CN106530972A - 柔性阵列基板的制作方法 - Google Patents
柔性阵列基板的制作方法 Download PDFInfo
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Abstract
本发明提供一种柔性阵列基板的制作方法,该方法首先将柔性基板贴附在刚性支撑板上制作背面驱动电路,并在背面驱动电路上制作保护层,然后揭下柔性基板翻转后再次贴附到刚性支撑板上,使保护层与胶粘层接触,接着在柔性基板上开设过孔,制作正面驱动电路及显示电路,所述正面驱动电路与所述显示电路电性连接,所述背面驱动电路通过所述过孔与所述显示电路电性连接,制得具有双面电路结构的柔性阵列基板,通过将非显示区的电路结构分布到柔性基板的两面,能够减少非显示区的宽度,实现超窄边框或无边框显示。
Description
技术领域
本发明涉及显示技术领域,尤其涉及一种柔性阵列基板的制作方法。
背景技术
随着显示技术的发展,液晶显示器(Liquid Crystal Display,LCD)与有机发光二极管显示装置(Organic Light Emitting Display,OLED)等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点,而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品,成为显示装置中的主流。
请参阅图1,现有的液晶显示器通常包括:显示面板100、电性连接于所述显示面板100上侧的源极驱动芯片200、电性连接于所述显示面板100左右两侧的栅极驱动芯片400,以及与所述源极驱动芯片200以及栅极驱动芯片400均电性连接的驱动电路板300,所述显示面板100包括显示区101、以及包围所述显示区101的非显示区102,所述显示区101内设有多条平行间隔排列的水平的栅极线和多条平行间隔排列的竖直的源极线,所述非显示区102设有多条扇形排列的阵列基板走线(Wire On Array,WOA)500,通过所述WOA走线500将所述多条栅极线连接至所述栅极驱动芯片400,将所述多条源极线连接至源极驱动芯片200。
随着显示器的发展,超窄边框或者无边框渐渐成为一种趋势,不论LCD还是OLED,窄边框或无边框显示都可以带来更好的外观体验,然而,由于显示面板的显示区***存在无法省去的WOA走线,导致显示面板的显示区到边缘的距离增大,使得无边框或者超窄边框的实现变得困难。尤其,当显示面板的分辨率从高清上升到超高清或者更高时,需要更多的区域用来放置WOA走线,导致边框区域缩窄更加困难。此外,随着显示技术的发展,现有技术中,还可以采用阵列基板行驱动电路(Gate Driver on Array,GOA)来取代栅极驱动芯片,此时GOA电路被直接制作在显示面板的非显示区上并直接连接至栅极线,但此时WOA走线也不可省去,需要用WOA走线将所述驱动电路板与GOA电路电性连接到一起,此时虽然省去了栅极驱动芯片,但GOA电路也需要占用一定宽度非显示区,尤其当显示面板的分辨率从高清上升到超高清或者更高时,需要设置的GOA电路的级数会更多,而显示面板的宽度是固定的,导致只能延伸非显示区的宽度从而放置下更多的GOA电路的薄膜晶体管及电路结构,GOA电路以及WOA走线占用的布线面积过大对超窄边框或无边框显示的实现十分不利。
发明内容
本发明的目的在于提供一种柔性阵列基板的制作方法,能够在柔性基板上制作双面的电路结构,从而减少非显示区的宽度,实现超窄边框或无边框显示。
为实现上述目的,本发明提供了一种柔性阵列基板的制作方法,包括如下步骤:
步骤1、提供一刚性支撑板以及一柔性基板,利用胶粘层将所述柔性基板贴附到所述刚性支撑板上,使得所述柔性基板的背面远离所述刚性支撑板;
步骤2、在所述柔性基板的背面制作背面驱动电路,并在所述背面驱动电路上覆盖保护层;
步骤3、将所述柔性基板与所述刚性支撑板分离,翻转所述柔性基板,再次利用胶粘层将所述柔性基板贴附到所述刚性支撑板上,使得所述柔性基板的正面远离所述刚性支撑板,保护层与所述胶粘层接触;
步骤4、在所述柔性基板的正面预设的非显示区域形成贯穿所述柔性基板的过孔,暴露出柔性基板背面的背面驱动电路;
步骤5、在所述柔性基板的正面预设的非显示区域和显示区域分别形成正面驱动电路和显示电路,所述正面驱动电路与所述显示电路电性连接,所述背面驱动电路通过所述过孔与所述显示电路电性连接;
步骤6、将所述柔性基板与所述刚性支撑板分离,制得柔性阵列基板。
所述刚性支撑板的材料为玻璃。
所述柔性基板的材料为聚酰亚胺、聚对苯二甲酸乙二醇酯、环烯烃共聚物、或者聚醚砜树脂。
所述柔性基板的厚度为10至300微米。
所述步骤4中通过激光打孔、或化学腐蚀的方法制作所述过孔。
所述过孔的直径为5至100微米。
所述步骤3及步骤6中通过激光剥离的方式分离所述柔性基板与所述刚性支撑板。
所述胶粘层采用温控胶材料制作,所述步骤3及步骤6中通过改变胶粘层的温度的方式分离所述柔性基板与所述刚性支撑板。
所述正面驱动电路和背面驱动电路共同形成所述柔性阵列基板的WOA走线。
所述正面驱动电路和背面驱动电路共同形成所述柔性阵列基板的WOA走线和GOA电路。
本发明的有益效果:本发明提供了一种柔性阵列基板的制作方法,该方法首先将柔性基板贴附在刚性支撑板上制作背面驱动电路,并在背面驱动电路上制作保护层,然后揭下柔性基板翻转后再次贴附到刚性支撑板上,使保护层与胶粘层接触,接着在柔性基板上开设过孔,制作正面驱动电路及显示电路,所述正面驱动电路与所述显示电路电性连接,所述背面驱动电路通过所述过孔与所述显示电路电性连接,制得具有双面电路结构的柔性阵列基板,通过将非显示区的电路结构分布到柔性基板的两面,能够减少非显示区的宽度,实现超窄边框或无边框显示。
附图说明
为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。
附图中,
图1为现有的液晶显示装置的结构示意图;
图2为本发明的柔性阵列基板的制作方法的步骤1的示意图;
图3为本发明的柔性阵列基板的制作方法的步骤2的示意图;
图4和图5为本发明的柔性阵列基板的制作方法的步骤3的示意图;
图6为本发明的柔性阵列基板的制作方法的步骤4的示意图;
图7为本发明的柔性阵列基板的制作方法的步骤5的示意图;
图8为本发明的柔性阵列基板的制作方法的步骤6的示意图;
图9为本发明的柔性阵列基板的制作方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图9,本发明提供一种柔性阵列基板的制作方法,包括如下步骤:
步骤1、请参阅图2,提供一刚性支撑板1以及一柔性基板3,利用胶粘层2将所述柔性基板3贴附到所述刚性支撑板1上,使得所述柔性基板3的背面远离所述刚性支撑板1。
具体地,所述刚性支撑板1的材料为玻璃,所述柔性基板3的材料为聚酰亚胺(PI)、聚对苯二甲酸乙二醇酯(PET)、环烯烃共聚物(COC)、或聚醚砜树脂(PES)等材质的较薄的基板,厚度范围在10至300um之间以便于后续的打孔操作。所述胶粘层2可选择压敏胶或温控胶等胶水材料。
步骤2、请参阅图3,在所述柔性基板3的背面制作背面驱动电路4,并在所述背面驱动电路4上覆盖保护层5。
具体地,所述保护层5可采用无机氧化物通过沉积制备,也可以采用稳定的有机物通过涂布制备。
步骤3、请参阅图4,将所述柔性基板3与所述刚性支撑板1分离,请参阅图5,翻转所述柔性基板3,再次利用胶粘层2将所述柔性基板3贴附到所述刚性支撑板1上,使得所述柔性基板3的正面远离所述刚性支撑板1,保护层5与所述胶粘层2接触。
具体地,所述步骤3中可通过激光剥离的方式分离所述柔性基板3与所述刚性支撑板1,也可以通过采用温控胶材料制作胶粘层2,然后通过改变胶粘层2的温度来改变其粘性,将所述柔性基板3从所述刚性支撑板1上剥离下来。
步骤4、请参阅图6,在所述柔性基板3的正面预设的非显示区域形成贯穿所述柔性基板3的过孔6,暴露出柔性基板3背面的背面驱动电路4。
具体地,所述步骤4中可以通过激光打孔、或化学腐蚀的方法制作所述过孔6,所述过孔6的直径需要与待穿越该过孔6的导线的直径相匹配,优选地,所述过孔6的直径为5至100微米。
步骤5、请参阅图7,在所述柔性基板3的正面预设的非显示区域和显示区域分别形成正面驱动电路7和显示电路,所述正面驱动电路7与所述显示电路电性连接,所述背面驱动电路4通过所述过孔6与所述显示电路电性连接。
具体地,由于柔性基板3的厚度相比于传统的玻璃基板厚度大幅减小,有效保证了步骤4中开设过孔6以及步骤5中在过孔6内形成连接背面驱动电路4与显示电路的导线的步骤的良率,保证制程顺利进行。
具体地,所述显示区域位于所述柔性基板3的中央,所述非显示区域包围所述显示区域,所述正面驱动电路7和背面驱动电路4共同形成所述柔性阵列基板的WOA走线,所述显示电路包括多条数据线、以及多条扫描线,所述多条数据线与多条扫描线垂直交错形成多个像素单元,每一条WOA走线均对应电性连接一条数据线或一条扫描线,各条WOA走线从外部接收扫描信号或数据信号并相应传递给扫描线或数据线,从而实现画面显示。
值得一提的是,本发明同样适用于采用GOA技术的阵列基板,此时所述正面驱动电路7和背面驱动电路4共同形成所述柔性阵列基板的WOA走线和GOA电路,所述GOA电路包括对应与所述扫描线一一对应的多个GOA单元,每一条WOA走线均对应电性连接一条数据线或一个GOA单元,所述各条WOA走线将从外部接收到的信号传递给GOA单元生成扫描信号再传递给扫描线或者接收数据信号传递给数据线,从而实现画面显示,采用GOA技术可以免去外接的栅极驱动芯片,从而进一步减少显示装置的边框宽度。
需要说明的是,通过上述方法将非显示区的电路结构(包括WOA电路及GOA电路)分布到柔性基板的两面,相比于将非显示区的电路结构全部分布于柔性基板的同一面,能够大幅度减少非显示区的电路结构占用的布线面积,进而减少非显示区的宽度,实现超窄边框或无边框显示。
步骤6、将所述柔性基板3与所述刚性支撑板1分离,制得柔性阵列基板。
具体地,所述步骤6中分离所述柔性基板3与所述刚性支撑板1的方式可以选择激光剥离、或采用温控胶制作胶粘层2并改变胶粘层2的温度使其剥离等。
综上所述,本发明提供了一种柔性阵列基板的制作方法,该方法首先将柔性基板贴附在刚性支撑板上制作背面驱动电路,并在背面驱动电路上制作保护层,然后揭下柔性基板翻转后再次贴附到刚性支撑板上,使保护层与胶粘层接触,接着在柔性基板上开设过孔,制作正面驱动电路及显示电路,所述正面驱动电路与所述显示电路电性连接,所述背面驱动电路通过所述过孔与所述显示电路电性连接,制得具有双面电路结构的柔性阵列基板,通过将非显示区的电路结构分布到柔性基板的两面,能够减少非显示区的宽度,实现超窄边框或无边框显示。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的保护范围。
Claims (10)
1.一种柔性阵列基板的制作方法,其特征在于,包括如下步骤:
步骤1、提供一刚性支撑板(1)以及一柔性基板(3),利用胶粘层(2)将所述柔性基板(3)贴附到所述刚性支撑板(1)上,使得所述柔性基板(3)的背面远离所述刚性支撑板(1);
步骤2、在所述柔性基板(3)的背面制作背面驱动电路(4),并在所述背面驱动电路(4)上覆盖保护层(5);
步骤3、将所述柔性基板(3)与所述刚性支撑板(1)分离,翻转所述柔性基板(3),再次利用胶粘层(2)将所述柔性基板(3)贴附到所述刚性支撑板(1)上,使得所述柔性基板(3)的正面远离所述刚性支撑板(1),保护层(5)与所述胶粘层(2)接触;
步骤4、在所述柔性基板(3)的正面预设的非显示区域形成贯穿所述柔性基板(3)的过孔(6),暴露出柔性基板(3)背面的背面驱动电路(4);
步骤5、在所述柔性基板(3)的正面预设的非显示区域和显示区域分别形成正面驱动电路(7)和显示电路,所述正面驱动电路(7)与所述显示电路电性连接,所述背面驱动电路(4)通过所述过孔(6)与所述显示电路电性连接;
步骤6、将所述柔性基板(3)与所述刚性支撑板(1)分离,制得柔性阵列基板。
2.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述刚性支撑板(1)的材料为玻璃。
3.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述柔性基板(3)的材料为聚酰亚胺、聚对苯二甲酸乙二醇酯、环烯烃共聚物、或者聚醚砜树脂。
4.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述柔性基板(3)的厚度为10至300微米。
5.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述步骤4中通过激光打孔、或化学腐蚀的方法制作所述过孔(6)。
6.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述过孔(6)的直径为5至100微米。
7.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述步骤3及步骤6中通过激光剥离的方式分离所述柔性基板(3)与所述刚性支撑板(1)。
8.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述胶粘层(2)采用温控胶材料制作,所述步骤3及步骤6中通过改变胶粘层(2)的温度的方式分离所述柔性基板(3)与所述刚性支撑板(1)。
9.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述正面驱动电路(7)和背面驱动电路(4)共同形成所述柔性阵列基板的WOA走线。
10.如权利要求1所述的柔性阵列基板的制作方法,其特征在于,所述正面驱动电路(7)和背面驱动电路(4)共同形成所述柔性阵列基板的WOA走线和GOA电路。
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US10477689B2 (en) | 2019-11-12 |
EP3561799A4 (en) | 2020-06-17 |
JP2020504444A (ja) | 2020-02-06 |
JP6742523B2 (ja) | 2020-08-19 |
US20180213648A1 (en) | 2018-07-26 |
EP3561799B1 (en) | 2021-07-28 |
EP3561799A1 (en) | 2019-10-30 |
CN106530972B (zh) | 2017-12-29 |
WO2018113025A1 (zh) | 2018-06-28 |
KR102263432B1 (ko) | 2021-06-14 |
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