JP4478028B2 - 発光素子において用いられる回折光学構造を製造するための方法 - Google Patents
発光素子において用いられる回折光学構造を製造するための方法 Download PDFInfo
- Publication number
- JP4478028B2 JP4478028B2 JP2004550602A JP2004550602A JP4478028B2 JP 4478028 B2 JP4478028 B2 JP 4478028B2 JP 2004550602 A JP2004550602 A JP 2004550602A JP 2004550602 A JP2004550602 A JP 2004550602A JP 4478028 B2 JP4478028 B2 JP 4478028B2
- Authority
- JP
- Japan
- Prior art keywords
- micro
- optical
- led
- light
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 14
- 238000009826 distribution Methods 0.000 claims abstract description 16
- 238000007493 shaping process Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 7
- 238000005266 casting Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 60
- 239000000463 material Substances 0.000 description 20
- 239000012780 transparent material Substances 0.000 description 15
- 239000004593 Epoxy Substances 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 8
- 238000004049 embossing Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
- G02B5/188—Plurality of such optical elements formed in or on a supporting substrate
- G02B5/1885—Arranged as a periodic array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Glass Compositions (AREA)
Description
115 155 A2には、LEDに接触するための電極を含むガラス板下に配置されるLEDのアレイ、およびLEDにより発される光を平行化するためのDOEのアレイをともなう光学コンピュータが示されている。
プからの光を平行化するだけのために設計され、したがって、複数のエレクトロルミネセンス素子が存在する場合またはLEDチップ(または他のエレクトロルミネセンス素子)のまわりに蛍光材料が配置される場合に対しては役に立たない、現在の技術とは対照的である。
換言すると、エレクトロルミネセンス素子1は発光表面および前記発光表面に対向する基部を含み、前記基部はハウジングおよび/または基板の内側面に取付けられ、発光表面は少なくとも部分的にハウジング2を充填するかまたは基板を被覆する少なくとも部分的に透明な材料3により被覆される。この少なくとも部分的に透明な材料3は第1の面を規定し、ある少なくとも部分的に透明な層が前記第1の面に固着し、前記第1の面に本質的に平行な第2の面を規定する。マイクロ光学要素12は前記第2の面に存在するマイクロ光学構造からなる。
1.チップを理想的な点源のアレイとしてモデル化する。各仮想源の分布はLEDチップの分布に一致するよう仮定され、つまり、ランベルティアンチップ分布に対しては各点源もランベルティアンであると仮定される。
おける電磁境界条件を介して接続され、必要とされる素子の物理的寸法は、それらの等式および境界条件を、考慮された空間のすべての点において同時に満足させる表面に対して解くことにより得られなければならない。
わかり、なぜならば、標準的な既製品のLEDを規格化された基礎層に標準的な手段で付加するだけでよいからである。
み付けされた平均である。中間部分52はさらなるコリメータとなり、それに衝突する光を軸の方向に向ける。ボーダーレンズ部分53はチップのハウジングの端縁部から反射される光を特に平行化するよう設計される。レンズは、ハウジングを、レンズから変動する距離をさらに有する二次的な拡張された源として考慮することにより設計される。
変換するための構造を表現したものである。図15はオーダ2の回転対称性を有する2つの別個の相対的に小さな光源の出力を変換するための構造を表現したものである。図16は、八角形の光源の出力を変換するための構造を表現したものである。光源の形状そのものに対応して、それは、(2つの交互する側部の長さを伴う八角形に対しては)オーダ4の、(正八角形に対しては)オーダ8の回転対称性を有する。
Claims (1)
- ハウジング(2)および/または基板に配されるエレクトロルミネセンス素子と関連して発光素子において用いられる回折光学構造を製造するための方法であって、回折光学構造はエレクトロルミネセンス素子(1)により発せられる光に影響するよう構成され、前記方法は、
点源からなるアレイとしてエレクトロルミネセンス素子(1)の発光をモデル化するステップを含み、各点源は全体としてエレクトロルミネセンス素子と同じ角光分布を有し、一方、強度は、選択肢として、エレクトロルミネセンス素子の局所的発光強度に適合され、前記方法はさらに、
エレクトロルミネセンス素子を出る光がハウジング(2)および/または基板によって回折光学構造に到達する前に反射される点に対応する二次的な点源の発光をモデル化し、二次的な点源の発光をランベルティアンであるとしてモデル化するステップと、
所望される光ビーム形状に対し、ビーム整形光学素子を各点源毎に設計するステップと、
すべての点源に対するビーム整形光学素子を結合させて、全体の光学的機能を生じさせるステップと、
全体的な光学的機能に従って回折光学構造に対し表面プロファイルを生じさせるステップとを含む、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02405977A EP1420462A1 (en) | 2002-11-13 | 2002-11-13 | Light emitting device |
PCT/CH2003/000721 WO2004044995A1 (en) | 2002-11-13 | 2003-11-04 | Light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006506803A JP2006506803A (ja) | 2006-02-23 |
JP4478028B2 true JP4478028B2 (ja) | 2010-06-09 |
Family
ID=32116357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004550602A Expired - Lifetime JP4478028B2 (ja) | 2002-11-13 | 2003-11-04 | 発光素子において用いられる回折光学構造を製造するための方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8487519B2 (ja) |
EP (3) | EP1420462A1 (ja) |
JP (1) | JP4478028B2 (ja) |
CN (1) | CN1739202B (ja) |
AT (1) | ATE362658T1 (ja) |
AU (1) | AU2003273712A1 (ja) |
DE (1) | DE60313884T2 (ja) |
HK (1) | HK1087246A1 (ja) |
TW (1) | TWI333697B (ja) |
WO (1) | WO2004044995A1 (ja) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070092330A (ko) * | 2003-04-16 | 2007-09-12 | 업스트림 엔지니어링 오와이 | 2d/3d 데이터 프로젝터 |
EP1622205A3 (en) * | 2004-07-29 | 2006-02-08 | Schott AG | Electronic package incorporating electronic components generating and/or receiving light-based signals |
KR101163091B1 (ko) | 2004-08-06 | 2012-07-20 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | Led 램프 시스템 |
DE102005028748A1 (de) * | 2004-10-25 | 2006-05-04 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes Halbleiterbauelement und Bauelementgehäuse |
ES2333231T3 (es) * | 2005-03-10 | 2010-02-18 | Nanogate Advanced Materials Gmbh | Diodo luminoso. |
EP1715521B1 (en) | 2005-04-21 | 2012-02-22 | C.R.F. Società Consortile per Azioni | Use of a transparent display having light-emitting diodes (LED) in a motor vehicle |
WO2006123917A1 (en) * | 2005-05-20 | 2006-11-23 | Luxpia Co., Ltd. | Light emitting diode package having a reflector cup by metal thin film and its manufacturing method |
WO2006126809A1 (en) * | 2005-05-26 | 2006-11-30 | Luxpia Co., Ltd. | Very small light emitting diode package and manufacturing methods of it |
DE102005026206A1 (de) * | 2005-06-07 | 2006-12-14 | Siemens Ag | Lichterzeugende Anordnung |
JP4449837B2 (ja) * | 2005-06-27 | 2010-04-14 | パナソニック電工株式会社 | 発光装置 |
WO2007031929A1 (en) * | 2005-09-16 | 2007-03-22 | Koninklijke Philips Electronics N.V. | Method for manufacturing led wafer with light extracting layer |
US7955531B1 (en) | 2006-04-26 | 2011-06-07 | Rohm And Haas Electronic Materials Llc | Patterned light extraction sheet and method of making same |
US7521727B2 (en) | 2006-04-26 | 2009-04-21 | Rohm And Haas Company | Light emitting device having improved light extraction efficiency and method of making same |
KR100770424B1 (ko) | 2006-12-13 | 2007-10-26 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
EP1962350A1 (en) * | 2007-02-22 | 2008-08-27 | LEXEDIS Lighting GmbH | Emitting surface of light emitting diode packages |
US9400394B2 (en) | 2007-05-14 | 2016-07-26 | Heptagon Micro Optics Pte. Ltd. | Illumination system |
WO2009006747A1 (en) * | 2007-07-12 | 2009-01-15 | Heptagon Oy | Optical element, illumination system and method of designing an optical element |
CN101918884A (zh) * | 2008-01-08 | 2010-12-15 | 杜比实验室特许公司 | 视差减小 |
EP2263037B1 (en) * | 2008-04-04 | 2019-03-20 | Lumileds Holding B.V. | Projection module for a headlamp |
DE102008021658A1 (de) | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung mit Volumenstrukturierung |
US20100260945A1 (en) * | 2009-02-13 | 2010-10-14 | Luminus Devices, Inc. | System and methods for optical curing using a reflector |
FR2947385B1 (fr) | 2009-06-26 | 2011-11-11 | Saint Gobain | Diode electroluminescente integrant un element optique plan a modulation d'indice de refraction |
US8253798B2 (en) * | 2010-02-03 | 2012-08-28 | Unitechno Corporation | Video surveillance device with infrared LED |
AT509562A1 (de) * | 2010-02-24 | 2011-09-15 | Thallner Erich | Leuchteinrichtung und verfahren zur herstellung einer solchen |
KR20130085373A (ko) | 2010-05-28 | 2013-07-29 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 빔 성형 광학 스택, 광원 및 조명기구 |
ES2408860B1 (es) * | 2011-12-13 | 2014-04-24 | Lledo Iluminación Sa | Luminaria led con simetría de revolución. |
JP2013190522A (ja) * | 2012-03-13 | 2013-09-26 | Stanley Electric Co Ltd | 光学素子、照明装置 |
CN102788281B (zh) * | 2012-08-13 | 2014-11-05 | 无锡奥普顿光电子有限公司 | 一种用于led照明的二次光学元件 |
KR102008315B1 (ko) | 2013-01-23 | 2019-10-21 | 삼성전자주식회사 | 발광 소자 패키지 |
US9696199B2 (en) * | 2015-02-13 | 2017-07-04 | Taiwan Biophotonic Corporation | Optical sensor |
DE102016116439A1 (de) | 2016-09-02 | 2018-03-08 | Osram Opto Semiconductors Gmbh | Anordnung mit einem Gehäuse mit einem strahlungsemittierenden optoelektronischen Bauelement |
DE102016116468A1 (de) | 2016-09-02 | 2018-03-08 | Osram Opto Semiconductors Gmbh | Optoelektronische anordnung |
CN110741202B (zh) * | 2017-06-19 | 2022-04-19 | 昕诺飞控股有限公司 | 用于led的输出透镜和形成输出透镜的方法 |
DE102018126297A1 (de) * | 2018-10-23 | 2020-04-23 | HELLA GmbH & Co. KGaA | Beleuchtungsvorrichtung für Fahrzeuge |
DE102018221634A1 (de) * | 2018-12-13 | 2020-06-18 | Osram Gmbh | Vorrichtung zum entkeimen eines fluids |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1966059A (en) * | 1933-03-13 | 1934-07-10 | George Slaff | Production of white light |
JPS55113387A (en) * | 1979-02-22 | 1980-09-01 | Sanyo Electric Co Ltd | Light emitting diode indicator |
US4843280A (en) * | 1988-01-15 | 1989-06-27 | Siemens Corporate Research & Support, Inc. | A modular surface mount component for an electrical device or led's |
US5130531A (en) * | 1989-06-09 | 1992-07-14 | Omron Corporation | Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens |
DE3929477A1 (de) * | 1989-09-05 | 1991-03-07 | Siemens Ag | Led-anordnung |
JPH05102528A (ja) * | 1991-10-11 | 1993-04-23 | Omron Corp | 光半導体素子 |
AU694619B2 (en) * | 1995-03-03 | 1998-07-23 | Minnesota Mining And Manufacturing Company | Light directing film having variable height structured surface and light directing article constructed therefrom |
JPH08330635A (ja) | 1995-05-30 | 1996-12-13 | Canon Inc | 発光装置 |
DE19527026C2 (de) * | 1995-07-24 | 1997-12-18 | Siemens Ag | Optoelektronischer Wandler und Herstellverfahren |
DE19600306C1 (de) * | 1996-01-05 | 1997-04-10 | Siemens Ag | Halbleiter-Bauelement, insb. mit einer optoelektronischen Schaltung bzw. Anordnung |
US5698941A (en) * | 1996-01-16 | 1997-12-16 | Motorola | Optical correction layer for a light emitting apparatus |
US5919551A (en) * | 1996-04-12 | 1999-07-06 | 3M Innovative Properties Company | Variable pitch structured optical film |
US6102552A (en) * | 1996-10-18 | 2000-08-15 | Hewlett-Packard Company | Laser-array based digital illuminator |
AU1307999A (en) * | 1997-11-06 | 1999-05-31 | Donnelly Corporation | Light emitting element having an optical element molded in surface thereof |
FR2785364B1 (fr) | 1998-11-03 | 2000-12-22 | Valeo Vision | Feu de signalisation a diffraction, notamment pour vehicule automobile |
US6752505B2 (en) * | 1999-02-23 | 2004-06-22 | Solid State Opto Limited | Light redirecting films and film systems |
GB9919689D0 (en) | 1999-08-19 | 1999-10-20 | Microsharp Corp Limited | Back-lighting arrangement and the like |
CN1311566C (zh) * | 1999-11-30 | 2007-04-18 | 欧姆龙株式会社 | 光学器件的制造方法及其获得的产品 |
JP3652945B2 (ja) * | 1999-12-28 | 2005-05-25 | 松下電器産業株式会社 | 光情報処理装置 |
CN2426640Y (zh) * | 2000-05-19 | 2001-04-11 | 张开开 | 定向光高效发光二极管 |
GB0017658D0 (en) * | 2000-07-19 | 2000-09-06 | Secr Defence | Light emitting diodes |
JP2002076440A (ja) | 2000-08-28 | 2002-03-15 | Stanley Electric Co Ltd | 発光装置及び光空間伝送装置 |
US6891200B2 (en) | 2001-01-25 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
MXPA04000043A (es) * | 2001-07-16 | 2005-08-16 | Ics Intelligent Control System | Foprmacion difragente de la distribucion de intensidades de un haz luminoso espacialmente parcialmente coherente. |
-
2002
- 2002-11-13 EP EP02405977A patent/EP1420462A1/en not_active Withdrawn
-
2003
- 2003-11-04 CN CN2003801086175A patent/CN1739202B/zh not_active Expired - Lifetime
- 2003-11-04 AT AT03757622T patent/ATE362658T1/de not_active IP Right Cessation
- 2003-11-04 US US10/533,966 patent/US8487519B2/en active Active
- 2003-11-04 DE DE60313884T patent/DE60313884T2/de not_active Expired - Lifetime
- 2003-11-04 JP JP2004550602A patent/JP4478028B2/ja not_active Expired - Lifetime
- 2003-11-04 WO PCT/CH2003/000721 patent/WO2004044995A1/en active IP Right Grant
- 2003-11-04 AU AU2003273712A patent/AU2003273712A1/en not_active Abandoned
- 2003-11-04 EP EP07008822A patent/EP1808904A1/en not_active Ceased
- 2003-11-04 EP EP03757622A patent/EP1561246B1/en not_active Expired - Lifetime
- 2003-11-10 TW TW092131429A patent/TWI333697B/zh not_active IP Right Cessation
-
2006
- 2006-06-27 HK HK06107260.2A patent/HK1087246A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20060279955A1 (en) | 2006-12-14 |
HK1087246A1 (en) | 2006-10-06 |
JP2006506803A (ja) | 2006-02-23 |
EP1561246A1 (en) | 2005-08-10 |
US8487519B2 (en) | 2013-07-16 |
CN1739202A (zh) | 2006-02-22 |
TWI333697B (en) | 2010-11-21 |
DE60313884D1 (de) | 2007-06-28 |
CN1739202B (zh) | 2010-06-09 |
TW200410417A (en) | 2004-06-16 |
AU2003273712A1 (en) | 2004-06-03 |
DE60313884T2 (de) | 2008-01-17 |
EP1420462A1 (en) | 2004-05-19 |
EP1808904A1 (en) | 2007-07-18 |
WO2004044995A1 (en) | 2004-05-27 |
EP1561246B1 (en) | 2007-05-16 |
ATE362658T1 (de) | 2007-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4478028B2 (ja) | 発光素子において用いられる回折光学構造を製造するための方法 | |
JP6279531B2 (ja) | オプトエレクトロニクスチップオンボードモジュール用のコーティング法 | |
CN110196528B (zh) | 微型化光学投射模块 | |
JP6355558B2 (ja) | 改善された光学系を備えているオプトエレクトロニクスモジュール | |
US20060044806A1 (en) | Light emitting diode system packages | |
US10345611B2 (en) | Illumination system | |
JP7436369B2 (ja) | ランバート分布を有する光をバットウィング分布に変換するマイクロ構造 | |
CN217981833U (zh) | ToF发射模组及包含其的电子设备 | |
TW202131054A (zh) | 光學系統、照明系統以及使用此光學系統的方法 | |
JP6364929B2 (ja) | 蓄光部材 | |
US20160149101A1 (en) | Optoelectronic semiconductor component | |
JP7106824B2 (ja) | 光照射装置 | |
TW202332937A (zh) | 光學系統裝置以及光學系統裝置的製造方法 | |
JP2014203604A (ja) | 照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090428 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090721 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090818 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091110 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20091214 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100216 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100312 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4478028 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130319 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130319 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130319 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140319 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |