JP2018521476A - Led照明装置 - Google Patents
Led照明装置 Download PDFInfo
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- JP2018521476A JP2018521476A JP2017568061A JP2017568061A JP2018521476A JP 2018521476 A JP2018521476 A JP 2018521476A JP 2017568061 A JP2017568061 A JP 2017568061A JP 2017568061 A JP2017568061 A JP 2017568061A JP 2018521476 A JP2018521476 A JP 2018521476A
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- 239000000758 substrate Substances 0.000 claims abstract description 133
- 239000000919 ceramic Substances 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 25
- 238000005286 illumination Methods 0.000 claims 5
- 238000003491 array Methods 0.000 abstract description 22
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/023—Power supplies in a casing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (15)
- LED照明装置であって、
第1LED配列を有する第1基板部分を含む第1LEDモジュールであり、前記第1LED配列は実質的に前記第1基板部分の一方の側に配置されている、第1LEDモジュールと、
第2LED配列を有する第2基板部分を含む第2LEDモジュールであり、前記第2LED配列は実質的に前記第2基板部分の一方の側に配置されている、第2LEDモジュールと、を含み、
前記第1LED配列および前記第2LED配列がそれぞれに前記第1基板部分および前記第2基板部分の最上部に在るように前記第1基板部分および前記第2基板部分が向けられている場合に、前記第1LED配列の極性と前記第2LED配列の極性は反対であり、
前記第1LEDモジュールおよび前記第2LEDモジュールは前記第1LED配列および前記第2LED配列が互いに並ぶように配置されており、
前記第1LED配列および前記第2LED配列のアノードは同じ第1端部で終端し、かつ、前記第1LED配列および前記第2LED配列のカソードは同じ第2端部で終端する、
照明装置。 - 前記第1LED配列および前記第2LED配列は電気的に並列に接続されている、
請求項1に記載の照明装置。 - 前記第1LED配列は第1の直列に接続された複数のLEDを含み、かつ、前記第2LED配列は第2の直列に接続された複数のLEDを含む、
請求項1または2に記載の照明装置。 - 前記LED照明装置は、さらに、
前記第1LED配列および前記第2LED配列の前記アノードに対して電気的に接続された第1電気パッドと、
前記第1LED配列および前記第2LED配列の前記カソードに対して電気的に接続された第2電気パッドと、を含む、
請求項1乃至3いずれか一項に記載の照明装置。 - 各基板部分は別個のセラミック基板であり、
前記第1LED配列は第1セラミック基板の第1表面の第1側にマウントされており、かつ、
前記第2LED配列は第2セラミック基板の第1表面の第1側にマウントされている、
請求項1乃至4いずれか一項に記載の照明装置。 - 前記第1LED配列のアノードとカソードのうち少なくとも1つは、前記第1セラミック基板の前記第1表面の異なる側である、第2側に配置されており、かつ、
前記第2LED配列のアノードとカソードのうち少なくとも1つは、前記第2セラミック基板の前記第1表面の異なる側である、第2側に配置されている、
請求項5に記載の照明装置。 - 前記第1LED配列のアノードとカソードのうち少なくとも1つは、前記第1セラミック基板の第2表面に配置されており、前記第2表面は前記第1セラミック基板の前記第1表面に対向しており、
前記第2LED配列のアノードとカソードのうち少なくとも1つは、前記第2セラミック基板の第2表面に配置されており、前記第2表面は前記第2セラミック基板の前記第1表面に対向している、
請求項5または6に記載の照明装置。 - 前記第1LEDモジュールは、さらに、前記第1セラミック基板の第2表面に配置された第1熱パッドを含み、前記第2表面は前記第1セラミック基板の前記第1表面に対向しており、
前記第2LEDモジュールは、さらに、前記第1セラミック基板の第2表面に配置された第2熱パッドを含み、前記第2表面は前記第1セラミック基板の前記第1表面に対向している、
請求項5乃至7いずれか一項に記載の照明装置。 - 前記LED照明装置は、さらに、リードフレームを含み、
前記第1LEDモジュールおよび前記第2LEDモジュールは前記リードフレームにおける開口をブリッジしている、
請求項1乃至8いずれか一項に記載の照明装置。 - 前記第1LEDモジュールおよび前記第2LEDモジュールは、プリント回路基板、リードフレーム、または他のチップキャリア上にマウントされ、または、その中に埋め込まれている、
請求項1乃至8いずれか一項に記載の照明装置。 - 照明装置を形成する方法であって、
第1LED配列を有する第1基板部分を含む第1LEDモジュールを備えるステップであり、前記第1LED配列は実質的に前記第1基板部分の一方の側に向けて配置されている、ステップと、
第2LED配列を有する第2基板部分を含む第2LEDモジュールを備えるステップであり、前記第2LED配列は実質的に前記第2基板部分の一方の側に向けて配置されており、前記第2LED配列のアノード及びカソードのレイアウトは前記第1LED配列のアノード及びカソードのレイアウトの鏡像である、ステップと、
前記第1LED配列および前記第2LED配列が互いに並ぶように、前記第1LEDモジュールと並んで前記第2LEDモジュールを配置するステップと、を含み、
前記第1LED配列および前記第2LED配列がそれぞれに前記第1基板部分および前記第2基板部分の最上部に在るように前記第1基板部分および前記第2基板部分が向けられている場合に、前記第1LED配列の極性と前記第2LED配列の極性は反対である、
方法。 - 前記方法は、さらに、
第1電気パッドを前記第1LED配列および前記第2LED配列のアノードに電気的に接続するステップと、
第2電気パッドを前記第1LED配列および前記第2LED配列のカソードに電気的に接続するステップと、を含む、
請求項11に記載の方法。 - 前記方法は、さらに、
前記第1LED配列を第1セラミック基板の第1表面の一方の側にマウントするステップであり、前記第1LEDモジュールは前記第1セラミック基板を含む、ステップと、
前記第2LED配列を第2セラミック基板の第1表面の一方の側にマウントするステップであり、前記第2LEDモジュールは前記第2セラミック基板を含む、ステップと、を含む、
請求項11または12に記載の方法。 - 前記方法は、さらに、
少なくとも1つの第1熱パッドを前記第1セラミック基板の第2表面に配置するステップであり、前記第2表面は前記第1セラミック基板の前記第1表面に対向している、ステップと、
少なくとも1つの第2熱パッドを前記第2セラミック基板の第2表面に配置するステップであり、前記第2表面は前記第2セラミック基板の前記第1表面に対向している、ステップと、を含む、
請求項13に記載の方法。 - 前記方法は、さらに、
リードフレームの開口を前記第1LEDモジュールでブリッジするステップと、
前記リードフレームの同じ開口を前記第2LEDモジュールでブリッジするステップと、を含む、
請求項11乃至14いずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15174948 | 2015-07-02 | ||
EP15174948.8 | 2015-07-02 | ||
PCT/EP2016/064849 WO2017001336A1 (en) | 2015-07-02 | 2016-06-27 | An led lighting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018521476A true JP2018521476A (ja) | 2018-08-02 |
JP6811195B2 JP6811195B2 (ja) | 2021-01-13 |
Family
ID=53498915
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017568061A Active JP6811195B2 (ja) | 2015-07-02 | 2016-06-27 | Led照明装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10159121B2 (ja) |
EP (1) | EP3318109A1 (ja) |
JP (1) | JP6811195B2 (ja) |
KR (1) | KR102458620B1 (ja) |
CN (1) | CN108112284B (ja) |
WO (1) | WO2017001336A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10475876B2 (en) | 2016-07-26 | 2019-11-12 | X-Celeprint Limited | Devices with a single metal layer |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW557590B (en) * | 2002-09-04 | 2003-10-11 | Opto Tech Corp | Light-emitting device array |
KR101115800B1 (ko) * | 2004-12-27 | 2012-03-08 | 엘지디스플레이 주식회사 | 발광소자 패키지, 이의 제조 방법 및 백라이트 유닛 |
US7518148B2 (en) * | 2005-03-29 | 2009-04-14 | General Electric Company | Full fault tolerant architecture for organic electronic devices |
JP5366688B2 (ja) | 2009-07-16 | 2013-12-11 | 日本航空電子工業株式会社 | ソケット、基板組立体及びそれを備える装置 |
JP4910023B2 (ja) * | 2009-08-27 | 2012-04-04 | シャープ株式会社 | 光源装置 |
US8764220B2 (en) * | 2010-04-28 | 2014-07-01 | Cooper Technologies Company | Linear LED light module |
EP2990718B1 (en) * | 2010-04-27 | 2019-06-05 | Cooper Technologies Company | Linkable linear light emitting diode system |
US8573804B2 (en) * | 2010-10-08 | 2013-11-05 | Guardian Industries Corp. | Light source, device including light source, and/or methods of making the same |
DE202010013142U1 (de) | 2010-12-16 | 2011-02-17 | Rui Teng Opto Technology Co., Ltd., Pingzhen City | LED-Modulaufbau |
US9247597B2 (en) * | 2011-12-02 | 2016-01-26 | Lynk Labs, Inc. | Color temperature controlled and low THD LED lighting devices and systems and methods of driving the same |
KR102098831B1 (ko) * | 2012-06-07 | 2020-04-08 | 시코쿠 케이소쿠 코교 가부시키가이샤 | Led 조명 모듈 및 led 조명 장치 |
DE102013211223A1 (de) | 2013-06-14 | 2014-12-18 | Osram Gmbh | Leadframe für eine Leuchtvorrichtung |
-
2016
- 2016-06-27 KR KR1020187003233A patent/KR102458620B1/ko active IP Right Grant
- 2016-06-27 EP EP16732607.3A patent/EP3318109A1/en active Pending
- 2016-06-27 WO PCT/EP2016/064849 patent/WO2017001336A1/en unknown
- 2016-06-27 JP JP2017568061A patent/JP6811195B2/ja active Active
- 2016-06-27 CN CN201680039250.3A patent/CN108112284B/zh active Active
- 2016-06-27 US US15/740,165 patent/US10159121B2/en active Active
Also Published As
Publication number | Publication date |
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CN108112284A (zh) | 2018-06-01 |
WO2017001336A1 (en) | 2017-01-05 |
US20180199402A1 (en) | 2018-07-12 |
JP6811195B2 (ja) | 2021-01-13 |
EP3318109A1 (en) | 2018-05-09 |
KR102458620B1 (ko) | 2022-10-25 |
US10159121B2 (en) | 2018-12-18 |
KR20180026497A (ko) | 2018-03-12 |
CN108112284B (zh) | 2020-12-01 |
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