TW201739817A - 光反射用硬化性樹脂組成物及其硬化物、以及光半導體裝置 - Google Patents

光反射用硬化性樹脂組成物及其硬化物、以及光半導體裝置 Download PDF

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Publication number
TW201739817A
TW201739817A TW106104345A TW106104345A TW201739817A TW 201739817 A TW201739817 A TW 201739817A TW 106104345 A TW106104345 A TW 106104345A TW 106104345 A TW106104345 A TW 106104345A TW 201739817 A TW201739817 A TW 201739817A
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TW
Taiwan
Prior art keywords
resin composition
group
curable resin
cured product
weight
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Application number
TW106104345A
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English (en)
Chinese (zh)
Inventor
Hirose Suzuki
Yasutaka Ebiura
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Daicel Corp
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Publication of TW201739817A publication Critical patent/TW201739817A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00Compositions of unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
TW106104345A 2016-02-12 2017-02-10 光反射用硬化性樹脂組成物及其硬化物、以及光半導體裝置 TW201739817A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016025329A JP2017141415A (ja) 2016-02-12 2016-02-12 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置

Publications (1)

Publication Number Publication Date
TW201739817A true TW201739817A (zh) 2017-11-16

Family

ID=59563851

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104345A TW201739817A (zh) 2016-02-12 2017-02-10 光反射用硬化性樹脂組成物及其硬化物、以及光半導體裝置

Country Status (5)

Country Link
JP (1) JP2017141415A (ko)
KR (1) KR20180107227A (ko)
CN (1) CN108603010A (ko)
TW (1) TW201739817A (ko)
WO (1) WO2017138491A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018135557A1 (ja) * 2017-01-23 2018-07-26 株式会社ダイセル 硬化性エポキシ樹脂組成物
WO2019124476A1 (ja) * 2017-12-21 2019-06-27 株式会社ダイセル 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置
CN111040702B (zh) * 2019-12-31 2022-10-11 无锡创达新材料股份有限公司 一种led反射杯用的有机硅环氧树脂组合物及其固化物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011060819A (ja) * 2009-09-07 2011-03-24 Nitto Denko Corp 光半導体素子収納用実装パッケージ用樹脂組成物およびそれを用いて得られる光半導体発光装置
CN103492482B (zh) * 2011-06-27 2016-11-09 株式会社大赛璐 光反射用固化性树脂组合物及光半导体装置
WO2013008680A1 (ja) * 2011-07-13 2013-01-17 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP5829893B2 (ja) * 2011-11-09 2015-12-09 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP5838790B2 (ja) * 2011-12-22 2016-01-06 日本ゼオン株式会社 光反射部材用樹脂組成物、光反射部材及び発光素子
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックIpマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置

Also Published As

Publication number Publication date
WO2017138491A1 (ja) 2017-08-17
CN108603010A (zh) 2018-09-28
JP2017141415A (ja) 2017-08-17
KR20180107227A (ko) 2018-10-01

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