JP2020188408A5 - - Google Patents
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- JP2020188408A5 JP2020188408A5 JP2019092973A JP2019092973A JP2020188408A5 JP 2020188408 A5 JP2020188408 A5 JP 2020188408A5 JP 2019092973 A JP2019092973 A JP 2019092973A JP 2019092973 A JP2019092973 A JP 2019092973A JP 2020188408 A5 JP2020188408 A5 JP 2020188408A5
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- 238000010586 diagram Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Description
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019092973A JP7292100B2 (ja) | 2019-05-16 | 2019-05-16 | 弾性表面波素子、フィルタ回路及び電子部品 |
US16/868,526 US11088671B2 (en) | 2019-05-16 | 2020-05-06 | Surface acoustic wave device, filter circuit, and electronic component |
CN202010381485.9A CN111953309B (zh) | 2019-05-16 | 2020-05-08 | 表面声波元件、滤波电路以及电子零件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019092973A JP7292100B2 (ja) | 2019-05-16 | 2019-05-16 | 弾性表面波素子、フィルタ回路及び電子部品 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020188408A JP2020188408A (ja) | 2020-11-19 |
JP2020188408A5 true JP2020188408A5 (ja) | 2022-05-10 |
JP7292100B2 JP7292100B2 (ja) | 2023-06-16 |
Family
ID=73222031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019092973A Active JP7292100B2 (ja) | 2019-05-16 | 2019-05-16 | 弾性表面波素子、フィルタ回路及び電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11088671B2 (ja) |
JP (1) | JP7292100B2 (ja) |
CN (1) | CN111953309B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019138812A1 (ja) * | 2018-01-12 | 2019-07-18 | 株式会社村田製作所 | 弾性波装置、マルチプレクサ、高周波フロントエンド回路、及び通信装置 |
US11750172B2 (en) | 2019-08-21 | 2023-09-05 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate |
US11722122B2 (en) * | 2019-11-22 | 2023-08-08 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate with high density electrode |
CN116584040A (zh) * | 2021-02-04 | 2023-08-11 | 株式会社村田制作所 | 弹性波装置 |
CN116584041A (zh) * | 2021-02-04 | 2023-08-11 | 株式会社村田制作所 | 弹性波装置 |
WO2022264933A1 (ja) * | 2021-06-16 | 2022-12-22 | 株式会社村田製作所 | 弾性波装置 |
WO2023204250A1 (ja) * | 2022-04-20 | 2023-10-26 | 株式会社村田製作所 | 弾性波装置 |
CN117200743A (zh) * | 2022-05-31 | 2023-12-08 | 华为技术有限公司 | 滤波器及电子设备 |
CN115395918B (zh) * | 2022-10-27 | 2023-08-29 | 中国科学技术大学 | 声波谐振器及其设计方法、制造方法 |
WO2024119507A1 (zh) * | 2022-12-09 | 2024-06-13 | 中国科学技术大学 | 体声波谐振器及其制备方法 |
CN117013984B (zh) * | 2023-08-21 | 2024-05-28 | 天通瑞宏科技有限公司 | 一种键合晶圆及薄膜声表面波器件 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5574660A (en) | 1978-11-29 | 1980-06-05 | Shinko Electric Co Ltd | Handy type memo unit |
JP3952666B2 (ja) | 2000-06-23 | 2007-08-01 | 株式会社日立製作所 | 弾性表面波素子 |
JP2006025396A (ja) | 2004-06-09 | 2006-01-26 | Seiko Epson Corp | 弾性表面波装置、その製造方法、および電子機器 |
US7161448B2 (en) * | 2004-06-14 | 2007-01-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator performance enhancements using recessed region |
WO2008078481A1 (ja) | 2006-12-25 | 2008-07-03 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
JP2011166259A (ja) * | 2010-02-05 | 2011-08-25 | Murata Mfg Co Ltd | 弾性表面波装置 |
EP2658123B1 (en) * | 2010-12-24 | 2019-02-13 | Murata Manufacturing Co., Ltd. | Elastic wave device and method for manufacturing the same. |
EP2830216A4 (en) * | 2012-03-23 | 2016-04-27 | Murata Manufacturing Co | ELASTIC WAVING DEVICE AND MANUFACTURING METHOD THEREFOR |
US10381998B2 (en) | 2015-07-28 | 2019-08-13 | Qorvo Us, Inc. | Methods for fabrication of bonded wafers and surface acoustic wave devices using same |
JP6360847B2 (ja) * | 2016-03-18 | 2018-07-18 | 太陽誘電株式会社 | 弾性波デバイス |
US11258427B2 (en) | 2016-11-25 | 2022-02-22 | Tohoku University | Acoustic wave devices |
-
2019
- 2019-05-16 JP JP2019092973A patent/JP7292100B2/ja active Active
-
2020
- 2020-05-06 US US16/868,526 patent/US11088671B2/en active Active
- 2020-05-08 CN CN202010381485.9A patent/CN111953309B/zh active Active
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