JP3917994B2 - 塗布膜用乾燥炉 - Google Patents
塗布膜用乾燥炉 Download PDFInfo
- Publication number
- JP3917994B2 JP3917994B2 JP2004243930A JP2004243930A JP3917994B2 JP 3917994 B2 JP3917994 B2 JP 3917994B2 JP 2004243930 A JP2004243930 A JP 2004243930A JP 2004243930 A JP2004243930 A JP 2004243930A JP 3917994 B2 JP3917994 B2 JP 3917994B2
- Authority
- JP
- Japan
- Prior art keywords
- coating film
- substrate
- pin
- glass substrate
- hot plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001035 drying Methods 0.000 title claims description 80
- 239000011248 coating agent Substances 0.000 title claims description 54
- 238000000576 coating method Methods 0.000 title claims description 54
- 239000000758 substrate Substances 0.000 claims description 106
- 239000011521 glass Substances 0.000 claims description 67
- 238000010438 heat treatment Methods 0.000 claims description 16
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 6
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
- F26B25/004—Handling, e.g. loading or unloading arrangements for articles in the shape of discrete sheets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
- F26B9/06—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
次に、実施の形態2について説明するが実施の形態1と異なる点は送り手段18の構造が違うものである。
2 ホットプレートヒータ(加熱手段)
3 乾燥室
6 ガラス基板
10,18 送り手段
11 支持ピン
12 移動ピン
20 回転体
21 ピン
Claims (5)
- 上面に塗布膜が塗布された基板を加熱してこの塗布膜を乾燥させる塗布膜用乾燥炉であって、
側面に形成された基板の搬送口と、前記基板の塗布膜を加熱乾燥させる加熱手段と、前記塗布膜の加熱乾燥時に、基板の下面と当接し、基板との当接位置を移動させる送り手段とを備え、且つ、前記送り手段は、前記搬送口から搬入された基板の下面を支持する支持ピンと、駆動手段にて支持ピンよりも低い位置から高い位置へ垂直方向に移動すると共に水平方向におけるX軸方向及びこれに直交するY軸方向に移動する移動ピンとから構成されたことを特徴とする塗布膜用乾燥炉。 - 前記加熱手段は、基板を挟んだ上下一対のホットプレートヒータとしたことを特徴とする請求項1記載の塗布膜用乾燥炉。
- 上面に塗布膜が塗布された基板を加熱してこの塗布膜を乾燥させる塗布膜用乾燥炉であって、
ホットプレートヒータ、基板、ホットプレートヒータと基板を上下で挟むようにホットプレートヒータを順次配置し、上下のホットプレートヒータ間に前記基板の搬送口と、前記塗布膜の加熱乾燥時に、ガラス基板の下面と当接し、基板との当接位置を移動させる送り手段とを設け、且つ、前記送り手段は、前記搬送口から搬入された基板の下面を支持する支持ピンと、駆動手段にて支持ピンよりも低い位置から高い位置へ垂直方向に移動すると共に水平方向におけるX軸方向及びこれに直交するY軸方向に移動する移動ピンとから構成されたことを特徴とする塗布膜用乾燥炉。 - 前記支持ピン及び移動ピンは、耐熱性樹脂で形成されていることを特徴とする請求項1から3のいずれかに記載の塗布膜用乾燥炉。
- 前記移動ピンは、前記ガラス基板を一方向及びそれと逆方向に移動させるように構成されていることを特徴とする請求項1から4のいずれかに記載の塗布膜用乾燥炉。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004243930A JP3917994B2 (ja) | 2004-08-24 | 2004-08-24 | 塗布膜用乾燥炉 |
PCT/JP2005/015221 WO2006022232A1 (ja) | 2004-08-24 | 2005-08-22 | 塗布膜用乾燥炉 |
KR1020077004085A KR101117536B1 (ko) | 2004-08-24 | 2005-08-22 | 도포막용 건조로 |
CNB2005800285630A CN100478085C (zh) | 2004-08-24 | 2005-08-22 | 涂布膜用干燥炉 |
US11/659,317 US8167611B2 (en) | 2004-08-24 | 2005-08-22 | Drying furnace for coated film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004243930A JP3917994B2 (ja) | 2004-08-24 | 2004-08-24 | 塗布膜用乾燥炉 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006061755A JP2006061755A (ja) | 2006-03-09 |
JP3917994B2 true JP3917994B2 (ja) | 2007-05-23 |
Family
ID=35967444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004243930A Active JP3917994B2 (ja) | 2004-08-24 | 2004-08-24 | 塗布膜用乾燥炉 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8167611B2 (ja) |
JP (1) | JP3917994B2 (ja) |
KR (1) | KR101117536B1 (ja) |
CN (1) | CN100478085C (ja) |
WO (1) | WO2006022232A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009044463A1 (ja) * | 2007-10-03 | 2009-04-09 | Kabushiki Kaisha Ishiihyoki | 塗布膜用乾燥装置 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4387432B2 (ja) * | 2007-10-01 | 2009-12-16 | 株式会社石井表記 | 塗布膜用乾燥装置 |
JP5104192B2 (ja) * | 2007-10-18 | 2012-12-19 | 凸版印刷株式会社 | レジスト塗布基板の熱処理装置及びその熱処理方法 |
JP5292799B2 (ja) * | 2007-12-19 | 2013-09-18 | 凸版印刷株式会社 | 基板用支持ピン |
TWI508178B (zh) * | 2008-07-16 | 2015-11-11 | Tera Semicon Corp | 批量式熱處理裝置 |
KR101537675B1 (ko) * | 2008-10-07 | 2015-07-17 | 엘지디스플레이 주식회사 | 도포막용 건조로 |
JP5204641B2 (ja) * | 2008-12-24 | 2013-06-05 | 古河機械金属株式会社 | 部材処理装置 |
JP4790092B1 (ja) * | 2010-04-30 | 2011-10-12 | 日本碍子株式会社 | 塗膜乾燥炉 |
WO2012035722A1 (ja) * | 2010-09-14 | 2012-03-22 | 古河機械金属株式会社 | 処理装置 |
JP5678177B2 (ja) * | 2011-04-13 | 2015-02-25 | シャープ株式会社 | 基板支持装置、及び乾燥装置 |
DE102011109325B4 (de) * | 2011-08-03 | 2016-09-22 | Venjakob Maschinenbau Gmbh & Co. Kg | Vorrichtung zum Trocknen von Werkstücken |
US9362634B2 (en) | 2011-12-27 | 2016-06-07 | Perfectvision Manufacturing, Inc. | Enhanced continuity connector |
DE102012103275A1 (de) * | 2012-04-16 | 2013-10-17 | Benteler Automobiltechnik Gmbh | Schichtofenanlage sowie Verfahren zum Betreiben der Schichtofenanlage |
CN102863147B (zh) * | 2012-09-26 | 2014-10-29 | 深圳市华星光电技术有限公司 | 对基板进行烤焙处理的装置及方法 |
CN103196282A (zh) * | 2013-03-28 | 2013-07-10 | 沈南飞 | 一种简易的家用烘干箱 |
CN103278966A (zh) * | 2013-04-22 | 2013-09-04 | 合肥京东方光电科技有限公司 | 一种取向膜预固化设备 |
JP5724014B1 (ja) * | 2014-04-22 | 2015-05-27 | 株式会社幸和 | 基板支持装置及び基板処理装置 |
US9564695B2 (en) | 2015-02-24 | 2017-02-07 | Perfectvision Manufacturing, Inc. | Torque sleeve for use with coaxial cable connector |
WO2016199689A1 (ja) * | 2015-06-11 | 2016-12-15 | シャープ株式会社 | 基板処理装置 |
CN105080803B (zh) | 2015-08-21 | 2018-08-07 | 京东方科技集团股份有限公司 | 基板承载结构、减压干燥设备及减压干燥方法 |
CN105509431A (zh) * | 2016-01-27 | 2016-04-20 | 南京工程学院 | 电气自动化烘干室 |
CN106225467B (zh) * | 2016-07-14 | 2019-03-15 | 武汉华星光电技术有限公司 | 薄膜烘干机支架及薄膜烘干机 |
JP6400771B1 (ja) * | 2017-04-11 | 2018-10-03 | 株式会社石井表記 | ヒータ付き減圧ユニット及び電池製造用装置 |
CN108089378B (zh) * | 2018-01-03 | 2020-07-07 | 惠科股份有限公司 | 一种烘烤方法、装置及烘烤炉 |
CN110314812A (zh) * | 2018-03-29 | 2019-10-11 | 阳程科技股份有限公司 | 镜板水洗烘干机改良构造 |
JP7321768B2 (ja) | 2018-05-23 | 2023-08-07 | 信越化学工業株式会社 | 化学気相成長装置および被膜形成方法 |
CN109163516A (zh) * | 2018-09-20 | 2019-01-08 | 东阳市新意工业产品设计有限公司 | 一种化工生产设备及其工作方法 |
KR102559551B1 (ko) * | 2021-03-11 | 2023-07-27 | 주식회사 한국제이텍트써모시스템 | 열처리 오븐의 히터 유닛 |
CN113310292A (zh) * | 2021-06-09 | 2021-08-27 | 安徽省舒城华竹实业有限公司 | 一种竹制工艺品加工用集中烘干装置及其烘干方法 |
Family Cites Families (11)
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JP3568634B2 (ja) | 1995-06-22 | 2004-09-22 | 株式会社東芝 | 塗膜乾燥方法およびその装置 |
JP3597321B2 (ja) | 1996-09-03 | 2004-12-08 | 大日本スクリーン製造株式会社 | 減圧乾燥装置 |
JP2001012856A (ja) * | 1999-06-28 | 2001-01-19 | Hitachi Chemical Techno-Plant Co Ltd | 熱処理装置 |
JP2002195755A (ja) * | 2000-10-16 | 2002-07-10 | Matsushita Electric Ind Co Ltd | 熱処理装置 |
JP2002225329A (ja) | 2001-02-06 | 2002-08-14 | Matsushita Electric Ind Co Ltd | 画像形成装置 |
JP4635350B2 (ja) * | 2001-02-28 | 2011-02-23 | 光洋サーモシステム株式会社 | 搬送装置 |
JP4025030B2 (ja) * | 2001-04-17 | 2007-12-19 | 東京エレクトロン株式会社 | 基板の処理装置及び搬送アーム |
JP4018892B2 (ja) * | 2001-10-03 | 2007-12-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3751246B2 (ja) * | 2001-11-13 | 2006-03-01 | 大日本スクリーン製造株式会社 | 薄膜形成装置および搬送方法 |
US6796054B2 (en) * | 2002-03-12 | 2004-09-28 | Tokyo Electron Limited | Low-pressure dryer and low-pressure drying method |
US7550043B2 (en) * | 2002-12-20 | 2009-06-23 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
-
2004
- 2004-08-24 JP JP2004243930A patent/JP3917994B2/ja active Active
-
2005
- 2005-08-22 KR KR1020077004085A patent/KR101117536B1/ko active IP Right Grant
- 2005-08-22 CN CNB2005800285630A patent/CN100478085C/zh active Active
- 2005-08-22 US US11/659,317 patent/US8167611B2/en not_active Expired - Fee Related
- 2005-08-22 WO PCT/JP2005/015221 patent/WO2006022232A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009044463A1 (ja) * | 2007-10-03 | 2009-04-09 | Kabushiki Kaisha Ishiihyoki | 塗布膜用乾燥装置 |
KR101378049B1 (ko) * | 2007-10-03 | 2014-03-27 | 이시이 효키 가부시키가이샤 | 도포막용 건조장치 |
Also Published As
Publication number | Publication date |
---|---|
CN100478085C (zh) | 2009-04-15 |
JP2006061755A (ja) | 2006-03-09 |
CN101010147A (zh) | 2007-08-01 |
US8167611B2 (en) | 2012-05-01 |
WO2006022232A1 (ja) | 2006-03-02 |
US20100167224A1 (en) | 2010-07-01 |
KR20070053714A (ko) | 2007-05-25 |
KR101117536B1 (ko) | 2012-03-07 |
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