JP2023501301A - プリント回路基板及び他の基板の孔を介して充填する単一工程電解方法 - Google Patents
プリント回路基板及び他の基板の孔を介して充填する単一工程電解方法 Download PDFInfo
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- 238000011049 filling Methods 0.000 title claims description 19
- 238000007747 plating Methods 0.000 claims abstract description 157
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- 239000010949 copper Substances 0.000 claims abstract description 128
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 127
- 239000002253 acid Substances 0.000 claims abstract description 56
- 238000009713 electroplating Methods 0.000 claims abstract description 48
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 29
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- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 6
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- 239000005751 Copper oxide Substances 0.000 description 5
- 229910000431 copper oxide Inorganic materials 0.000 description 5
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- 239000002202 Polyethylene glycol Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
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- 150000003839 salts Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
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- LUENVHHLGFLMFJ-UHFFFAOYSA-N 4-[(4-sulfophenyl)disulfanyl]benzenesulfonic acid Chemical compound C1=CC(S(=O)(=O)O)=CC=C1SSC1=CC=C(S(O)(=O)=O)C=C1 LUENVHHLGFLMFJ-UHFFFAOYSA-N 0.000 description 1
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- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
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- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
a)銅電気めっきを受容するための電子基板を作製する工程と、
b)電子基板内に1つ以上の貫通孔及び/又は1つ以上のマイクロビアのうちの少なくとも一方を形成する工程と、
c)電子基板を酸銅電気めっき溶液と接触させることによって、1つ以上の貫通孔及び/又は1つ以上のマイクロビアに銅を電気めっきする工程であって、酸銅電気めっき溶液が、
a.銅イオン源と、
b.硫酸と、
c.塩化物イオン源と、
d.光沢剤と、
e.湿潤剤と、
f.レベラーと、
を含有する工程と、を含み、
酸銅電気めっき溶液が、単一工程プロセス用に構成され、同じ酸銅電気めっき溶液が、金属化が完了するまで、1つ以上の貫通孔及び/又は1つ以上のマイクロビアをめっきする。
を含む。
実施例:
比較例1:
実施例1:
比較例2:
実施例2:
実施例3:
比較例3:
実施例4:
実施例5:
実施例6:
実施例7:
Claims (20)
- プリント回路基板の製造における銅電気めっきの方法であって、
a)銅電気めっきを受容するための電子基板を作製する工程と、
b)前記電子基板内に1つ以上の貫通孔及び/又は1つ以上のマイクロビアのうちの少なくとも一方を形成する工程と、
c)前記電子基板を酸銅電気めっき溶液と接触させることによって、前記1つ以上の貫通孔及び/又は前記1つ以上のマイクロビアに銅を電気めっきする工程であって、前記酸銅電気めっき溶液が、
a.銅イオン源と、
b.硫酸と、
c.塩化物イオン源と、
d.光沢剤と、
e.湿潤剤と、
f.レベラーと、
を含有する、工程と、を含み、
前記酸銅電気めっき溶液が、単一工程プロセス用に構成され、前記同じ酸銅電気めっき溶液が、金属化が完了するまで、前記1つ以上の貫通孔及び/又は前記1つ以上のマイクロビアをめっきする、方法。 - 電気めっきを受容するための前記プリント回路基板を作製する工程が、前記1つ以上の貫通孔及び/又は前記1つ以上のマイクロビアを金属化する前に前記プリント回路基板を洗浄する工程を含む、請求項1に記載の方法。
- 洗浄された前記プリント回路基板をマイクロエッチングする工程を更に含む、請求項2に記載の方法。
- 前記1つ以上の金属化貫通孔及び/又は前記1つ以上のマイクロビアが、いかなる欠陥も呈さない、請求項1に記載の方法。
- 金属化された前記電気めっき銅堆積物が、前記1つ以上の貫通孔及び/又は前記1つ以上のマイクロビアを完全に充填し、前記電子基板上にコンフォーマル銅堆積物を堆積させる、請求項4に記載の方法。
- 前記電子基板が、約0.005~約3mmの厚さを有する、請求項1に記載の方法。
- 前記1つ以上の貫通孔及び/又は前記1つ以上のマイクロビアが、約0.005~約1mmの直径を有する、請求項6に記載の方法。
- 前記1つ以上の貫通孔及び/又は前記1つ以上のマイクロビアが、約0.075~約0.25mmの直径を有する、請求項7に記載の方法。
- 前記1つ以上の貫通孔及び/又は前記1つ以上のマイクロビアが、約0.5:1~約6:1のアスペクト比を有する、請求項6に記載の方法。
- 前記コンフォーマル堆積物が、約5~約100μmの厚さを有する、請求項5に記載の方法。
- 前記酸銅電気めっき浴を、約10~約50℃の温度で乾燥させる、請求項1に記載の方法。
- 前記酸銅電気めっき浴が、
a)100~300g/Lの硫酸銅と、
b)10~150g/Lの硫酸と、
c)20~200ppmの塩化物イオンと、
d)0.1~30ppmの光沢剤と、
e)0.1~50g/Lの湿潤剤と、
f)0.001~200ppmと、
を含む、請求項1に記載の方法。 - 前記単一工程酸銅電気めっきプロセスが、めっきサイクルを含み、前記めっきサイクルは、順に、
a)ある期間のパルスめっきであって、前記パルスめっきが、前記電子基板の両側に2つのパルス形態を使用し、前記パルス形態が位相シフトを呈する、パルスめっきと、
b)ある期間にわたって順方向電流を使用する直流めっきと、
を含む、請求項1に記載の方法。 - 工程a)及びb)が繰り返されて、前記1つ以上の貫通孔を完全に充填する、請求項13に記載の方法。
- 工程a)の前に、ある期間にわたって順方向電流を使用する直流めっきの工程を更に含む、請求項13に記載の方法。
- 前記第1の期間の直流めっきが、前記1つ以上の貫通孔及び/又は1つ以上のマイクロビアの表面上にフラッシュ銅層を堆積させる、請求項15に記載の方法。
- 前記第1の期間のパルスめっきが、銅めっきされる表面の量を最小化しつつ、前記1つ以上の貫通孔の中央の充填を加速する、請求項13に記載の方法。
- 前記1つ以上の貫通孔の中心が閉鎖されると、前記波形が、同じ酸銅めっき溶液中で直流に移行して、前記1つ以上の貫通孔を完全に充填する、請求項17に記載の方法。
- 前記電子基板が、噴霧、拭い、液浸、及び浸漬からなる群から選択される方法によって、前記酸銅電気めっき溶液と接触させられる、請求項1に記載の方法。
- 前記電子基板を前記酸銅めっき浴に浸漬することによって、前記電子基板を前記酸銅電気めっき溶液と接触させる、請求項19に記載の方法。
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