CN101562952B - 线路基板、线路基板的制作方法及电路板的制作方法 - Google Patents
线路基板、线路基板的制作方法及电路板的制作方法 Download PDFInfo
- Publication number
- CN101562952B CN101562952B CN200810301211.3A CN200810301211A CN101562952B CN 101562952 B CN101562952 B CN 101562952B CN 200810301211 A CN200810301211 A CN 200810301211A CN 101562952 B CN101562952 B CN 101562952B
- Authority
- CN
- China
- Prior art keywords
- substrate
- conducting wire
- base plate
- circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 106
- 238000012545 processing Methods 0.000 claims description 55
- 229920002120 photoresistant polymer Polymers 0.000 claims description 29
- 238000003825 pressing Methods 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 238000011161 development Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000004804 winding Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 208000019300 CLIPPERS Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1554—Rotating or turning the PCB in a continuous manner
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810301211.3A CN101562952B (zh) | 2008-04-18 | 2008-04-18 | 线路基板、线路基板的制作方法及电路板的制作方法 |
US12/332,321 US8268537B2 (en) | 2008-04-18 | 2008-12-10 | Method for manufacturing printed circuit board |
US13/461,749 US20120211267A1 (en) | 2008-04-18 | 2012-05-01 | Printed circuit board substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810301211.3A CN101562952B (zh) | 2008-04-18 | 2008-04-18 | 线路基板、线路基板的制作方法及电路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101562952A CN101562952A (zh) | 2009-10-21 |
CN101562952B true CN101562952B (zh) | 2012-04-11 |
Family
ID=41200170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810301211.3A Expired - Fee Related CN101562952B (zh) | 2008-04-18 | 2008-04-18 | 线路基板、线路基板的制作方法及电路板的制作方法 |
Country Status (2)
Country | Link |
---|---|
US (2) | US8268537B2 (zh) |
CN (1) | CN101562952B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102656956B (zh) * | 2010-07-26 | 2015-02-18 | 日本梅克特隆株式会社 | 柔性印刷电路板及其制造方法 |
CN111935902A (zh) * | 2020-09-23 | 2020-11-13 | 歌尔股份有限公司 | 印制电路板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5240746A (en) * | 1991-02-25 | 1993-08-31 | Delco Electronics Corporation | System for performing related operations on workpieces |
US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
ATE180137T1 (de) * | 1992-06-15 | 1999-05-15 | Heinze Dyconex Patente | Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung |
JP3979391B2 (ja) * | 2004-01-26 | 2007-09-19 | 松下電器産業株式会社 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
US7746656B2 (en) * | 2005-05-16 | 2010-06-29 | Stats Chippac Ltd. | Offset integrated circuit package-on-package stacking system |
JP2007067244A (ja) * | 2005-08-31 | 2007-03-15 | Sony Corp | 回路基板 |
-
2008
- 2008-04-18 CN CN200810301211.3A patent/CN101562952B/zh not_active Expired - Fee Related
- 2008-12-10 US US12/332,321 patent/US8268537B2/en active Active
-
2012
- 2012-05-01 US US13/461,749 patent/US20120211267A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20090260867A1 (en) | 2009-10-22 |
CN101562952A (zh) | 2009-10-21 |
US8268537B2 (en) | 2012-09-18 |
US20120211267A1 (en) | 2012-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Co-applicant after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Co-applicant before: Hongsheng Technology Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170307 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 |