JP4183859B2 - 半導体基板試験装置 - Google Patents

半導体基板試験装置 Download PDF

Info

Publication number
JP4183859B2
JP4183859B2 JP24890599A JP24890599A JP4183859B2 JP 4183859 B2 JP4183859 B2 JP 4183859B2 JP 24890599 A JP24890599 A JP 24890599A JP 24890599 A JP24890599 A JP 24890599A JP 4183859 B2 JP4183859 B2 JP 4183859B2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
needle
contact
test
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP24890599A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001077160A (ja
Inventor
進 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP24890599A priority Critical patent/JP4183859B2/ja
Priority to TW89117199A priority patent/TW541430B/zh
Priority to KR10-2000-0051602A priority patent/KR100478261B1/ko
Priority to DE2000143193 priority patent/DE10043193B4/de
Publication of JP2001077160A publication Critical patent/JP2001077160A/ja
Application granted granted Critical
Publication of JP4183859B2 publication Critical patent/JP4183859B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908—Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
    • G01R31/3191—Calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2882—Testing timing characteristics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318511—Wafer Test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP24890599A 1999-09-02 1999-09-02 半導体基板試験装置 Expired - Fee Related JP4183859B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP24890599A JP4183859B2 (ja) 1999-09-02 1999-09-02 半導体基板試験装置
TW89117199A TW541430B (en) 1999-09-02 2000-08-25 Test device for semiconductor wafers
KR10-2000-0051602A KR100478261B1 (ko) 1999-09-02 2000-09-01 반도체 기판 시험장치
DE2000143193 DE10043193B4 (de) 1999-09-02 2000-09-01 Prüfgerät für Halbleitersubstrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24890599A JP4183859B2 (ja) 1999-09-02 1999-09-02 半導体基板試験装置

Publications (2)

Publication Number Publication Date
JP2001077160A JP2001077160A (ja) 2001-03-23
JP4183859B2 true JP4183859B2 (ja) 2008-11-19

Family

ID=17185185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24890599A Expired - Fee Related JP4183859B2 (ja) 1999-09-02 1999-09-02 半導体基板試験装置

Country Status (4)

Country Link
JP (1) JP4183859B2 (ko)
KR (1) KR100478261B1 (ko)
DE (1) DE10043193B4 (ko)
TW (1) TW541430B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7319335B2 (en) 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7332916B2 (en) 2005-03-03 2008-02-19 Semiconductor Technology Academic Research Center On-chip signal waveform measurement apparatus for measuring signal waveforms at detection points on IC chip
US7535238B2 (en) 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US7786742B2 (en) 2006-05-31 2010-08-31 Applied Materials, Inc. Prober for electronic device testing on large area substrates
CN101689522B (zh) 2007-06-29 2011-11-02 爱德万测试株式会社 测试装置
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
JP4773549B2 (ja) 2009-07-01 2011-09-14 株式会社半導体理工学研究センター タイミング信号発生回路
KR100990198B1 (ko) 2009-08-07 2010-10-29 가부시키가이샤 어드밴티스트 웨이퍼 트레이 및 시험 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8515025D0 (en) * 1985-06-13 1985-07-17 Plessey Co Plc Calibration apparatus
JP2576233Y2 (ja) * 1991-08-05 1998-07-09 株式会社アドバンテスト Ｉｃ試験装置のテストヘッドと試料との接続機構
US5565788A (en) * 1994-07-20 1996-10-15 Cascade Microtech, Inc. Coaxial wafer probe with tip shielding
JPH08139142A (ja) * 1994-11-09 1996-05-31 Tokyo Electron Ltd プローブ装置
JP3188935B2 (ja) * 1995-01-19 2001-07-16 東京エレクトロン株式会社 検査装置
US5729150A (en) * 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables

Also Published As

Publication number Publication date
KR100478261B1 (ko) 2005-03-23
JP2001077160A (ja) 2001-03-23
TW541430B (en) 2003-07-11
KR20010050313A (ko) 2001-06-15
DE10043193A1 (de) 2001-04-12
DE10043193B4 (de) 2007-05-03

Similar Documents

Publication Publication Date Title
US5905382A (en) Universal wafer carrier for wafer level die burn-in
US7046027B2 (en) Interface apparatus for semiconductor device tester
JPH11125646A (ja) 垂直針型プローブカード、その製造方法およびその不良プローブ針の交換方法
JPH11101820A (ja) プローブカードおよびそれを用いたウエハテスト方法
US6836130B2 (en) Method and apparatus for wafer scale testing
JPH09304436A (ja) プローブカード
JP4183859B2 (ja) 半導体基板試験装置
US7768283B1 (en) Universal socketless test fixture
JP3586106B2 (ja) Ｉｃ試験装置用プローブカード
JP2000346875A (ja) プローブカードおよびこれを用いたｉｃ試験装置
JP2737774B2 (ja) ウェハテスタ
US20090128172A1 (en) Calibration board for electronic device test apparatus
JPH11295342A (ja) プローブカード及びその製造方法
JP2003050262A (ja) 高周波ｉｃソケット、半導体試験装置および半導体試験方法ならびに半導体装置の製造方法
JP2768310B2 (ja) 半導体ウェハ測定治具
KR20090075515A (ko) 프로브 카드 및 이를 포함하는 테스트 장비
KR0141453B1 (ko) 노운 굳 다이의 제조장치와 제조방법
JPH06308155A (ja) プローブ装置
CN114624568A (zh) 失效分析装置
JPH0823013A (ja) ウエハー用プローバ
JPS6137776B2 (ko)
JPS5918864B2 (ja) 半導体ウエハ−検査装置
JPH0720150A (ja) プローブカード及びこれを用いた試験装置
JPH072975U (ja) 加熱又は冷却テストに適したプローブカード
Yang et al. A new bare die test methodology

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060822

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080515

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080603

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080730

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20080730

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080826

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080903

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110912

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees