JP2017159378A - 吸着用パッドおよび吸着用パッドの動作方法 - Google Patents
吸着用パッドおよび吸着用パッドの動作方法 Download PDFInfo
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- JP2017159378A JP2017159378A JP2016043610A JP2016043610A JP2017159378A JP 2017159378 A JP2017159378 A JP 2017159378A JP 2016043610 A JP2016043610 A JP 2016043610A JP 2016043610 A JP2016043610 A JP 2016043610A JP 2017159378 A JP2017159378 A JP 2017159378A
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- 238000000034 method Methods 0.000 title claims description 12
- 238000001179 sorption measurement Methods 0.000 title abstract description 8
- 230000035515 penetration Effects 0.000 claims description 35
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 3
- 238000011017 operating method Methods 0.000 claims description 3
- 238000003795 desorption Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B47/00—Suction cups for attaching purposes; Equivalent means using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Workpieces (AREA)
Abstract
【解決手段】吸着用パッド(10)は、内部空間(16)を有する本体部(11)と、内部空間(16)と連通するパッド部(12)と、先端部(13A)を有し、先端部(13A)をパッド部(12)に向けて内部空間(16)に設けられ、先端部(13A)がパッド部(12)の内外へ往復動するシャフト部(13)と、フリー状態では、先端部(13A)をパッド部(12)内に引き込んでシャフト部(13)を保持するシャフト弾性部(14)と、を備える。
【選択図】図1
Description
11B ガイド本体部; 11C キャップ保持部; 11D 保持部;
11E 保持部; 11F、11G ストッパ部;
12 パッド部; 12A リップ; 12B パッド貫通部;
13 シャフト部; 13A 先端部; 13B 保持部;
13C フランジ部; 13D シャフト貫通部; 14 シャフト弾性部;
15 ピストン部; 15A 窪み部; 15B 交差貫通部;
16 内部空間; 16A シャフト室; 16B ピストン室;
16C エア貫通部; 16D ガイド貫通部; 22、23 シール部;
24 窪み部; 25 ピストン弾性部;
Claims (6)
- 内部空間を有する本体部と、
前記内部空間と連通するパッド部と、
先端部を有し、前記先端部を前記パッド部に向けて前記内部空間に設けられ、前記先端部が前記パッド部の内外へ往復動するシャフト部と、
前記先端部を前記パッド部内に引き込んで前記シャフト部を保持するシャフト弾性部と、
を備えることを特徴とする吸着用パッド。 - 請求項1記載の吸着用パッドにおいて、
前記シャフト部のストローク量が、前記シャフト部の前記先端部が前記パッド部外へ飛び出す最大飛び出し量よりも大きいことを特徴とする吸着用パッド。 - 請求項1または2記載の吸着用パッドにおいて、
前記内部空間と連通するエア出入部と、
前記内部空間内で前記シャフト部と前記エア出入部との間に設けられるピストン部と、
を更に備えることを特徴とする吸着用パッド。 - 請求項1〜3のいずれか一項に記載の吸着用パッドにおいて、
前記本体部は、前記パッド部と連通し、前記シャフト部の先端部が挿入されるガイド貫通部を更に有し、
前記シャフト部は、前記先端部と反対側に前記ガイド貫通部よりも大径のフランジ部を更に有することを特徴とする吸着用パッド。 - 内部空間を有する本体部と、前記内部空間と連通するパッド部と、先端部を前記パッド部に向けて前記内部空間に設けられるシャフト部と、を備える吸着用パッドの動作方法であって、
(a)前記先端部を前記パッド部内に引き込んだ状態のまま、前記内部空間からエアの吸引を行い、前記パッド部にワークを吸着させる工程と、
(b)前記(a)工程の後、前記内部空間へエアの供給を行い、前記パッド部からエアを吐出させた後、前記シャフト部を前記パッド部から飛び出させる工程と、
を含むことを特徴とする吸着用パッドの動作方法。 - 請求項5記載の吸着用パッドの動作方法において、
前記(b)工程では、前記先端部を前記パッド部から飛び出させた後に、前記パッド部からのエアの吐出を停止することを特徴とする吸着用パッドの動作方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016043610A JP6325589B2 (ja) | 2016-03-07 | 2016-03-07 | 吸着用パッド |
KR1020170026062A KR102535641B1 (ko) | 2016-03-07 | 2017-02-28 | 흡착용 패드 |
TW106106933A TWI705037B (zh) | 2016-03-07 | 2017-03-03 | 吸附用墊 |
CN201710128425.4A CN107165923B (zh) | 2016-03-07 | 2017-03-06 | 吸附用吸盘 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016043610A JP6325589B2 (ja) | 2016-03-07 | 2016-03-07 | 吸着用パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017159378A true JP2017159378A (ja) | 2017-09-14 |
JP6325589B2 JP6325589B2 (ja) | 2018-05-16 |
Family
ID=59848808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016043610A Active JP6325589B2 (ja) | 2016-03-07 | 2016-03-07 | 吸着用パッド |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6325589B2 (ja) |
KR (1) | KR102535641B1 (ja) |
CN (1) | CN107165923B (ja) |
TW (1) | TWI705037B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110193843A (zh) * | 2019-06-27 | 2019-09-03 | 广东欧亚包装有限公司 | 一种瓶子抓取装置及其控制方法 |
JP2020011352A (ja) * | 2018-07-19 | 2020-01-23 | 株式会社コスメック | 吸着位置決め装置 |
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---|---|---|---|---|
FR3073766B1 (fr) * | 2017-11-22 | 2019-10-25 | Coval | Dispositif de prehension avec surveillance de son etat de fonctionnement |
KR101977625B1 (ko) * | 2018-01-24 | 2019-05-13 | 제너셈(주) | 픽커 |
CN108890358A (zh) * | 2018-07-27 | 2018-11-27 | 航天南洋(浙江)科技有限公司 | 真空吸附夹具中的平板式真空吸盘 |
CN108673388A (zh) * | 2018-07-27 | 2018-10-19 | 航天南洋(浙江)科技有限公司 | 壳体类零件真空吸附夹具 |
KR102011410B1 (ko) * | 2019-04-30 | 2019-08-16 | 제너셈(주) | 픽커 |
DE102019127292B4 (de) * | 2019-10-10 | 2023-01-19 | Asm Assembly Systems Gmbh & Co. Kg | Vorrichtung und Verfahren zur präzisen Bestückung mit Bestückungselementen |
CN110980283B (zh) * | 2019-12-17 | 2021-08-27 | 广东创智智能装备有限公司 | 一种用于工件移动的装置 |
KR102436662B1 (ko) * | 2020-09-14 | 2022-08-26 | 한화정밀기계 주식회사 | 부품 픽업 장치 |
CN113394157B (zh) * | 2021-08-18 | 2021-12-03 | 深圳飞骧科技股份有限公司 | 芯片吸取工具 |
KR102525827B1 (ko) * | 2022-12-08 | 2023-04-26 | (주)브이텍 | 세로형 진공 그리퍼 장치 |
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WO2016056115A1 (ja) * | 2014-10-10 | 2016-04-14 | 富士機械製造株式会社 | 吸着ノズル |
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2016
- 2016-03-07 JP JP2016043610A patent/JP6325589B2/ja active Active
-
2017
- 2017-02-28 KR KR1020170026062A patent/KR102535641B1/ko active IP Right Grant
- 2017-03-03 TW TW106106933A patent/TWI705037B/zh active
- 2017-03-06 CN CN201710128425.4A patent/CN107165923B/zh active Active
Patent Citations (5)
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JPS5898191U (ja) * | 1981-12-24 | 1983-07-04 | 日本ビクター株式会社 | 強制離脱型真空チヤツク |
JPS6376490U (ja) * | 1986-11-08 | 1988-05-20 | ||
WO2005049287A1 (ja) * | 2003-11-21 | 2005-06-02 | Mitsuboshi Diamond Industrial Co., Ltd. | 真空吸着ヘッド、その真空吸着ヘッドを用いた真空吸着装置及びテーブル |
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JP2020011352A (ja) * | 2018-07-19 | 2020-01-23 | 株式会社コスメック | 吸着位置決め装置 |
WO2020017110A1 (ja) * | 2018-07-19 | 2020-01-23 | 株式会社コスメック | 吸着位置決め装置 |
JP7022429B2 (ja) | 2018-07-19 | 2022-02-18 | 株式会社コスメック | 吸着位置決め構造体及び吸着位置決め装置 |
CN110193843A (zh) * | 2019-06-27 | 2019-09-03 | 广东欧亚包装有限公司 | 一种瓶子抓取装置及其控制方法 |
CN110193843B (zh) * | 2019-06-27 | 2024-04-30 | 广东欧亚包装有限公司 | 一种瓶子抓取装置及其控制方法 |
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Publication number | Publication date |
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CN107165923A (zh) | 2017-09-15 |
TW201739681A (zh) | 2017-11-16 |
TWI705037B (zh) | 2020-09-21 |
JP6325589B2 (ja) | 2018-05-16 |
KR20170104379A (ko) | 2017-09-15 |
CN107165923B (zh) | 2020-02-21 |
KR102535641B1 (ko) | 2023-05-23 |
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