JP2018181911A - 光半導体装置 - Google Patents
光半導体装置 Download PDFInfo
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- JP2018181911A JP2018181911A JP2017074501A JP2017074501A JP2018181911A JP 2018181911 A JP2018181911 A JP 2018181911A JP 2017074501 A JP2017074501 A JP 2017074501A JP 2017074501 A JP2017074501 A JP 2017074501A JP 2018181911 A JP2018181911 A JP 2018181911A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 230000003287 optical effect Effects 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000006243 chemical reaction Methods 0.000 claims abstract description 37
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052796 boron Inorganic materials 0.000 claims abstract description 36
- 238000007747 plating Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (4)
- 複数の光電変換部を有し、前記複数の光電変換部のそれぞれを互いに隔てるようにトレンチが形成された半導体基板と、
少なくとも前記トレンチの内面に形成された絶縁層と、
前記絶縁層上に形成されたボロン層と、
前記ボロン層上に形成された金属層と、を備える、光半導体装置。 - 光電変換部及び信号出力部を有し、前記光電変換部と前記信号出力部とを隔てるようにトレンチが形成された半導体基板と、
少なくとも前記トレンチの内面に形成された絶縁層と、
前記絶縁層上に形成されたボロン層と、
前記ボロン層上に形成された金属層と、を備える、光半導体装置。 - 前記絶縁層、前記ボロン層及び前記金属層は、前記半導体基板の表面上に至っている、請求項1又は2に記載の光半導体装置。
- 前記金属層は、めっき層である、請求項1〜3のいずれか一項に記載の光半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017074501A JP2018181911A (ja) | 2017-04-04 | 2017-04-04 | 光半導体装置 |
US15/942,684 US11088190B2 (en) | 2017-04-04 | 2018-04-02 | Optical semiconductor device |
CN201810289855.9A CN108695399A (zh) | 2017-04-04 | 2018-04-03 | 光半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017074501A JP2018181911A (ja) | 2017-04-04 | 2017-04-04 | 光半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018181911A true JP2018181911A (ja) | 2018-11-15 |
Family
ID=63669895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017074501A Pending JP2018181911A (ja) | 2017-04-04 | 2017-04-04 | 光半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11088190B2 (ja) |
JP (1) | JP2018181911A (ja) |
CN (1) | CN108695399A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
JP2018181910A (ja) * | 2017-04-04 | 2018-11-15 | 浜松ホトニクス株式会社 | 光半導体装置の製造方法 |
CN111863853A (zh) * | 2019-04-24 | 2020-10-30 | 深圳第三代半导体研究院 | 一种垂直集成单元二极管芯片 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60233851A (ja) * | 1984-04-17 | 1985-11-20 | Olympus Optical Co Ltd | 固体イメ−ジセンサ |
JP2007288136A (ja) * | 2006-03-24 | 2007-11-01 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2016100347A (ja) * | 2014-11-18 | 2016-05-30 | ソニー株式会社 | 固体撮像装置及びその製造方法、並びに電子機器 |
TW201712858A (zh) * | 2015-09-30 | 2017-04-01 | Hamamatsu Photonics Kk | 背面射入型固體攝像裝置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6274905B1 (en) * | 1999-06-30 | 2001-08-14 | Fairchild Semiconductor Corporation | Trench structure substantially filled with high-conductivity material |
US20020197823A1 (en) * | 2001-05-18 | 2002-12-26 | Yoo Jae-Yoon | Isolation method for semiconductor device |
JP2003086827A (ja) | 2001-09-12 | 2003-03-20 | Hamamatsu Photonics Kk | ホトダイオードアレイ、固体撮像装置、及び、放射線検出器 |
US6674124B2 (en) * | 2001-11-15 | 2004-01-06 | General Semiconductor, Inc. | Trench MOSFET having low gate charge |
US7154136B2 (en) * | 2004-02-20 | 2006-12-26 | Micron Technology, Inc. | Isolation structures for preventing photons and carriers from reaching active areas and methods of formation |
JP2008034772A (ja) * | 2006-08-01 | 2008-02-14 | Matsushita Electric Ind Co Ltd | 固体撮像装置及び固体撮像装置の製造方法およびカメラ |
KR100801053B1 (ko) * | 2006-10-27 | 2008-02-04 | 삼성전자주식회사 | 소자 분리 방법 및 이를 이용한 이미지 소자의 형성 방법 |
US8440495B2 (en) * | 2007-03-06 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for reducing crosstalk in image sensors using implant technology |
US20100148230A1 (en) * | 2008-12-11 | 2010-06-17 | Stevens Eric G | Trench isolation regions in image sensors |
JP2010245499A (ja) | 2009-03-16 | 2010-10-28 | Sony Corp | 固体撮像装置及び電子機器 |
JP2010287743A (ja) * | 2009-06-11 | 2010-12-24 | Sony Corp | 半導体装置及びその製造方法、固体撮像素子 |
JP5511308B2 (ja) * | 2009-10-26 | 2014-06-04 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP5810551B2 (ja) | 2011-02-25 | 2015-11-11 | ソニー株式会社 | 固体撮像装置、および、その製造方法、電子機器 |
US9093266B2 (en) * | 2011-04-11 | 2015-07-28 | Micron Technology, Inc. | Forming high aspect ratio isolation structures |
US20130056809A1 (en) * | 2011-09-07 | 2013-03-07 | Duli Mao | Image Sensor with Reduced Noiseby Blocking Nitridation Over Selected Areas |
JP5794068B2 (ja) | 2011-09-16 | 2015-10-14 | ソニー株式会社 | 固体撮像素子および製造方法、並びに電子機器 |
JP2015088568A (ja) * | 2013-10-29 | 2015-05-07 | 株式会社東芝 | 固体撮像装置および固体撮像装置の製造方法 |
JP2016039315A (ja) * | 2014-08-08 | 2016-03-22 | 株式会社東芝 | 固体撮像素子 |
JP2016187007A (ja) * | 2015-03-27 | 2016-10-27 | 株式会社東芝 | 固体撮像装置および固体撮像装置の製造方法 |
CN106299095A (zh) * | 2015-06-12 | 2017-01-04 | 映瑞光电科技(上海)有限公司 | 一种高压倒装led芯片及其制作方法 |
TWI562345B (en) | 2016-03-04 | 2016-12-11 | Silicon Optronics Inc | Image sensing device |
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2017
- 2017-04-04 JP JP2017074501A patent/JP2018181911A/ja active Pending
-
2018
- 2018-04-02 US US15/942,684 patent/US11088190B2/en active Active
- 2018-04-03 CN CN201810289855.9A patent/CN108695399A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60233851A (ja) * | 1984-04-17 | 1985-11-20 | Olympus Optical Co Ltd | 固体イメ−ジセンサ |
JP2007288136A (ja) * | 2006-03-24 | 2007-11-01 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2016100347A (ja) * | 2014-11-18 | 2016-05-30 | ソニー株式会社 | 固体撮像装置及びその製造方法、並びに電子機器 |
TW201712858A (zh) * | 2015-09-30 | 2017-04-01 | Hamamatsu Photonics Kk | 背面射入型固體攝像裝置 |
Also Published As
Publication number | Publication date |
---|---|
CN108695399A (zh) | 2018-10-23 |
US11088190B2 (en) | 2021-08-10 |
US20180286898A1 (en) | 2018-10-04 |
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