JP2023016949A - ロードポート - Google Patents
ロードポート Download PDFInfo
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- JP2023016949A JP2023016949A JP2022195158A JP2022195158A JP2023016949A JP 2023016949 A JP2023016949 A JP 2023016949A JP 2022195158 A JP2022195158 A JP 2022195158A JP 2022195158 A JP2022195158 A JP 2022195158A JP 2023016949 A JP2023016949 A JP 2023016949A
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- foup
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- 238000000638 solvent extraction Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 232
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 57
- 238000002347 injection Methods 0.000 description 57
- 239000007924 injection Substances 0.000 description 57
- 235000012431 wafers Nutrition 0.000 description 54
- 239000002245 particle Substances 0.000 description 26
- 229910052757 nitrogen Inorganic materials 0.000 description 23
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 22
- 239000001301 oxygen Substances 0.000 description 22
- 229910052760 oxygen Inorganic materials 0.000 description 22
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- -1 moisture Substances 0.000 description 7
- 239000012299 nitrogen atmosphere Substances 0.000 description 7
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- 238000010926 purge Methods 0.000 description 6
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- 230000008859 change Effects 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
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- 230000002452 interceptive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
搬送空間を外部空間から隔離する壁の一部を構成するベースと、
前記ベースに設けられた開口部と、
前記開口部の開閉と、収容物を収容した容器に対する蓋体の固定及び固定の解除が可能なドアと、
前記ベースと前記容器との間をシールする第1シール部材と、
を備え、
前記ドアの前記容器側の端面の少なくとも一部が、前記第1シール部材の前記容器側の端部より前記搬送空間側に位置する。
前記容器が前記開口部に取付けられた状態で、前記容器を前記ベース側に押圧するクランプユニットを有し、
前記クランプユニットにクランプされた前記容器により前記ベース側に押圧された前記第1シール部材の前記容器側の端部より、前記ドアの前記容器側の端面の少なくとも一部が前記搬送空間側に位置する。
前記容器と対向する、前記ドアの端面の一部が、前記搬送空間側に凹む凹部を有する。
前記凹部の形状は、前記容器内の圧力を高めることで膨張した前記蓋体の膨張面に対応する。
前記ベースと前記ドアとの間をシールする第2シール部材を備え、
前記ドアの前記容器側の端面の全てが、前記第1シール部材の前記容器側の端部より前記搬送空間側に位置する。
前記ベースと前記ドアとの間をシールする第2シール部材と、
前記第1シール部材を介して前記容器が前記開口部と当接する状態にあるとき、少なくとも前記第1シール部材、前記第2シール部材、前記蓋体、および前記ドアによって構成された密閉空間と、
前記密閉空間にガスを注入する第1ガス注入部と、
前記密閉空間を排気する第1ガス排出部と、
を備えた。
前記ベースと前記ドアとの間をシールする第2シール部材と、
前記第1シール部材を介して前記容器が前記ベースと当接し、かつ前記第2シール部材を介して前記ドアが前記ベースと当接する状態にあるとき、前記ベース、前記第1シール部材、前記第2シール部材、前記蓋体、および前記ドアによって構成された密閉空間と、
を備え、
前記容器を前記ベースにクランプする際、前記ドアと前記蓋体とが離隔した状態から、前記ドアに向かって前記容器を近づける。
本実施形態のロードポート4には以下の特徴がある。
本実施形態のドア開閉システムには以下の特徴がある。
7 FOUP(容器)
9 搬送空間
41 ベース
50 クランプユニット(クランプ)
72 蓋体
81 ドア部(ドア)
87 第1ガス注入ノズル(第1ガス注入部)
88 第1ガス排出ノズル(第1ガス排出部)
92 開口部
94 Oリング(第1シール部材)
96 Oリング(第2シール部材)
Sd 密閉空間
Claims (1)
- 搬送空間を外部空間から隔離する壁の一部を構成するベースと、
前記ベースに設けられた開口部と、
前記開口部の開閉と、収容物を収容した容器に対する蓋体の固定及び固定の解除が可能なドアと、
前記ベースと前記容器との間をシールする第1シール部材と、
を備え、
前記ドアの前記容器側の端面の少なくとも一部が、前記第1シール部材の前記容器側の端部より前記搬送空間側に位置することを特徴とするロードポート。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015154593 | 2015-08-04 | ||
JP2015154593 | 2015-08-04 | ||
JP2021015015A JP7193748B2 (ja) | 2015-08-04 | 2021-02-02 | ロードポート |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021015015A Division JP7193748B2 (ja) | 2015-08-04 | 2021-02-02 | ロードポート |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023016949A true JP2023016949A (ja) | 2023-02-02 |
Family
ID=57942900
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017532455A Active JP6836078B2 (ja) | 2015-08-04 | 2016-07-12 | ロードポート |
JP2021015015A Active JP7193748B2 (ja) | 2015-08-04 | 2021-02-02 | ロードポート |
JP2022195158A Pending JP2023016949A (ja) | 2015-08-04 | 2022-12-06 | ロードポート |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017532455A Active JP6836078B2 (ja) | 2015-08-04 | 2016-07-12 | ロードポート |
JP2021015015A Active JP7193748B2 (ja) | 2015-08-04 | 2021-02-02 | ロードポート |
Country Status (6)
Country | Link |
---|---|
US (2) | US10501271B2 (ja) |
JP (3) | JP6836078B2 (ja) |
KR (2) | KR102581235B1 (ja) |
CN (2) | CN115440640A (ja) |
TW (2) | TWI681915B (ja) |
WO (1) | WO2017022432A1 (ja) |
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TWI681915B (zh) | 2015-08-04 | 2020-01-11 | 日商昕芙旎雅股份有限公司 | 裝載埠 |
CN106684023A (zh) * | 2017-03-14 | 2017-05-17 | 大族激光科技产业集团股份有限公司上海分公司 | 全封闭式smif*** |
KR102474585B1 (ko) * | 2017-05-11 | 2022-12-06 | 로제 가부시키가이샤 | 박판형상 기판 유지 핑거 및 이 핑거를 구비하는 반송 로봇 |
US10566216B2 (en) * | 2017-06-09 | 2020-02-18 | Lam Research Corporation | Equipment front end module gas recirculation |
JP6939335B2 (ja) * | 2017-09-27 | 2021-09-22 | Tdk株式会社 | ロードポート装置、ロードポート装置の駆動方法 |
CN110137121B (zh) * | 2018-02-09 | 2024-03-26 | 东京毅力科创株式会社 | 基板处理装置 |
JP7048885B2 (ja) * | 2018-03-15 | 2022-04-06 | シンフォニアテクノロジー株式会社 | Efem |
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2016
- 2016-04-29 TW TW105113523A patent/TWI681915B/zh active
- 2016-04-29 TW TW108147441A patent/TWI727562B/zh active
- 2016-07-12 JP JP2017532455A patent/JP6836078B2/ja active Active
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US20180229945A1 (en) | 2018-08-16 |
TW201708080A (zh) | 2017-03-01 |
US10501271B2 (en) | 2019-12-10 |
JP2021068919A (ja) | 2021-04-30 |
JP6836078B2 (ja) | 2021-02-24 |
JPWO2017022432A1 (ja) | 2018-05-24 |
KR20180036963A (ko) | 2018-04-10 |
WO2017022432A1 (ja) | 2017-02-09 |
KR20230136694A (ko) | 2023-09-26 |
CN107924860B (zh) | 2022-08-30 |
US10947063B2 (en) | 2021-03-16 |
JP7193748B2 (ja) | 2022-12-21 |
KR102581235B1 (ko) | 2023-09-21 |
CN107924860A (zh) | 2018-04-17 |
TWI681915B (zh) | 2020-01-11 |
CN115440640A (zh) | 2022-12-06 |
TWI727562B (zh) | 2021-05-11 |
TW202017821A (zh) | 2020-05-16 |
US20200071091A1 (en) | 2020-03-05 |
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