the liquid crystal cell 1. In the state where all the pressurizing sections 22 pressurize TCP 3, the pressures of the pressurizing sections 22 are controlled to be equal. The thermo-compression bonding device Chengri ^ 'control device 26 raises the heating head 16 to complete the thermo-compression bonding step. In the above-mentioned thermocompression bonding method, first, the thermocompression bonding is sequentially performed from the central portion to both sides, so that the liquid crystal cell 1 and the CP3 are not misaligned, and the thermocompression bonding can be performed accurately at a certain position. Because the pressing part 22 is divided, even if the glass substrate 5 of the liquid crystal cell 1 has some unevenness, the pressing part 22 individually presses the output side terminal 7 of TCP3, so it crushes the conductive particles in ACF4. Can be reliably thermocompression bonded electrically and mechanically. (Second Embodiment) -14- 569062 (ίο) In the first embodiment, the main pressure section 22 is individually connected to the main pressure section 22 by a spring 34, but the following structure is also substituted. 40, which is divided into two parts, that is, as shown in FIG. 7 ', an elastic member is provided below the main pressurizing portion 24, and the fluid body 38 is accommodated in the bag body 36, and the pressurizing portion 22 is below the elastic member 40. With this structure, when the elastic member 40, (the third embodiment) moves the main pressing portion 24 to the lower side, each pressing portion 22 can be press-bonded to TCP 3 by being closer to the central portion, and then heat-bonded.

於上述實施例’沿連㈣8之配線方向，即了⑺之輸出側立而子7之配置邊，分割為條狀，准亦可如圖8所示之分割為格子狀之加熱工具2 〇。而使其成為個別加壓此被分割之加壓部。之構造。此種構造’更能精細將丁⑺因應玻璃基板5之厚度進行 (第4實施例）於第1貫施例係沿連接墊8之g己轉方6In the above-mentioned embodiment ', along the wiring direction of the flail 8, the output side of the flail is arranged on the side of the sub 7 and divided into strips. As shown in FIG. 8, it can also be divided into a grid-like heating tool 20. It becomes the pressurizing part which presses this divided part individually. Of the structure. This structure ’can be performed more precisely in accordance with the thickness of the glass substrate 5. (Fourth embodiment) In the first embodiment, it is transferred along the g of the connecting pad 8 to the side 6

<仗呈δ之配、，果万向，即輸出側端子7 之配線方向分割加壓部22，惟於本實施㈣如圖9所示向盘此等配線傾斜之方向，分割加熱工具2()以構成加壓部22。此種分割之構ϋ，因形成加壓部22，其係對各連接塾8 傾斜，且與配線方向正交方向鄰接者，故能以丨I加壓心進行複數配線間之連接，能更確實進行熱壓接。而即使_有不動作之加壓部22，惟固能以鄰接之其他加壓部22壓接，故更可提高製造成品率。又各加壓部2 2亦可間隙配置。 -15- 569062 (11) __續頁 (變更例1) 上述貫施例係將了03連接於液晶胞1之構造，惟代之以 ^可I基板（FPC)連接於;夜晶胞w，亦可適用此熱壓接裝置10。 (變更例2) 不限於液日日頭不裝置，亦可適用於有機顯示裝置等一般顯示裝置。 (變更例3) 亦可以電腦控制各加壓部之上Τ' (第5實施例） i 用圖11至圖13 5兒明本實施例之熱壓接方法。又本實施例之…、C接衣置與圖1所示第1實施例之不同處係第1實施例為將力[郤向加壓之配線寬度方向分割，而本實施例為將加壓部向向加壓之配線長度方向分割。第I步驟係將液晶胞丨置於載置台12上。又放置之液晶胞丨亦可為組合初次裝TCP3之製品亦可，又修復作業後進行修理之製品亦可。第2步驟仏以定位裝置32進行液晶胞1之連接墊8與TCp3 之輸出側端子7之定位。圖"係進行此定位之狀態。第〇 v驟ίτ、以移動裝置丨8將支持柱丨9移動至下方（Z軸方向），將加熱頭16移動至下方時’主加壓部24亦移動至下方 :吊在彈簀34之各加壓部22亦移動至下方。而分割之加壓部 2 2中位於連接墊8基部側(對液晶胞1之端邊内偏"之加壓部 22先加壓TCP3(圖12之狀態）’轉加壓部22向連接墊8端部 '16-< With the δ distribution, it is universal, that is, the pressing portion 22 is divided in the direction of the wiring of the output side terminal 7, but in this implementation, the heating tool 2 is divided in a direction inclined to the wiring as shown in FIG. 9. () To constitute the pressurizing section 22. This divided structure, because the pressurizing portion 22 is formed, is inclined to each connection 塾 8, and is adjacent to the direction orthogonal to the wiring direction. Therefore, it is possible to connect a plurality of wiring rooms with a pressurized center, and more Be sure to perform thermocompression bonding. And even if there is a non-operating pressurizing portion 22, it can be crimped by other adjacent pressurizing portions 22, so the manufacturing yield can be improved. Moreover, each pressurizing part 22 may be arrange | positioned gap. -15- 569062 (11) __continued (change example 1) The above-mentioned embodiment is a structure in which 03 is connected to the liquid crystal cell 1, but is replaced by a ^ I substrate (FPC); night cell w The thermocompression bonding device 10 can also be applied. (Modification 2) The device is not limited to a liquid display, and can be applied to a general display device such as an organic display device. (Modification 3) It is also possible to control T ′ on each pressing part by computer (Fifth Embodiment) i The method of thermocompression bonding of this embodiment will be described with reference to FIGS. 11 to 13. In this embodiment, the difference between the C garment set and the first embodiment shown in FIG. 1 is that the first embodiment divides the force [but divides in the direction of the pressurized wiring width, and this embodiment The part is divided in the direction of the length of the pressurized wiring. The first step is to place the liquid crystal cells on the mounting table 12. The liquid crystal cell placed on it can also be a product assembled with TCP3 for the first time, or a product repaired after the repair operation. The second step: the positioning device 32 is used to position the connection pad 8 of the liquid crystal cell 1 and the output-side terminal 7 of the TCp3. The map is the state where this positioning is performed. Step 0v: Use the moving device to move the support column to the lower side (Z-axis direction), and when the heating head 16 is moved to the lower side, the 'main pressurizing part 24 also moves to the lower side: Hanging on the bomb 34 Each pressing portion 22 also moves downward. And the divided pressurizing portion 22 is located at the base side of the connection pad 8 (the pressurizing portion 22 which is internally biased to the end of the liquid crystal cell 1 first pressurizes TCP3 (the state of FIG. 12) 'turn the pressurizing portion 22 to the connection Pad 8 end '16-

569062 側依序加壓TCP3。此時，因藉彈性構件之彈簧34，故加壓部22可沿TCP3表面加壓TCP3。如此從連接墊8基部側向端部側加壓時，溶解之ACF從連接墊8基部側向端部側流動， ACF4之溢出部分成為連接墊8之端部側。而最端部之加壓部22加壓TCP3，完成TCP3之熱壓接步驟。此時，ACF4係如上述儲存在連接墊8之端部側，而不留存在連接墊8之基部側（圖1 3)。第4步驟係以移動裝置丨8使加熱頭丨6昇高，完成熱壓接步驟。依本實施例之熱壓接方法，因ACF4儲存在連接墊8之端邛側而不㈢存在基部側，故連接墊8之基部側不致發生金屬腐敍。故不發生如先前之顯示不良之情形。 (第6貧施例）依圖14說明第6實施例。於第5只施例，彈性構件使用彈簧3 4，惟亦可代之以如圖 14所示將流動體38收容於袋體3 $之彈性體㈣。由於使用彈性體4〇，可沿連接墊8長度方向分割之加壓部 22依序加壓TCP3。 (第7貫施例）依圖15說明第7實施例。第）K ^例係以分割加熱工具20之加壓部22加壓TC P3，本貝^例代之以如圖1 5所示加熱之輥子體加壓TCP3者輥子體之加熱亦可與圖1所示熱壓接裝置同樣，於金屬等、、、導虹而成之加熱頭16内裝加熱器，與輥子體側面接觸進 -17- 569062 仃加熱’又亦可於輥子體内裝加熱器。以加熱之輥子體42加壓TCP3之方法係以輥子體42加壓位於連接墊8之基部側之TCP3 ’然後邊將輥子體42向連接塾8之端部側轉動，邊加壓TCP3。匕X ACF4熱壓接TCP3，並與第5實施例同樣將ACF4 推出連接塾8之端部側，污染物亦同樣凝集於連接塾8之端部側。因此’可防止連接塾8之金屬腐名虫，不致發生顯示不良之情形。 [發明之效果]569062 side sequentially pressurizes TCP3. At this time, since the spring 34 of the elastic member is used, the pressurizing portion 22 can pressurize TCP3 along the TCP3 surface. When pressing from the base side to the end side of the connection pad 8 in this way, the dissolved ACF flows from the base side to the end side of the connection pad 8, and the overflow portion of the ACF 4 becomes the end side of the connection pad 8. The most pressing part 22 pressurizes TCP3 to complete the thermocompression bonding step of TCP3. At this time, the ACF4 is stored on the end side of the connection pad 8 as described above, without leaving the base side of the connection pad 8 (Fig. 13). The fourth step is to move the heating device 丨 8 to raise the heating head 丨 6 to complete the thermocompression bonding step. According to the thermocompression bonding method of this embodiment, since the ACF4 is stored on the end side of the connection pad 8 without the base side, the base side of the connection pad 8 does not cause metal corruption. Therefore, it does not occur as shown previously. (Sixth Poor Embodiment) A sixth embodiment will be described with reference to FIG. 14. In the fifth embodiment, the elastic member uses a spring 34, but it can also be replaced with an elastic body 收容 that houses the fluid body 38 in the bag body as shown in FIG. Since the elastic body 40 is used, the pressing portion 22 which can be divided along the length direction of the connection pad 8 sequentially pressurizes TCP3. (Seventh embodiment) A seventh embodiment will be described with reference to Fig. 15. No. K ^ Example is to pressurize TC P3 by the pressurizing portion 22 of the split heating tool 20, and this example uses the heated roller body to press TCP 3 as shown in Figure 15 to heat the roller body. The thermocompression bonding device shown in 1 is the same. The heating head 16 made of metal, etc. is equipped with a heater, which comes into contact with the side of the roller body. -17- 569062 仃 Heating 'can also be installed inside the roller body. Device. The method for pressing TCP3 by the heated roller body 42 is to press TCP3 'on the base side of the connection pad 8 with the roller body 42 and then press TCP3 while rotating the roller body 42 toward the end side of the connection 塾 8. Dagger X ACF4 was thermocompression-bonded to TCP3, and ACF4 was pushed out of the end portion of connection 塾 8 in the same manner as in the fifth embodiment, and contamination was also condensed on the end portion of connection 塾 8. Therefore, it is possible to prevent the metal rotten insects connected to the cymbal 8 from displaying badly. [Effect of the invention]

I 依本發明，可分割為複數構成加熱工具之加壓部，以各分割之加壓部加壓TCP等配線體。由於向配線體寬度方向分割加壓部，故即使構成顯示胞之玻璃基板有厚度少許不均之情形，惟可確實加壓配線體，進行電、機械式連接。又由於沿配線體長度方向分割，故可抑止ACF汙染物凝集於連接墊8之基部側，抑止金層腐蝕等不良之發生。 [圖式簡單說明] 圖1係本發明第1實施例之熱壓接裝置透視圖。圖2係加熱頭内部構造正面圖。圖3係圖2之A - A線剖面圖。圖4係熱壓接前之狀態說明圖。圖5係熱壓接中之說明圖。圖6係熱歷接裝置10之方塊圖。 -18- 569062 (14) 圖7係第2實施例之加熱頭16之構造。圖8係第3實施例之加熱工具20之分割狀態底面圖。圖9係第4實施例之加熱工具20之分割狀態底面圖。圖10係圖1之熱壓接裝置變形例圖。圖11係第5實施例之熱壓接步驟說明圖。圖12係第5實施例之熱壓接步驟說明圖。I According to the present invention, it can be divided into a plurality of pressurizing sections constituting a heating tool, and each divided pressurizing section pressurizes a wiring body such as TCP. Since the pressing portion is divided in the width direction of the wiring body, even if the glass substrate constituting the display cell is slightly uneven in thickness, the wiring body can be surely pressed for electrical and mechanical connection. Since it is divided along the length of the wiring body, it is possible to prevent the ACF pollutant from condensing on the base side of the connection pad 8 and prevent the occurrence of defects such as corrosion of the gold layer. [Brief Description of the Drawings] Fig. 1 is a perspective view of a thermocompression bonding device according to a first embodiment of the present invention. Figure 2 is a front view of the internal structure of the heating head. Fig. 3 is a sectional view taken along the line A-A in Fig. 2. FIG. 4 is an explanatory diagram of a state before thermal compression bonding. Fig. 5 is an explanatory diagram in thermocompression bonding. FIG. 6 is a block diagram of the thermal calendar connection device 10. -18- 569062 (14) Fig. 7 shows the structure of the heating head 16 of the second embodiment. FIG. 8 is a bottom view of a divided state of the heating tool 20 according to the third embodiment. FIG. 9 is a bottom view of the divided state of the heating tool 20 according to the fourth embodiment. FIG. 10 is a diagram of a modification example of the thermocompression bonding apparatus of FIG. 1. FIG. Fig. 11 is an explanatory diagram of a thermal compression bonding step of the fifth embodiment. Fig. 12 is an explanatory diagram of a thermal compression bonding step of the fifth embodiment.

圖1 3係第5實施例之熱壓接步驟說明圖。圖14係第6實施例之熱壓接裝置圖。圖15係第7實施例之熱壓接裝置圖。圖16係液晶胞與TCP之定位狀態透視圖。圖17係TCP之組合狀態步驟圖。圖式代表符號說明FIG. 13 is an explanatory diagram of a thermal compression bonding step of the fifth embodiment. Fig. 14 is a diagram of a thermal compression bonding device according to a sixth embodiment. Fig. 15 is a diagram of a thermocompression bonding apparatus according to a seventh embodiment. Fig. 16 is a perspective view of the positioning state of the liquid crystal cell and the TCP. Figure 17 is a step diagram of the combined state of TCP. Schematic representation of symbols

1 液晶胞 2 PCB 3 TCP 4 ACF 5 玻璃基板 6 驅動晶片1C 7 輸出端子 8 連接墊 9 絕緣膜 10 熱壓接裝置 12 載置台 14 支持部 -19- 569062 〇5) 16 加熱頭 18 移動裝置 20 加熱工具 22 加壓部 24 主加壓部 26 控制裝置 28 馬達 30 加熱裝置 32 定位裝置 34 彈簧1 LCD cell 2 PCB 3 TCP 4 ACF 5 Glass substrate 6 Driver chip 1C 7 Output terminal 8 Connection pad 9 Insulation film 10 Thermocompression device 12 Mounting stage 14 Support section-19- 569062 〇5) 16 Heating head 18 Mobile device 20 Heating tool 22 Pressure section 24 Main pressure section 26 Control device 28 Motor 30 Heating device 32 Positioning device 34 Spring

-20--20-

Claims

569062569062

拾、申讀專利範圍 1. 一種熱壓接裝置，复係攸i尤a / ，、ίτ、將+面顯示裝置之顯示胞置於載置台上’藉各向異性導電膜以加熱工具從上方埶壓接上述顯示胞周邊之連接塾群與薄片狀配線體之端子群，其特诚為分割為複數加壓部，俾加壓於上述加熱工呈之上述配線體，〃設置移動機構，以便將上述分割之各加壓部移動至下方。Pick up and apply for the patent scope 1. A thermocompression device, which is a combination of 尤 a and a, and ίτ, puts the display cell of the + surface display device on the mounting table 'by using an anisotropic conductive film to heat the tool from above埶 Crimp the terminal group connecting the 塾 group around the display cell and the sheet-shaped wiring body, which is divided into multiple pressing parts, 俾 pressurize the wiring body presented by the heating process, 〃 set a moving mechanism so that The divided pressing portions are moved downward.

2. 如申請專利範圍第w之熱壓接裝置，其中上述分割之各加壓部係藉彈性構件設於主加壓部下面，上述主加壓部係以上述移動機構移動至下方，上述主加壓部以上述移動機構移動至下方時，上述各加壓部亦個別藉上述彈性構件移動至下方。 3. 如申請專利範圍第2項之熱壓接裝置，其中上述彈性構件係彈簧，個別連接上述主加壓部與上述各加壓部。2. For example, the thermocompression bonding device in the w range of the patent application, wherein each of the divided pressing sections is provided below the main pressing section by an elastic member, the main pressing section is moved downward by the moving mechanism, and the main section When the pressing portion is moved downward by the moving mechanism, each of the pressing portions is also moved downward by the elastic member individually. 3. For the thermocompression bonding device according to item 2 of the patent application, wherein the elastic member is a spring, and the main pressing portion and each of the pressing portions are individually connected.

4如申請專利範圍第3項之熱壓接裝置，其中上述彈性構件係含複數彈簧，其係彼此非壓縮時之全長不同者。 5. 如申請專利範圍第2項之熱壓接裝置，其中上述彈性構件係收容於袋體之流動體，配置於上述主加壓部與上述各加壓部間。 6. 一種熱壓接裝置，其係將平面顯示裝置之顯示胞置於載置台上，藉各向異性導電膜以加熱工具從上方熱壓接上述顯示胞周邊之連接墊群與薄片狀配線體之端子群，其特徵為以輥子體構成加壓部，俾加壓於上述加熱工 5690624. The thermocompression bonding device according to item 3 of the patent application range, wherein the elastic member includes a plurality of springs, which are different in length when they are not compressed with each other. 5. The thermocompression bonding device according to item 2 of the patent application, wherein the elastic member is a fluid body housed in a bag body, and is disposed between the main pressurizing section and each of the pressurizing sections. 6. A thermocompression bonding device, which comprises placing a display cell of a flat display device on a mounting table, and thermocompression bonding the connection pad group and the sheet-shaped wiring body around the display cell from above by an anisotropic conductive film with a heating tool. The terminal group is characterized in that a pressing part is constituted by a roller body, and the pressure is applied to the heating device 569062.

具之上述配線體。 -種熱壓接裝置’其係將平面顯示裝置之顯示置台上’藉各向異性導電膜以加熱工具從上方熱壓接上述顯不胞周邊之連接墊群與薄片狀配線體之端子群，其特被為上述加妖工ii 0T. . y …、，、之加壓部係沿上述連接墊群之排列方向分割，以上述分割之中央部分之加壓部加壓於上述端子後以夾上述中央部分之加壓部兩側之加壓部，依序加壓上述端子群。 8. -種熱壓接裝i，其係將+面顯示裝置之顯示胞置於載置台上，藉各向異性導電臈以加熱工具從上方熱壓接上述顯示胞周邊之連接墊群與薄片狀配線體之端子群，其特徵為上述加熱工具之加壓部係沿上述連接墊群之長度方向分割，以上述連接墊之基部側加壓部加壓於上述端子群後，上述分割之加壓部向上述連接墊之端部依序加壓。 9.With the above wiring body. -A type of thermocompression bonding device, which is to place the display of a flat display device on the stage. It is specially divided by the above-mentioned demon worker ii 0T .. y, ... ,, and the pressing part is divided along the arrangement direction of the connection pad group, and the pressing part of the divided central part is pressurized on the terminal and clamped. The pressing portions on both sides of the pressing portion in the central portion sequentially pressurize the terminal group. 8.-A type of thermocompression bonding device i, which is to place the display cell of the + surface display device on a mounting table, and use an anisotropic conductive pad to thermally crimp the connection pad group and sheet around the display cell from above with a heating tool The terminal group of the wire-shaped wiring body is characterized in that the pressing portion of the heating tool is divided along the length direction of the connection pad group, and the pressing portion of the base side of the connection pad is pressed to the terminal group, and the division is added. The pressing portion sequentially presses the ends of the connection pads. 9.

種熱壓接裝置，其係將平面顯示裝置之顯示胞置於載置台上’藉各向異性導電膜以加熱工具從上方熱壓接上述顯示胞周邊之連接墊群與薄片狀配線體之端子群，其特徵為由輥子體構成上述加熱工具之加壓部，從上述連接墊之基部側向上述連接墊之端部側，轉動上述輥子體加壓於上述端子群。 _ 2 -A thermocompression bonding device, which is to place a display cell of a flat display device on a mounting table by using an anisotropic conductive film and a heating tool to thermally crimp the connection pad group around the display cell and the terminals of the sheet-shaped wiring body from above. The group is characterized in that a pressing part of the heating tool is constituted by a roller body, and the roller body is rotated to press the terminal group from a base portion side of the connection pad to an end portion side of the connection pad. _ 2 -