JP2020521336A - フレキシブルアレイ基板の製造方法 - Google Patents
フレキシブルアレイ基板の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 43
- 239000010410 layer Substances 0.000 claims abstract description 35
- 239000012790 adhesive layer Substances 0.000 claims abstract description 26
- 238000002161 passivation Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 6
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims description 6
- 239000004695 Polyether sulfone Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920006393 polyether sulfone Polymers 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000009751 slip forming Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
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- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Abstract
Description
剛性支持板を提供し、前記剛性支持板上に接着層を形成し、前記接着層上にパッシベーション層を形成するステップS1と、
前記パッシベーション層上に裏面駆動回路を製造し、且つ前記裏面駆動回路上に平坦層を被覆するステップS2と、
前記平坦層上にフレキシブル基板を製造するステップS3と、
前記フレキシブル基板上に前記フレキシブル基板及び平坦層を貫通するビアホールを形成するステップS4と、
前記フレキシブル基板上に正面駆動回路及び正面駆動回路に電気的に接続される表示回路を形成し、前記正面駆動回路が前記ビアホールによって前記裏面駆動回路に電気的に接続されるステップS5と、
前記剛性支持板及び接着層を剥離し、フレキシブルアレイ基板を得るステップS6と、を含む。
剛性支持板を提供し、前記剛性支持板上に接着層を形成し、前記接着層上にパッシベーション層を形成するステップS1と、
前記パッシベーション層上に裏面駆動回路を製造し、且つ前記裏面駆動回路上に平坦層を被覆するステップS2と、
前記平坦層上にフレキシブル基板を製造するステップS3と、
前記フレキシブル基板上に前記フレキシブル基板及び平坦層を貫通するビアホールを形成するステップS4と、
前記フレキシブル基板上に正面駆動回路及び正面駆動回路に電気的に接続される表示回路を形成し、前記正面駆動回路が前記ビアホールによって前記裏面駆動回路に電気的に接続されるステップS5と、
前記剛性支持板及び接着層を剥離し、フレキシブルアレイ基板を得るステップS6と、を含み、
そのうち、前記フレキシブル基板の材料はポリイミド、ポリエチレンテレフタレート、環状オレフィン共重合体、又はポリエーテルスルホン樹脂であり、
そのうち、前記フレキシブル基板の厚さは5〜500ミクロンである。
Claims (18)
- フレキシブルアレイ基板の製造方法であって、
剛性支持板を提供し、前記剛性支持板上に接着層を形成し、前記接着層上にパッシベーション層を形成するステップS1と、
前記パッシベーション層上に裏面駆動回路を製造し、且つ前記裏面駆動回路上に平坦層を被覆するステップS2と、
前記平坦層上にフレキシブル基板を製造するステップS3と、
前記フレキシブル基板上に前記フレキシブル基板及び平坦層を貫通するビアホールを形成するステップS4と、
前記フレキシブル基板上に正面駆動回路及び正面駆動回路に電気的に接続される表示回路を形成し、前記正面駆動回路が前記ビアホールによって前記裏面駆動回路に電気的に接続されるステップS5と、
前記剛性支持板及び接着層を剥離し、フレキシブルアレイ基板を得るステップS6と、を含むフレキシブルアレイ基板の製造方法。 - 前記剛性支持板の材料はガラスである請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記フレキシブル基板の材料はポリイミド、ポリエチレンテレフタレート、環状オレフィン共重合体、又はポリエーテルスルホン樹脂である請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記フレキシブル基板の厚さは5〜500ミクロンである請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記ステップS4では、レーザー穴開け、又は化学腐食の方法によって前記ビアホールを製造する請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記ビアホールの直径は5〜100ミクロンである請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記ステップS6では、レーザー剥離の方式によって前記剛性支持板及び接着層を剥離する請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記ステップS3では、塗布又は貼付の方式によって平坦層上にフレキシブル基板を製造する請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記正面駆動回路と裏面駆動回路とが共同で前記フレキシブルアレイ基板のWOA配線を形成する請求項1に記載のフレキシブルアレイ基板の製造方法。
- 前記正面駆動回路と裏面駆動回路とが共同で前記フレキシブルアレイ基板のWOA配線及びGOA回路を形成する請求項1に記載のフレキシブルアレイ基板の製造方法。
- フレキシブルアレイ基板の製造方法であって、
剛性支持板を提供し、前記剛性支持板上に接着層を形成し、前記接着層上にパッシベーション層を形成するステップS1と、
前記パッシベーション層上に裏面駆動回路を製造し、且つ前記裏面駆動回路上に平坦層を被覆するステップS2と、
前記平坦層上にフレキシブル基板を製造するステップS3と、
前記フレキシブル基板上に前記フレキシブル基板及び平坦層を貫通するビアホールを形成するステップS4と、
前記フレキシブル基板上に正面駆動回路及び正面駆動回路に電気的に接続される表示回路を形成し、前記正面駆動回路が前記ビアホールによって前記裏面駆動回路に電気的に接続されるステップS5と、
前記剛性支持板及び接着層を剥離し、フレキシブルアレイ基板を得るステップS6と、を含み、
前記フレキシブル基板の材料はポリイミド、ポリエチレンテレフタレート、環状オレフィン共重合体、又はポリエーテルスルホン樹脂であり、
前記フレキシブル基板の厚さは5〜500ミクロンであるフレキシブルアレイ基板の製造方法。 - 前記剛性支持板の材料はガラスである請求項11に記載のフレキシブルアレイ基板の製造方法。
- 前記ステップS4では、レーザー穴開け、又は化学腐食の方法によって前記ビアホールを製造する請求項11に記載のフレキシブルアレイ基板の製造方法。
- 前記ビアホールの直径は5〜100ミクロンである請求項11に記載のフレキシブルアレイ基板の製造方法。
- 前記ステップS6では、レーザー剥離の方式によって前記剛性支持板及び接着層を剥離する請求項11に記載のフレキシブルアレイ基板の製造方法。
- 前記ステップS3では、塗布又は貼付の方式によって平坦層上にフレキシブル基板を製造する請求項11に記載のフレキシブルアレイ基板の製造方法。
- 前記正面駆動回路と裏面駆動回路とが共同で前記フレキシブルアレイ基板のWOA配線を形成する請求項11に記載のフレキシブルアレイ基板の製造方法。
- 前記正面駆動回路と裏面駆動回路とが共同で前記フレキシブルアレイ基板のWOA配線及びGOA回路を形成する請求項11に記載のフレキシブルアレイ基板の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710370204.8A CN106952583B (zh) | 2017-05-23 | 2017-05-23 | 柔性阵列基板的制作方法 |
CN201710370204.8 | 2017-05-23 | ||
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CN107742628A (zh) * | 2017-09-12 | 2018-02-27 | 奕瑞影像科技(太仓)有限公司 | 柔性闪烁屏、放射线图像传感器及其制备方法 |
CN109523914B (zh) * | 2017-09-19 | 2021-10-15 | 深圳天珑无线科技有限公司 | 一种柔性屏的保护装置、显示面板及电子装置 |
US10209597B1 (en) * | 2018-01-04 | 2019-02-19 | Didrew Technology (Bvi) Limited | System and method of manufacturing frameless LCD display |
CN108122497B (zh) * | 2018-02-02 | 2023-11-14 | 京东方科技集团股份有限公司 | 一种柔性阵列基板、柔性显示装置及组装方法 |
CN109148529B (zh) * | 2018-08-20 | 2021-11-02 | 武汉华星光电半导体显示技术有限公司 | 基板及显示装置 |
CN109410852A (zh) * | 2018-10-22 | 2019-03-01 | 惠科股份有限公司 | 一种显示装置及其检测方法 |
TWI707180B (zh) * | 2019-11-08 | 2020-10-11 | 友達光電股份有限公司 | 對向基板 |
CN110890050B (zh) * | 2019-11-21 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | 阵列基板及其制作方法、显示装置 |
CN114203729B (zh) * | 2021-12-02 | 2023-10-17 | 武汉华星光电半导体显示技术有限公司 | 半成品oled显示面板、oled显示面板制备方法 |
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EP3640925A4 (en) | 2020-12-09 |
US10743424B2 (en) | 2020-08-11 |
EP3640925A1 (en) | 2020-04-22 |
CN106952583A (zh) | 2017-07-14 |
KR20200010473A (ko) | 2020-01-30 |
CN106952583B (zh) | 2019-04-30 |
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