JP4299087B2 - プリント配線板 - Google Patents
プリント配線板 Download PDFInfo
- Publication number
- JP4299087B2 JP4299087B2 JP2003325481A JP2003325481A JP4299087B2 JP 4299087 B2 JP4299087 B2 JP 4299087B2 JP 2003325481 A JP2003325481 A JP 2003325481A JP 2003325481 A JP2003325481 A JP 2003325481A JP 4299087 B2 JP4299087 B2 JP 4299087B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- insulating layer
- printed wiring
- via hole
- via holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000000149 penetrating effect Effects 0.000 claims description 50
- 239000010410 layer Substances 0.000 claims description 46
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 47
- 239000004020 conductor Substances 0.000 description 38
- 239000000758 substrate Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
以上のようにして、プリント配線板10が製造される。
Claims (5)
- 第1絶縁層と;
前記第1絶縁層の一方側の表面上に形成され、互いに直交する2方向によって規定されるグリット状に配列される複数の突起状電極端子それぞれが前記一方側に溶融接合される複数の電極パッドと;
前記複数の電極パッドのそれぞれの前記一方側とは反対側である他方側に形成され、前記一方側で非貫通であり、前記複数の電極パッドそれぞれと前記第1絶縁層の前記他方側とを層間接続する複数の非貫通バイアホールと;を備え、
前記複数の非貫通バイアホールの少なくとも1つは、最も近接している前記グリッドの辺縁が延びる方向である近接辺縁方向で隣接する少なくとも一方の非貫通バイアホールに対して、中心軸間隔がグリッド間隔よりも長くなるように、前記近接辺縁方向の直交方向成分を含んでずれた平面位置に形成されている、ことを特徴とするプリント配線板。 - 前記第1絶縁層の前記他方側に順次形成された少なくとも1つの第2絶縁層と;
前記第2絶縁層それぞれの前記一方側に位置する一方側絶縁層に形成されたバイアホールのランド領域の前記他方側に形成され、前記一方側絶縁層に形成されたバイアホールと前記第2絶縁層の前記他方側とを層間接続する複数の非貫通バイアホールと;を更に備えることを特徴とする請求項1に記載のプリント配線板。 - 前記少なくとも1つも非貫通バイアホールは、前記複数の非貫通バイアホールの最外周部に配置される、ことを特徴とする請求項1又は2に記載のプリント配線板。
- 前記複数の突起状電極端子はペリフェラル型に配列され、
前記少なくとも1つの非貫通バイアホールは、更に、前記複数の非貫通バイアホールの最内周部に配置されることを特徴とする請求項3に記載のプリント配線板。 - 前記少なくとも1つの非貫通バイアホールは、前記近接辺縁方向にほぼ沿って連続的に配列された複数の特定非貫通バイアホールであり、
前記複数の特定非貫通バイアホールは、前記近接辺縁方向の直交方向に交互にずれた平面位置に形成されている、ことを特徴とする請求項1〜4のいずれか一項に記載のプリント配線板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003325481A JP4299087B2 (ja) | 2003-09-18 | 2003-09-18 | プリント配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003325481A JP4299087B2 (ja) | 2003-09-18 | 2003-09-18 | プリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005093743A JP2005093743A (ja) | 2005-04-07 |
JP4299087B2 true JP4299087B2 (ja) | 2009-07-22 |
Family
ID=34455910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003325481A Expired - Lifetime JP4299087B2 (ja) | 2003-09-18 | 2003-09-18 | プリント配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4299087B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9881115B2 (en) | 2016-04-27 | 2018-01-30 | International Business Machines Corporation | Signal via positioning in a multi-layer circuit board using a genetic via placement solver |
US9916410B2 (en) | 2015-06-22 | 2018-03-13 | International Business Machines Corporation | Signal via positioning in a multi-layer circuit board |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007184414A (ja) * | 2006-01-06 | 2007-07-19 | Matsushita Electric Ind Co Ltd | 半導体素子実装用基板、半導体装置及び電子機器 |
JP5096683B2 (ja) * | 2006-03-03 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4991637B2 (ja) * | 2008-06-12 | 2012-08-01 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2003
- 2003-09-18 JP JP2003325481A patent/JP4299087B2/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9916410B2 (en) | 2015-06-22 | 2018-03-13 | International Business Machines Corporation | Signal via positioning in a multi-layer circuit board |
US10657308B2 (en) | 2015-06-22 | 2020-05-19 | International Business Machines Corporation | Signal via positioning in a multi-layer circuit board |
US9881115B2 (en) | 2016-04-27 | 2018-01-30 | International Business Machines Corporation | Signal via positioning in a multi-layer circuit board using a genetic via placement solver |
Also Published As
Publication number | Publication date |
---|---|
JP2005093743A (ja) | 2005-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5224845B2 (ja) | 半導体装置の製造方法及び半導体装置 | |
US8299368B2 (en) | Interconnection element for electric circuits | |
JP2009004744A (ja) | プリント基板 | |
US8847078B2 (en) | Printed wiring board and method for manufacturing printed wiring board | |
US7985926B2 (en) | Printed circuit board and electronic component device | |
JP2008131035A (ja) | バンプ付き半導体チップ及びそれを備える半導体パッケージ | |
JP4976840B2 (ja) | プリント配線板、プリント配線板の製造方法および電子機器 | |
JP4819335B2 (ja) | 半導体チップパッケージ | |
JP2017084997A (ja) | プリント配線板及びその製造方法 | |
JP2006294976A (ja) | 半導体装置およびその製造方法 | |
JP2006303364A (ja) | Bga型多層回路配線板 | |
JP5238274B2 (ja) | 配線回路基板およびその製造方法 | |
JP4299087B2 (ja) | プリント配線板 | |
JP2010232616A (ja) | 半導体装置及び配線基板 | |
CN104779236B (zh) | 用于ic封装基板的倒装芯片焊盘几何结构 | |
JP2017175085A (ja) | 両面配線フレキシブル基板 | |
JP2008166464A (ja) | 配線基板及びその製造方法 | |
JP4967325B2 (ja) | 多層配線板 | |
JP2007027341A (ja) | プリント配線板および電子部品実装構造 | |
JP2006253167A (ja) | キャビティ構造プリント配線板の製造方法及び実装構造 | |
JP2014123592A (ja) | プリント配線板の製造方法及びプリント配線板 | |
US7825340B2 (en) | Double-sided wiring board, manufacturing method of double-sided wiring board, and mounting double-sided wiring board | |
JP2006261382A (ja) | 多層配線板及びその製造方法 | |
JP2006041238A (ja) | 配線基板及び配線基板の製造方法 | |
JP4176283B2 (ja) | 可撓性微細多層回路基板の製造法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060828 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20060926 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20061010 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20061011 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090306 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090326 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090416 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4299087 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120424 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120424 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130424 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140424 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |