JP2021015872A - ウエーハ搬送機構および研削装置 - Google Patents
ウエーハ搬送機構および研削装置 Download PDFInfo
- Publication number
- JP2021015872A JP2021015872A JP2019129155A JP2019129155A JP2021015872A JP 2021015872 A JP2021015872 A JP 2021015872A JP 2019129155 A JP2019129155 A JP 2019129155A JP 2019129155 A JP2019129155 A JP 2019129155A JP 2021015872 A JP2021015872 A JP 2021015872A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grinding
- suction
- holding
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 28
- 238000005498 polishing Methods 0.000 title abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 51
- 235000012431 wafers Nutrition 0.000 claims description 273
- 238000004140 cleaning Methods 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 230000007723 transport mechanism Effects 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 12
- 239000008400 supply water Substances 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims 4
- 230000003028 elevating effect Effects 0.000 description 24
- 238000005406 washing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Robotics (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
4:ウエーハ保持手段
6:移動手段
8:吸引保持部
P:ポーラス面
10:水供給部
12:セグメント
18:環状壁
W:ウエーハ
50:研削装置
52:カセット
52a:第一のカセット
52b:第二のカセット
54:カセット載置部
54a:第一のカセット載置部
54b:第二のカセット載置部
56:ウエーハ搬出入手段
58:仮置き手段
60:チャックテーブル
62:第一の搬送手段
64:研削手段
66:洗浄手段
126:乾燥手段
Claims (5)
- ウエーハを搬送するウエーハ搬送機構であって、
ウエーハを保持するウエーハ保持手段と、該ウエーハ保持手段を移動する移動手段とを備え、
該ウエーハ保持手段は、ウエーハの外周領域を吸引保持するポーラス面を備えた吸引保持部と、該吸引保持部の内側に配設され水を供給する水供給部とを含むウエーハ搬送機構。 - 該吸引保持部は複数のセグメントから構成され隣接する該セグメントと該セグメントとの間に該水供給部から供給された水を流出させる請求項1記載のウエーハ搬送機構。
- 隣接する該セグメントと該セグメントとの間から流出する水の勢いを抑制する環状壁が該吸引保持部を囲繞して配設される請求項2記載のウエーハ搬送機構。
- 複数のウエーハを収容したカセットが載置されるカセット載置部と、該カセット載置部に載置されたカセットからウエーハを搬出および搬入するウエーハ搬出入手段と、該ウエーハ搬出入手段によって搬出されたウエーハが仮置きされる仮置き手段と、該仮置き手段に仮置きされたウエーハをチャックテーブルまで搬送する第一の搬送手段と、該チャックテーブルに保持されたウエーハの上面を研削する研削手段と、研削済みのウエーハを該チャックテーブルから搬出し洗浄手段まで搬送する第二の搬送手段と、
から少なくとも構成された研削装置であって、
該第二の搬送手段は、請求項1または2記載のウエーハ搬送機構から構成される研削装置。 - 該チャックテーブルと該洗浄手段との間に該第二の搬送手段によって搬送されるウエーハの下面を乾燥する乾燥手段が配設される請求項4記載の研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019129155A JP7358096B2 (ja) | 2019-07-11 | 2019-07-11 | ウエーハ搬送機構および研削装置 |
KR1020200073370A KR20210007839A (ko) | 2019-07-11 | 2020-06-17 | 웨이퍼 반송 기구 및 연삭 장치 |
TW109121683A TW202105578A (zh) | 2019-07-11 | 2020-06-24 | 晶圓搬送機構及磨削裝置 |
CN202010630407.8A CN112276792B (zh) | 2019-07-11 | 2020-07-03 | 晶片搬送机构和磨削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019129155A JP7358096B2 (ja) | 2019-07-11 | 2019-07-11 | ウエーハ搬送機構および研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021015872A true JP2021015872A (ja) | 2021-02-12 |
JP7358096B2 JP7358096B2 (ja) | 2023-10-10 |
Family
ID=74304872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019129155A Active JP7358096B2 (ja) | 2019-07-11 | 2019-07-11 | ウエーハ搬送機構および研削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7358096B2 (ja) |
KR (1) | KR20210007839A (ja) |
CN (1) | CN112276792B (ja) |
TW (1) | TW202105578A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114473822A (zh) * | 2022-04-15 | 2022-05-13 | 四川明泰微电子科技股份有限公司 | 一种晶圆减薄抛光装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09306974A (ja) * | 1996-05-14 | 1997-11-28 | Toshiba Corp | ワーク保持装置 |
JP2003197710A (ja) * | 2001-12-27 | 2003-07-11 | Sharp Corp | 板状物の薄層加工装置及び板状物の薄層加工方法 |
JP2009147144A (ja) * | 2007-12-14 | 2009-07-02 | Tokyo Seimitsu Co Ltd | ウェーハ搬送装置およびウェーハ搬送方法 |
JP2010177228A (ja) * | 2009-01-27 | 2010-08-12 | Disco Abrasive Syst Ltd | 研削装置 |
JP2011023433A (ja) * | 2009-07-14 | 2011-02-03 | Disco Abrasive Syst Ltd | ウエーハ搬送装置 |
JP2012089627A (ja) * | 2010-10-18 | 2012-05-10 | Disco Abrasive Syst Ltd | ウエーハ搬送機構 |
JP2014099435A (ja) * | 2012-11-13 | 2014-05-29 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3082603B2 (ja) * | 1994-11-22 | 2000-08-28 | 住友金属工業株式会社 | ウエハ搬送装置 |
JP2000106390A (ja) * | 1998-09-29 | 2000-04-11 | Disco Abrasive Syst Ltd | ウェーハ搬送装置 |
JP4170886B2 (ja) | 2003-11-21 | 2008-10-22 | 株式会社ディスコ | コインスタックキャリアー |
JP4634949B2 (ja) * | 2006-03-20 | 2011-02-16 | 株式会社ディスコ | ウエーハの保持パッド |
JP5179928B2 (ja) * | 2008-04-11 | 2013-04-10 | 株式会社ディスコ | ウエーハの搬出方法 |
JP5318536B2 (ja) * | 2008-11-10 | 2013-10-16 | 株式会社ディスコ | 研削装置 |
JP6037685B2 (ja) * | 2012-07-03 | 2016-12-07 | 株式会社ディスコ | 研削装置 |
JP6726591B2 (ja) * | 2016-09-30 | 2020-07-22 | 株式会社ディスコ | 加工装置 |
-
2019
- 2019-07-11 JP JP2019129155A patent/JP7358096B2/ja active Active
-
2020
- 2020-06-17 KR KR1020200073370A patent/KR20210007839A/ko active Search and Examination
- 2020-06-24 TW TW109121683A patent/TW202105578A/zh unknown
- 2020-07-03 CN CN202010630407.8A patent/CN112276792B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09306974A (ja) * | 1996-05-14 | 1997-11-28 | Toshiba Corp | ワーク保持装置 |
JP2003197710A (ja) * | 2001-12-27 | 2003-07-11 | Sharp Corp | 板状物の薄層加工装置及び板状物の薄層加工方法 |
JP2009147144A (ja) * | 2007-12-14 | 2009-07-02 | Tokyo Seimitsu Co Ltd | ウェーハ搬送装置およびウェーハ搬送方法 |
JP2010177228A (ja) * | 2009-01-27 | 2010-08-12 | Disco Abrasive Syst Ltd | 研削装置 |
JP2011023433A (ja) * | 2009-07-14 | 2011-02-03 | Disco Abrasive Syst Ltd | ウエーハ搬送装置 |
JP2012089627A (ja) * | 2010-10-18 | 2012-05-10 | Disco Abrasive Syst Ltd | ウエーハ搬送機構 |
JP2014099435A (ja) * | 2012-11-13 | 2014-05-29 | Disco Abrasive Syst Ltd | 切削装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114473822A (zh) * | 2022-04-15 | 2022-05-13 | 四川明泰微电子科技股份有限公司 | 一种晶圆减薄抛光装置 |
CN114473822B (zh) * | 2022-04-15 | 2022-07-05 | 四川明泰微电子科技股份有限公司 | 一种晶圆减薄抛光装置 |
Also Published As
Publication number | Publication date |
---|---|
CN112276792B (zh) | 2024-03-12 |
JP7358096B2 (ja) | 2023-10-10 |
CN112276792A (zh) | 2021-01-29 |
KR20210007839A (ko) | 2021-01-20 |
TW202105578A (zh) | 2021-02-01 |
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