JP2017141415A - 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置 - Google Patents

光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置 Download PDF

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Publication number: JP2017141415A
Authority: JP; Japan
Prior art keywords: resin composition; group; curable resin; light; cured product
Prior art date: 2016-02-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2016025329A

Other languages

English (en)

Japanese (ja)

Inventor

弘世鈴木

Hirose Suzuki

弘世鈴木

康貴海老浦

Yasutaka Ebiura

康貴海老浦

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Daicel Corp

Original Assignee

Daicel Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-02-12

Filing date

2016-02-12

Publication date

2017-08-17

2016-02-12 Application filed by Daicel Corp filed Critical Daicel Corp

2016-02-12 Priority to JP2016025329A priority Critical patent/JP2017141415A/ja

2017-02-06 Priority to KR1020187025517A priority patent/KR20180107227A/ko

2017-02-06 Priority to PCT/JP2017/004216 priority patent/WO2017138491A1/ja

2017-02-06 Priority to CN201780010306.7A priority patent/CN108603010A/zh

2017-02-10 Priority to TW106104345A priority patent/TW201739817A/zh

2017-08-17 Publication of JP2017141415A publication Critical patent/JP2017141415A/ja

Status Pending legal-status Critical Current

Links

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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4253—Rubbers
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C—CHEMISTRY; METALLURGY
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JP2016025329A 2016-02-12 2016-02-12 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置 Pending JP2017141415A (ja)

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KR1020187025517A KR20180107227A (ko)	2016-02-12	2017-02-06	광 반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치
PCT/JP2017/004216 WO2017138491A1 (ja)	2016-02-12	2017-02-06	光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
CN201780010306.7A CN108603010A (zh)	2016-02-12	2017-02-06	光反射用固化性树脂组合物及其固化物、以及光半导体装置
TW106104345A TW201739817A (zh)	2016-02-12	2017-02-10	光反射用硬化性樹脂組成物及其硬化物、以及光半導體裝置

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CN111040702B (zh) *	2019-12-31	2022-10-11	无锡创达新材料股份有限公司	一种led反射杯用的有机硅环氧树脂组合物及其固化物

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