JP2020043265A - 光電変換装置および機器 - Google Patents
光電変換装置および機器 Download PDFInfo
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 163
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 91
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 87
- 239000004065 semiconductor Substances 0.000 claims abstract description 62
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 25
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 25
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 17
- 229910044991 metal oxide Inorganic materials 0.000 claims description 9
- 150000004706 metal oxides Chemical class 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical group [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 7
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 4
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052745 lead Inorganic materials 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 137
- 238000000926 separation method Methods 0.000 description 68
- 239000000758 substrate Substances 0.000 description 17
- 239000012212 insulator Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000004020 conductor Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000005530 etching Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000484 niobium oxide Inorganic materials 0.000 description 4
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910001935 vanadium oxide Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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- H01L27/144—Devices controlled by radiation
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Abstract
Description
1001 裏面
101、102、103、104 光電変換部
111、121、131 溝
200 シリコン化合物膜
300 金属化合物膜
Claims (20)
- 複数の光電変換部を有する半導体層を備え、前記半導体層が前記複数の光電変換部の各々の受光面を成す主面を有する光電変換装置であって、
前記複数の光電変換部に含まれる、第1光電変換部、第2光電変換部、第3光電変換部および第4光電変換部が、前記第1光電変換部と前記第4光電変換部との間に前記第2光電変換部と前記第3光電変換部とが位置するように並んでおり、
前記半導体層は、前記第1光電変換部と前記第2光電変換部との間に位置する第1溝と、前記第2光電変換部と前記第3光電変換部との間に位置する第2溝と、前記第3光電変換部と前記第4光電変換部との間に位置する第3溝と、を有し、前記第1溝、前記第2溝、前記第3溝の各々は、前記主面に連続しており、
前記主面の上には、シリコン酸化物膜、シリコン窒化物膜およびシリコン炭化物膜のいずれかであるシリコン化合物膜と、前記シリコン化合物膜と前記半導体層との間に位置する金属化合物膜と、が設けられており、
前記第1溝および前記第3溝の中には、前記シリコン化合物膜と前記金属化合物膜とが延在しており、
前記第2溝の中には、前記金属化合物膜が延在しており、
前記第2溝の底から前記シリコン化合物膜までの距離をHb、前記主面から前記シリコン化合物膜までの距離をHd、前記第1溝の幅をWa、前記第2溝の幅をWbとして、Hd<HbおよびWa−2×Hd>Wbを満たすことを特徴とする光電変換装置。 - 前記第1溝の深さをDa、前記第2溝の深さをDbとして、Da>WaおよびDb>Wbを満たす、請求項1に記載の光電変換装置。
- Da−Db>Hdを満たす、請求項2に記載の光電変換装置。
- Db<Hbを満たす、請求項2または3に記載の光電変換装置。
- 前記第1溝と前記第2溝との間の距離をPa、前記第2溝と前記第3溝との間の距離をPbとして、Db<Pa+Pbを満たす、請求項2乃至4のいずれか1項に記載の光電変換装置。
- Db<Daを満たす、請求項2乃至5のいずれか1項に記載の光電変換装置。
- Da/Wa<Db/Wbを満たす、請求項2乃至6のいずれか1項に記載の光電変換装置。
- Wa>2×Wbを満たす、請求項1乃至7のいずれか1項に記載の光電変換装置。
- 前記主面の上における前記金属化合物膜の厚さをTm、前記主面の上における前記シリコン化合物膜の厚さをTsとして、Tm<WaおよびTs<Waを満たす、請求項1乃至8のいずれか1項に記載の光電変換装置。
- Tm<Tsを満たす、請求項9に記載の光電変換装置。
- Wb≦2×Tm<Waを満たす、請求項9または10に記載の光電変換装置。
- 2×Tm<Wa−Wbを満たす、請求項9乃至11のいずれか1項に記載の光電変換装置。
- 2×Tm+2×Ts<Waを満たす、請求項9乃至12のいずれか1項に記載の光電変換装置。
- 前記シリコン化合物膜はシリコン酸化物膜であり、
前記金属化合物膜は、第1金属酸化物層と、前記第1金属酸化物層と前記半導体層との間に位置する第2金属酸化物層との複層膜である、請求項1乃至10のいずれか1項に記載の光電変換装置。 - 前記第1金属酸化物層は酸化タンタル層、酸化チタン層または酸化ジルコニウム層である、請求項14に記載の光電変換装置。
- 前記第2金属酸化物層は酸化アルミニウム層または酸化ハフニウム層である、請求項14または15に記載の光電変換装置。
- 前記第2金属酸化物層の厚さは前記第1金属酸化物層の厚さよりも小さい、請求項14乃至16のいずれか1項に記載の光電変換装置。
- 前記主面の上には複数のレンズを含むレンズアレイが設けられており、前記複数のレンズのうちの1つのレンズが、前記第2光電変換部と前記第3光電変換部との上に配されている、請求項1乃至17のいずれか1項に記載の光電変換装置。
- 前記レンズアレイと前記半導体層との間には、複数のレンズを含む別のレンズアレイが設けられている、請求項18に記載の光電変換装置。
- 請求項1乃至19のいずれか1項に記載の光電変換装置を備える機器であって、
前記光電変換装置に対応付けられた光学系、
前記光電変換装置を制御する制御装置、
前記光電変換装置から出力された信号を処理する処理装置、
前記光電変換装置で得られた情報を表示する表示装置、
前記光電変換装置で得られた情報を記憶する記憶装置、および、
前記光電変換装置で得られた情報に基づいて前記光電変換装置を移動させる機械装置、
の少なくともいずれかを更に備えることを特徴とする機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2018170835A JP7182968B2 (ja) | 2018-09-12 | 2018-09-12 | 光電変換装置および機器 |
US16/556,964 US10991741B2 (en) | 2018-09-12 | 2019-08-30 | Photoelectric conversion apparatus and equipment |
CN201910845927.8A CN110896083B (zh) | 2018-09-12 | 2019-09-09 | 光电转换装置和设备 |
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KR20220045810A (ko) * | 2020-10-06 | 2022-04-13 | 삼성전자주식회사 | 이미지 센서 |
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