JP2017196689A - ワイヤソー装置 - Google Patents
ワイヤソー装置 Download PDFInfo
- Publication number
- JP2017196689A JP2017196689A JP2016088232A JP2016088232A JP2017196689A JP 2017196689 A JP2017196689 A JP 2017196689A JP 2016088232 A JP2016088232 A JP 2016088232A JP 2016088232 A JP2016088232 A JP 2016088232A JP 2017196689 A JP2017196689 A JP 2017196689A
- Authority
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- Prior art keywords
- cleaning liquid
- cover
- wire saw
- processing chamber
- saw device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims abstract description 199
- 239000007788 liquid Substances 0.000 claims abstract description 188
- 238000005406 washing Methods 0.000 abstract description 9
- 238000003754 machining Methods 0.000 description 21
- 239000006061 abrasive grain Substances 0.000 description 15
- 239000012530 fluid Substances 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
20 カバー
21 透明部
20a 内表面
40 洗浄ユニット
41 洗浄液流路
42 洗浄液流出口
43 洗浄液受溝
43a 開口縁
44 洗浄液案内部
100 ワイヤソー装置
W ワーク
Claims (1)
- ワークを加工するための加工室と、該加工室を覆うカバーと、該カバーの少なくとも一部に設けられた透明部とを備えるワイヤソー装置であって、
前記カバーの内表面上部に対向配置された洗浄ユニットを備え、
前記洗浄ユニットは、前記透明部の横断方向に沿って延びる洗浄液流路と、該洗浄液流路に設けられた洗浄液流出口と、該洗浄液流出口の下方で上方に向けて開口し前記横断方向に沿って延びる洗浄液受溝と、該洗浄液受溝の開口縁に沿って延びかつ前記カバーへ向けて斜め下方へ延びる洗浄液案内部と、を有することを特徴とするワイヤソー装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016088232A JP6614015B2 (ja) | 2016-04-26 | 2016-04-26 | ワイヤソー装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016088232A JP6614015B2 (ja) | 2016-04-26 | 2016-04-26 | ワイヤソー装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017196689A true JP2017196689A (ja) | 2017-11-02 |
JP6614015B2 JP6614015B2 (ja) | 2019-12-04 |
Family
ID=60238765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016088232A Active JP6614015B2 (ja) | 2016-04-26 | 2016-04-26 | ワイヤソー装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6614015B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112170937A (zh) * | 2020-09-30 | 2021-01-05 | 金龙 | 一种电气设备用自动管道切割机 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01148254U (ja) * | 1988-03-29 | 1989-10-13 | ||
JP2000153460A (ja) * | 1998-11-16 | 2000-06-06 | Tokyo Seiko Co Ltd | 液体供給装置 |
JP2000167760A (ja) * | 1998-12-04 | 2000-06-20 | Tokyo Seimitsu Co Ltd | ワイヤソーのガイドローラカバー |
US20090000446A1 (en) * | 2005-12-20 | 2009-01-01 | Claus Jeppesen | Machine Tool |
JP2014034018A (ja) * | 2012-08-10 | 2014-02-24 | Koyo Thermo System Kk | 洗浄装置 |
-
2016
- 2016-04-26 JP JP2016088232A patent/JP6614015B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01148254U (ja) * | 1988-03-29 | 1989-10-13 | ||
JP2000153460A (ja) * | 1998-11-16 | 2000-06-06 | Tokyo Seiko Co Ltd | 液体供給装置 |
JP2000167760A (ja) * | 1998-12-04 | 2000-06-20 | Tokyo Seimitsu Co Ltd | ワイヤソーのガイドローラカバー |
US20090000446A1 (en) * | 2005-12-20 | 2009-01-01 | Claus Jeppesen | Machine Tool |
JP2014034018A (ja) * | 2012-08-10 | 2014-02-24 | Koyo Thermo System Kk | 洗浄装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112170937A (zh) * | 2020-09-30 | 2021-01-05 | 金龙 | 一种电气设备用自动管道切割机 |
Also Published As
Publication number | Publication date |
---|---|
JP6614015B2 (ja) | 2019-12-04 |
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