JP2784522B2 - Electronic component mounting substrate and method of manufacturing the same - Google Patents
Electronic component mounting substrate and method of manufacturing the sameInfo
- Publication number
- JP2784522B2 JP2784522B2 JP2247829A JP24782990A JP2784522B2 JP 2784522 B2 JP2784522 B2 JP 2784522B2 JP 2247829 A JP2247829 A JP 2247829A JP 24782990 A JP24782990 A JP 24782990A JP 2784522 B2 JP2784522 B2 JP 2784522B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- heat sink
- adhesive
- electronic component
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は，耐湿性及び放熱板の保持性に優れた電子部
品搭載用基板及びその製造方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting electronic components, which is excellent in moisture resistance and heat sink retention, and a method of manufacturing the same.
従来，電子部品搭載用基板においては，半導体素子な
どの電子部品からの発熱を放散させるため，電気絶縁性
の基材に電子部品搭載用の電子部品搭載用凹部を設ける
と共に該電子部品搭載用凹部の反対側に放熱板を設けて
いる（例えば，特開昭59−32191号公報）。2. Description of the Related Art Conventionally, in an electronic component mounting substrate, in order to dissipate heat generated from an electronic component such as a semiconductor element, an electronic component mounting concave portion is provided on an electrically insulating base material, and the electronic component mounting concave portion is provided. (See, for example, JP-A-59-32191).
また，従来，一般に，上記放熱板は接着剤を介して，
基材の凹所に接着されている。そのため，上記接着剤が
外気に露出している部分，つまり凹所側壁と放熱板側壁
との間を金属メッキ層により被覆することが行われてい
る。これを第7A図〜第９図により説明する。Conventionally, generally, the above-mentioned heat radiating plate is provided with an adhesive.
Adhered to the recess in the substrate. Therefore, a portion where the adhesive is exposed to the outside air, that is, a portion between the side wall of the recess and the side wall of the heat sink is covered with a metal plating layer. This will be described with reference to FIGS. 7A to 9.
即ち，従来の電子部品搭載用基板の製造方法として
は，第7A図〜第7E図に示すごとく，まず銅張積層板であ
る基材９に放熱板接合用の凹所92を設ける（第7A図）。
次いで，該電子部品搭載用凹部92の天井面921に接着剤
８を介して放熱板７を接着する（第7B図）。なお，符号
91は銅箔等の金属層である。That is, as a conventional method for manufacturing a substrate for mounting electronic components, as shown in FIGS. 7A to 7E, first, a concave portion 92 for joining a heat sink is provided in a base material 9 which is a copper-clad laminate (FIG. 7A). Figure).
Next, the heat radiating plate 7 is bonded to the ceiling surface 921 of the electronic component mounting concave portion 92 via the adhesive 8 (FIG. 7B). The sign
91 is a metal layer such as a copper foil.
次に，第7C図に示すごとく，基材９の表側から，放熱
板７の上面が露出するまでザグリ加工して，電子部品搭
載用凹部93を設ける。そして，第7D図に示すごとく上記
電子部品搭載用凹部93の側面と露出した放熱板上面に金
属メッキ層76を，また放熱板７と基材９の裏側面との間
に金属メッキ層75を形成する。Next, as shown in FIG. 7C, a counterboring process is performed from the front side of the base material 9 until the upper surface of the heat sink 7 is exposed, thereby providing an electronic component mounting concave portion 93. Then, as shown in FIG. 7D, a metal plating layer 76 is provided on the side surface of the concave part 93 for mounting electronic components and on the exposed upper surface of the heat sink, and a metal plating layer 75 is provided between the heat sink 7 and the back side surface of the base material 9. Form.
その後，第7E図に示すごとく，パターン94の形成を行
い，電子部品搭載用基板90とする。Thereafter, as shown in FIG. 7E, a pattern 94 is formed to obtain an electronic component mounting substrate 90.
上記のごとくして得られた電子部品搭載用基板90は，
上記第7E図に示すごとく，基材裏側においては放熱板７
と基材９との間に金属メッキ層75が，また放熱板７の上
面と電子部品搭載用凹部93との間に金属メッキ層76が形
成されている。そのため，基材９の裏側から電子部品搭
載用凹部93内への湿気の浸入が遮断される。The electronic component mounting substrate 90 obtained as described above is
As shown in FIG. 7E, the heat radiating plate 7
A metal plating layer 75 is formed between the substrate 9 and the base plate 9, and a metal plating layer 76 is formed between the upper surface of the heat sink 7 and the recess 93 for mounting electronic components. Therefore, infiltration of moisture from the back side of the base material 9 into the electronic component mounting recess 93 is blocked.
しかしながら，上記電子部品搭載用基板90は，第８図
に示すごとく，凹所92の側壁と放熱板７の側壁とが対向
している対向部分95において，その開口部750に金属メ
ッキ層75が形成されないことがある。つまり，メッキ不
良穴751を生ずる。However, as shown in FIG. 8, the electronic component mounting substrate 90 has a metal plating layer 75 in the opening 750 at the opposing portion 95 where the side wall of the recess 92 and the side wall of the radiator plate 7 oppose each other. May not be formed. That is, a defective plating hole 751 is generated.
かかるメッキ不良穴751を生ずると，この部分より湿
気が浸入して，半導体などの電子部品が損傷するおそれ
がある。特に，基材９が樹脂系のものであるときには，
湿気が上記メッキ不良穴751より上記凹所92内に浸入
し，樹脂基材内を経て電子部品（図示略）に達する。When such a plating failure hole 751 is generated, moisture may enter from this portion, and electronic components such as semiconductors may be damaged. In particular, when the substrate 9 is made of a resin,
Moisture penetrates into the recess 92 through the poor plating hole 751 and reaches the electronic component (not shown) through the inside of the resin base material.
一方，上記メッキ不良穴751を発生する理由として
は，凹所92と放熱板７との間の前記対向部分95のクリア
ランス（約0.1〜0.2mm）が大きいためと考えられる。On the other hand, it is considered that the reason why the plating failure hole 751 occurs is that the clearance (about 0.1 to 0.2 mm) of the facing portion 95 between the recess 92 and the heat sink 7 is large.
そこで，この対向部分95のクリアランスを小さくする
ことが考えられる。しかし，凹所92の加工，放熱板７の
外形加工におけるバラツキのために，前記クリアランス
を生じてしまう。Therefore, it is conceivable to reduce the clearance of the facing portion 95. However, the clearance is generated due to variations in the processing of the recess 92 and the external processing of the heat radiation plate 7.
また，上記問題点に対する対策として，第９図に示す
ごとく，凹所92を幅広く設けて，その天井面921におけ
る，凹所82の側壁と放熱板７の側壁との間を広く取る方
法がある。そして，これらの表面に金属メッキ層75を連
続的に設ける。この方法では，上記対向部分95のクリア
ランスが充分に大きいため，この対向部分においても金
属メッキ層75が形成される。As a countermeasure against the above problem, as shown in FIG. 9, there is a method in which the recess 92 is provided widely, and the space between the side wall of the recess 82 and the side wall of the heat sink 7 on the ceiling surface 921 is wide. . Then, a metal plating layer 75 is continuously provided on these surfaces. In this method, the metal plating layer 75 is also formed on the facing portion 95 since the clearance of the facing portion 95 is sufficiently large.
しかし，凹所92を大きく取ると，基材９の裏側面にお
けるパターン形成の自由度が阻害される。一方，凹所92
の大きさを制限すれば，放熱板７が小形状となり放熱性
が阻害される。However, if the recess 92 is made large, the degree of freedom in pattern formation on the back surface of the base material 9 is impaired. Meanwhile, the depression 92
If the size is limited, the heat radiating plate 7 becomes small, and the heat radiating property is hindered.
また，上記方法では，凹所92の天井面921に放熱板７
を接着する際，接着剤８が両者の間よりはみ出す（溢
流）ことがある。そして，この接着剤のはみ出し部分が
大きいときには，金属メッキ層75が形成されない。その
ため，はみ出し防止のために，接着剤８の量を調整する
必要がある。In the above method, the heat sink 7 is provided on the ceiling surface 921 of the recess 92.
When the adhesive is adhered, the adhesive 8 may protrude from between the two (overflow). When the protruding portion of the adhesive is large, the metal plating layer 75 is not formed. Therefore, it is necessary to adjust the amount of the adhesive 8 in order to prevent protrusion.
また，上記に示した電子部品搭載用基板においては，
放熱板が基材９の凹所92内に挿入され，接着剤８によっ
て接着されているが，長期間の使用中に放熱板が剥離脱
落するおそれがある。In the electronic component mounting board shown above,
Although the heat sink is inserted into the recess 92 of the base material 9 and adhered by the adhesive 8, there is a possibility that the heat sink may peel off during long-term use.
本発明はかかる問題点に鑑み，放熱板と凹所との対向
部分における金属メッキ層を確実に形成し，接着剤量の
調整の必要がなく，また放熱板の脱落のおそれがない，
放熱性及び耐湿性に優れた電子部品搭載用基板及びその
製造方法を提供しようとするものである。In view of the above problems, the present invention reliably forms a metal plating layer at a portion where a heat sink and a recess face each other, does not require adjustment of the amount of adhesive, and does not cause the heat sink to fall off.
An object of the present invention is to provide an electronic component mounting substrate excellent in heat dissipation and moisture resistance and a method of manufacturing the same.
本発明は，第１基材と，第２基材と，両者の間に接着
剤を介して挟着固定した放熱板と，上記第１基材側にお
いて該第１基材及び接着剤を貫通して放熱板の上部まで
ザグリ加工形成した電子部品搭載用凹部とよりなり，ま
た上記放熱板の裏側は上記第２基材に設けた段付穴より
その一部を露出させてなる電子部品搭載用基板であっ
て，上記第２基材の段付穴と放熱板との対向部分には，
第２基材と放熱板の両者にまたがると共に上記接着剤を
同一表面上に露出させた露出凹部をザグリ加工により設
けてなり，かつ上記放熱板と露出凹部と第２基材裏側に
は連続した金属メッキ層が被覆してあることを特徴とす
る電子部品搭載用基板にある。According to the present invention, there is provided a first base material, a second base material, and a heat sink sandwiched and fixed between the first base material and the second base material, and the first base material and the adhesive are penetrated on the first base material side. And an electronic component mounting recess formed by counterboring the upper part of the heat sink, and a part of the back side of the heat sink is exposed from a stepped hole provided in the second base material. And a radiating plate facing the stepped hole of the second base material.
An exposed concave portion is provided by counterbore processing which extends over both the second base material and the heat sink and exposes the adhesive on the same surface, and is continuous with the heat sink, the exposed concave portion and the back side of the second base material. An electronic component mounting substrate, which is covered with a metal plating layer.
本発明において最も注目すべきことは，上記裏側の対
向部分において上記露出凹部を設け，放熱板と露出凹部
と第２基材裏側面との間に連続した金属メッキ層を被覆
していること，及び第１基材と第２基材との間に放熱板
を挟着固定すると共に放熱板の裏側の一部分を第２基材
の段付穴より露出させていることにある。The most remarkable point in the present invention is that the exposed concave portion is provided in the opposite portion on the back side, and a continuous metal plating layer is coated between the heat sink, the exposed concave portion, and the back surface of the second base material. And a heat sink is sandwiched and fixed between the first base material and the second base material, and a part of the back side of the heat sink is exposed from the stepped hole of the second base material.
上記露出凹部は，第２基材と放熱板の両者の間に，ま
たがって形成されている。また，第２基材の裏側の段付
穴は，通常，第２基材の中央部分に角状或いは円状等に
形成される。そして，放熱板は凸状を有しており，その
小径部分が上記第２基材の段付穴に挿入された状態で第
２基材に保持され，放熱板の裏側が外部へ露出している
（第１図参照）。そのため，放熱板の小径部は上記段付
穴と相似形に設けられる。それ故，上記対向部分は，通
常は角状，円状等の環状に形成される（第３図参照）。The exposed concave portion is formed so as to extend between both the second base member and the heat sink. In addition, the stepped hole on the back side of the second base material is generally formed in a square shape or a circular shape in the center portion of the second base material. The heat sink has a convex shape, and the small diameter portion is held by the second base in a state of being inserted into the stepped hole of the second base, and the back side of the heat sink is exposed to the outside. (See FIG. 1). Therefore, the small diameter portion of the heat sink is provided in a shape similar to the stepped hole. Therefore, the opposed portion is usually formed in an annular shape such as a square shape or a circular shape (see FIG. 3).
また，接着剤は段付穴側壁と放熱板側壁との間，即ち
上記対向部分に充填されている。そして，該対向部分に
おいて，ザグリ加工によって設けた前記露出凹部には，
接着剤が露出した状態にある。該接着剤の露出表面は，
露出凹部の天井面とほぼ同じ面上にある。The adhesive is filled between the side wall of the stepped hole and the side wall of the heat radiating plate, that is, the above-mentioned facing portion. And, in the exposed concave portion provided by the counterbore processing in the opposed portion,
The adhesive is exposed. The exposed surface of the adhesive is
It is on the same plane as the ceiling surface of the exposed recess.
上記第１基材，第２基材の材料としては，ガラス−エ
ポキシ樹脂，ガラス−ビスマレイミド−トリアジン樹
脂，ガラス−ポリイミド樹脂等がある。また，放熱板と
しては，銅，鉄系合金，銅系合金等がある。Examples of the material of the first base material and the second base material include glass-epoxy resin, glass-bismaleimide-triazine resin, and glass-polyimide resin. Further, as the heat radiating plate, there are copper, iron-based alloy, copper-based alloy and the like.
また，接着剤としては流れ性の良い，プリプレグと称
される接着シートがある。また，接着剤の材料として
は，エポキシ樹脂，ビスマレイミド−トリアジン樹脂
（BT樹脂），ポリイミド樹脂等がある。また，金属メッ
キ層の材料としては，銅，ニッケル，金等がある。As the adhesive, there is an adhesive sheet called prepreg, which has good flowability. In addition, examples of the material of the adhesive include an epoxy resin, a bismaleimide-triazine resin (BT resin), and a polyimide resin. The material of the metal plating layer includes copper, nickel, gold and the like.
また，上記対向部分におけるクリアランスは,0.05〜
0.3mmとすることが好ましい。0.05mm未満では，放熱板
と段付穴との寸法精度が厳しくなり，一方0.3mmを越え
ると接着剤層の幅が大きくなりすぎて金属メッキ層が充
分に形成されないおそれがある。In addition, the clearance at the above opposing part is 0.05 to
It is preferably 0.3 mm. If it is less than 0.05 mm, the dimensional accuracy between the heat sink and the stepped hole becomes severe, while if it exceeds 0.3 mm, the width of the adhesive layer becomes too large and the metal plating layer may not be formed sufficiently.
また，露出凹部の深さは,0.05〜0.2mmとすることが好
ましい。0.05mm未満では基材の厚み精度と露出凹部の加
工精度が厳しく，一方,0.2mmを越えると金属を加工する
上で負荷が大きすぎるからである。Further, the depth of the exposed concave portion is preferably set to 0.05 to 0.2 mm. If the thickness is less than 0.05 mm, the thickness accuracy of the base material and the processing accuracy of the exposed concave portion are severe, while if it exceeds 0.2 mm, the load is too large in processing the metal.
更に露出凹部の幅は0.5〜2.0mmとすることが好まし
い。0.5mm未満では加工する刃の径が小さすぎて折れ易
く，一方,2.0mmを越えると加工される凹部がデッドスペ
ース（Dead Space）となり配線有効面積に制限を受け
ることになるからである。また，上記露出凹部はザグリ
加工により形成する。Further, the width of the exposed concave portion is preferably set to 0.5 to 2.0 mm. If it is less than 0.5 mm, the diameter of the blade to be machined is too small and it is easy to break. On the other hand, if it exceeds 2.0 mm, the recess to be machined becomes a dead space, which limits the effective wiring area. The exposed recess is formed by counterboring.
次に，上記電子部品搭載用基板の製造方法としては，
第２基材の裏側に放熱板の裏側を露出させるための段付
穴を設け，一方第１基材には放熱板の内面側を挿入する
内面凹所を設け，ついで，上記第２基材の段付穴と第１
基材の内面凹所との間に放熱板を挟着すると共に第２基
材と放熱板とを接着剤を介して接着すると共に該接着剤
を第２基材裏側における段付穴側壁と放熱板側壁との対
向部分の開口部近くまで充填し，ついで，該対向部分に
おいて第２基材と放熱板との両者にまたがるザグリ加工
を行い，上記接着剤を露出させた露出凹部を形成し，更
に，第１基材側において第１基材及び接着剤を貫通して
放熱板の一部分までザグリ化合を行って電子部品搭載用
凹部を形成し，その後，上記放熱板と露出凹部と第２基
材裏側面との間に連続した金属メッキ層を形成すること
を特徴とする電子部品搭載用基板の製造方法がある。Next, as a method of manufacturing the electronic component mounting board,
A stepped hole for exposing the back side of the heat sink is provided on the back side of the second base material, while an inner recess for inserting the inner surface side of the heat sink is provided in the first base material. Stepped hole and 1st
A heat radiating plate is sandwiched between the inner surface recess of the base material and the second base material and the heat radiating plate are adhered to each other with an adhesive. Filling up to the vicinity of the opening of the portion facing the plate side wall, and then performing counterbore processing on both the second base material and the heat sink in the facing portion to form an exposed concave portion exposing the adhesive, Further, on the first base material side, penetrating the first base material and the adhesive, a counterbore compound is performed to a part of the heat sink to form a recess for mounting electronic components, and thereafter, the heat sink, the exposed recess and the second base are formed. There is a method for manufacturing a substrate for mounting electronic components, wherein a continuous metal plating layer is formed between the substrate and the back surface of the material.
上記製造方法において，最も注目すべきことは，第１
基材と第２基材との間に放熱板を接着するに当たり，接
着剤を上記段付穴と放熱板との対向部分の開口部近くま
で充填し，次いで該対向部分を放熱板と第２基材にまた
がってザグリ加工して上記露出凹部を形成し，その後金
属メッキ層を形成すること，放熱板を第１基材と第２基
材との間に挟着すると共に第２基材の段付穴から放熱板
の裏側を露出させていることである。In the above manufacturing method, the most remarkable thing is the first
In bonding the heat sink between the base material and the second base material, the adhesive is filled up to near the opening of the facing portion between the stepped hole and the heat sink. Counterbore processing is performed over the base material to form the exposed concave portion, and thereafter, a metal plating layer is formed. A heat sink is sandwiched between the first base material and the second base material, and the second base material is formed. That is, the back side of the heat sink is exposed from the stepped hole.
また，上記接着に当たっては，接着剤を対向部分の開
口部に若干はみ出させることが好ましい。これにより，
接着剤が対向部分の開口部まで完全に充填されたことが
確認できる。このはみ出した接着剤は，上記露出凹部の
形成の際に，ザグリ加工により対向部分における放熱板
及び第２基材と共に取り除かれる。In the bonding, it is preferable that the adhesive slightly protrudes into the opening of the opposing portion. This gives
It can be confirmed that the adhesive was completely filled up to the opening of the opposing portion. The protruding adhesive is removed together with the heat radiating plate and the second base material in the facing portion by counterboring when forming the exposed concave portion.
また，露出凹部の形状としては，四角状（第2C図），
半円状（第４図），三角状（第５図），楕円状（第６
図）など，特に接着剤露出部分がメッキされ易い形状と
する。In addition, the shape of the exposed recess is square (Fig. 2C),
Semicircular (Fig. 4), triangular (Fig. 5), elliptical (Fig. 6)
In particular, the exposed part of the adhesive is easily plated.
また，上記放熱板の形状は，第１基材と第２基材とを
重ね合わせたとき，その内面凹所と段付穴とによって形
成される空間部とほぼ同じである（第2A図参照）。The shape of the heat sink is substantially the same as the space formed by the inner recess and the stepped hole when the first base material and the second base material are overlapped (see FIG. 2A). ).
なお，前記電子部品搭載用凹部内には，金属メッキ層
を設ける場合，設けない場合がある。The metal plating layer may or may not be provided in the electronic component mounting recess.
本発明の電子部品搭載用基板においては，第２基材と
放熱板にまたがる前記露出凹部を設け，また該露出凹部
には接着剤を同一面上に露出させている。それ故，第２
基材裏側に金属メッキ層を被覆したとき，該金属メッキ
層は上記露出凹部表面に完全に形成されることとなる。In the electronic component mounting board according to the present invention, the exposed concave portion is provided over the second base member and the heat sink, and the adhesive is exposed on the same surface in the exposed concave portion. Therefore, the second
When a metal plating layer is coated on the back side of the base material, the metal plating layer is completely formed on the exposed concave surface.
つまり，露出凹部は，その天井面が放熱板，接着剤及
び第２基材の順に並んで同一面上に形成されている。そ
れ故，金属メッキ層はこれらの間に連続して形成される
こととなる。もしも，前記従来のごとく，上記対向部分
に接着剤が存在していない場合，或いは接着剤がはみ出
している状態の場合には金属メッキ層を完全に連続形成
させることができない。That is, the exposed concave portion is formed on the same surface with its ceiling surface arranged in the order of the heat sink, the adhesive, and the second base material. Therefore, the metal plating layer is formed continuously between them. If the adhesive does not exist in the facing portion as in the conventional case, or if the adhesive is protruding, the metal plating layer cannot be formed completely continuously.
また，本発明においては，接着剤を上記対向部分の間
に充填し，その後対向部分の開口部をザグリ加工して露
出凹部を形成する。そのため，接着剤は，対向部分を満
たすに充分な量を用い，場合によってははみ出させても
良い。それ故，従来のごとく接着剤がはみ出ないよう
に，かつ充填するに丁度良い量に調整する必要もない。Further, in the present invention, an adhesive is filled between the opposing portions, and then the opening of the opposing portion is counterbored to form an exposed concave portion. Therefore, the adhesive may be used in an amount sufficient to fill the opposing portion, and may be protruded in some cases. Therefore, it is not necessary to adjust the adhesive so that the adhesive does not protrude, and to adjust the amount to just a suitable amount as in the related art.
また，本発明においては，前記従来技術のごとく対向
部分の間隔を大きくする必要がない。それ故，放熱板は
パターン形成に可能な限り，大きくすることができ，放
熱性を向上させることができる。Further, in the present invention, it is not necessary to increase the interval between the facing portions as in the prior art. Therefore, the heat radiating plate can be made as large as possible for pattern formation, and the heat radiating property can be improved.
また，本発明においては，放熱板，露出凹部，第２基
材裏側に連続した金属メッキ層が形成してあるので，電
子部品搭載用凹部に基材裏側から湿気が浸入するこいと
がない。Further, in the present invention, since a continuous metal plating layer is formed on the heat radiating plate, the exposed concave portion, and the back side of the second base material, moisture does not enter the concave portion for mounting electronic components from the back side of the base material.
また，放熱板は第１基材と第２基材との間に挟着固定
されているので，従来のごとく放熱板が脱落するおそれ
がない。Further, since the heat radiating plate is sandwiched and fixed between the first base material and the second base material, there is no possibility that the heat radiating plate falls off as in the related art.
したがって，本発明によれば，上記対向部分における
金属メッキ層を確実に形成し，接着剤量の調整の必要が
なく，更に放熱板の脱落のおそれがない放熱性及び耐湿
性に優れた電子部品搭載用基板を提供することができ
る。Therefore, according to the present invention, an electronic component having excellent heat dissipation and moisture resistance, in which the metal plating layer in the facing portion is reliably formed, the amount of adhesive does not need to be adjusted, and the heat sink does not fall off. A mounting substrate can be provided.
また，本発明の製造方法によれば，上記のごとき優れ
た電子部品搭載用基板を容易に製造することができる。Further, according to the manufacturing method of the present invention, the excellent electronic component mounting board as described above can be easily manufactured.
第１実施例 本発明の実施例にかかる電子部品搭載用基板につき，
第１図〜第３図を用いて説明する。First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described.
This will be described with reference to FIGS.
本例の電子部品搭載用基板１は，第１図に示すごと
く，第１基材1Aと，第２基材1Bと，両者の間に接着剤３
を介して挟着固定した放熱板２と，上記第１基材1A側に
おいて該第１基材1Aと接着剤３を貫通して放熱板２の上
部までザグリ加工形成した電子部品搭載用凹部13とより
なる。As shown in FIG. 1, the electronic component mounting board 1 of this embodiment includes a first base material 1A, a second base material 1B, and an adhesive 3 therebetween.
A heat sink 2 sandwiched and fixed through the first base 1A and an electronic component mounting recess 13 formed by counterboring the upper surface of the heat sink 2 through the first base 1A and the adhesive 3 on the side of the first base 1A. And
また，上記放熱板２の裏側は，上記第２基材1Bに設け
た段付穴11Bより，その一部を露出させている。また，
上記第２基材1Bの段付穴11Bと放熱板２の対向部分に
は，第２基材1Bと放熱板の両者にまたがると共に上記接
着剤３を同一表面上に露出させた露出凹部４（第2C図）
をザグリ加工により設けてある。A part of the back side of the heat sink 2 is exposed through a stepped hole 11B provided in the second base material 1B. Also,
An exposed recess 4 (see FIG. 3), which covers both the second base 1B and the radiator plate and exposes the adhesive 3 on the same surface, is provided at a portion where the stepped hole 11B of the second base 1B and the radiator plate 2 face each other. (Fig. 2C)
Are provided by counterbore processing.
更に，上記放熱板２と露出凹部４と第２基材1Bの裏側
には連続した金属メッキ層75が被覆してある。Further, a continuous metal plating layer 75 is coated on the back side of the heat sink 2, the exposed concave portion 4, and the second substrate 1B.
また，第１基材1Aの表側においては，電子部品搭載用
凹部13の内面に金属メッキ層76が形成され，第１基材1A
の上面にはパターン94が形成してある。更に，第１基材
及び第２基材を貫通しているスルーホール98には，導体
ピン99が挿入してある。スルーホール98の内部には金属
メッキ層981が形成してある。On the front side of the first substrate 1A, a metal plating layer 76 is formed on the inner surface of the electronic component mounting recess 13 so that the first substrate 1A
A pattern 94 is formed on the upper surface of the substrate. Further, a conductor pin 99 is inserted into a through hole 98 penetrating the first base material and the second base material. A metal plating layer 981 is formed inside the through hole 98.
次に上記電子部品搭載用基板１の製造方法につき，第
2A図〜第2E図及び第３図を用いて説明する。Next, a method of manufacturing the electronic component mounting board 1 will be described.
This will be described with reference to FIGS. 2A to 2E and FIG.
まず，第2A図，第３図に示すごとく，第２基材1Bの裏
側に，放熱板２の裏側22を露出させるための段付穴11B
を設ける。また，第１基材1Aにおいては，その裏側に放
熱板２の内面側21を挿入する内面凹所11Aをザグリ加工
により設ける。First, as shown in FIGS. 2A and 3, a stepped hole 11B for exposing the back side 22 of the heat sink 2 is formed on the back side of the second base material 1B.
Is provided. Further, in the first base material 1A, an inner surface recess 11A for inserting the inner surface side 21 of the heat sink 2 is provided on the back side by counterbore processing.
また，放熱板２は，逆凸形状を有し，その小径部が裏
側22を，大径部が内面側21を構成している。そして，該
放熱板２の形状は，上記第１基材1Aと第２基材1Bとを重
ね合わせたときに形成される空間と同じである（第2B図
参照）。また，第２基材1Bは段付穴11Bに，放熱板の裏
側22を挿入する開口部12Bを有する。なお，上記第１基
材1Aは銅箔19を貼った銅張り積層板である。The heat radiating plate 2 has an inverted convex shape, and the small diameter portion forms the back side 22 and the large diameter portion forms the inner side 21. The shape of the heat radiating plate 2 is the same as the space formed when the first base material 1A and the second base material 1B are overlapped (see FIG. 2B). The second base material 1B has an opening 12B in the stepped hole 11B for inserting the back side 22 of the heat sink. The first substrate 1A is a copper-clad laminate on which a copper foil 19 is pasted.
次に，第2A図に示すごとく，放熱板２及び第２基材1B
に接着剤３を付着させて，第2B図に示すごとく，第１基
材1Aと第２基材1Bとの間に放熱板２を挟持し，加熱加圧
し，放熱板２を接着する。Next, as shown in FIG. 2A, the heat sink 2 and the second base material 1B
Then, as shown in FIG. 2B, the heat radiating plate 2 is sandwiched between the first base material 1A and the second base material 1B, and heated and pressed to bond the heat radiating plate 2 thereto.
このとき，接着剤３は，第１基材1Aの内面凹所11Aと
放熱板２の間に，及び第２基材の段付穴11Bと放熱板２
との間，即ち対向部分120内に充填される。また，接着
剤３は，対向部分120の開口部121より外部にはみ出し
（溢流）て，はみ出し部31を形成している。そのため，
放熱板２と第２基材の段付穴11Bとの間は，接着剤３に
よって完全に満たされている。また，上記接着時には，
第１基材1Aと第２基材1Bとは同時に接着剤３により接着
される。At this time, the adhesive 3 is applied between the inner surface recess 11A of the first base 1A and the heat sink 2, and between the stepped hole 11B of the second base 1 and the heat sink 2.
, Ie, in the facing portion 120. The adhesive 3 protrudes (spills) out of the opening 121 of the facing portion 120 to form the protruding portion 31. for that reason,
The space between the radiator plate 2 and the stepped hole 11B of the second base material is completely filled with the adhesive 3. At the time of bonding,
The first substrate 1A and the second substrate 1B are simultaneously bonded by the adhesive 3.
次に，第2C図に示すごとく，上記対向部分120におい
て第２基材1Bと放熱板２との両者にまたがるザグリ加工
を行い，露出凹部４を形成する。該露出凹部４の天井面
は，第２基材1Bに形成された段部13Bと，放熱板２に形
成された段部24と，両者の間に露出した接着剤３の露出
面32とよりなり，これらは同一面上にある。Next, as shown in FIG. 2C, counterbore processing is performed on both the second base material 1B and the radiator plate 2 in the facing portion 120 to form the exposed concave portion 4. The ceiling surface of the exposed concave portion 4 has a stepped portion 13B formed in the second base material 1B, a stepped portion 24 formed in the heat sink 2, and an exposed surface 32 of the adhesive 3 exposed therebetween. And these are on the same plane.
一方，第１基材1Aの表側においては，第2C図に示すご
とく，電子部品搭載用凹所13をザグリ加工により形成
し，放熱板２の内面側を露出させる。即ち，第１基材1A
と接着剤３とを貫通すると共に放熱板２の内面側の一部
まで達するザグリ加工を行う。また，該電子部品搭載用
凹部13においては，その側壁131と接着剤の露出面33と
は同一面上にある。On the other hand, on the front side of the first substrate 1A, as shown in FIG. 2C, a recess 13 for mounting an electronic component is formed by counterboring to expose the inner surface side of the heat sink 2. That is, the first substrate 1A
And the adhesive 3 are penetrated and a counterboring process is performed to reach a part of the inner surface side of the heat sink 2. In the electronic component mounting recess 13, the side wall 131 and the exposed surface 33 of the adhesive are on the same plane.
次に，第2D図に示すごとく，第２基材1Bの裏側におい
て，放熱板2,露出凹部4,第２基材1Bの表面に連続した金
属メッキ層75を形成する。また，第１基材1Aの表側にお
いても電子部品搭載用凹部13に金属メッキ層76を形成す
る。これら金属メッキ層の形成は，同時に行う。Next, as shown in FIG. 2D, on the back side of the second base 1B, a continuous metal plating layer 75 is formed on the heat sink 2, the exposed recess 4, and the surface of the second base 1B. In addition, a metal plating layer 76 is formed in the electronic component mounting recess 13 also on the front side of the first base 1A. The formation of these metal plating layers is performed simultaneously.
その後，第2E図に示すごとく，エッチングにより導体
回路94の形成を行う。以上により，電子部品搭載用基板
が製造される。このものは，前記第１図に示したものと
同様である。Thereafter, as shown in FIG. 2E, the conductor circuit 94 is formed by etching. Thus, the electronic component mounting board is manufactured. This is the same as that shown in FIG.
次に，作用効果につき説明する。 Next, the function and effect will be described.
上記のごとく，本例の電子部品搭載用基板１は，前記
第２基材1Bの段付穴11Bと放熱板２との間の対向部分120
において，第２基材1Bと放熱板２にまたがる露出凹部４
を形成し，第２基材1B,露出凹部4,放熱板２に連続した
金属メッキ層75を設けている。そして，上記露出凹部４
においては，第2C図に示すごとく，第２基材の段部13B
と接着剤の露出面32と放熱板の段部24が同一面上にあ
る。そのため，金属メッキ層75が，これらの表面に確実
に連続形成される。As described above, the electronic component mounting board 1 of the present embodiment includes an opposing portion 120 between the stepped hole 11B of the second base material 1B and the heat sink 2.
, The exposed concave portion 4 extending over the second base material 1B and the heat sink 2
The second base material 1B, the exposed concave portion 4, and the heat sink 2 are provided with a continuous metal plating layer 75. And the above-mentioned exposed recess 4
In FIG. 2C, as shown in FIG.
The exposed surface 32 of the adhesive and the step portion 24 of the heat sink are on the same surface. Therefore, the metal plating layer 75 is reliably and continuously formed on these surfaces.
また，本例では，第2B図に示すごとく，放熱板２の接
着に当たり，接着剤３のはみ出し部31を形成させてい
る。そのため，接着剤３は，放熱板２と第２基材1Bとの
間に完全に充填される。そして，このはみ出し部31は，
第2C図に示すごとく，ザグリ加工による露出凹部４形成
の際に除去される。Further, in this example, as shown in FIG. 2B, when the heat radiating plate 2 is bonded, a protruding portion 31 of the adhesive 3 is formed. Therefore, the adhesive 3 is completely filled between the heat sink 2 and the second base 1B. And this protruding part 31
As shown in FIG. 2C, it is removed when the exposed recess 4 is formed by counterboring.
それ故，露出凹部４の表面には，必ず接着剤３の露出
面32が形成され，前記金属メッキ層75が確実に形成され
る。また，そのため，従来のごとく，接着剤のはみ出し
防止，接着剤の充填等のために，接着剤量の調整を行う
必要がない。Therefore, the exposed surface 32 of the adhesive 3 is always formed on the surface of the exposed concave portion 4, so that the metal plating layer 75 is surely formed. Therefore, it is not necessary to adjust the amount of the adhesive in order to prevent the adhesive from protruding and to fill the adhesive as in the related art.
また，前記第９図に示した従来技術のごとく対向部分
の間隔を大きくする必要がない。そのため，放熱板は，
できるだけ大きく配設することができ，放熱性が向上す
る。また，放熱板，露出凹部，第２基材裏側に，連続し
た金属メッキ層75が形成されているので，電子部品搭載
部分に基材裏側から湿気が浸入することもない。Further, unlike the prior art shown in FIG. 9, it is not necessary to increase the distance between the opposing portions. Therefore, the heat sink is
It can be placed as large as possible, improving heat dissipation. Further, since the continuous metal plating layer 75 is formed on the heat radiating plate, the exposed concave portion, and the back side of the second base material, moisture does not enter the electronic component mounting portion from the back side of the base material.
また，放熱板２は第１図に示すごとく，第１基材1Aと
第２基材1Bとにより挟着固定されているので，長期間の
使用においても放熱板２が脱落することがない。Further, as shown in FIG. 1, the heat radiating plate 2 is sandwiched and fixed between the first base material 1A and the second base material 1B, so that the heat radiating plate 2 does not fall off even during long-term use.
なお，上記第１実施例においては，下記の態様を採用
することもできる（特願平１−291756号参照）。In the first embodiment, the following mode can be adopted (see Japanese Patent Application No. 1-291756).
即ち，電子部品搭載用凹部の金属メッキ層76は，上例
では，その側壁と底面に形成したが，該金属メッキ層76
は，電子部品搭載用凹部の開口部周縁に対しても形成す
ることができる。また，該金属メッキ層76は，電子部品
搭載用凹部の側壁上方には設けないこと，電子部品搭載
用凹部の底面には設けないことという態様も取り得る。That is, in the above example, the metal plating layer 76 of the concave part for mounting electronic components was formed on the side wall and the bottom surface.
Can also be formed on the periphery of the opening of the electronic component mounting recess. Further, the metal plating layer 76 may not be provided above the side wall of the electronic component mounting concave portion, and may not be provided on the bottom surface of the electronic component mounting concave portion.
また，電子部品搭載用凹部13内に搭載した電子部品の
回路端子は，通常は，基材表面の導体回路の端子にワイ
ヤーによりボンディングする。しかし，場合によって
は，電子部品のアース端子の１つを放熱板自体に直接ボ
ンディングすることもできる。The circuit terminals of the electronic components mounted in the electronic component mounting recesses 13 are usually bonded by wires to the terminals of the conductor circuit on the surface of the base material. However, in some cases, one of the ground terminals of the electronic component can be directly bonded to the heat sink itself.
更に，放熱板には，放熱用フィンを接合して，放熱性
を高めることもできる。Furthermore, a heat radiating fin can be joined to the heat radiating plate to enhance heat radiation.
第２実施例 本例は，第４図〜第６図に示すごとく，第１実施例に
おける露出凹部４の形状を種々変えたものである。Second Embodiment In this embodiment, as shown in FIGS. 4 to 6, the shape of the exposed recess 4 in the first embodiment is variously changed.
即ち，第４図に示す露出凹部４は，半円状で第２基材
1Bの円弧状面141と，接着剤の露出面32と，放熱板の円
弧状面212とよりなる。That is, the exposed concave portion 4 shown in FIG.
The arc-shaped surface 141 of FIG. 1B, the exposed surface 32 of the adhesive, and the arc-shaped surface 212 of the heat sink.
また，第５図に示す露出凹部４は，三角状で，第２基
材1Bの斜面142と，接着剤の露出面32と放熱板の斜面213
とよりなる。Further, the exposed concave portion 4 shown in FIG. 5 has a triangular shape, the slope 142 of the second base material 1B, the exposed surface 32 of the adhesive, and the slope 213 of the heat sink.
And
更に，第６図に示す露出凹部４は，略楕円状で，第２
基材1Bの弧面143と接着剤の露出面32と，放熱板の弧面2
14とよりなる。Further, the exposed concave portion 4 shown in FIG.
Arc surface 143 of substrate 1B, exposed surface 32 of adhesive, and arc surface 2 of heat sink
Consists of 14.
上記いずれの露出凹部においても，上記の各表面は，
連続した面上にある。それ故，第１実施例と同様に，そ
の表面には連続した金属メッキ層を確実に形成でき，同
様の効果を得ることができる。In any of the above-mentioned exposed concave portions, each of the above surfaces is
It is on a continuous surface. Therefore, similarly to the first embodiment, a continuous metal plating layer can be reliably formed on the surface, and the same effect can be obtained.
第３実施例 上記第１実施例における具体例について示す。Third Embodiment A specific example of the first embodiment will be described.
本例においては，第１基材1A,第２基材1Bとして，厚
さ0.5mmのビスマレイミド−トリアジン樹脂（BT樹脂）
材の銅張積層板を用いた。放熱板は，銅板を用いた。In this example, a 0.5 mm thick bismaleimide-triazine resin (BT resin) is used as the first base material 1A and the second base material 1B.
The material used was a copper-clad laminate. A copper plate was used as the heat sink.
接着剤３としては,BT樹脂のプリプレグ接着剤を用い
た。その接着にあたっては,170℃で加熱圧着した。この
とき，はみ出し部31の高さは約0.1mmであった。また，
露出凹部４（第2C図）の深さは,0.1mm,幅1.0mmであっ
た。該露出凹部４は対向部分120に沿って四角環状を呈
している。As the adhesive 3, a prepreg adhesive of BT resin was used. The bonding was performed by thermocompression bonding at 170 ° C. At this time, the height of the protruding portion 31 was about 0.1 mm. Also,
The depth of the exposed recess 4 (FIG. 2C) was 0.1 mm and the width was 1.0 mm. The exposed concave portion 4 has a rectangular ring shape along the facing portion 120.
金属メッキ層75,76は，無電解方法当は電解方法によ
り形成し，その金属メッキの厚みは約20μｍであった。
また，金属メッキ層75は，放熱板2,露出凹部4,第２基材
1Bの裏側面に連続して，確実に形成されていた。金属メ
ッキ層76も同様に連続形成されていた。The metal plating layers 75 and 76 were formed by an electroless method or an electrolytic method, and the thickness of the metal plating was about 20 μm.
Further, the metal plating layer 75 is composed of the heat sink 2, the exposed recess 4, the second base material.
It was formed continuously and reliably on the back side of 1B. The metal plating layer 76 was similarly formed continuously.
なお，比較のために，第2B図に示すごとく，接着剤の
はみ出し部31があるままで，金属メッキ層75の形成を行
った。その結果，接着剤のはみ出し部31において，金属
メッキ層が被覆されていないメッキ不良部分を，各所で
生じていた。For comparison, as shown in FIG. 2B, the metal plating layer 75 was formed with the protruding portion 31 of the adhesive remaining. As a result, in the protruding portion 31 of the adhesive, defective plating portions where the metal plating layer is not covered are generated at various places.
第１図〜第３図は第１実施例の電子部品搭載用基板を示
し，第１図はその断面図，第2A図〜第2E図はその製造工
程説明図，第３図は第１基材，放熱板，第２基材の展開
斜視図，第４図〜第６図は第２実施例における露出凹部
の形状を示す図，第7A図〜第９図は従来の電子部品搭載
用基板を示し，第7A図〜第7E図はその製造工程説明図，
第８図はその断面図，第９図は他の従来の電子部品搭載
用基板の断面図である。 １……電子部品搭載用基板， 13……電子部品搭載用凹部， 120……対向部分， ２……放熱板， ３……接着剤， 31……はみ出し部， ４……露出凹部， 75,76……金属メッキ層， 1A……第１基材， 1B……第２基材， 11A……内面凹所， 11B……段付穴，1 to 3 show an electronic component mounting board according to a first embodiment, FIG. 1 is a cross-sectional view thereof, FIGS. 2A to 2E are explanatory views of the manufacturing process thereof, and FIG. Exploded perspective views of a material, a heat sink, and a second base material, FIGS. 4 to 6 show shapes of exposed concave portions in the second embodiment, and FIGS. 7A to 9 show conventional electronic component mounting substrates. 7A to 7E are explanatory views of the manufacturing process,
FIG. 8 is a sectional view of the same, and FIG. 9 is a sectional view of another conventional electronic component mounting substrate. DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting board, 13 ... Electronic component mounting concave part, 120 ... Opposing part, 2 ... Heat sink, 3 ... Adhesive, 31 ... Extruded part, 4 ... Exposed concave part, 75, 76 ... metal plating layer, 1A ... 1st base material, 1B ... 2nd base material, 11A ... inner surface recess, 11B ... stepped hole,
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/12 H01L 23/34 - 23/473 H05K 1/02 H05K 3/46Continued on the front page (58) Fields surveyed (Int.Cl. 6 , DB name) H01L 23/12 H01L 23/34-23/473 H05K 1/02 H05K 3/46
Claims (3)
剤を介して挟着固定した放熱板と， 上記第１基材側において該第１基材及び接着剤を貫通し
て放熱板の上部までザグリ加工形成した電子部品搭載用
凹部とよりなり，また上記放熱板の裏側は上記第２基材
に設けた段付穴よりその一部を露出させてなる電子部品
搭載用基板であって， 上記第２基材の段付穴と放熱板との対向部分には，第２
基材と放熱板の両者にまたがると共に上記接着剤を同一
表面上に露出させた露出凹部をザグリ加工により設けて
なり， かつ上記放熱板と露出凹部と第２基材裏側には連続した
金属メッキ層が被覆してあることを特徴とする電子部品
搭載用基板。1. A first base material, a second base material, a radiator plate sandwiched and fixed between the first base material and the second base material with an adhesive, and the first base material and the adhesive on the first base material side. An electronic component having a recessed part for mounting an electronic component which penetrates and is formed to the upper part of a heat sink, and a part of the back side of the heat sink is exposed from a stepped hole provided in the second base material; A mounting substrate, wherein a second portion of the second base material is provided with a
An exposed recess is provided by facing to cover both the base material and the heat sink and exposes the adhesive on the same surface, and continuous metal plating is applied to the heat sink, the exposed recess and the back of the second base material. A substrate for mounting an electronic component, wherein the substrate is coated with a layer.
るための段付穴を設け，一方第１基材には放熱板の内面
側を挿入する内面凹所を設け， ついで，上記第２基材の段付穴と第１基材の内面凹所と
の間に放熱板を挟着すると共に第２基材と該１基材と放
熱板とを接着剤を介して接着すると共に該接着剤を第２
基材裏側における段付穴側壁と放熱板側壁との対向部分
の開口部近くまで充填し， ついで，該対向部分において第２基材と放熱板との両者
にまたがるザグリ加工を行い，上記接着剤を露出させた
露出凹部を形成し， 更に，第１基材側において第１基材及び接着剤を貫通し
て放熱板の一部分までザグリ加工を行って電子部品搭載
用凹部を形成し， その後，上記放熱板と露出凹部と第２基材裏側面との間
に連続した金属メッキ層を形成することを特徴とする電
子部品搭載用基板の製造方法。2. A stepped hole is provided on the back side of the second base for exposing the back side of the heat sink, while the first base is provided with an inner recess for inserting the inner side of the heat sink. A heat sink is sandwiched between the stepped hole of the second base material and the inner surface recess of the first base material, and the second base material, the first base material, and the heat sink are adhered to each other with an adhesive. With the second adhesive
Filling up to the vicinity of the opening of the opposing portion of the stepped hole side wall and the heat sink side wall on the back side of the base material, and then, in the opposing portion, counterbore processing over both the second base material and the heat sink is performed. Is formed by exposing the first substrate and the adhesive on the first substrate side, and a counterboring process is performed to a part of the heat sink to form an electronic component mounting concave portion. A method for manufacturing an electronic component mounting board, comprising: forming a continuous metal plating layer between the heat sink, the exposed recess, and the back surface of the second base material.
第２基材の間に接着するに当たり，接着剤は上記段付穴
と放熱板との対向部分の開口部にはみ出させることを特
徴とする電子部品搭載用基板の製造方法。3. An adhesive according to claim 2, wherein, when the heat radiating plate is bonded between the first base material and the second base material, the adhesive is protruded into an opening at a portion facing the stepped hole and the heat radiating plate. A method for manufacturing a substrate for mounting electronic components, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2247829A JP2784522B2 (en) | 1990-09-17 | 1990-09-17 | Electronic component mounting substrate and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2247829A JP2784522B2 (en) | 1990-09-17 | 1990-09-17 | Electronic component mounting substrate and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04125953A JPH04125953A (en) | 1992-04-27 |
| JP2784522B2 true JP2784522B2 (en) | 1998-08-06 |
Family
ID=17169293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2247829A Expired - Lifetime JP2784522B2 (en) | 1990-09-17 | 1990-09-17 | Electronic component mounting substrate and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2784522B2 (en) |
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|---|---|---|---|---|
| KR20220080655A (en) * | 2020-12-07 | 2022-06-14 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Circuit board with embedded copper block structure |
| KR20220081241A (en) * | 2020-12-08 | 2022-06-15 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Method for manufacturing circuit board with embedded copper block structure |
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| JP3052766B2 (en) * | 1994-02-22 | 2000-06-19 | トヨタ自動車株式会社 | Impact energy absorption structure by car interior materials |
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| GB2293798B (en) * | 1994-10-07 | 1998-03-04 | Toyota Motor Co Ltd | Occupant protecting structures of vehicle body upper portions |
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| JP3000898B2 (en) * | 1995-07-12 | 2000-01-17 | トヨタ自動車株式会社 | Impact energy absorbing structure of automobile |
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| JPWO2015178394A1 (en) * | 2014-05-23 | 2017-04-20 | 住友ベークライト株式会社 | Metal foil-clad board, circuit board, and heating element mounting board |
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1990
- 1990-09-17 JP JP2247829A patent/JP2784522B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220080655A (en) * | 2020-12-07 | 2022-06-14 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Circuit board with embedded copper block structure |
| KR102541575B1 (en) * | 2020-12-07 | 2023-06-12 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Circuit board with embedded copper block structure |
| KR20220081241A (en) * | 2020-12-08 | 2022-06-15 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Method for manufacturing circuit board with embedded copper block structure |
| KR102497274B1 (en) * | 2020-12-08 | 2023-02-07 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Method for manufacturing circuit board with embedded copper block structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04125953A (en) | 1992-04-27 |
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