JP2753766B2 - Substrate for mounting electronic components - Google Patents
Substrate for mounting electronic componentsInfo
- Publication number
- JP2753766B2 JP2753766B2 JP2191001A JP19100190A JP2753766B2 JP 2753766 B2 JP2753766 B2 JP 2753766B2 JP 2191001 A JP2191001 A JP 2191001A JP 19100190 A JP19100190 A JP 19100190A JP 2753766 B2 JP2753766 B2 JP 2753766B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- insulating base
- base material
- circuit
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は，放熱板と接地回路又は電源回路の低インダ
クタンス化を図った電子部品搭載用基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a board for mounting electronic components in which a heat sink and a ground circuit or a power supply circuit have low inductance.
第５図に示すごとく，従来，電子部品搭載用基板９
は，絶縁基材91の下部に設けた凹所90内に接着剤98を介
して搭載した放熱板８と，該放熱板８の上部に設けた電
子部品搭載用凹部70と，絶縁基材91の上面に設けた接地
回路92とを有する。なお，該接地回路92は，電源回路と
して用いることもある。また，同図において符号94は信
号回路,95はスルーホール,96は導体ピンである。As shown in FIG.
A heat sink 8 mounted via an adhesive 98 in a recess 90 provided below the insulating base 91, an electronic component mounting recess 70 provided above the heat sink 8, and an insulating base 91. And a ground circuit 92 provided on the upper surface of the device. Note that the ground circuit 92 may be used as a power supply circuit. In the same figure, reference numeral 94 denotes a signal circuit, 95 denotes a through hole, and 96 denotes a conductor pin.
また，電子部品搭載用凹部70内に搭載した電子部品７
と接地回路92との間はボンディングワイヤー71により接
続する。これにより，電子部品７はその接地電極がボン
ディングワイヤー71,絶縁基材上面の接地回路92,スルー
ホール95,導体ピン96を経てアースされる。Also, the electronic component 7 mounted in the electronic component mounting recess 70 is provided.
And the ground circuit 92 are connected by a bonding wire 71. Thus, the ground electrode of the electronic component 7 is grounded via the bonding wire 71, the ground circuit 92 on the upper surface of the insulating base material, the through hole 95, and the conductor pin 96.
また，信号回路94と電子部品７との間にもボンディン
グワイヤー71が接続される。Further, a bonding wire 71 is connected between the signal circuit 94 and the electronic component 7.
しかしながら，従来の電子部品搭載用基板において
は，接地回路92を絶縁基材の表面に設けているため，信
号回路94を設けるスペースが制約される。However, in the conventional electronic component mounting board, since the ground circuit 92 is provided on the surface of the insulating base material, the space in which the signal circuit 94 is provided is limited.
また，近年は，上記電子部品が高周波域で使用される
ことが多い。そのため，接地回路，電源回路は，低イン
ダクタンス（磁気誘導係数）回路とする必要があり，回
路パターンはできるだけ幅広くすることが望まれてい
る。In recent years, the electronic components are often used in a high frequency range. Therefore, the ground circuit and the power supply circuit need to be low inductance (magnetic induction coefficient) circuits, and it is desired that the circuit pattern be as wide as possible.
また，放熱板と信号回路との間には，絶縁基材91が存
在するため，放熱板８が電気的に浮遊している。そのた
め，前記のごとく高周波域で使用される場合には，上記
絶縁基材91内に静電気が蓄積され，これが一種のコンデ
ンサーを形成し，電気的ノイズが発生することがある。Further, since the insulating base material 91 exists between the heat sink and the signal circuit, the heat sink 8 is electrically floating. Therefore, when used in a high frequency range as described above, static electricity is accumulated in the insulating base material 91, which forms a kind of capacitor, and may generate electric noise.
また，絶縁基材91としてガラスエポキシ基板等の樹脂
系絶縁基材を用いた場合には，電子部品搭載用凹所70の
側壁へ，絶縁基材の外部から湿気が浸入するおそれがあ
る。この湿気は電子部品に対して悪影響を与える。その
ため，上記凹所の耐湿性が要求される。When a resin-based insulating substrate such as a glass epoxy substrate is used as the insulating substrate 91, moisture may enter the sidewalls of the electronic component mounting recess 70 from outside the insulating substrate. This moisture has an adverse effect on electronic components. Therefore, the above-mentioned recess is required to have moisture resistance.
また，上記従来の電子部品搭載用基板においては，電
子部品７から発せられる熱は，放熱板８の上面を通って
放熱される。しかし，その放熱性は充分でない。特に，
近年はハイパワーの電子部品が用いられ，放熱性の向上
が要求されている。In the conventional electronic component mounting board, heat generated from the electronic component 7 is radiated through the upper surface of the heat radiating plate 8. However, its heat dissipation is not sufficient. Especially,
In recent years, high-power electronic components have been used, and improvements in heat dissipation have been demanded.
本発明はかかる問題点に鑑み，接地回路又は電源回路
の低インダクタンス化を図ることができ，また電気的ノ
イズの発生がなく，かつ耐湿性，放熱性に優れた電子部
品搭載用基板を提供しようとするものである。In view of the above problems, the present invention provides an electronic component mounting board which can reduce the inductance of a ground circuit or a power supply circuit, does not generate electric noise, and is excellent in moisture resistance and heat dissipation. It is assumed that.
本発明は，電子部品搭載用凹所を形成するための貫通
穴と導体回路と多数のスルーホールとを有する絶縁基材
と，該絶縁基材の裏面側の全面に絶縁接着層を介して接
合した放熱板とよりなり，上記絶縁基材には上記貫通穴
の側壁から該絶縁基材の裏面側にかけて形成した電源回
路又は接地回路用の導通メッキ層を設け，また上記絶縁
基材の貫通穴と放熱板の上面とにより電子部品搭載用凹
所を形成し，また上記放熱板には上記スルーホールに対
応する位置に開口穴を設け，かつこれら開口穴のうち，
接地回路に接続した接地用スルーホールに対向する開口
穴は，少なくともその１つが該接地用スルーホールと略
同径の接続穴を形成しており，またそれ以外の開口はス
ルーホールよりも大きい直径の逃げ穴を形成しているこ
とを特徴とする電子部品搭載用基板にある。The present invention relates to an insulating base material having a through-hole for forming an electronic component mounting recess, a conductive circuit, and a large number of through-holes, and is bonded to the entire back surface of the insulating base material via an insulating adhesive layer. A conductive plating layer for a power supply circuit or a grounding circuit formed from the side wall of the through hole to the back side of the insulating base material, and the insulating base material is provided with a through hole of the insulating base material. And an upper surface of the radiator plate to form an electronic component mounting recess, and the radiator plate is provided with an opening at a position corresponding to the through hole.
At least one of the opening holes facing the grounding through hole connected to the grounding circuit has a connection hole having substantially the same diameter as the grounding through hole, and the other openings have a diameter larger than that of the through hole. The electronic component mounting board is characterized in that the relief hole is formed.
本発明において最も注目すべきことは，絶縁基材にお
いて上記貫通穴の側壁から裏面側にかけて上記導通メッ
キ層を設けると共に，該絶縁基材の裏面側に放熱板を接
合し，該放熱板には上記接続穴と逃げ穴とを設けたこと
にある。In the present invention, it is most remarkable that the conductive plating layer is provided on the insulating base material from the side wall to the back surface of the through hole, and a heat sink is joined to the rear surface of the insulating base material. The connection hole and the relief hole are provided.
上記導通メッキ層は，電源回路又は接地回路として用
いるもので，上記のごとく貫通穴の側壁から絶縁基材の
裏面側にかけて形成する。また，該導通メッキ層は，貫
通穴の側壁全面に設ける。そして，上記裏面側の導通メ
ッキ層は，例えば電源回路用又は接地回路用のスルーホ
ールへ連通させて設ける。The conductive plating layer is used as a power supply circuit or a ground circuit, and is formed from the side wall of the through hole to the back side of the insulating base as described above. The conductive plating layer is provided on the entire side wall of the through hole. The conductive plating layer on the back side is provided so as to communicate with a through hole for a power supply circuit or a ground circuit, for example.
また，放熱板は，絶縁基材の裏面側に，その全面に接
合する。また，該放熱板には，絶縁基材に設けたスルー
ホールに対応する位置に開口穴を設ける。この開口穴は
２種類の大きさがある。本発明では，この開口穴の少な
くとも１つを接続穴として用いる。The heat sink is bonded to the entire back surface of the insulating base material. Further, an opening hole is provided in the heat sink at a position corresponding to the through hole provided in the insulating base material. The opening hole has two sizes. In the present invention, at least one of the opening holes is used as a connection hole.
即ち，まず上記スルーホールには，信号回路用，電源
回路用及び接地回路用の３種類がある。そして，大部分
のスルーホールは信号回路に接続されている。また，少
数のスルーホール（例えば１〜５個）は電源回路に，そ
して残りの少数のスルーホール（例えば１〜５個）は接
地回路に接続されている。That is, first, there are three types of through holes for a signal circuit, a power circuit, and a ground circuit. Most of the through holes are connected to the signal circuit. Also, a small number of through holes (for example, 1 to 5) are connected to the power supply circuit, and the remaining small number of through holes (for example, 1 to 5) are connected to the ground circuit.
本発明では，上記接地回路に接続されている接地用ス
ルーホールのうち，少なくともその１つを適当に選び，
放熱板においてその接地用スルーホールに対する位置に
上記接続穴を設けている。そして，この接続穴は，上記
接地用スルーホールと略同径である。In the present invention, at least one of the ground through holes connected to the ground circuit is appropriately selected,
The connection hole is provided on the heat sink at a position corresponding to the through hole for grounding. The connection hole has substantially the same diameter as the grounding through hole.
また，このように設けた接続穴には，上記接地用スル
ーホールとの間で電気的接続を図るため，両者間に共通
する導体ピンを挿入する（第３図参照）。また，導体ピ
ン挿入後は，接続穴及び接地用スルーホール内を半田で
充填することが好ましい。In order to establish electrical connection with the grounding through hole, a common conductor pin is inserted into the connection hole thus provided (see FIG. 3). After the conductor pins are inserted, the connection holes and the through holes for grounding are preferably filled with solder.
一方，上記接続穴を構成しない他の開口穴は，全て
「逃げ穴」として構成する。即ち，上記逃げ穴は，スル
ーホールと対応する位置に，しかもスルーホールよもも
大きい直径の穴とする。該逃げ穴は，スルーホール内を
洗浄し易くするため，及びスルーホール内に絶縁基材側
より導体ピンを挿入する際に接合用半田がスルーホール
内壁に円滑に浸透し易くするための穴である。この逃げ
穴には，スルーホールに挿入した導体ピンは接触しな
い。On the other hand, the other opening holes that do not constitute the connection holes are all constituted as “escape holes”. That is, the relief hole is located at a position corresponding to the through hole and has a diameter larger than that of the through hole. The relief hole is a hole for facilitating cleaning of the inside of the through-hole, and for facilitating the permeation of the solder for joining into the inner wall of the through-hole when the conductor pin is inserted from the insulating base material side into the through-hole. is there. The conductor pin inserted into the through hole does not contact the relief hole.
上記電子部品搭載用基板は，例えば次のようにして製
造する。まず，絶縁基材に上記貫通穴及びスルーホール
を形成する。そして，上記貫通穴及びスルーホールの内
壁面を含めた絶縁基材の全面にパネルメッキ（別名スル
ーホールメッキ）を施す。その後，常法により絶縁基材
の表面に接地回路又は，電源回路，信号回路等の導電回
路を形成する。このとき，接地回路又は電源回路用の導
通メッキ層が形成される。The electronic component mounting board is manufactured, for example, as follows. First, the through hole and the through hole are formed in an insulating base material. Then, panel plating (also called through-hole plating) is performed on the entire surface of the insulating base including the through-holes and the inner wall surfaces of the through-holes. Thereafter, a conductive circuit such as a ground circuit or a power supply circuit or a signal circuit is formed on the surface of the insulating base material by an ordinary method. At this time, a conductive plating layer for a ground circuit or a power supply circuit is formed.
その後，上記絶縁基材の裏面側の全表面に，接着剤シ
ート，プリプレグ等の絶縁接着層を介して放熱板を接着
する。これにより，絶縁基材の貫通穴と放熱板とによ
り，電子部品搭載用凹所が形成される。また，上記絶縁
接着層には，上記貫通穴及びスルーホールに対応する部
分を，上記接続穴，逃げ穴とほぼ同じ口径に予め開口さ
せておくことが好ましい。Thereafter, a heat radiating plate is adhered to the entire back surface of the insulating base material via an insulating adhesive layer such as an adhesive sheet or a prepreg. Thus, a recess for mounting an electronic component is formed by the through hole of the insulating base material and the heat sink. Further, it is preferable that a portion corresponding to the through-hole and the through-hole is previously opened in the insulating adhesive layer to have substantially the same diameter as the connection hole and the relief hole.
また，上記導通メッキ層用の金属メッキ層としては，
銅，ニッケル，ニッケル−金などを用いる。また，この
導通メッキ層の厚みは10〜40μｍとすることが好まし
い。As the metal plating layer for the conductive plating layer,
Copper, nickel, nickel-gold or the like is used. The thickness of the conductive plating layer is preferably set to 10 to 40 μm.
本発明においては，絶縁基材における上記貫通穴の側
壁と裏面側に，上記導通メッキ層を設けている。そのた
め，該導通メッキ層は，まず貫通穴の側壁において広い
面積で形成され，た絶縁基材の裏面側においては任意の
広い幅のパターンとして形成される。それ故，導通メッ
キ層は低インダクタンスの回路とすることができる。In the present invention, the conductive plating layer is provided on the side wall and the back surface side of the through hole in the insulating base material. Therefore, the conductive plating layer is first formed with a wide area on the side wall of the through hole, and is formed as an arbitrary wide pattern on the back side of the insulating base material. Therefore, the conductive plating layer can be a circuit with low inductance.
また，放熱板に設けた上記接続穴は接地用スルーホー
ルと略同径であり，両者には共通の導体ピンが挿入され
ることになる。そのため，接地回路と放熱板とは導体ピ
ンによって電気的に接続されることとなる。それ故，電
回路搭載用基板を，高周波域で使用した場合でも，絶縁
基材内に静電気が蓄積されることがない。したがって，
電気的ノイズの発生がない。Further, the connection hole provided in the heat sink has substantially the same diameter as the grounding through hole, and a common conductor pin is inserted into both. Therefore, the ground circuit and the heat sink are electrically connected by the conductor pins. Therefore, even when the electric circuit board is used in a high frequency range, no static electricity is accumulated in the insulating base material. Therefore,
There is no generation of electrical noise.
また，上記貫通穴は，その壁面が上記導通メッキ層に
より被覆されているので，電子部品搭載用凹所内へ絶縁
基材を通じて湿気が浸入するおそれがない。Further, since the wall surface of the through hole is covered with the conductive plating layer, there is no possibility that moisture may enter the electronic component mounting recess through the insulating base material.
また，放熱板は，絶縁基材の裏面側に，その全表面に
おいて配設している。そのため，本発明の電子部品搭載
用基板は放熱性にも優れている。また，放熱板には，上
記逃げ穴を設け，該逃げ穴の直径はスルーホールの直径
よりも大きくしたので，ピンの接合検査が容易であり，
またピンと放熱板との短絡を防ぐことができる。Further, the heat radiating plate is disposed on the entire back surface of the insulating base material. Therefore, the electronic component mounting board of the present invention is also excellent in heat dissipation. In addition, the above-mentioned relief hole is provided in the heat sink, and the diameter of the relief hole is made larger than the diameter of the through hole, so that it is easy to inspect the bonding of the pins.
In addition, a short circuit between the pin and the heat sink can be prevented.
以上のごとく，本発明によれば，接地回路，電源回路
の低インダクタンス化を図ることができ，また電気的ノ
イズの発生がなく，かつ耐湿性，放熱性にも優れた電子
部品搭載用基板を提供することができる。As described above, according to the present invention, it is possible to reduce the inductance of the grounding circuit and the power supply circuit, and to provide an electronic component mounting board which does not generate electric noise and has excellent moisture resistance and heat dissipation. Can be provided.
第１実施例 本発明の実施例にかかる電子部品搭載用基板につき，
第１図〜第３図を用いて説明する。First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described.
This will be described with reference to FIGS.
本例の電子部品搭載用基板１は，第１図に示すごと
く，電子部品搭載用凹所130を形成するための貫通穴13
と信号回路18とスルーホール15とを有する絶縁基材10
と，該絶縁基材10の裏面側（下側）の全面に絶縁接着層
３を介して接合した放熱板２とよりなる。そして，上記
絶縁基材10には，上記貫通穴13の側壁から該絶縁基材10
の裏面側にかけて形成した接地回路用の導通メッキ層16
を有する。As shown in FIG. 1, the electronic component mounting board 1 of this embodiment has a through hole 13 for forming an electronic component mounting recess 130.
Base material 10 having a signal circuit 18 and a through hole 15
And a heat radiating plate 2 joined to the entire back surface (lower side) of the insulating base material 10 via an insulating adhesive layer 3. Then, the insulating base material 10 is inserted into the insulating base material 10 from the side wall of the through hole 13.
Conductive plating layer 16 for the ground circuit formed on the back side of
Having.
また，上記放熱板２には，上記スルーホール15に対応
する位置に，それぞれ開口穴を設けている。そして，こ
れら開口穴のうち接地用スルーホール150に対向するも
のを，接地穴25としている。該接続穴25は接地用スルー
ホール150と略同径である。また，接地用スルーホール1
50及びスルーホール15は同径である。一方，上記接続穴
25以外の開口穴は，該スルーホール15よりも大きい直径
の逃げ穴21である。Further, the radiator plate 2 is provided with an opening hole at a position corresponding to the through hole 15. And, of these opening holes, the one facing the grounding through hole 150 is the grounding hole 25. The connection hole 25 has substantially the same diameter as the through hole 150 for grounding. In addition, through hole 1 for grounding
50 and the through hole 15 have the same diameter. On the other hand,
Opening holes other than 25 are relief holes 21 having a diameter larger than that of the through hole 15.
更に，上記絶縁基材10の貫通穴13と，放熱板２の上面
とにより電子部品搭載用凹所130を形成している。Further, a recess 130 for mounting an electronic component is formed by the through hole 13 of the insulating base material 10 and the upper surface of the heat sink 2.
そして，上記貫通穴13の側壁は，第１図，第２図に示
すごとく，四角状を有し，その側壁には側壁導通メッキ
層161が被覆されている。また，絶縁基材の裏面側に
は，裏面側導通メッキ層162が，上記側壁導通メッキ層1
61と接地回路用スルーホール150との間に延在形成され
ている。As shown in FIGS. 1 and 2, the side wall of the through hole 13 has a square shape, and the side wall is covered with a side wall conductive plating layer 161. On the back side of the insulating base material, a back side conductive plating layer 162 is provided.
It extends between 61 and the ground circuit through hole 150.
更に，絶縁基材10の裏面側において裏面側導通メッキ
層162の表面にはソルダーレジスト19が設けてある。ま
た，上記貫通穴13の側壁導通メッキ層161と，凹所130の
下面を形成する放熱板２の上面の一部分と，信号回路18
と，スルーホール15と，接地用スルーホール150と，放
熱板２の外側面と，接続穴25と，逃げ穴21の各表面に
は，ニッケル層を介して金メッキ層４が形成されてい
る。Further, a solder resist 19 is provided on the backside conductive plating layer 162 on the backside of the insulating base material 10. Further, the side wall conductive plating layer 161 of the through hole 13, a part of the upper surface of the heat sink 2 forming the lower surface of the recess 130, and the signal circuit 18.
The gold plated layer 4 is formed on each surface of the through hole 15, the grounding through hole 150, the outer surface of the heat sink 2, the connection hole 25, and the relief hole 21 via a nickel layer.
また，上記絶縁接着層３においては，上記貫通穴13の
開口直径より大きい径の開口部31を有する。また，スル
ーホール15よりも大きく放熱板２の逃げ穴21と同径の開
口部32を有する。更に，接続穴25及び接地用スルーホー
ル150と同径の開口部33を有する。The insulating adhesive layer 3 has an opening 31 having a diameter larger than the opening diameter of the through hole 13. Further, it has an opening 32 which is larger than the through hole 15 and has the same diameter as the clearance hole 21 of the heat sink 2. Further, it has an opening 33 having the same diameter as the connection hole 25 and the grounding through hole 150.
上記において，絶縁基材10はガラス布エポキシ樹脂基
板を，また放熱板としては厚み0.5mmの銅板を用いた。
また，絶縁接着層はプリプレグ材を用い，厚み約0.1mm
とした。また，導通メッキ層は銅により厚み25μｍに形
成した。また，スルーホール及び接地用スルーホールは
直径0.6mm,放熱板２における接続穴は直径0.6mm,逃げ穴
は直径1.6mmとした。In the above description, a glass cloth epoxy resin substrate was used as the insulating base material 10, and a copper plate having a thickness of 0.5 mm was used as the heat sink.
The insulating adhesive layer is made of prepreg material and has a thickness of about 0.1 mm.
And The conductive plating layer was formed of copper to a thickness of 25 μm. The through-hole and the grounding through-hole had a diameter of 0.6 mm, the connection hole in the heat sink 2 had a diameter of 0.6 mm, and the relief hole had a diameter of 1.6 mm.
また，上記のごとく構成した電子部品搭載用基板１に
は，第３図に示すごとく，上記スルーホール15に導体ピ
ン56の頭部561を挿入する。また，上記接地用スルーホ
ール50及び接続穴25には導体ピン57の頭部571を挿入す
る。該導体ピン57は，導体ピン56に比して頭部571が長
い。また，導体ピン56,57挿入後は，導体ピン56とスル
ーホール15,導体ピン57と接地用スルーホール150及び接
続穴25との間に半田を充填し，両者間の電気的接続を確
実にする。Further, the head 561 of the conductor pin 56 is inserted into the through hole 15 in the electronic component mounting board 1 configured as described above, as shown in FIG. The head 571 of the conductor pin 57 is inserted into the through hole 50 for grounding and the connection hole 25. The conductor pin 57 has a longer head 571 than the conductor pin 56. After the conductor pins 56 and 57 are inserted, solder is filled between the conductor pins 56 and the through holes 15 and between the conductor pins 57 and the grounding through holes 150 and the connection holes 25 to ensure the electrical connection between the two. I do.
また，電子部品搭載用凹所130内に電子部品50を搭載
する。そして電子部品50と導通メッキ層16の間，及び電
子部品50と信号回路18との間に，ボンディングワイヤー
51,52を接続する。また，スルーホール15には，上記凹
所130側から導体ピン56の頭部を挿入する。Also, the electronic component 50 is mounted in the electronic component mounting recess 130. A bonding wire is provided between the electronic component 50 and the conductive plating layer 16 and between the electronic component 50 and the signal circuit 18.
Connect 51,52. The head of the conductor pin 56 is inserted into the through hole 15 from the recess 130 side.
次に作用効果につき説明する。 Next, the operation and effect will be described.
本例の電子部品搭載用基板においては，第１図に示す
ごとく，絶縁基材10における貫通穴13の側壁と裏面側と
の間に導通メッキ層16を形成している。そのため，該導
通メッキ層16は，貫通穴13の側壁及び絶縁基材10の裏面
側において大きい面積を占めることができる。それ故，
導通メッキ層16は，低インダクタンスの回路とすること
ができる。In the electronic component mounting board of the present embodiment, as shown in FIG. 1, a conductive plating layer 16 is formed between the side wall of the through hole 13 in the insulating base material 10 and the back side. Therefore, the conductive plating layer 16 can occupy a large area on the side wall of the through hole 13 and on the back side of the insulating base material 10. Therefore,
The conductive plating layer 16 can be a low inductance circuit.
また，放熱板２に設けた接続穴25は，接地用スルーホ
ール150と略同径であり，両者には共通の導体ピン57の
頭部571が挿入され，またこれらは半田により接合され
ている。そのため，接地回路と放熱板２とが導体ピン57
によって電気的に接続されることとなる。それ故，電子
回路搭載用基板を高周波域で使用した場合でも，絶縁基
材内に静電気が蓄積されることがない。したがって，電
気的ノイズの発生がない。The connection hole 25 provided in the heat sink 2 has substantially the same diameter as the grounding through hole 150, and the head 571 of the common conductor pin 57 is inserted into both of them, and these are joined by solder. . Therefore, the grounding circuit and the heat sink 2 are connected to the conductor pins 57.
Are electrically connected by the Therefore, even when the electronic circuit board is used in a high frequency range, static electricity does not accumulate in the insulating base material. Therefore, no electric noise is generated.
また，上記貫通穴13は，その壁面が上記導通メッキ層
16により被覆されているので，電子部品搭載用凹所130
内へ絶縁基材を通じて湿気が浸入することがない。それ
故，耐湿性に優れている。The through-hole 13 has a wall surface formed by the conductive plating layer.
Since it is covered with 16, the recess 130
Moisture does not penetrate through the insulating base material. Therefore, it has excellent moisture resistance.
更に，絶縁基材10の裏面側の全面に，放熱板２が設け
てあるので，電子部品が発生する熱を効率良く，放散さ
せることができる。Further, since the heat radiating plate 2 is provided on the entire back surface of the insulating base material 10, the heat generated by the electronic components can be efficiently dissipated.
第２実施例 上記第１実施例に示した電子部品搭載用基板の製造方
法につき，第4A図〜第4E図を用いて説明する。Second Embodiment A method of manufacturing the electronic component mounting board shown in the first embodiment will be described with reference to FIGS. 4A to 4E.
まず，第4A図に示すごとく，絶縁基材10としての銅張
ガラス布エポキシ樹脂基板を準備する。該絶縁基材10の
上下面には銅箔11,11が形成されている。次に第4B図に
示すごとく，絶縁基材10に，前記凹所形成用の貫通穴13
及び多数のスルーホール15を穿設する。First, as shown in FIG. 4A, a copper-clad glass cloth epoxy resin substrate as an insulating base material 10 is prepared. Copper foils 11, 11 are formed on the upper and lower surfaces of the insulating base material 10, respectively. Next, as shown in FIG. 4B, a through hole 13 for forming the recess is formed in the insulating base material 10.
And a large number of through holes 15 are formed.
次いで，第4C図に示すごとく，上記絶縁基材10の全表
面，即ち貫通穴13,スルーホール15,絶縁基材の上下両面
に無電解メッキと電解メッキの２段メッキによりパネル
メッキを施し，銅メッキ層を形成する。Then, as shown in FIG. 4C, the entire surface of the insulating base material 10, that is, the through holes 13, the through holes 15, and the upper and lower surfaces of the insulating base material are subjected to panel plating by two-step plating of electroless plating and electrolytic plating. Form a copper plating layer.
そして，常法により，フォトレジスト，エッチング，
ソルダーレジスト印刷を行い，第4D図に示すごとく，絶
縁基材10における貫通穴13の側壁及び裏面側に接地回路
用の導通メッキ層16を形成する。また，同時に信号回路
18,電源回路，接地回路を形成し，これらはスルーホー
ルに接続する。更に，絶縁基材10の裏面側の裏面側導通
メッキ層162の表面，信号回路18の表面などにはソルダ
ーレジスト膜19を形成する。また，ここに，接地回路用
の上記導通メッキ層16を接続したスルーホールは，接地
用スルーホール150とする。Then, the photoresist, etching,
Solder resist printing is performed, and as shown in FIG. 4D, a conductive plating layer 16 for a ground circuit is formed on the side wall and the back side of the through hole 13 in the insulating base material 10. At the same time, the signal circuit
18, A power supply circuit and a grounding circuit are formed, and these are connected to through holes. Further, a solder resist film 19 is formed on the surface of the back side conductive plating layer 162 on the back side of the insulating base material 10, the surface of the signal circuit 18, and the like. Here, the through hole to which the conductive plating layer 16 for the ground circuit is connected is a through hole 150 for grounding.
一方，上記絶縁基材10とは別に，第4E図に示すごと
く，放熱板２とシート状の絶縁接着層３とを準備する。
該放熱板２は，上記絶縁基材10の接地用スルーホール15
0に対応する位置に接続穴25を有する。一方，スルーホ
ール15に対応する位置には，該スルーホール15よりも大
きい直径の逃げ穴21を有する。On the other hand, separately from the insulating base material 10, a heat sink 2 and a sheet-like insulating adhesive layer 3 are prepared as shown in FIG. 4E.
The heat radiating plate 2 is provided with a through hole 15 for grounding of the insulating base material 10.
A connection hole 25 is provided at a position corresponding to 0. On the other hand, at a position corresponding to the through hole 15, a relief hole 21 having a diameter larger than that of the through hole 15 is provided.
また，絶縁接着層３は，絶縁基材の貫通穴13と同径の
開口部31,上記放熱板２の接続穴25と同径の開口部33,及
び逃げ穴21と同径の開口部32を有する。The insulating adhesive layer 3 has an opening 31 having the same diameter as the through hole 13 of the insulating base material, an opening 33 having the same diameter as the connection hole 25 of the heat sink 2, and an opening 32 having the same diameter as the relief hole 21. Having.
その後は，上記第4D図に示した絶縁基材10の裏面側
に，上記絶縁接着層３を介して放熱板２を積層し，これ
らを加熱圧着する。更に，ニッケルメッキを施した後，
金メッキ層４を施す。これにより，上記三者を一体的に
固着してなる，電子部品搭載用基板１（第１図）が得ら
れる。Thereafter, the heat radiating plate 2 is laminated on the back surface of the insulating base material 10 shown in FIG. 4D via the insulating adhesive layer 3, and these are heat-pressed. After nickel plating,
A gold plating layer 4 is applied. As a result, the electronic component mounting board 1 (FIG. 1) in which the above three members are integrally fixed is obtained.
本例によれば，上記電子部品搭載用基板１を容易に製
造することができる。According to this embodiment, the electronic component mounting board 1 can be easily manufactured.
なお，上記実施例においては，導通メッキ層16を接地
用スルーホール150に接続し，該接地用スルーホール150
は放熱板２の接続穴25に接続しているが，他の接地用ス
ルーホール150は放熱板２の接続穴25と全て接続する必
要はない。即ち，電気的ノイズ防止のためには，少なく
とも１つの接地用スルーホールが放熱板と接続されてお
れば良い。In the above embodiment, the conductive plating layer 16 is connected to the grounding through hole 150,
Are connected to the connection holes 25 of the heat sink 2, but the other grounding through holes 150 need not all be connected to the connection holes 25 of the heat sink 2. That is, in order to prevent electrical noise, at least one grounding through-hole may be connected to the heat sink.
また，図示省略したが，接地回路も上記導通メッキ層
16と同様に絶縁基材の裏面側に形成することもできる。Although not shown, the grounding circuit is also the conductive plating layer.
Similarly to 16, it can be formed on the back side of the insulating base material.
第１図ないし第３図は第１実施例における電子部品搭載
用基板を示し，第１図はその断面図，第２図はその裏面
図，第３図は電子部品及び導体ピンを装着した断面図，
第4A図〜第4E図は第２実施例における製造工程図，第５
図は従来の電子部品搭載用基板の断面図である。 １……電子部品搭載用基板， 10……絶縁基材， 13……貫通穴， 130……電子部品搭載用凹所， 15……スルーホール， 150……接地用スルーホール， 16……導通メッキ層， ２……放熱板， 21……逃げ穴， 25……接続穴， ３……絶縁接着層， ４……金メッキ層，1 to 3 show an electronic component mounting board according to the first embodiment. FIG. 1 is a cross-sectional view, FIG. 2 is a rear view thereof, and FIG. Figure,
FIGS. 4A to 4E are manufacturing process diagrams of the second embodiment, and FIGS.
The figure is a sectional view of a conventional electronic component mounting substrate. 1 ... board for mounting electronic parts, 10 ... insulating base material, 13 ... through hole, 130 ... recess for mounting electronic parts, 15 ... through hole, 150 ... through hole for grounding, 16 ... conduction Plating layer, 2 ... heat sink, 21 ... escape hole, 25 ... connection hole, 3 ... insulating adhesive layer, 4 ... gold plating layer,
Claims (1)
穴と導体回路と多数のスルーホールとを有する絶縁基材
と，該絶縁基材の裏面側の全面に絶縁接着層を介して接
合した放熱板とよりなり， 上記絶縁基材には上記貫通穴の側壁から該絶縁基材の裏
面側にかけて形成した電源回路又は接地回路用の導通メ
ッキ層を設け，また上記絶縁基材の貫通穴と放熱板の上
面とにより電子部品搭載用凹所を形成し， また上記放熱板には上記スルーホールに対応する位置に
開口穴を設け， かつ，これらの開口穴のうち，接地回路に接続した接地
用スルーホールに対向する開口穴は，少なくともその１
つが該接地用スルーホールと略同径の接続穴を形成して
おり， またそれ以外の開口穴はスルーホールよりも大きい直径
の逃げ穴を形成していることを特徴とする電子部品搭載
用基板。1. An insulating base material having a through hole for forming an electronic component mounting recess, a conductor circuit, and a large number of through holes, and an insulating adhesive layer formed on the entire back surface of the insulating base material via an insulating adhesive layer. A conductive plating layer for a power supply circuit or a ground circuit formed from the side wall of the through hole to the back surface side of the insulating base; A recess for mounting electronic components is formed by the hole and the upper surface of the heat sink, and an opening is provided in the heat sink at a position corresponding to the through-hole, and the opening is connected to a ground circuit. At least one of the openings facing the grounded through hole
A connection hole having a diameter substantially the same as that of the through hole for grounding, and a hole having a diameter larger than that of the other through hole is formed as a clearance hole. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2191001A JP2753766B2 (en) | 1990-07-19 | 1990-07-19 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2191001A JP2753766B2 (en) | 1990-07-19 | 1990-07-19 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476980A JPH0476980A (en) | 1992-03-11 |
| JP2753766B2 true JP2753766B2 (en) | 1998-05-20 |
Family
ID=16267217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2191001A Expired - Fee Related JP2753766B2 (en) | 1990-07-19 | 1990-07-19 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2753766B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0576072U (en) * | 1992-03-18 | 1993-10-15 | 株式会社三協精機製作所 | Board ground connection structure |
| JP4799359B2 (en) * | 2006-10-13 | 2011-10-26 | 株式会社東芝 | High frequency circuit board and method for manufacturing high frequency circuit board |
| JP4922729B2 (en) * | 2006-10-20 | 2012-04-25 | 三洋電機株式会社 | Compressor and manufacturing method thereof |
| JP4863854B2 (en) * | 2006-12-01 | 2012-01-25 | 三洋電機株式会社 | Compressor and manufacturing method thereof |
-
1990
- 1990-07-19 JP JP2191001A patent/JP2753766B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0476980A (en) | 1992-03-11 |
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