JP2016029739A - オプトエレクトロニクスチップオンボードモジュール用のコーティング法 - Google Patents
オプトエレクトロニクスチップオンボードモジュール用のコーティング法 Download PDFInfo
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- JP2016029739A JP2016029739A JP2015214180A JP2015214180A JP2016029739A JP 2016029739 A JP2016029739 A JP 2016029739A JP 2015214180 A JP2015214180 A JP 2015214180A JP 2015214180 A JP2015214180 A JP 2015214180A JP 2016029739 A JP2016029739 A JP 2016029739A
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Abstract
Description
a)液状シリコーンを、該支持体の外形寸法に相当するか又はこれらを上回る外形寸法を有し、上方を開放した型中へ注型し、
b)該支持体を該型中へ導入し、その際に、1個の該オプトエレクトロニクス部品又は複数の該オプトエレクトロニクス部品を完全に該シリコーン中へ浸漬し、かつ該支持体の表面は該シリコーンと全面にわたって接触するか、又は該支持体は少なくとも部分的に、全面にわたって該シリコーン中へ浸り、
c)該シリコーンを、該オプトエレクトロニクス部品及び該支持体と一緒に硬化かつ架橋させ、かつ
d)硬化された該シリコーンを含んでなる該コーティングを有する該支持体を、該型から取り出す。
a.一次光学部品及び二次光学部品は匹敵する構造サイズを有する。
b.該一次光学部品の構造サイズは、該二次光学部品よりも小さい。
c.該一次光学部品の構造サイズは、該二次光学部品よりも大きい。
該放射体内で、該構造サイズの比は双方の空間方向で同じか又は異なっていてよく、又はその過程で変化してもよい。
2、2′ 支持体
3、3′ 導体パス
4、4′ LED
5、5′ 光円すい
6 接合箇所
7 オーバーラップ領域
11〜11″′ コーティングされたチップオンボードLEDモジュール
12 シリコーンコーティング
13 支持体側面のコーティング
15 シリコーンを含んでなるレンズ
16 粗面化された表面構造
17 りん光材料
18 多様な波長の光
20 流込み型
21 液状シリコーン
22 シリコーンストック
23 光学部品
24 一次光学部品
25 二次光学部品
26 リフレクタ
27 レンズの光軸
28 LEDの光軸
30 放射方向
Claims (17)
- 1個以上のオプトエレクトロニクス部品(4)が取り付けられている平坦な支持体(2、2′)を含むオプトエレクトロニクスチップオンボードモジュール(1、11〜11″′)を、シリコーンを含んでなる透明で耐UV性かつ耐熱性のコーティング(12)でコーティングする方法であって、次の処理工程:
a)液状シリコーン(21、22)を、該支持体(2、2′)の外形寸法に相当するか又はこれらの外形寸法を上回る外形寸法を有し、上方を開放した型(20)中へ注型し、
b)該支持体(2、2′)を該型(20)中へ導入し、その際に、1個の該オプトエレクトロニクス部品(4)又は複数の該オプトエレクトロニクス部品(4)を完全に該シリコーン(21)中へ浸漬し、かつ該支持体(2、2′)の表面は該シリコーン(21)と全面にわたって接触するか、又は該支持体(2、2′)は少なくとも部分的に、全面にわたって該シリコーン(21)中へ浸り、
c)該シリコーン(21)を、該オプトエレクトロニクス部品(4)及び該支持体(2、2′)と一緒に硬化かつ架橋させ、かつ
d)硬化されたシリコーン(21)を含んでなる該コーティング(12)を有する該支持体(2、2′)を、該型(20)から取り出す
を特徴とする、オプトエレクトロニクスチップオンボードモジュール(1、11〜11″′)をコーティングする方法。 - 処理工程a)及び/又はb)及び/又はc)及び/又はd)を、高められた雰囲気圧力下で、特に4〜10bar、特に5〜7barの雰囲気圧力で実施する、請求項1記載の方法。
- 該液状シリコーン(21、22)中へ、光学機能性材料(17)、特にりん光性及び/又は散乱性の材料又は粒子が混入されているか又は混入される、請求項1又は2記載の方法。
- 該コーティング(12)の表面上に、該型により予め与えられた又は後で付加された表面構造(15、16)が生じる、請求項1から3までのいずれか1項記載の方法。
- 該支持体(2、2′)に、1個以上の縁部までオプトエレクトロニクス部品(4)が取り付けられるか又は取り付けられている、請求項1から4までのいずれか1項記載の方法。
- 該支持体(2、2′)が縁部なしで及び/又は該縁部を越えてまでコーティングされる、請求項1から5までのいずれか1項記載の方法。
- 該シリコーン(21)が、少なくとも1個の光学部品、特に少なくとも1個のレンズ(15)が該シリコーン(21)中に形成されるように成形される、請求項1から6までのいずれか1項記載の方法。
- 該方法を、該チップオンボードモジュール(1、11〜11″′)が、少なくとも1個の該オプトエレクトロニクス部品(4)に隣接した少なくとも1個の一次光学部品(24)と、任意に少なくとも1個の二次光学部品(25)とを有し、その際に、該一次光学部品(24)及び該二次光学部品(25)からなる群から選択される少なくとも1個の光学部品(23)が、該シリコーン(21)中に形成されるように実施する、請求項1から7までのいずれか1項記載の方法。
- 特に請求項1から8までのいずれか1項記載の方法により製造できる、1個以上のオプトエレクトロニクス部品(4)が取り付けられている平坦な支持体(2、2′)を含み、シリコーン(21、22)を含んでなる透明で耐UV性かつ耐熱性のコーティング(12)を有する、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)であって、
1個以上のオプトエレクトロニクス部品(4)が取り付けられている該支持体(2、2′)の表面が、縁部なしで該シリコーン(21、22)でコーティングされていることを特徴とする、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)。 - 該支持体(2、2′)がその側面でも少なくとも部分的に該シリコーン(21、22)でコーティングされている、請求項9記載のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)。
- 該シリコーン(21、22)が、光学機能性材料(17)、特にりん光性及び/又は散乱性の材料又は粒子の混和物を含有する、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)に関する請求項9又は10記載のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)。
- 該コーティング(12)が表面構造(15、16)、特にレンズ(15)又は光散乱性粗面(16)を有する、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)に関する請求項9から11までのいずれか1項記載のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)。
- 該コーティング(12)が、少なくとも1個の光学部品、特に少なくとも1個のレンズ(15)及び/又は少なくとも1個のレンズアレイを有する、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)に関する請求項9から12までのいずれか1項記載のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)。
- 該チップオンボードモジュール(11〜11″′)が、少なくとも1個の該オプトエレクトロニクス部品(4)に隣接した少なくとも1個の一次光学部品(24)と、任意に少なくとも1個の二次光学部品(25)とを有し、その際に、該一次光学部品(24)及び該二次光学部品(25)からなる群から選択される少なくとも1個の光学部品(23)が、少なくとも部分的に該コーティング(12)中に形成されている、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)に関する請求項9から13までのいずれか1項記載のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)。
- 該支持体(2、2′)に、縁部上まで又は縁部の直前までオプトエレクトロニクス部品(4)が取り付けられている、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)に関する請求項9から14までのいずれか1項記載のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)。
- 請求項1から6までのいずれか1項記載の方法により製造されているか又は製造できる、オプトエレクトロニクスチップオンボードモジュール(11〜11″′)に関する請求項9から15までのいずれか1項記載のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)。
- オプトエレクトロニクスチップオンボードモジュール(11〜11″′)に関する請求項9から16までのいずれか1項記載の2個以上のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)を有するシステムであって、
該オプトエレクトロニクスチップオンボードモジュール(11〜11″′)の該支持体(2、2′)が、同一平面上で又は定義された間隔で互いに隣り合って配置されており、その際に、特に該支持体(2、2′)へのオプトエレクトロニクス部品(4)の縁部の取り付けに基づき、隣接した支持体(2、2′)間の境界をも越えてオプトエレクトロニクス部品(4)の規則的な配置及び離間となることを特徴とする、2個以上のオプトエレクトロニクスチップオンボードモジュール(11〜11″′)を有するシステム。
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DE102010044471A DE102010044471A1 (de) | 2010-09-06 | 2010-09-06 | Beschichtungsverfahren für ein optoelektronisches Chip-On-Board-Modul |
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US9269836B2 (en) | 2016-02-23 |
KR20130043685A (ko) | 2013-04-30 |
JP6279531B2 (ja) | 2018-02-14 |
US8956922B2 (en) | 2015-02-17 |
US20130193592A1 (en) | 2013-08-01 |
CN103109587A (zh) | 2013-05-15 |
EP2614694B1 (de) | 2020-02-26 |
TW201216443A (en) | 2012-04-16 |
TWI518875B (zh) | 2016-01-21 |
CN103109587B (zh) | 2016-10-19 |
KR20160042158A (ko) | 2016-04-18 |
KR101660684B1 (ko) | 2016-09-27 |
WO2012031703A1 (de) | 2012-03-15 |
JP2013537005A (ja) | 2013-09-26 |
JP5882332B2 (ja) | 2016-03-09 |
EP2614694A1 (de) | 2013-07-17 |
US20150048407A1 (en) | 2015-02-19 |
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