JP2784523B2 - Substrate for mounting electronic components - Google Patents
Substrate for mounting electronic componentsInfo
- Publication number
- JP2784523B2 JP2784523B2 JP2247830A JP24783090A JP2784523B2 JP 2784523 B2 JP2784523 B2 JP 2784523B2 JP 2247830 A JP2247830 A JP 2247830A JP 24783090 A JP24783090 A JP 24783090A JP 2784523 B2 JP2784523 B2 JP 2784523B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- base material
- component mounting
- concave portion
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は，耐湿性に優れ，かつ高密度配線が可能な電
子部品搭載用基板に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting board which is excellent in moisture resistance and capable of high-density wiring.
従来，電子部品搭載用基板においては，半導体素子な
ど電子部品からの発熱を放散させるため，基材に電子部
品搭載用凹部を設けると共にその反対側に接着剤を介し
て放熱板を設けている（例えば，特開昭59−32191号公
報）。Conventionally, in a substrate for mounting electronic components, in order to dissipate heat generated from electronic components such as semiconductor elements, a concave portion for mounting electronic components is provided on a base material, and a radiator plate is provided on the opposite side of the substrate via an adhesive. For example, JP-A-59-32191).
即ち，第10図に示すごとく，従来の電子部品搭載用基
板90は，基材９に設けた凹所92内に接着剤８を介して放
熱板７を接合している。また，基材裏側においては放熱
板７と基材９との間に金属メッキ層75が，また放熱板７
の上面と電子部品搭載用凹部93との間に金属メッキ層76
が形成されている。そのため，基材９の裏側から電子部
品搭載用凹部93内への湿気の浸入が遮断される。なお，
同図において符号94は導体回路である。That is, as shown in FIG. 10, in the conventional electronic component mounting substrate 90, the heat radiating plate 7 is joined to the concave portion 92 provided in the base material 9 via the adhesive 8. Further, on the back side of the base material, a metal plating layer 75 is provided between the heat sink 7 and the base material 9 and the heat sink 7 is provided.
Metal plating layer 76 between the upper surface of the
Are formed. Therefore, infiltration of moisture from the back side of the base material 9 into the electronic component mounting recess 93 is blocked. In addition,
In the figure, reference numeral 94 denotes a conductor circuit.
しかしながら，上記電子部品搭載用基板90は，第11図
に示すごとく，凹所92の側壁と放熱板７の側壁とが対向
している対向部分95において，その開口部750に金属メ
ッキ層75が形成されないことがある。つまり，メッキ不
良穴751を生ずる。However, as shown in FIG. 11, the electronic component mounting board 90 has a metal plating layer 75 in an opening 750 in an opposing portion 95 where the side wall of the recess 92 and the side wall of the heat sink 7 oppose each other. May not be formed. That is, a defective plating hole 751 is generated.
かかるメッキ不良穴751を生ずると，この部分より電
子部品搭載用凹部内へ湿気が浸入して，半導体などの電
子部品が損傷するおそれがある。When such a plating failure hole 751 is generated, moisture may enter into the electronic component mounting concave portion from this portion, and the electronic component such as a semiconductor may be damaged.
一方，上記メッキ不良穴751を発生する理由として
は，凹所92と放熱板７との間の前記対向部分95のクリア
ランスが大きいため（約0.1〜0.2mm）と考えられる。On the other hand, it is considered that the plating failure hole 751 is generated because the clearance of the facing portion 95 between the recess 92 and the heat sink 7 is large (about 0.1 to 0.2 mm).
そこで，この対向部分95のクリアランスを小さくする
必要があるが，加工上のバラツキのために，前記クリア
ランスを生じてしまう。Therefore, it is necessary to reduce the clearance of the facing portion 95, but the clearance occurs due to processing variations.
他方，上記問題点に対する対策として，第12図に示す
ごとく，凹所92を幅広く設けて，その天井面921におけ
る，凹所92の側壁と放熱板７の側壁との間を広く取る方
法がある。そして，これらの表面に金属メッキ層75を連
続的に設ける。この方法では，上記対向部分95のクリア
ランスが充分に大きいため，この対向部分においても金
属メッキ層75が形成される。On the other hand, as a countermeasure against the above problem, as shown in FIG. 12, there is a method in which the recess 92 is provided widely and the space between the side wall of the recess 92 and the side wall of the heat sink 7 on the ceiling surface 921 is widened. . Then, a metal plating layer 75 is continuously provided on these surfaces. In this method, the metal plating layer 75 is also formed on the facing portion 95 since the clearance of the facing portion 95 is sufficiently large.
しかし，凹所92を大きく取ると，基材９の裏側面にお
ける導体回路パターン形成の自由度が阻害される。一
方，凹所92の大きさを制限すれば，放熱板７が小形状と
なり放熱性が阻害される。However, if the recess 92 is made large, the degree of freedom in forming a conductive circuit pattern on the back surface of the base material 9 is impaired. On the other hand, if the size of the recess 92 is limited, the heat radiating plate 7 becomes small in size, and the heat radiating property is hindered.
また，上記方法では，凹所92の天井面921に放熱板７
を接着する際，接着剤８が両者の間よりはみ出す（溢
流）ことがある。そして，この接着剤のはみ出し部分が
大きいときには，金属メッキ層75が形成されない。その
ため，はみ出し防止のために，接着剤８の量を調整する
必要がある。In the above method, the heat sink 7 is provided on the ceiling surface 921 of the recess 92.
When the adhesive is adhered, the adhesive 8 may protrude from between the two (overflow). When the protruding portion of the adhesive is large, the metal plating layer 75 is not formed. Therefore, it is necessary to adjust the amount of the adhesive 8 in order to prevent protrusion.
ところで，近年，電子部品の高機能化に伴って，演算
処理速度の高速化が必要となり，特に電子部品への信号
の入出力に使用されるディジタル信号（ON−OFF）のク
ロック周波数も，数十MHzから数百MHzへと高周波域に拡
大している。By the way, in recent years, as the functions of electronic components have become more sophisticated, it has become necessary to increase the speed of arithmetic processing. In particular, the clock frequency of digital signals (ON-OFF) used for inputting and outputting signals to electronic components has also increased. It has expanded to a high frequency range from ten MHz to several hundred MHz.
しかし，高周波域においてディタル信号のパルス波を
効率良く入出力させるためには，回路の電気特性として
は，キャンパシタンス（誘電率）とインダクタンス（磁
気誘導係数）とを小さくする必要がある。この中，キャ
パシタンスは，基材の材料特性で定められるが，インダ
クタンスは配線設計に起因することが多い。However, in order to efficiently input and output a pulse wave of a digital signal in a high frequency range, it is necessary to reduce the capacitance (permittivity) and inductance (magnetic induction coefficient) as electrical characteristics of the circuit. Among these, the capacitance is determined by the material characteristics of the base material, but the inductance often results from the wiring design.
特に，電源回路，接地回路は，低インダクタンス回路
とする必要があり，その回路パターンは出来るだけ太く
することが望まれる。In particular, the power supply circuit and the ground circuit need to be low-inductance circuits, and their circuit patterns are desired to be as thick as possible.
また，上記高機能化に伴って，電子部品搭載用凹部内
に配置した電子部品からも多量の熱が発生する。それ
故，放熱板は少しでも大きいことが要求され，その結果
放熱板を接合する基材の裏側面は，回路形成の自由度が
少なくなっている。In addition, a large amount of heat is generated from the electronic components arranged in the electronic component mounting recesses in accordance with the above-mentioned sophistication. Therefore, the heat sink is required to be as large as possible, and as a result, the back surface of the base material to which the heat sink is joined has a reduced degree of freedom in circuit formation.
本発明はかかる問題点に鑑み，放熱板と凹所との対向
部分における金属メッキ層が確実に形成されており，ま
た電源回路又は接地回路を低インダクタンス回路とする
ことができる，高機能で放熱性に優れた電子部品搭載用
基板を提供しようとするものである。SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a high-performance and heat-dissipating device in which a metal plating layer is reliably formed at a portion where a heat sink and a recess face each other, and a power supply circuit or a ground circuit can be a low inductance circuit. It is an object of the present invention to provide an electronic component mounting substrate having excellent performance.
本発明は，導体回路を有する基材と，該基材に設けた
電子部品搭載用凹部と，その反対側に設けた該電子部品
搭載用凹部よりも大きい径の凹所と，該凹所内に接着剤
を介して固着されその背面を上記電子品搭載用凹部に露
出させた放熱板とよりなる電子部品搭載用基板であっ
て，基材裏側における上記凹所の側壁と放熱板の側壁と
が対向している対向部分には，基材と放熱板の両者にま
たがると共に上記接着剤を同一表面上に露出させた露出
凹部を設けてなり，かつ上記放熱板と露出凹部と基材裏
側には連続した金属メッキ層が被覆してあり，また，上
記電子部品搭載用凹部の側壁には基材の外部へ導通させ
た導通層を設け，また該導通層には電源用端子又は接地
用端子を設けてなることを特徴とする電子部品搭載用基
板にある。The present invention provides a substrate having a conductive circuit, an electronic component mounting concave portion provided in the substrate, a concave portion provided on the opposite side having a diameter larger than the electronic component mounting concave portion, and a concave portion provided in the concave portion. An electronic component mounting board fixed by an adhesive and having a back surface exposed to the electronic product mounting recess, wherein a side wall of the recess and a side wall of the heat sink on the back side of the base material are formed. The opposite facing portion is provided with an exposed concave portion that extends over both the base material and the heat sink and exposes the adhesive on the same surface. A continuous metal plating layer is coated, and a conductive layer is provided on the side wall of the electronic component mounting recess, the conductive layer being electrically connected to the outside of the substrate. The conductive layer has a power supply terminal or a ground terminal. An electronic component mounting board characterized by being provided.
本発明において最も注目すべきことは，上記対向部分
において上記露出凹部を設け，放熱板と露出凹部と基材
裏側面との間に連続した金属メッキ層を被覆しているこ
と，及び電子部品搭載用凹部の側壁には上記導通層を設
け，かつ該導通層に電源用端子又は接地用端子を設けた
ことにある。The most remarkable point in the present invention is that the exposed concave portion is provided in the opposed portion, and a continuous metal plating layer is provided between the heat sink, the exposed concave portion, and the back surface of the substrate. The conductive layer is provided on the side wall of the recess, and the power supply terminal or the ground terminal is provided on the conductive layer.
上記露出凹部は，基材と放熱板の両者の間に，またが
って形成されている。また，放熱板接合用の凹所は，通
常，基材の中央部分に角状或いは円状等の凹所として形
成され，また放熱板は該凹所と相似形に設けられる。そ
れ故，上記対向部分は，通常は角状，円状等の環状に形
成される（第４図参照）。The exposed concave portion is formed between both the base material and the heat sink. Further, the recess for joining the heat sink is usually formed as a square or circular recess in the center of the base material, and the heat sink is provided in a similar shape to the recess. Therefore, the opposed portion is usually formed in a ring shape such as a square shape or a circular shape (see FIG. 4).
また，接着剤は凹所側壁と放熱板側壁との間，即ち上
記対向部分に充填されている。そして，該対向部分にお
いて設けた前記露出凹部には，接着剤が露出した状態に
ある。該接着剤の露出表面は，露出凹部の天井面とほぼ
同じ面上にある。The adhesive is filled between the side wall of the recess and the side wall of the radiator plate, that is, the opposing portion. The adhesive is exposed in the exposed recess provided in the facing portion. The exposed surface of the adhesive is on substantially the same surface as the ceiling surface of the exposed recess.
上記基材の材料としては，ガラス−エポキシ樹脂，ガ
ラス−ビスマレイミド−トリアジン樹脂，ガラス−ポリ
イミド樹脂等がある。また，放熱板としては，銅，鉄系
合金，銅系合金等がある。Examples of the material of the base include glass-epoxy resin, glass-bismaleimide-triazine resin, glass-polyimide resin, and the like. Further, as the heat radiating plate, there are copper, iron-based alloy, copper-based alloy and the like.
また，接着剤としては流れ性の良い，プリプレグと称
される接着シートがある。また，接着剤の材料として
は，エポキシ樹脂，ビスマレイミド−トリアジン樹脂
（BT樹脂），ポリイミド樹脂等がある。また，金属メッ
キ層の材料としては，銅，ニッケル，金等がある。As the adhesive, there is an adhesive sheet called prepreg, which has good flowability. In addition, examples of the material of the adhesive include an epoxy resin, a bismaleimide-triazine resin (BT resin), and a polyimide resin. The material of the metal plating layer includes copper, nickel, gold and the like.
また，上記対向部分におけるクリアランスは,0.05〜
0.3mmとすることが好ましい。0.05mm未満では，放熱板
と凹所との寸法精度が厳しくなり，一方0.3mmを越える
と接着剤層の幅が大きくなりすぎて金属メッキ層が充分
に形成されないおそれがある。In addition, the clearance at the above opposing part is 0.05 to
It is preferably 0.3 mm. If the thickness is less than 0.05 mm, the dimensional accuracy between the heat sink and the recess becomes severe, while if it exceeds 0.3 mm, the width of the adhesive layer becomes too large and the metal plating layer may not be formed sufficiently.
また，露出凹部の深さは,0.05〜0.2mmとすることが好
ましい。0.05mm未満では基材の厚み精度と凹部の加工精
度が厳しく，一方,0.2mmを越えると金属を加工する上で
負荷が大きすぎるからである。Further, the depth of the exposed concave portion is preferably set to 0.05 to 0.2 mm. If the thickness is less than 0.05 mm, the thickness accuracy of the base material and the processing accuracy of the concave portion are severe, while if it exceeds 0.2 mm, the load is too large in processing the metal.
更に露出凹部の幅は0.5〜2.0mmとすることが好まし
い。0.5mm未満では加工する刃の径が小さすぎて折れ易
く，一方,2.0mmを越えると加工凹部がデッドスペース
（Dead Space）となり配線有効面積に制限を受けるこ
とになるからである。Further, the width of the exposed concave portion is preferably set to 0.5 to 2.0 mm. If it is less than 0.5 mm, the diameter of the blade to be machined is too small and it is easy to break, while if it exceeds 2.0 mm, the machining recess becomes a dead space and the effective wiring area is limited.
また，上記電子部品搭載用基板の製造方法としては，
次の方法がある。即ち，まず，内部に予め電源回路又は
接地回路を設けた基材の裏側に，放熱板接合用の凹所を
設け，該凹所には接着剤を介して放熱板を接着すると共
に該接着剤を基材裏側における凹所側壁と放熱板側壁と
の対向部分の開口部近くまで充填する。In addition, as a method of manufacturing the electronic component mounting substrate,
There are the following methods. That is, first, on the back side of a base material in which a power supply circuit or a grounding circuit is previously provided, a concave portion for joining a heat sink is provided, and the heat sink is bonded to the concave portion with an adhesive, and the adhesive Is filled up to the vicinity of the opening at the opposing portion between the side wall of the recess and the side wall of the heat sink on the back side of the substrate.
ついで，該対向部分において基材と放熱板との両者に
またがるザグリ加工を行い，上記接着剤を露出させた露
出凹部を形成する。ついで，基材の表側において基材及
び接着剤を貫通して放熱板の上部までザグリ加工を行っ
て，電子部品搭載用凹部を形成する。その後，上記放熱
板と露出凹部と基材裏側面との間に連続した金属メッキ
層を形成し，また上記電子部品搭載用凹部の内部に導通
層用の金属メッキ層を形成する。Then, counterbore processing is performed on both the base material and the heat radiating plate in the opposing portion to form an exposed concave portion exposing the adhesive. Then, on the front side of the base material, a counterboring process is performed to penetrate the base material and the adhesive to the upper portion of the heat sink to form a concave portion for mounting electronic components. Thereafter, a continuous metal plating layer is formed between the heat sink, the exposed concave portion, and the back surface of the substrate, and a metal plated layer for a conductive layer is formed inside the electronic component mounting concave portion.
また，上記接着に当たっては，接着剤を対向部分の開
口部に若干はみ出させることが好ましい。これにより，
接着剤が対向部分の開口部まで完全に充填されたことが
確認できる。このはみ出した接着剤は，上記露出凹部の
形成の際に，対向部分における放熱板及び基材と共に取
り除かれる。In the bonding, it is preferable that the adhesive slightly protrudes into the opening of the opposing portion. This gives
It can be confirmed that the adhesive was completely filled up to the opening of the opposing portion. The protruding adhesive is removed together with the heat radiating plate and the base material in the facing portion when the exposed concave portion is formed.
また，露出凹部の形状としては，四角状（第3C図），
半円状（第５図），三角状（第６図），楕円状（第７
図）など，特に接着剤露出部分がメッキされ易い形状と
する。In addition, the shape of the exposed concave portion is square (Fig. 3C),
Semicircular (Fig. 5), triangular (Fig. 6), elliptical (Fig. 7)
In particular, the exposed part of the adhesive is easily plated.
また，上記電子部品搭載用凹部に設けた導通層には電
源用端子又は接地用端子のいずれか一方を設ける。そし
て，例えば，導通層に電源用端子を設けた場合には，接
地用端子は例えば従来と同様に設ける。In addition, one of a power supply terminal and a ground terminal is provided on the conductive layer provided in the electronic component mounting recess. When, for example, a power supply terminal is provided on the conductive layer, a ground terminal is provided, for example, in the same manner as in the related art.
また，これら導通層，電源用端子，接地用端子は，例
えば電子部品搭載用凹部及びその開口周縁に金属メッキ
を施すことにより一体的に設ける。また，導通層を基材
の外部へ導通させる手段として，基材内に，スルーホー
ル等の外部へ通ずる，幅広の金属層（例えば，内部電源
回路）を設ける方法がある。また，電子部品搭載用凹部
の下部に設けた放熱板に直接に電気的導通を図る方法も
ある。The conductive layer, the power supply terminal, and the ground terminal are integrally provided by, for example, applying metal plating to the electronic component mounting concave portion and the periphery of the opening. Further, as a means for conducting the conduction layer to the outside of the base material, there is a method of providing a wide metal layer (for example, an internal power supply circuit) in the base material, such as a through hole, which leads to the outside. There is also a method of directly establishing electrical conduction with a heat sink provided below the electronic component mounting recess.
また，電子部品搭載用凹部の開口周縁には信号用端子
を設ける。該信号用端子は基材に設けた信号パターンの
先端部分である。一方電源用端子又は接地用端子は，電
子部品搭載用凹部側壁に設けた導通層の一部分がその開
口周縁へ少し伸びた形状を有する。そして，信号用端子
と電源用端子又は接地用端子は，上記開口周縁におい
て，いわば相互乗り入れした状態に配置されている（第
２図参照）。A signal terminal is provided around the opening of the electronic component mounting recess. The signal terminal is a tip portion of a signal pattern provided on the base material. On the other hand, the power supply terminal or the ground terminal has a shape in which a part of the conductive layer provided on the side wall of the concave part for mounting the electronic component slightly extends to the periphery of the opening. The signal terminal and the power supply terminal or the grounding terminal are arranged so as to enter each other at the periphery of the opening (see FIG. 2).
また，本発明においては，第１基材と第２基材を積層
して，一方の基材に電源用端子を他方の基材に接地用端
子を形成した積層型の電子部品搭載用基板を構成するこ
ともできる（第８図，第９図参照）。このものは上記と
同様の第１基材の上に，更にもう１層の第２基材を積層
したものである。そして，第２基材は，上記電子部品搭
載用凹部の上方に開口部を有し，該開口部には前記と同
様の導通層を設ける。また，該導通層には電源用端子又
は接地用端子を設ける。更に上記第２基材は２層以上に
設けることもできる。Further, in the present invention, a laminated electronic component mounting substrate in which a first substrate and a second substrate are laminated, and a power supply terminal is formed on one substrate and a ground terminal is formed on the other substrate. It can also be configured (see FIGS. 8 and 9). This is obtained by further laminating another second base material on the same first base material as described above. The second base has an opening above the electronic component mounting recess, and the opening is provided with the same conductive layer as described above. Further, a power supply terminal or a ground terminal is provided on the conductive layer. Further, the second base material may be provided in two or more layers.
このような積層型基板においては，上記電源回路，接
地回路をそれぞれ任意にかつ，大きく形成することがで
き，一層高機能化を図ることができる。In such a laminated substrate, the power supply circuit and the ground circuit can be formed arbitrarily and large, respectively, so that the functions can be further enhanced.
即ち，この積層型基板において最も重要なことは，第
１基材と第２基材を積層し，第１基材に設けた電子部品
搭載用凹部及びその開口周縁には，前記と同様に第１導
通層及び相互乗り入れした信号用端子と電源用端子（又
は接地用端子）を設けること，また第２基材の開口部及
びその開口周縁には第２導通層及び相互乗り入れした信
号用端子と接地用端子（又は電源用端子）を設けること
である。That is, the most important thing in this laminated substrate is that the first base material and the second base material are laminated, and the electronic component mounting concave portion provided on the first base material and the peripheral edge of the opening are formed in the same manner as described above. (1) Providing a conductive layer and a signal terminal and a power terminal (or a ground terminal) which have entered each other, and a second conductive layer and a signal terminal which have entered each other in an opening of the second base material and the periphery of the opening. This is to provide a grounding terminal (or a power supply terminal).
そして，上記電源用端子は，第１基材側又は第２基材
側のいずれか一方に設け，該電源用端子を設けなかった
側に接地用端子を設ける。また，上記第１導通層，第２
導通層，電源用端子，接地用端子の形成などは上記と同
様である。The power supply terminal is provided on either the first base material side or the second base material side, and the ground terminal is provided on the side where the power supply terminal is not provided. Further, the first conductive layer, the second conductive layer,
The formation of the conductive layer, the power supply terminal, and the ground terminal is the same as described above.
本発明の電子部品搭載用基板においては，基材と放熱
板にまたがる前記露出凹部を設け，また該露出凹部には
接着剤を同一面上に露出させている。それ故，基材裏側
に金属メッキ層を被覆したとき，該金属メッキ層は上記
露出凹部表面に完全に形成されることとなる。In the electronic component mounting substrate according to the present invention, the exposed concave portion is provided to extend over the base material and the heat sink, and the adhesive is exposed on the same surface in the exposed concave portion. Therefore, when the metal plating layer is coated on the back side of the base material, the metal plating layer is completely formed on the exposed concave surface.
つまり，露出凹部は，その天井面が放熱板，接着剤及
び基材の順に並んで同一面上に形成されている。それ
故，金属メッキ層はこれらの間に連続して形成されるこ
ととなる。もしも，前記従来のごとく，上記対向部分に
接着剤が存在していない場合，或いは接着剤がはみ出し
ている状態の場合には金属メッキ層を完全に連続形成さ
せることができない。That is, the exposed concave portion is formed on the same surface with its ceiling surface arranged in the order of the heat sink, the adhesive and the base material. Therefore, the metal plating layer is formed continuously between them. If the adhesive does not exist in the facing portion as in the conventional case, or if the adhesive is protruding, the metal plating layer cannot be formed completely continuously.
また，本発明においては，接着剤を上記対向部分の間
に充填し，その後対向部分の開口部をザグリ加工して露
出凹部を形成する。そのため，接着剤は，対向部分を満
たすに充分な量を用い，場合によってははみ出させても
良い。それ故，従来のごとく接着剤がはみ出ないよう
に，かつ充填するに丁度良い量に調整する必要もない。Further, in the present invention, an adhesive is filled between the opposing portions, and then the opening of the opposing portion is counterbored to form an exposed concave portion. Therefore, the adhesive may be used in an amount sufficient to fill the opposing portion, and may be protruded in some cases. Therefore, it is not necessary to adjust the adhesive so that the adhesive does not protrude, and to adjust the amount to just a suitable amount as in the related art.
また，本発明においては，前記従来技術のごとく対向
部分の間隔を大きくする必要がない。それ故，放熱板は
パターン形成に可能な限り，大きくすることができ，放
熱性を向上させることができる。Further, in the present invention, it is not necessary to increase the interval between the facing portions as in the prior art. Therefore, the heat radiating plate can be made as large as possible for pattern formation, and the heat radiating property can be improved.
また，本発明においては，放熱板，露出凹部，基材裏
側に連続した金属メッキ層が形成してあるので，電子部
品搭載用部分に基材裏側から湿気が浸入することがな
い。Further, in the present invention, since a continuous metal plating layer is formed on the heat radiating plate, the exposed concave portion, and the back side of the base material, moisture does not enter the electronic component mounting portion from the back side of the base material.
一方，基材の表側においては，電源用端子又は接地用
端子は，電子部品の接続端子にボンディングワイヤーに
より接続する。そして，該電源用端子まはた接地用端子
は，上記導通層を通じ，内部回路を介して基材外部の電
源又はアースと接続される。また，信号用端子について
も電子部品の接続端子とボンディングワイヤーにより接
続する。該信号用端子は，導体回路の信号パターンに導
通している。On the other hand, on the front side of the base material, the power supply terminal or the ground terminal is connected to the connection terminal of the electronic component by a bonding wire. Then, the power supply terminal or the ground terminal is connected to a power supply or ground outside the substrate through an internal circuit through the conductive layer. Also, the signal terminal is connected to the connection terminal of the electronic component by a bonding wire. The signal terminal is electrically connected to the signal pattern of the conductor circuit.
そして，上記導通層は電子部品搭載用凹部の側壁に設
けられ，その導通面積が大きいので，外部へ通ずる内部
電源回路又は内部接地回路を大きくすることができ，電
源回路又は接地回路を低インダクタンス回路とすること
ができる。The conductive layer is provided on the side wall of the electronic component mounting concave portion and has a large conductive area, so that an internal power supply circuit or an internal grounding circuit which communicates with the outside can be enlarged. It can be.
さらに，信号用端子と電源用端子又は接地用端子を，
並列配置した場合には，電子部品の接続端子と上記各端
子との間はほぼ同じ間隔とすることができ，ボンディン
グワイヤーの接続が容易である。In addition, the signal terminal and the power supply terminal or the ground terminal
When arranged in parallel, the connection terminals of the electronic component and the above terminals can be set at substantially the same interval, so that the connection of the bonding wires is easy.
したがって，本発明によれば，上記対向部分における
金属メッキ層が確実に形成されており，また電源回路又
は接地回路を低インダクタンス回路とすることができ
る，高機能で放熱性に優れた電子部品搭載用基板を提供
することができる。Therefore, according to the present invention, the metal plating layer in the above-mentioned opposing portion is securely formed, and the power supply circuit or the ground circuit can be a low inductance circuit. Substrate can be provided.
第１実施例 本発明の実施例にかかる電子部品搭載用基板につき，
第１図〜第４図を用いて説明する。First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described.
This will be described with reference to FIGS.
本例の電子部品搭載用基板１は，第１図に示すごと
く，表側面に信号パターンとしての導体回路94を設け，
また内部に内部電源回路15を設けた基材10と，該基材10
に設けた電子部品搭載用凹部13と，その反対側に設けた
該電子部品搭載用凹部13よりも大きい凹所11（第3A図，
第3C図参照）と，該凹所11内に接着剤３を介して固着さ
れ，その背面を上記電子部品搭載用凹部13に露出させた
放熱板２とよりなる。As shown in FIG. 1, the electronic component mounting board 1 of this embodiment is provided with a conductor circuit 94 as a signal pattern on the front surface thereof.
A base material 10 having an internal power supply circuit 15 therein;
The electronic component mounting recess 13 provided on the other side and the recess 11 larger than the electronic component mounting recess 13 provided on the opposite side (FIG. 3A,
3C) and the heat radiating plate 2 which is fixed in the recess 11 with an adhesive 3 and the back surface of which is exposed to the electronic component mounting recess 13.
そして，上記基材10の裏側において，凹所11の側壁12
と放熱板２の側壁21とが対向している対向部分には，露
出凹部４を有してなる。該露出凹部４は，放熱板２と基
材10の両者にまたがって，上記対向部分において形成し
てある。そして，該露出凹部４の天井面は，放熱板，露
出した接着剤，基材が同一面上にある。また，上記放熱
板と露出凹部と基材裏側には連続した金属メッキ層75が
被覆してある。Then, on the back side of the base material 10, the side wall 12 of the recess 11 is formed.
An exposed concave portion 4 is provided at a portion where the heat sink 2 and the side wall 21 face each other. The exposed concave portion 4 is formed at the above-mentioned facing portion over both the heat radiating plate 2 and the base material 10. The ceiling surface of the exposed recess 4 has a heat sink, an exposed adhesive, and a base material on the same surface. A continuous metal plating layer 75 is coated on the heat sink, the exposed concave portion, and the back side of the base material.
また，基材10の表側においては，電子部品搭載用凹部
13の内面に金属メッキの導通層76が形成され，基材上面
には導体回路94が形成してある。更に，基材10のスルー
ホール98には，導体ピン99が挿入してある。スルーホー
ル98の内部には金属メッキ層981が形成してある。Also, on the front side of the base material 10, there is a recess for mounting electronic components.
A conductive layer 76 of metal plating is formed on the inner surface of the substrate 13, and a conductor circuit 94 is formed on the upper surface of the base material. Further, conductor pins 99 are inserted into the through holes 98 of the base material 10. A metal plating layer 981 is formed inside the through hole 98.
そして，第２図に示すごとく，上記金属メッキの導通
層76の外壁面には上記内部電源回路15が接続されてい
る。該内部電源回路15は，例えば基材10の表面に設ける
導体回路94の線幅の100倍以上という大きい幅で設けて
ある。そして，該内部電源回路15は，電源用スルーホー
ル98に接続されている。As shown in FIG. 2, the internal power supply circuit 15 is connected to the outer wall surface of the conductive layer 76 of the metal plating. The internal power supply circuit 15 is provided with a large width, for example, 100 times or more the line width of the conductor circuit 94 provided on the surface of the base material 10. The internal power supply circuit 15 is connected to the power supply through hole 98.
また，電子部品搭載用凹部13の開口周縁には，上記導
通層76に対して電源用端子151が同時メッキにより形成
されている。また，上記電源用端子151と併行に，信号
パターン用導体回路94の信号用端子941,接地回路18の接
地用端子181が相互乗り入れした状態で，並列に設けら
れている。At the periphery of the opening of the electronic component mounting recess 13, a power supply terminal 151 is formed on the conductive layer 76 by simultaneous plating. A signal terminal 941 of the signal pattern conductor circuit 94 and a grounding terminal 181 of the grounding circuit 18 are provided in parallel with the power supply terminal 151 in a state where they are laid on each other.
次に上記電子部品搭載用基板１の製造方法につき，第
3A図〜第3E図を用いて説明する。Next, a method of manufacturing the electronic component mounting board 1 will be described.
This will be described with reference to FIGS. 3A to 3E.
まず，第3A図に示すごとく，基材10の裏側に，放熱板
配線用の凹所11をザグリ加工により設ける。該凹所11
は，側壁12と天井面111を有する。また，該基材10はそ
の内部に内部電源回路15を有している。即ち，該基材10
は，薄い絶縁基材の上に内部電源回路15をメッキにより
形成し，その上に他の絶縁基材を接着して形成してあ
る。また，基材10は，その表面に銅箔19を設けてある。First, as shown in FIG. 3A, a recess 11 for heat sink wiring is provided on the back side of the base material 10 by counterbore processing. The recess 11
Has a side wall 12 and a ceiling surface 111. The substrate 10 has an internal power supply circuit 15 therein. That is, the substrate 10
Is formed by plating an internal power supply circuit 15 on a thin insulating base material and bonding another insulating base material thereon. The substrate 10 has a copper foil 19 provided on the surface thereof.
次に，第3B図に示すごとく，上記凹所11内に接着剤３
を介して放熱板２を接着する。このとき，接着剤３は，
凹所11の天井面111と放熱板２の間に，及び凹所11の側
壁12と放熱板２の側壁21との間，即ち対向部分120内に
充填される。また，接着剤３は，対向部分120の開口部1
21より外部にはみ出し（溢流）て，はみ出し部31を形成
している。そのため，放熱板２と凹所11との間は，接着
剤によって完全に満たされている。Next, as shown in FIG. 3B, the adhesive 3 is placed in the recess 11.
The heat radiating plate 2 is adhered through. At this time, the adhesive 3
The space between the ceiling surface 111 of the recess 11 and the radiator plate 2 and the space between the side wall 12 of the recess 11 and the side wall 21 of the radiator plate 2, that is, the inside of the facing portion 120 are filled. The adhesive 3 is applied to the opening 1 of the facing portion 120.
It protrudes outside (overflows) from 21 to form a protruding portion 31. Therefore, the space between the heat radiating plate 2 and the recess 11 is completely filled with the adhesive.
次に，第3C図に示すごとく，上記対向部分120におい
て基材10と放熱板２との両者にまたがるザグリ加工を行
い，露出凹部４を形成する。該露出凹部４の天井面は，
基材１に形成された段部14と，放熱板２に形成された段
部21と，両者の間に露出した接着剤３の露出面32とより
なり，これらは同一面上にある。Next, as shown in FIG. 3C, counterbore processing is performed on both the base material 10 and the radiator plate 2 in the facing portion 120 to form the exposed recess 4. The ceiling surface of the exposed recess 4 is
A step 14 formed on the substrate 1, a step 21 formed on the heat sink 2, and an exposed surface 32 of the adhesive 3 exposed between the two are on the same surface.
一方，基材の表側においては，電子部品搭載用凹部13
をザグリ加工により形成し，放熱板２の背面を露出させ
る。また，該電子部品搭載用凹部13においては，その側
壁131と内部電源回路15の切断面152と接着剤の露出面33
とは同一面上にある。また，該電子部品搭載用凹部13
は，前記凹所11よりも小さい穴である。On the other hand, on the front side of the substrate,
Is formed by counterbore processing to expose the back surface of the heat sink 2. Further, in the electronic component mounting recess 13, the side wall 131, the cut surface 152 of the internal power supply circuit 15, and the exposed surface 33 of the adhesive are provided.
And are on the same plane. Also, the electronic component mounting recess 13 is provided.
Is a hole smaller than the recess 11.
次に，第3D図に示すごとく，基材10の裏側において，
放熱板2,露出凹部4,基材10の表面に連続した金属メッキ
層75を形成する。また，基材10の表側においても電子部
品搭載用凹部13に金属メッキにより導通層76を形成す
る。これら金属メッキ層75,導通層76の形成は，同時に
行う。Next, as shown in FIG. 3D, on the back side of the base material 10,
A continuous metal plating layer 75 is formed on the heat radiating plate 2, the exposed concave portion 4, and the surface of the substrate 10. Also, on the front side of the base material 10, the conductive layer 76 is formed in the electronic component mounting recess 13 by metal plating. The formation of the metal plating layer 75 and the conduction layer 76 is performed simultaneously.
また，上記導通層76の形成時には，その外側面が内部
電源回路15の上記切断面152と接続される。その後，第3
E図に示すごとく，エッチングにより導体回路94を形成
する。また，電子部品搭載用凹部13の開口周縁に電源用
端子151（第１図，第２図）を形成する。When the conductive layer 76 is formed, its outer surface is connected to the cut surface 152 of the internal power supply circuit 15. Then the third
As shown in FIG. E, a conductor circuit 94 is formed by etching. In addition, power supply terminals 151 (FIGS. 1 and 2) are formed on the periphery of the opening of the electronic component mounting recess 13.
以上により，電子部品搭載用基板が製造される。この
ものは，前記第１図，第２図に示したものと同様であ
る。Thus, the electronic component mounting board is manufactured. This is the same as that shown in FIGS. 1 and 2.
また，前記第3E図，第４図に示すごとく，上記電子部
品搭載用基板１の裏側には，基材10の上に連続した金属
メッキ層75が形成されている。As shown in FIGS. 3E and 4, a continuous metal plating layer 75 is formed on the base material 10 on the back side of the electronic component mounting substrate 1.
次に，作用効果につき説明する。 Next, the function and effect will be described.
上記のごとく，本例の電子部品搭載用基板１は，前記
対向部分120において，基材１と放熱板２にまたがる露
出凹部４を形成し，基材1,露出凹部4,放熱板２に連続し
た金属メッキ層75を設けている。そして，上記露出凹部
４においては，第3C図に示すごとく，基材の段部14と接
着剤の露出面32と放熱板の段部21が同一面上にある。そ
のため，金属メッキ層75が，これらの表面に確実に連続
形成される。As described above, the electronic component mounting board 1 of the present embodiment has the exposed recess 4 extending over the base 1 and the radiator plate 2 in the facing portion 120, and is continuously connected to the base 1, the exposed recess 4, and the radiator plate 2. A metal plating layer 75 is provided. In the exposed recess 4, as shown in FIG. 3C, the step 14 of the base material, the exposed surface 32 of the adhesive, and the step 21 of the heat sink are on the same plane. Therefore, the metal plating layer 75 is reliably and continuously formed on these surfaces.
また，本例では，第3B図に示すごとく，放熱板２の接
着に当たり，接着剤３のはみ出し部31を形成させてい
る。そのため，接着剤３は，放熱板２と凹所11との間に
完全に充填される。そして，このはみ出し部31は，第3C
図に示すごとく，ザグリ加工による露出凹部４形成の際
に除去される。Further, in this example, as shown in FIG. 3B, the protrusion 31 of the adhesive 3 is formed when bonding the heat sink 2. Therefore, the adhesive 3 is completely filled between the heat sink 2 and the recess 11. And this protruding part 31 is 3C
As shown in the figure, it is removed when the exposed recess 4 is formed by counterboring.
それ故，露出凹部４の表面には，必ず接着剤３の露出
面32が形成され，前記金属メッキ層75が確実に形成され
る。また，そのため，従来のごとく，接着剤のはみ出し
防止，接着剤の充填等のために，接着剤量の調整を行う
必要がない。Therefore, the exposed surface 32 of the adhesive 3 is always formed on the surface of the exposed concave portion 4, so that the metal plating layer 75 is surely formed. Therefore, it is not necessary to adjust the amount of the adhesive in order to prevent the adhesive from protruding and to fill the adhesive as in the related art.
また，従来技術のごとく対向部分の間隔を大きくする
必要がない。そのため，放熱板は，凹所内に，できるだ
け大きく配設することができ，放熱性が向上する。ま
た，放熱板，露出凹部，基材裏側に，連続した金属メッ
キ層75が形成されているので，上記内部電源回路15につ
いても電子部品搭載部分に基材裏側から湿気が浸入する
こともない。Further, it is not necessary to increase the interval between the facing portions as in the related art. Therefore, the heat radiating plate can be arranged as large as possible in the recess, and the heat radiating property is improved. Further, since the continuous metal plating layer 75 is formed on the heat radiating plate, the exposed concave portions, and the back side of the base material, moisture does not enter the electronic component mounting portion of the internal power supply circuit 15 from the back side of the base material.
また，本例の電子部品搭載用基板においては，電源用
端子151を接続した導通層76が，電子部品搭載用凹部13
の側壁及び底面に設けてあるので，上記内部電源回路15
についても電源回路を大きく取ることができる。それ
故，該電源回路を低インダクタンス回路とすることがで
き，電子部品の高機能化に対応できる。In the electronic component mounting board of this example, the conductive layer 76 to which the power supply terminal 151 is connected is formed by the electronic component mounting recess 13.
The internal power supply circuit 15
In this case, a large power supply circuit can be used. Therefore, the power supply circuit can be a low-inductance circuit, and it is possible to cope with higher functions of electronic components.
また，電子部品搭載用凹部13の開口周縁に設けた信号
用端子941,電源用端子151,接地用端子181は，並列配置
してあるので，これら各端子と電子部品88の接続端子87
との間におけるボンディングワイヤー89の接続が容易で
ある（第１図）。Also, since the signal terminal 941, the power supply terminal 151, and the ground terminal 181 provided on the periphery of the opening of the electronic component mounting recess 13 are arranged in parallel, the connection terminals 87 for connecting these terminals to the electronic component 88 are arranged.
The connection of the bonding wire 89 is easy (FIG. 1).
なお，上記電源用端子151と接地用端子181とはその位
置を逆になして，電源用端子151を接地用端子として，
また接地用端子181を電源用端子として使用することも
できる。The positions of the power terminal 151 and the ground terminal 181 are reversed, and the power terminal 151 is used as a ground terminal.
Also, the ground terminal 181 can be used as a power terminal.
なお，放熱板には，放熱用フィンを接合して，放熱性
を高めることもできる。In addition, a radiating fin can be joined to the radiating plate to enhance the radiating property.
第２実施例 本例は，第５図〜第７図に示すごとく，第１実施例に
おける露出凹部４の形状を種々変えたものである。Second Embodiment In this embodiment, as shown in FIGS. 5 to 7, the shape of the exposed concave portion 4 in the first embodiment is variously changed.
即ち，第５図に示す露出凹部４は，半円状で基材１の
円弧状面141と，接着剤の露出面32と，放熱板の円弧状
面212とよりなる。That is, the exposed concave portion 4 shown in FIG. 5 is formed in a semicircular shape with the arc-shaped surface 141 of the base material 1, the exposed surface 32 of the adhesive, and the arc-shaped surface 212 of the heat sink.
また，第６図に示す露出凹部４は，三角状で，基材１
の斜面142と，接着剤の露出面32と放熱板の斜面213とよ
りなる。Further, the exposed concave portion 4 shown in FIG.
Of the adhesive, the exposed surface 32 of the adhesive, and the inclined surface 213 of the heat sink.
更に，第７図に示す露出凹部４は，略楕円状で，基材
１の弧面143と接着剤の露出面32と，放熱板の弧面214と
よりなる。Further, the exposed concave portion 4 shown in FIG. 7 is substantially elliptical, and includes the arc surface 143 of the base material 1, the exposed surface 32 of the adhesive, and the arc surface 214 of the heat sink.
上記いずれの露出凹部においても，上記の各表面は，
連続した面上にある。それ故，第１実施例と同様に，そ
の表面には連続した金属メッキ層を確実に形成でき，同
様の効果を得ることができる。In any of the above-mentioned exposed concave portions, each of the above surfaces is
It is on a continuous surface. Therefore, similarly to the first embodiment, a continuous metal plating layer can be reliably formed on the surface, and the same effect can be obtained.
第３実施例 上記第１実施例における具体例について示す。Third Embodiment A specific example of the first embodiment will be described.
本例においては，基材10として，ビスマレイミド−ト
リアジン樹脂（BT樹脂）材の銅張積層板を用いた。In this example, a copper-clad laminate made of a bismaleimide-triazine resin (BT resin) was used as the substrate 10.
放熱板配線用の凹所11は，深さ1.2mm,タテ，ヨコ各20
mmの角状凹所とした。放熱板２としては銅板を用い，そ
の厚みは1.2mm,タテ，ヨコ各19.8mmの角板であった。そ
のため，凹所11と放熱板２間の対向部分120のクリアラ
ンスは，約0.1mmである。The recess 11 for the heatsink wiring is 1.2 mm deep,
mm square recess. The heat radiating plate 2 was a copper plate having a thickness of 1.2 mm and a length and width of 19.8 mm each. Therefore, the clearance of the facing portion 120 between the recess 11 and the heat sink 2 is about 0.1 mm.
接着剤3,35としては,BT樹脂のプリプレグ接着剤を用
いた。その接着にあたっては,170℃で加熱圧着した。こ
のとき，はみ出し部31の高さは約0.1mmであった。ま
た，露出凹部４の深さは,0.1mm,幅1.0mmであった。該露
出凹部４は対向部分120に沿って四角環状を呈してい
る。As the adhesives 3, 35, prepreg adhesive of BT resin was used. The bonding was performed by thermocompression bonding at 170 ° C. At this time, the height of the protruding portion 31 was about 0.1 mm. The depth of the exposed recess 4 was 0.1 mm and the width was 1.0 mm. The exposed concave portion 4 has a rectangular ring shape along the facing portion 120.
金属メッキ層75,導通層76は，無電解方法又は電解方
法により形成し，その金属メッキの厚みは約20μｍであ
った。また，金属メッキ層75は，放熱板2,露出凹部4,基
材裏側面に連続して，確実に形成されていた。金属メッ
キの導通層76も同様に連続形成されていた。The metal plating layer 75 and the conductive layer 76 were formed by an electroless method or an electrolytic method, and the thickness of the metal plating was about 20 μm. Further, the metal plating layer 75 was reliably formed continuously on the heat sink 2, the exposed recess 4, and the back surface of the base material. The conductive layer 76 of metal plating was similarly formed continuously.
なお，比較のために，第3B図に示すごとく，接着剤の
はみ出し部31があるままで，金属メッキ層75の形成を行
った。その結果，接着剤のはみ出し部31において，金属
メッキ層が被覆されていないメッキ不良部分を，各所で
生じていた。For comparison, as shown in FIG. 3B, the metal plating layer 75 was formed with the protruding portion 31 of the adhesive remaining. As a result, in the protruding portion 31 of the adhesive, defective plating portions where the metal plating layer is not covered are generated at various places.
第４実施例 本例は，第８図及び第９図に示すごとく，前記第１実
施例の電子部品搭載用基板において，更にその上にもう
一層の第２基材100を積層した積層型基板を示すもので
ある。Fourth Embodiment As shown in FIGS. 8 and 9, a fourth embodiment of the present invention relates to a laminated type substrate in which the second substrate 100 is further laminated on the electronic component mounting substrate of the first embodiment. It shows.
上記第２基材100は，前記第１実施例の導体回路94の
上にプリプレグ接着剤35を介して接合されている。The second base material 100 is joined to the conductor circuit 94 of the first embodiment via the prepreg adhesive 35.
また，第２基材100は，上記電子部品搭載用凹部13の
上方にそれよりも太径の開口部105を有し，該開口部105
の周囲には第２導通層760が金属メッキにより形成され
ている。また，該第２基材100は，その裏面に予め内部
接地回路185が設けてある。該内部接地回路185は，その
一方が接地用スルーホール98に接続され，他方は上記第
２導通層760に接続され，また前記内部電源回路15と同
様に広い幅を有する。また，該第２導通層760には接地
用端子186が延設してある。また，第２基材100の上面に
は，導体回路940が設けてある。The second base member 100 has an opening 105 having a diameter larger than that of the electronic component mounting recess 13.
A second conductive layer 760 is formed by metal plating around the periphery. The second substrate 100 has an internal grounding circuit 185 provided on the back surface thereof in advance. One of the internal ground circuits 185 is connected to the ground through hole 98, the other is connected to the second conductive layer 760, and has a wide width like the internal power supply circuit 15. In addition, a grounding terminal 186 extends from the second conductive layer 760. A conductive circuit 940 is provided on the upper surface of the second base material 100.
そして，電子部品搭載用凹部13内の電子部品88におけ
る各接続端子と，電源用端子151,導体回路94の信号用端
子941,接地用端子186,導体回路940の信号用端子943との
間には，それぞれボンディングワイヤー89,890が接続さ
れる。Then, between each connection terminal of the electronic component 88 in the electronic component mounting recess 13 and the power supply terminal 151, the signal terminal 941, the ground terminal 186, and the signal terminal 943 of the conductor circuit 940, between the power supply terminal 151, the signal terminal 941, and the ground terminal 186. Are connected to bonding wires 89 and 890, respectively.
本例によれば，第１実施例と同様の効果を得ることが
できる。According to this embodiment, the same effect as that of the first embodiment can be obtained.
また，本例においては，基材10の電子部品搭載用凹部
13の開口周縁，及び第２基材100の開口部105の開口周縁
に，それぞれ電源用端子151と信号用端子941,及び接地
用端子186と信号用端子943を並列配置している。そのた
め，第１実施例に比してより高密度の配線を行うことが
できる。Also, in this example, the concave portion for mounting electronic components on the base material 10 is used.
The power supply terminal 151 and the signal terminal 941, and the ground terminal 186 and the signal terminal 943 are arranged in parallel on the periphery of the opening 13 and the periphery of the opening 105 of the second base material 100, respectively. Therefore, higher-density wiring can be performed as compared with the first embodiment.
また，電源用端子151と接地用端子186を，広い面積の
導通層76,第２導通層760にそれぞれ配設しており，また
内部電源回路15,内部接地回路185を幅広く設けてあるの
でこれらを低インダクタンスとすることができる。お
な，電源用端子151と接地用端子186とは，その用途（電
源用，接地用）を逆にして用いることもできる。Further, the power supply terminal 151 and the grounding terminal 186 are provided on the conductive layer 76 and the second conductive layer 760 having a large area, respectively, and the internal power supply circuit 15 and the internal grounding circuit 185 are provided widely. Can have a low inductance. The power supply terminal 151 and the grounding terminal 186 can be used with their uses (for power supply and grounding) reversed.
第１図〜第４図は第１実施例の電子部品搭載用基板を示
し，第１図はその断面図，第２図はその要部斜視図，第
3A図〜第3E図はその製造工程説明図，第４図は第3E図の
裏面図，第５図〜第７図は第２実施例における露出凹部
の形状を示す図，第８図及び第９図は第４実施例の積層
型電子部品搭載用基板を示し，第８図はその断面図，第
９図はその要部斜視図，第10図〜第12図は従来の電子部
品搭載用基板を示し，第10図はその１例の断面図，第11
図はその問題点を示す断面図，第12図は他の従来の電子
部品搭載用基板の断面図である。 １……電子部品搭載用基板， 10……基材， 100……第２基材， 11……凹所， 12……凹所側壁， 13……電子部品搭載用凹部， 120……対向部分， 15……内部電源回路， 151……電源用端子， 181,186……接地用端子， 185……内部接地回路， ２……放熱板， 21……放熱板側壁， ３……接着剤， 31……はみ出し部， ４……露出凹部， 75……金属メッキ層， 76……導通層， 760……第２導通層， 941,943……信号用端子，1 to 4 show an electronic component mounting board according to a first embodiment, FIG. 1 is a cross-sectional view thereof, FIG.
3A to 3E are explanatory diagrams of the manufacturing process, FIG. 4 is a rear view of FIG. 3E, FIGS. 5 to 7 are diagrams showing the shapes of the exposed recesses in the second embodiment, FIGS. 9 shows a multilayer electronic component mounting substrate according to the fourth embodiment, FIG. 8 is a cross-sectional view thereof, FIG. 9 is a perspective view of a main part thereof, and FIGS. 10 to 12 are conventional electronic component mounting substrates. FIG. 10 is a cross-sectional view of one example, and FIG.
FIG. 12 is a sectional view showing the problem, and FIG. 12 is a sectional view of another conventional electronic component mounting substrate. DESCRIPTION OF SYMBOLS 1 ... board | substrate for electronic component mounting, 10 ... base material, 100 ... 2nd base material, 11 ... recessed part, 12 ... side wall of recessed part, 13 ... recessed part for electronic component mounting, 120 ... opposed part 15 internal power supply circuit 151 power supply terminal 181,186 grounding terminal 185 internal grounding circuit 2 radiator plate 21 radiator plate sidewall 3 adhesive ... protruding part, 4 ... exposed concave part, 75 ... metal plating layer, 76 ... conductive layer, 760 ... second conductive layer, 941,943 ... signal terminal,
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/12 H01L 23/34 - 23/473 H05K 1/02 H05K 3/46Continued on the front page (58) Fields surveyed (Int.Cl. 6 , DB name) H01L 23/12 H01L 23/34-23/473 H05K 1/02 H05K 3/46
Claims (1)
電子部品搭載用凹部と，その反対側に設けた該電子部品
搭載用凹部よりも大きい径の凹所と，該凹所内に接着剤
を介して固着されその背面を上記電子部品搭載用凹部に
露出させた放熱板とよりなる電子部品搭載用基板であっ
て， 基材裏側における上記凹所の側壁と放熱板の側壁とが対
向している対向部分には，基材と放熱板の両者にまたが
ると共に上記接着剤を同一表面上に露出させた露出凹部
を設けてなり， かつ上記放熱板と露出凹部と基材裏側には連続した金属
メッキ層が被覆してあり， また，上記電子部品搭載用凹部の側壁には基材の外部へ
導通させた導通層を設け，また該導通層には電源用端子
又は接地用端子を設けてなることを特徴とする電子部品
搭載用基板。1. A base material having a conductor circuit, an electronic component mounting concave portion provided on the base material, a concave portion provided on the opposite side having a diameter larger than that of the electronic component mounting concave portion, An electronic component mounting board fixed to the electronic component mounting recess through an adhesive, the back surface of which is exposed to the electronic component mounting concave portion, the side wall of the concave portion and the side wall of the heat radiating plate on the back side of the base material. In the opposite part, which is opposed to the base plate, there is provided an exposed concave portion which covers both the base material and the heat sink and exposes the adhesive on the same surface. Is covered with a continuous metal plating layer, and a conductive layer is provided on the side wall of the electronic component mounting recess, the conductive layer being electrically connected to the outside of the substrate. The conductive layer has a power terminal or a ground terminal. A substrate for mounting electronic components, characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2247830A JP2784523B2 (en) | 1990-09-17 | 1990-09-17 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2247830A JP2784523B2 (en) | 1990-09-17 | 1990-09-17 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04125954A JPH04125954A (en) | 1992-04-27 |
| JP2784523B2 true JP2784523B2 (en) | 1998-08-06 |
Family
ID=17169308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2247830A Expired - Lifetime JP2784523B2 (en) | 1990-09-17 | 1990-09-17 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2784523B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258260A (en) * | 2009-04-27 | 2010-11-11 | Nec Corp | Heat radiation printed board |
| JP5515755B2 (en) * | 2010-01-13 | 2014-06-11 | 日本電気株式会社 | Heat dissipation multilayer substrate, electronic device, and method of manufacturing heat dissipation multilayer substrate |
| JP6420561B2 (en) * | 2014-03-31 | 2018-11-07 | 京セラ株式会社 | Printed wiring board and manufacturing method thereof |
-
1990
- 1990-09-17 JP JP2247830A patent/JP2784523B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04125954A (en) | 1992-04-27 |
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