JP2804827B2 - Substrate for mounting electronic components - Google Patents

Substrate for mounting electronic components

Info

Publication number
JP2804827B2
JP2804827B2 JP2163777A JP16377790A JP2804827B2 JP 2804827 B2 JP2804827 B2 JP 2804827B2 JP 2163777 A JP2163777 A JP 2163777A JP 16377790 A JP16377790 A JP 16377790A JP 2804827 B2 JP2804827 B2 JP 2804827B2
Authority
JP
Japan
Prior art keywords
terminal
power supply
circuit
ground
insulating base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2163777A
Other languages
Japanese (ja)
Other versions
JPH0456142A (en
Inventor
一 矢津
照雄 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP2163777A priority Critical patent/JP2804827B2/en
Publication of JPH0456142A publication Critical patent/JPH0456142A/en
Application granted granted Critical
Publication of JP2804827B2 publication Critical patent/JP2804827B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は，電子部品搭載用基板，特にその電源回路，
接地回路及びこれらの電源用端子，接地用端子の配設構
造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a substrate for mounting electronic components, particularly a power supply circuit thereof,
The present invention relates to a grounding circuit and an arrangement structure of these power supply terminals and grounding terminals.

〔従来技術〕(Prior art)

第９図に示すごとく，電子部品搭載用基板９は，絶縁
基材90に半導体素子などの電子部品８を搭載するための
凹所98を有すると共に，その表面或いは内部に多数の信
号パターン91を設けている。なお，同図において92はス
ルーホール,96は導体ピンである。As shown in FIG. 9, the electronic component mounting board 9 has a recess 98 for mounting the electronic component 8 such as a semiconductor element on the insulating base material 90, and has a large number of signal patterns 91 on its surface or inside. Provided. In the figure, 92 is a through hole, and 96 is a conductor pin.

また，第９図，第11図に示すごとく，上記電子部品８
と上記信号パターン91の信号用端子910との間には，ボ
ンディングワイヤー81が接続してある。また，電子部品
８と電源用端子850又は接地用端子860との間にも，ボン
ディングワイヤー81が接続してある。Further, as shown in FIGS.
A bonding wire 81 is connected between the terminal and the signal terminal 910 of the signal pattern 91. A bonding wire 81 is also connected between the electronic component 8 and the power terminal 850 or the ground terminal 860.

そして，上記ボンディングワイヤー81の接続は，第９
図に示すごとく，電子部品８に設けられた多数の各接続
端子88と，上記多数の各信号用端子910,電源用端子850,
接地用端子860との間で行われている。そのため，電子
部品搭載用の凹所98の開口周縁には多数の信号用端子，
電源用端子，接地用端子が配列されている。And, the connection of the bonding wire 81
As shown in the figure, a large number of connection terminals 88 provided on the electronic component 8 and a large number of the respective signal terminals 910, power supply terminals 850,
The connection is made between the terminal 860 for grounding. Therefore, a large number of signal terminals are provided around the opening of the recess 98 for mounting electronic components.
Power supply terminals and ground terminals are arranged.

そして，上記開口周縁のこれら各端子は，第10図に示
すごとく，数十〜数百μｍの間隙を置いて密集してい
る。また，各端子において，信号用端子910は外方へ延
在する信号パターン91に配設されている。また，電源用
端子850は電源回路85に，接地用端子860は接地回路86に
それぞれ配設されている。As shown in FIG. 10, these terminals on the periphery of the opening are densely spaced with a gap of several tens to several hundreds μm. In each terminal, the signal terminal 910 is provided on the signal pattern 91 extending outward. The power terminal 850 is provided in the power circuit 85 and the ground terminal 860 is provided in the ground circuit 86.

また，上記電源回路85は，第９図〜第12図に示すごと
く，バイアホール855を経て，絶縁基材90内に設けた内
部電源回路856に連通している。この電源回路856は，前
記導体ピン96を通じて電源に接続されている。一方，上
記接地回路86も，電源回路85と同様に，第10図に，第11
図示すごとくバイアホール865を経て，絶縁基材90内に
設けた内部接地回路（図示略）に連通し，アースに接続
されている。The power supply circuit 85 communicates with the internal power supply circuit 856 provided in the insulating base material 90 via the via hole 855, as shown in FIGS. The power supply circuit 856 is connected to a power supply through the conductor pins 96. On the other hand, similarly to the power supply circuit 85,
As shown in the figure, through a via hole 865, it communicates with an internal ground circuit (not shown) provided in the insulating base material 90 and is connected to the ground.

〔解決しようとする課題〕[Problem to be solved]

ところで，近年，接地用端子の高機能化に伴って，演
算処理速度の高速化が必要となり，特に電子部品への信
号入出力に使用されるディジタル信号（ON−OFF）のク
ロック周波数も，数十MHzから数百MHzへと高周波域に拡
大している。By the way, in recent years, as the functions of the grounding terminals have become more sophisticated, it has become necessary to increase the processing speed. In particular, the clock frequency of digital signals (ON-OFF) used for inputting / outputting signals to / from electronic components has also increased. It has expanded to a high frequency range from ten MHz to several hundred MHz.

しかし，高周波域においてディジタル信号のパルス波
を効率良く出力させるためには，回路の電気特性として
は，キャパシタンス（誘電率）とインダクタンス（磁気
誘導係数）とを小さくする必要がある。この中，キャパ
シタンスは，絶縁基材の材料特性で定められるが，イン
ダクタンスは配線設計に起因することが多い。However, in order to efficiently output a pulse wave of a digital signal in a high frequency range, it is necessary to reduce capacitance (permittivity) and inductance (magnetic induction coefficient) as electrical characteristics of the circuit. Among these, the capacitance is determined by the material characteristics of the insulating base material, but the inductance often results from the wiring design.

特に，電源回路，接地回路は，低インダクタンス回路
が必要であり，その回路パターンは出来るだけ太くする
ことが望まれる。In particular, the power supply circuit and the ground circuit require a low inductance circuit, and it is desired that the circuit pattern be as thick as possible.

そのため，従来の電子部品搭載用基板９においては，
絶縁基材90内における前記内部電源回路856,内部接地回
路を幅広く形成しておき，絶縁基材90の表面の電源用端
子850,接地用端子860は信号用端子910の間に幅狭く設け
ていた。そして，内部電源回路856と電源用端子850間は
上記バイアホール855で，また内部接地回路と接地用端
子860間は上記バイアホール865で連通させている。Therefore, in the conventional electronic component mounting board 9,
The internal power supply circuit 856 and the internal grounding circuit in the insulating base material 90 are formed widely, and the power supply terminal 850 and the grounding terminal 860 on the surface of the insulating base material 90 are narrowly provided between the signal terminals 910. Was. The via hole 855 connects the internal power supply circuit 856 and the power supply terminal 850, and the via hole 865 connects the internal ground circuit and the grounding terminal 860.

しかしながら，近年は，上記のごとく，電子部品の高
機能化により，信号用端子910,電源用端子850,接地用端
子860の数が著しく増大している。そのため，これらを
電子部品搭載用の凹所98の周囲に配線するに当たり，そ
の設計自由度が著しく制限されてきている。However, in recent years, as described above, the number of the signal terminals 910, the power supply terminals 850, and the ground terminals 860 has been remarkably increased due to the enhancement of the functions of the electronic components. Therefore, when these are wired around the recess 98 for mounting electronic components, the degree of freedom in design is significantly restricted.

また，そのため，上記バイアホール855,865を穿設す
る場所が，極めて少なくなり，その解決対策が強く望ま
れている。即ち，上記開口周縁に高密度配線をすること
ができる方策が切望されている。Therefore, the number of places where the via holes 855 and 865 are to be formed is extremely small, and a solution for the problem is strongly desired. In other words, there is a long-felt need for a measure capable of providing high-density wiring on the periphery of the opening.

また，電子部品の高機能化に伴い，電源回路は例えば
入力回路及び出力回路に，それぞれ＋５ボルト，＋１ボ
ルトの４回路を必要とするなど，電子部品搭載用基板に
は多種類の電源回路が要求されている。In addition, as electronic components become more sophisticated, various types of power supply circuits are required for electronic component mounting boards, for example, the input circuit and the output circuit require four circuits of +5 volts and +1 volt, respectively. Has been requested.

本発明はかかる従来の問題点に鑑み，電子部品の高機
能化に対応でき，電子部品搭載用凹所の開口周縁に高密
度配線ができ，かつ複数の電源回路及び接地回路を有す
る電子部品搭載用基板を提供しようとするものである。The present invention has been made in view of the above-mentioned conventional problems, and is capable of responding to the enhancement of the function of electronic components, enabling high-density wiring around the opening of the electronic component mounting recess, and having a plurality of power supply circuits and ground circuits. The purpose is to provide a substrate for use.

〔課題の解決手段〕[Solutions to solve the problem]

本発明は，多数の信号パターンを設けた絶縁基材に電
子部品搭載用の凹所を形成してなる電子部品搭載用基板
において，上記凹所の側壁には導体層が形成されている
と共に該導体層は複数領域の端子部に電気的に分割され
ており，また絶縁基材の裏面には複数領域に分割形成さ
れた電源回路及び接地回路を設けてあり，これら電源回
路及び接地回路は上記いずれかの端子部に接続されてお
り，また上記端子部は電源用端子又は接地用端子を配設
してなることを特徴とする電子部品搭載用基板にある。The present invention is directed to an electronic component mounting substrate in which an electronic component mounting recess is formed in an insulating base material provided with a large number of signal patterns, wherein a conductive layer is formed on sidewalls of the recess and the conductive layer is formed. The conductor layer is electrically divided into terminals in a plurality of regions, and a power supply circuit and a ground circuit divided into a plurality of regions are provided on the back surface of the insulating base material. The electronic component mounting board is connected to one of the terminal portions, and the terminal portion is provided with a power supply terminal or a ground terminal.

本発明において最も注目すべきことは，上記凹所の側
壁に導体層を設け，該導体層は複数領域の端子部に分割
し，該端子部には電源用端子又は接地用端子のいずれか
を配設したこと，また絶縁基材の裏面には複数領域に分
割性形成され，かつ上記いずれかの端子部に接続した電
源回路及び接地回路を設けたことにある。The most remarkable point in the present invention is that a conductor layer is provided on the side wall of the recess, and the conductor layer is divided into a plurality of terminal portions, and one of a power supply terminal and a ground terminal is provided on the terminal portion. In addition, the power supply circuit and the grounding circuit are formed on the back surface of the insulating base and are divided into a plurality of regions and connected to any one of the terminal portions.

即ち，上記複数の端子部には電源用端子又は接地用端
子のいずれか一方を設ける。例えば，導体層を４つの複
数領域に分割して４つの端子部を形成した場合には，そ
の中の３つの端子部には＋５ボルト，＋３ボルト，＋１
ボルトの各電源用端子を設け,1つの端子部には接地用端
子を設ける。また，これらの電源用端子及び接地用端子
を設けた各端子部は，絶縁基材の裏面側に分割形成した
電源回路及び接地回路と接続している。That is, one of a power supply terminal and a ground terminal is provided in the plurality of terminal portions. For example, when the conductor layer is divided into four regions to form four terminal portions, three terminal portions among them have +5 volts, +3 volts, and +1
A power terminal for each bolt is provided, and one terminal is provided with a ground terminal. Further, each terminal portion provided with the power supply terminal and the ground terminal is connected to a power supply circuit and a ground circuit which are separately formed on the back surface side of the insulating base material.

また，これら導体層，電源用端子，接地用端子は，上
記凹所及びその開口周縁に金属メッキを施すことにより
一体的に設ける。そして，上記各端子部は，例えば上記
導体層の間に切欠溝を形成し，各端子部間の電気的導通
を遮断することにより形成する。The conductor layer, the power supply terminal, and the ground terminal are integrally provided by applying metal plating to the recess and the periphery of the opening. Each of the terminal portions is formed, for example, by forming a notch groove between the conductor layers and cutting off electrical conduction between the terminal portions.

また，電源回路及び接地回路は，例えば第４図に示す
ごとく，絶縁基材の裏面側の全面を複数領域に分割した
金属メッキ層により形成する。そして，各領域を電源回
路又は接地回路として用いる。上記複数領域の形成は，
上記金属メッキ層の形成に際して，境界部分にレジスト
膜を施しておき，この部分には金属メッキ層を設けない
ことにより形成する。或いは，全面に金属メッキを施し
た後，境界部分に切欠溝を刻設して各領域間の電気的導
通を遮断する。The power supply circuit and the grounding circuit are formed by a metal plating layer in which the entire surface on the back side of the insulating base material is divided into a plurality of regions as shown in FIG. 4, for example. Each region is used as a power supply circuit or a ground circuit. The formation of the plurality of regions is as follows.
In forming the metal plating layer, a resist film is applied to a boundary portion, and the metal plating layer is formed without providing a metal plating layer in this portion. Alternatively, after metal plating is performed on the entire surface, a cutout groove is cut in a boundary portion to cut off electrical conduction between the respective regions.

また，上記電源用端子又は接地用端子は，上記端子部
の一部分が，凹所の開口周縁へ少し伸びた形状を有す
る。また，絶縁基材上には信号パターンが形成されてお
り，該信号パターンの信号用端子と上記電源用端子又は
接地用端子は，凹所開口周縁において，いわば相互乗り
入れした状態に配置することが好ましい（第１図参
照）。In addition, the power supply terminal or the ground terminal has a shape in which a part of the terminal portion slightly extends to the periphery of the opening of the recess. Further, a signal pattern is formed on the insulating base material, and the signal terminal of the signal pattern and the power supply terminal or the grounding terminal may be arranged so as to be mutually intruded at the periphery of the opening of the recess. Preferred (see FIG. 1).

また，本発明においては，多数の信号パターンを設け
た絶縁基材を複数段に積層し，その中の少なくとも１段
の絶縁基材は，上記複数領域の端子部と，複数領域に分
割された電源回路及び接地回路と，上記電源用端子及び
接地用端子とを有する構成とすることもできる（第５図
〜第７図参照）。Further, in the present invention, an insulating base material provided with a large number of signal patterns is laminated in a plurality of stages, and at least one of the insulating base materials is divided into the plurality of terminal portions and the plurality of regions. A configuration having a power supply circuit and a grounding circuit, and the power supply terminal and the grounding terminal may be employed (see FIGS. 5 to 7).

〔作用及び効果〕[Action and effect]

本発明において，電源用端子又は接地用端子は，上記
凹所内に搭載した電子部品の接続端子にボンディングワ
イヤーにより接続する。そして，該電源用端子又は接地
用端子は，凹所側壁の端子部を通じて，絶縁基材裏面の
電源回路又は接地回路と接続される。また，絶縁基材上
の信号用端子についても電子部品の接続端子とボンディ
ングワイヤーにより接続する。該信号用端子は，信号パ
ターンに導通している。In the present invention, the power supply terminal or the ground terminal is connected to a connection terminal of the electronic component mounted in the recess by a bonding wire. Then, the power supply terminal or the ground terminal is connected to a power circuit or a ground circuit on the back surface of the insulating base material through the terminal portion on the side wall of the recess. Also, the signal terminals on the insulating base are connected to the connection terminals of the electronic component by bonding wires. The signal terminal is electrically connected to the signal pattern.

そして，上記端子部は凹所の側壁に設けられ，更に電
源回路及び接地回路は絶縁基材の裏面側に設けられてい
るので，各端子部，電源回路，接地回路の面積を大きく
することができる。そのため，電源回路又は接地回路を
低インダクタンス回路とすることができる。Since the terminals are provided on the side wall of the recess and the power supply circuit and the grounding circuit are provided on the back side of the insulating base material, the area of each terminal, the power supply circuit and the grounding circuit can be increased. it can. Therefore, the power supply circuit or the ground circuit can be a low inductance circuit.

また，電源用端子，接地用端子の配設に当たっては，
従来のごとく，バイアホールを穿設しない。そのため，
上記凹所の開口周縁にバイアホールを設ける必要はな
い。それ故，該開口周縁のスペースに余裕が生じ，従来
に比してより多くの信号用端子，電源用端子，接地用端
子を配置することができる。それ故，高密度配線が可能
となる。即ち，バイアホールは直径約0.3mm必要である
のに対し，各回路の線幅，端子幅は0.1mm以下である。
それ故，電源用端子，接地用端子に関するバイアホール
の省略は大きなスペースを生むことになる。また，凹所
側壁の導体層は複数領域の端子部に，絶縁基材裏面には
複数領域の電源回路及び接地回路を設けてあるので，複
数の電源回路，接地回路を有する電子部品搭載用基板を
得ることができる。When arranging the power supply terminal and the grounding terminal,
No via hole is formed as in the past. for that reason,
It is not necessary to provide a via hole around the opening of the recess. Therefore, there is a margin in the space around the opening, and more signal terminals, power supply terminals, and ground terminals can be arranged as compared with the related art. Therefore, high-density wiring becomes possible. That is, the via hole requires a diameter of about 0.3 mm, while the line width and terminal width of each circuit are 0.1 mm or less.
Therefore, omitting the via holes for the power supply terminal and the ground terminal creates a large space. Also, since the conductor layer on the side wall of the recess is provided with terminals in a plurality of regions and the power circuit and the ground circuit in a plurality of regions are provided on the back surface of the insulating base material, an electronic component mounting board having a plurality of power circuits and a ground circuit is provided. Can be obtained.

したがって，本発明によれば，電子部品の高機能化に
対応でき，電子部品搭載用凹所の開口周縁に高密度配線
ができ，かつ複数の電源回路及び接地回路を有する電子
部品搭載用基板を提供することができる。Therefore, according to the present invention, an electronic component mounting board having a plurality of power supply circuits and a plurality of grounding circuits, which is capable of responding to the enhancement of the functions of electronic components, enabling high-density wiring at the periphery of the opening of the electronic component mounting recess. Can be provided.

〔実施例〕〔Example〕

第１実施例 本発明の実施例にかかる電子部品搭載用基板につき，
第１図〜第４図を用いて説明する。First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described.
This will be described with reference to FIGS.

本例の電子部品搭載用基板は，多数の信号パターン４
を設けた絶縁基材６に電子部品搭載用の凹所68を形成
し，該凹所68の側壁には導体層１を設けてなる。The electronic component mounting board of this example has a large number of signal patterns 4.
A recess 68 for mounting electronic components is formed in the insulating base material 6 provided with the conductive layer 1 on the side wall of the recess 68.

上記導体層１は，第３図，第４図に示すごとく，複数
領域の４つの端子部101,102,103,104に電気的に分割さ
れている。また絶縁基材６の裏面には複数領域に分割形
成された電源回路141,143,144及び接地回路142を設けて
あり，これらは上記端子部101,103,104又は端子部102に
接続されている。As shown in FIGS. 3 and 4, the conductor layer 1 is electrically divided into four terminal portions 101, 102, 103, and 104 in a plurality of regions. A power supply circuit 141, 143, 144 and a ground circuit 142 divided into a plurality of regions are provided on the back surface of the insulating base material 6, and these are connected to the terminal portions 101, 103, 104 or 102.

また，上記端子部101,103,104には，電源用端子30
が，端子部102には接地用端子35が設けてある（第１
図）。In addition, the terminals 101, 103, and 104 are provided with power supply terminals 30.
However, the terminal section 102 is provided with a grounding terminal 35 (first
Figure).

そして，第１図〜第３図に示すごとく，上記凹所68の
開口周縁には，上記信号パターン４に配設した信号用端
子40を並列して配置し，かつ該信号用端子40の間にはこ
れと並列して上記電源用端子30又は接地用端子35を配置
している。また，上記絶縁基材６の下方にはプリプレグ
絶縁層66を介して放熱板18を接合している。また，該プ
リプレグ絶縁層66及び放熱板18は，絶縁基材６に設けた
スルーホール601に連通する穴661,181を有する。As shown in FIGS. 1 to 3, signal terminals 40 arranged on the signal pattern 4 are arranged in parallel around the opening of the recess 68. The power supply terminal 30 or the ground terminal 35 is disposed in parallel with the power supply terminal. A radiator plate 18 is bonded below the insulating base 6 via a prepreg insulating layer 66. Further, the prepreg insulating layer 66 and the heat sink 18 have holes 661 and 181 communicating with the through holes 601 provided in the insulating base material 6.

なお，上記導体層1,凹所底面メッキ層107電源用端子3
0,接地用端子35,電源回路，接地回路及びスルーホール
におけるメッキ層は，銅メッキにより同時形成してあ
る。In addition, the above conductor layer 1, recess bottom plating layer 107 power supply terminal 3
The plating layers of the grounding terminal 35, the power supply circuit, the grounding circuit, and the through hole are simultaneously formed by copper plating.

また，第１図，第３図，第４図に示すごとく，上記導
体層１は，切欠部15によって互いに電気的に絶縁され，
前記のごとく４つの端子部101〜104に分割されている。
また，絶縁基材裏面の電源回路141,143,144及び接地回
路142も，切欠部151によって互いに電気的に絶縁されて
いる。そして，上記端子部及び電源回路，接地回路は，
絶縁基材６の凹所の側壁及び裏面の全面に銅メッキを行
い，その後，上記切欠き15,151を刻設することにより形
成する。As shown in FIGS. 1, 3, and 4, the conductor layers 1 are electrically insulated from each other by the cutouts 15.
As described above, it is divided into four terminal portions 101 to 104.
Further, the power supply circuits 141, 143, 144 and the ground circuit 142 on the back surface of the insulating base are also electrically insulated from each other by the notch 151. And the above terminal part, power supply circuit and grounding circuit
The entire surface of the side wall and the back surface of the concave portion of the insulating base material 6 is plated with copper, and thereafter, the cutouts 15 and 151 are formed by engraving.

また，第２図，第４図に示すごとく，電源回路141は
電源用スルーホール601に連結されている。また，接地
回路142は，接地用スルーホール602に連結されている。
また，図示していないが，他の電源回路143,144も同様
に他の電源用スルーホールにそれぞれ連結されている。
なお，他の多くのスルーホール606は，電源回路141,接
地回路142との間に環状の非メッキ部607が介設してある
ので両者が連結されず，信号パターンのスルーホールと
して用いられる。In addition, as shown in FIGS. 2 and 4, the power supply circuit 141 is connected to the power supply through hole 601. The ground circuit 142 is connected to the ground through hole 602.
Although not shown, other power supply circuits 143 and 144 are similarly connected to other power supply through holes.
Many other through-holes 606 are used as signal pattern through-holes because the ring-shaped non-plated portion 607 is interposed between the power supply circuit 141 and the ground circuit 142 so that both are not connected.

また，凹所68の開口周縁には，第１図，第３図に示す
ごとく，該凹所68に向けて，信号パターン４の信号用端
子40が多数，配列配置されている。一方，多数の該信号
用端子40の間には，端子部101側から伸びた電源用端子3
0又は端子部102側から伸びた接地用端子35が，信号用端
子40と並列して配置されている。On the periphery of the opening of the recess 68, a large number of signal terminals 40 of the signal pattern 4 are arranged toward the recess 68 as shown in FIGS. On the other hand, between the signal terminals 40, there are power supply terminals 3 extending from the terminal portion 101 side.
A grounding terminal 35 extending from 0 or the terminal portion 102 side is arranged in parallel with the signal terminal 40.

次に，上記のごとく構成した電子部品搭載用基板に
は，第１図，第２図に示すごとく，その凹所68内に電子
部品８を搭載する。そして，該電子部品８の接続端子88
と，上記電源用端子30,信号用端子40,接地用端子35との
間に，ボンディングワイヤー５を接続する。Next, as shown in FIGS. 1 and 2, the electronic component 8 is mounted in the recess 68 of the electronic component mounting board configured as described above. The connection terminal 88 of the electronic component 8
The bonding wire 5 is connected between the power supply terminal 30, the signal terminal 40, and the ground terminal 35.

次に，作用効果につき説明する。 Next, the function and effect will be described.

本例の電子部品搭載用基板においては，電源用端子30
及び接地用端子35を有する端子部101〜104が，凹所68の
側壁に設けてある。また，電源回路141,143,144及び接
地回路142が，絶縁基材６の裏面に設けてあるので。そ
のため，電源回路及び接地回路の面積を大きく取ること
ができる。In the electronic component mounting board of this example, the power supply terminals 30
Terminal portions 101 to 104 having a ground terminal 35 are provided on the side wall of the recess 68. Also, the power supply circuits 141, 143, 144 and the ground circuit 142 are provided on the back surface of the insulating base 6. Therefore, the areas of the power supply circuit and the ground circuit can be increased.

それ故，該電源回路を低インダクタンス回路とするこ
とができ，電子部品の高機能化に対応できる。また，本
例では，電源回路を３個設けているので,3種類の電圧の
電源を利用することができ，高機能化に対応することが
できる。Therefore, the power supply circuit can be a low-inductance circuit, and it is possible to cope with higher functions of electronic components. Further, in this example, since three power supply circuits are provided, power supplies of three kinds of voltages can be used, and it is possible to cope with higher functionality.

また，電源用端子30,接地用端子35の配設に当たって
は，従来のごとくバイアホールを設けていない。それ
故，開口周縁のスペースに余裕が生じ，より多くの信号
用端子4,電源用端子30,接地用端子35を配置でき，高密
度配線が可能となる。In arranging the power supply terminal 30 and the grounding terminal 35, no via hole is provided as in the related art. Therefore, there is room in the space around the opening, and more signal terminals 4, power supply terminals 30, and grounding terminals 35 can be arranged, and high-density wiring is possible.

また，信号用端子４と電源用端子30,接地用端子35
は，配列配置してあるので，これら各端子と電子部品８
の接続端子88との間におけるボンディングワイヤー５の
接続が容易である。Also, the signal terminal 4 and the power supply terminal 30 and the grounding terminal 35
Are arranged in an array.
The connection of the bonding wire 5 to the connection terminal 88 is easy.

なお，上記電源用端子30と接地用端子35とはその位置
を逆にすることもできる。即ち，電源用端子30を接地用
端子，接地用端子35を電源用端子として使用することも
できる。The positions of the power supply terminal 30 and the grounding terminal 35 can be reversed. That is, the power supply terminal 30 can be used as a ground terminal and the ground terminal 35 can be used as a power supply terminal.

第２実施例 本例は，信号パターンを形成した絶縁基材を２段に積
層した電子部品搭載用基板に関するもので，これを第５
図〜第７図を用いて説明する。Second Embodiment The present embodiment relates to an electronic component mounting board in which insulating bases on which signal patterns are formed are laminated in two stages.
This will be described with reference to FIGS.

本例の電子部品搭載用基板は，第６図に示すごとく，
それぞれ多数の信号パターン４を設けた第１絶縁基材60
と第２絶縁基材62とを積層すると共に，電子部品搭載用
の凹所68を設けてなる積層型の電子部品搭載用基板であ
る。The electronic component mounting board of this example is, as shown in FIG.
First insulating substrate 60 provided with a plurality of signal patterns 4 respectively
And a second insulating base 62, and a laminated electronic component mounting substrate provided with a recess 68 for mounting electronic components.

上記第１絶縁基材60においては，複数領域に分割され
ていない電源用の導体層１を形成してある。一方，第２
絶縁基材62には，第１実施例に示したと同様に,4個の端
子部及び３領域の電源回路と１領域の接地回路が形成し
てある。以下，これを詳述する。In the first insulating base material 60, the power supply conductor layer 1 that is not divided into a plurality of regions is formed. On the other hand, the second
Similarly to the first embodiment, four terminal portions, a power supply circuit in three regions, and a ground circuit in one region are formed on the insulating base 62. Hereinafter, this will be described in detail.

上記凹所86の側壁には，第５図〜第７図に示すごと
く，内部の電源回路12によって外部へ導通させた導体層
１を設け，該導体層１には電源用端子30を配設してな
る。一方，上記凹所68の開口周縁の四辺には，上記信号
パターン４に配設した多数の信号用端子40を並列して配
置している。また該信号用端子40の間にはこれと並列し
て上記電源用端子30を配置している。また，凹所68の底
面には，上記導体層１に連続した底面導体層11が形成さ
れている。As shown in FIGS. 5 to 7, on the side wall of the recess 86, there is provided a conductor layer 1 which is conducted to the outside by an internal power supply circuit 12, and a power supply terminal 30 is provided on the conductor layer 1. Do it. On the other hand, on the four sides of the periphery of the opening of the recess 68, a number of signal terminals 40 arranged in the signal pattern 4 are arranged in parallel. The power supply terminals 30 are arranged between the signal terminals 40 in parallel with the signal terminals. On the bottom surface of the recess 68, a bottom conductor layer 11 continuous with the conductor layer 1 is formed.

更に，上記第２絶縁基材62には，第１絶縁基材60上の
上記電源用端子30,信号用端子40よりも外周に開口する
開口部69（第６図，第７図）を設ける。該開口部69は，
電子部品搭載用凹所の一部を構成している。また，該開
口部69における凹所側壁としての第２側壁には，第２導
体層２を設ける。Further, the second insulating base 62 is provided with an opening 69 (FIGS. 6 and 7) which opens on the outer periphery of the power supply terminal 30 and the signal terminal 40 on the first insulating base 60. . The opening 69 is
It constitutes a part of the recess for mounting electronic components. A second conductor layer 2 is provided on a second side wall serving as a concave side wall in the opening 69.

また，該第２導体層２は，前記第１実施例と同様に，
切欠溝15によって４つの領域に分割した端子部201,202,
203および204（図示略）を形成する。この中，端子部20
1は第２絶縁基材62の裏面に形成した接地回路221に接続
され，その他の端子202〜204は電源回路222〜224に接続
されている（第６図，第７図）。Further, the second conductor layer 2 is formed similarly to the first embodiment.
The terminal portions 201, 202, which are divided into four regions by the cutout grooves 15,
203 and 204 (not shown) are formed. Among them, the terminal section 20
1 is connected to a ground circuit 221 formed on the back surface of the second insulating base 62, and the other terminals 202 to 204 are connected to power circuits 222 to 224 (FIGS. 6 and 7).

一方，開口部69の開口周縁には信号パターン４に配設
した多数の信号用端子40を並列配置する。また，該信号
用端子40の間にはこれと並列して，上記各端子部201〜2
04に配設した接地用端子35,電源用端子37,38及び39（図
示略）を配置する。On the other hand, a large number of signal terminals 40 arranged in the signal pattern 4 are arranged in parallel at the periphery of the opening 69. Also, between the signal terminals 40, in parallel with this, each of the terminal portions 201 to 2
The grounding terminal 35 and the power supply terminals 37, 38 and 39 (not shown) disposed at 04 are arranged.

また，第２絶縁基材62の裏面と，絶縁基材60上面の信
号パターン４との間には，プリプレグ絶縁基材66が介設
されている。Further, a prepreg insulating base material 66 is interposed between the back surface of the second insulating base material 62 and the signal pattern 4 on the upper surface of the insulating base material 60.

次に，上記積層型の電子部品搭載用基板においては，
第５図，第６図に示すごとく，その凹所68内に，電子部
品８を搭載する。そして，該電子部品８の接続端子88
と，凹所68の開口周縁上の電源用端子30,信号用端子40
との間にボンディングワイヤー51を接続する。また，接
続端子88と，開口部69の開口周縁上の接地用端子35,電
源用端子37,38,信号用端子40との間にもボンディングワ
イヤー52を接続する。その他は，第１実施例と同様であ
る。Next, in the above-mentioned multilayer electronic component mounting substrate,
As shown in FIGS. 5 and 6, the electronic component 8 is mounted in the recess 68. The connection terminal 88 of the electronic component 8
And the power supply terminal 30 and the signal terminal 40 on the periphery of the opening of the recess 68.
And a bonding wire 51 is connected between them. The bonding wire 52 is also connected between the connection terminal 88 and the ground terminal 35, the power supply terminals 37 and 38, and the signal terminal 40 on the periphery of the opening 69. Others are the same as the first embodiment.

本例によれば，第１実施例と同様の効果を得ることが
できる。According to this embodiment, the same effect as that of the first embodiment can be obtained.

また，本例の積層型の電子部品搭載用基板において
は，凹所68の開口周縁，開口部69の開口周縁に，それぞ
れ電源用端子30と信号用端子40,或いは接地用端子35と
信号用端子40を並列配置しているので,1実施例に比し
て，更に高密度の配線を行うことができる。In the laminated electronic component mounting board of this example, the power supply terminal 30 and the signal terminal 40, or the ground terminal 35 and the signal terminal are provided around the opening edge of the recess 68 and the opening edge of the opening 69, respectively. Since the terminals 40 are arranged in parallel, higher-density wiring can be performed as compared with the first embodiment.

また，下側の絶縁基材60に電源回路を，上側の絶縁基
材62に３つの電源回路と１つの接地回路とを設けてい
る。それ故,4種の電源を利用することができる。なお，
電源用端子30と接地用端子35とは，その用途（電源用，
接地用）を逆にして用いることもできる。A power supply circuit is provided on the lower insulating base material 60, and three power supply circuits and one ground circuit are provided on the upper insulating base material 62. Therefore, four kinds of power sources can be used. In addition,
The power supply terminal 30 and the grounding terminal 35 are used for their purposes (for power supply,
(For grounding) can be reversed.

第３実施例 本例は，第２実施例において，凹所68の下部に金属製
の放熱板18を設けたものである。Third Embodiment This embodiment is different from the second embodiment in that a metal radiator plate 18 is provided below the recess 68.

そして，該放熱板18の上面には，底面導体層11を設け
る。また，放熱板18の下面及び絶縁基材60の下面には，
金属メッキ層181を設ける。該金属メッキ層181は，電源
回路として用いる。そのため，電源用端子30は導体層1,
放熱板18,金属メッキ層181を通じて外部電源に接続され
ている。その他は，第２実施例と同様である。Then, the bottom conductor layer 11 is provided on the upper surface of the heat sink 18. In addition, on the lower surface of the heat sink 18 and the lower surface of the insulating base 60,
A metal plating layer 181 is provided. The metal plating layer 181 is used as a power supply circuit. Therefore, the power supply terminal 30 is
It is connected to an external power supply through the heat sink 18 and the metal plating layer 181. Others are the same as the second embodiment.

本例によれば，第２実施例と同様の効果を得ることが
できる。According to this embodiment, the same effects as in the second embodiment can be obtained.

また，放熱板18を設けたので，電子部品８の放熱の促
進させることができる。Further, since the heat radiating plate 18 is provided, heat radiation of the electronic component 8 can be promoted.

【図面の簡単な説明】[Brief description of the drawings]

第１図〜第４図は第１実施例の電子部品搭載用基板の要
部を示し，第１図はその平面図，第２図は第１図のＡ−
Ａ線矢視断面図，第３図は凹所の斜視図，第４図は第２
図のＢ−Ｂ線矢視断面図，第５図〜第７図は第２実施例
の積層型電子部品搭載用基板の要部を示し，第５図はそ
の平面図，第６図は側面断面図，第７図は凹所の斜視
図，第８図は第３実施例の積層型電子部品搭載用基板の
要部断面図，第９図〜第12図は従来の電子部品搭載用基
板を示し，第９図はその側面図，第10図及び第11図は要
部平面図，第12図は第11図のＹ−Ｙ線矢視断面図であ
る。 １……導体層， 101,102,103,104……端子部， 141,143,144……電源回路， 142……接地回路， ２……第２導体層， 30,37,38……電源用端子， 35……接地用端子， ４……信号パターン， 40……信号用端子， 5,51,52……ボンディングワイヤー， 6,60……絶縁基材， 62……第２絶縁基材， ８……電子部品， 88……接続端子，1 to 4 show the main parts of the electronic component mounting board of the first embodiment, FIG. 1 is a plan view thereof, and FIG.
3 is a perspective view of the recess, and FIG.
5 to 7 show essential parts of the multilayer electronic component mounting substrate of the second embodiment, FIG. 5 is a plan view thereof, and FIG. 6 is a side view. FIG. 7 is a perspective view of the recess, FIG. 8 is a cross-sectional view of a principal part of the multilayer electronic component mounting board of the third embodiment, and FIGS. 9 to 12 are conventional electronic component mounting boards. 9 is a side view, FIGS. 10 and 11 are plan views of essential parts, and FIG. 12 is a sectional view taken along line YY of FIG. 1 ... conductor layer, 101, 102, 103, 104 ... terminal part, 141, 143, 144 ... power circuit, 142 ... ground circuit, 2 ... second conductor layer, 30, 37, 38 ... power terminal, 35 ... ground terminal, 4 ... signal pattern, 40 ... signal terminal, 5,51,52 ... bonding wire, 6,60 ... insulating base material, 62 ... second insulating base material, 8 ... electronic parts, 88 ... Connecting terminal,

フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/12Continuation of front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 23/12

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】多数の信号パターンを設けた絶縁基材に電
子部品搭載用の凹所を形成してなる電子部品搭載用基板
において， 上記凹所の側壁には導体層が形成されていると共に該導
体層は複数領域の端子部に電気的に分割されており，ま
た絶縁基材の裏面には複数領域に分割形成された電源回
路及び接地回路を設けてあり，これら電源回路及び接地
回路は上記いずれかの端子部に接続されており，また上
記端子部は電源用端子又は接地用端子を配設してなるこ
とを特徴とする電子部品搭載用基板。1. An electronic component mounting substrate comprising a plurality of signal patterns provided on an insulating substrate and having electronic component mounting recesses formed thereon, wherein a conductive layer is formed on sidewalls of the recesses. The conductor layer is electrically divided into terminals in a plurality of regions, and a power supply circuit and a ground circuit divided into a plurality of regions are provided on the back surface of the insulating base material. An electronic component mounting board, which is connected to any one of the terminal portions, and the terminal portion is provided with a power supply terminal or a ground terminal. 【請求項２】第１請求項において，電子部品搭載用基板
は多数の信号パターンを設けた絶縁基材を複数段に積層
してなり，その中の少なくとも１段の絶縁基材は上記複
数領域の端子部と複数領域に分割された電源回路及び接
地回路と上記電源用端子及び接地用端子とを有すること
を特徴とする電子部品搭載用基板。2. The electronic component mounting board according to claim 1, wherein an insulating base material provided with a large number of signal patterns is laminated in a plurality of stages, wherein at least one of the insulating base materials is provided in the plurality of regions. And a power supply circuit and a ground circuit divided into a plurality of regions, and the power supply terminal and the ground terminal.
JP2163777A 1990-06-21 1990-06-21 Substrate for mounting electronic components Expired - Lifetime JP2804827B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2163777A JP2804827B2 (en) 1990-06-21 1990-06-21 Substrate for mounting electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2163777A JP2804827B2 (en) 1990-06-21 1990-06-21 Substrate for mounting electronic components

Publications (2)

Publication Number Publication Date
JPH0456142A JPH0456142A (en) 1992-02-24
JP2804827B2 true JP2804827B2 (en) 1998-09-30

Family

ID=15780522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2163777A Expired - Lifetime JP2804827B2 (en) 1990-06-21 1990-06-21 Substrate for mounting electronic components

Country Status (1)

Country Link
JP (1) JP2804827B2 (en)

Also Published As

Publication number Publication date
JPH0456142A (en) 1992-02-24

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