WO2016049938A1 - 一种led全周光光源及其制作方法 - Google Patents

一种led全周光光源及其制作方法 Download PDF

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Publication number
WO2016049938A1
WO2016049938A1 PCT/CN2014/088071 CN2014088071W WO2016049938A1 WO 2016049938 A1 WO2016049938 A1 WO 2016049938A1 CN 2014088071 W CN2014088071 W CN 2014088071W WO 2016049938 A1 WO2016049938 A1 WO 2016049938A1
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WIPO (PCT)
Prior art keywords
liner
led
lead
light
chip
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PCT/CN2014/088071
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English (en)
French (fr)
Inventor
叶逸仁
郑香奕
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东莞保明亮环保科技有限公司
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Priority to PCT/CN2014/088071 priority Critical patent/WO2016049938A1/zh
Publication of WO2016049938A1 publication Critical patent/WO2016049938A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the invention relates to the field of LED light sources, in particular to an LED full-circumference light source and a manufacturing method thereof.
  • LEDs light-emitting diodes
  • the LED light source is to place the LED chip on a predetermined placement position of the substrate.
  • the solid crystal glue is placed on the placed position, and baked at a high temperature of 150 ° C - 180 ° C for at least 60 minutes to make the LED chip.
  • Fixed on the substrate then soldering the wire process, soldering one end of the gold wire to the P and N poles of the chip, and soldering the other end to the substrate; then encapsulating with epoxy or silicone and baking at 150 ° C At least 4 hours; then the metal substrate on which the LED chip is cured is connected to the heat sink by epoxy resin, and the entire circuit board is screwed to a larger heat sink.
  • the LED light source has the following disadvantages: 1.
  • the production assembly process is cumbersome, the time is long, and the structure of the light source is complicated, which is not conducive to mass production; 2.
  • the substrate is limited by the planar design of the circuit board, and the LED is limited.
  • the shape specification of the luminaire makes the shape and specification of the LED luminaire single, and the space of the illuminating surface is small; 3.
  • the package of the LED chip needs to provide the substrate corresponding to the LED chip, which increases the cost and blocks part of the light source.
  • the present invention provides an LED full-circumference light source with simple structure, simple production and assembly, low cost, wide luminous surface, and arbitrarily set different shapes, and a manufacturing method thereof, which can effectively solve the existing LED light source.
  • the structure is complicated, the production and assembly process is cumbersome, and the production cost is high.
  • an LED full-circumference light source comprising:
  • the lining layer is provided with at least two LED chips, the P and N poles of the LED chip are exposed outside the lining layer, and the LED chips are electrically connected;
  • Two leads, one end of the lead is disposed in the lining layer, electrically connected to the LED chip, and the other end of the lead extends outside the lining layer;
  • An encapsulation layer is over the liner layer, and the LED chip and the lead are disposed between the liner layer and the encapsulation layer; wherein the liner layer and the encapsulation layer are mixed light-conducting and thermally conductive fillers; UV curable glue for phosphors.
  • the LED chip and the lead are electrically connected by vacuum coating or a conductive adhesive layer or a bonding wire.
  • a method for manufacturing an LED full-circumference light source comprising the following steps:
  • a UV-curable adhesive liner of a mixed light-conducting thermally conductive filler and a phosphor providing a liner mold, the liner mold being made of a light transmissive material, including PP, PE, ⁇ a glue or glass, the liner mold is provided with a liner groove and a lead groove, the liner mold is fixed and closely attached to the chip adhesive board, and then the lead is placed on the lead groove, wherein the liner The groove corresponds to the LED chip adhered to the chip adhesive board, and the UV-curable rubber mixed with the light-conducting heat-conductive filler and the phosphor is poured into the liner groove by a robot, and the mixed light is guided by the UV curing machine. Light-curing curing of the thermally conductive filler and the phosphor, so that the LED chip is embedded in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor;
  • step C Connect the chip, use a vacuum coating machine to plate the conductive material on the P and N poles of each adjacent LED chip in step B and the lead, and then solidify the conductive material to electrically connect the LED chip and the lead wire. ;
  • the package mold is made of a light transmissive material, the light transmissive material comprises PP, PE, silicone or glass, and the package mold is provided with a package groove, and the package mold is Fixed and stuck in step B
  • the package groove corresponds to the liner hole, and a robot is used to inject the light-guided heat-conductive filler and the phosphor-curable UV-curable glue into the package tank, and then the UV curing machine is used.
  • the mixed light-guided thermally conductive filler and the UV-cured adhesive of the phosphor are photocured to form a semi-finished product, and the liner mold and the package mold are further separated.
  • step E Fix the semi-finished product in step D on the mold base, and use the laser cutting machine to cut and separate according to the actual set shape.
  • step C the LED chip and the lead wire can also be electrically connected by means of a conductive adhesive or a bonding wire.
  • step B the lining mold has at least one lining groove.
  • step D the package mold has at least one package slot.
  • the curing time of the UV curing machine is 1-100 seconds.
  • the light-conducting and thermally conductive filler of the UV-curable adhesive of the light-conducting thermally conductive filler and the phosphor comprises nanometer or micron-sized alumina, magnesia, zinc oxide, cerium oxide, silicon oxide, glass powder. One or more.
  • the light source structure is very simple, which is conducive to mass production
  • the LED chip encapsulated in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor can achieve the full-circumference illumination effect without the barrier of the substrate.
  • Figure 1 is a schematic view of the structure of the present invention
  • Figure 2 is a schematic view of the package of the present invention.
  • Figure 3 is a schematic view of the finished product of the present invention.
  • FIG. 4 is a schematic view of a finished product according to another embodiment of the present invention.
  • an LED full-circumference light source comprising: a lining layer 1, the lining layer 1 is provided with at least two LED chips 3, the P and N poles of the LED chip 3 are exposed outside the lining layer 1, the LED chips 3 are electrically connected; two leads 5, one end of the lead 5 is disposed at the In the lining layer 1, electrically connected to the LED chip 3, the other end of the lead extends to the outside of the lining layer 1; an encapsulation layer 2, the encapsulation layer 2 covers the lining layer 1
  • the LED chip 3 and the lead 5 are disposed between the lining layer 1 and the encapsulating layer 2; wherein the lining layer 1 and the encapsulating layer 2 are UV curable adhesives for mixing the light-conducting thermally conductive filler and the phosphor.
  • the LED chip 3 and the lead 5 are electrically connected by vacuum coating or a conductive adhesive layer or a bonding wire.
  • the lining layer 1 and the encapsulating layer 2 can be formed into various shapes as shown in FIG. 3, and the shape of the finished product is square. As shown in FIG. 4, the shape of the finished product is elliptical.
  • a UV-curable adhesive liner of a mixed light-conducting thermally conductive filler and a phosphor providing a liner mold, the liner mold being made of a light transmissive material, including PP, PE, ⁇ a glue or glass, the liner mold is provided with a liner groove and a lead groove, the liner mold is fixed and closely attached to the chip adhesive board, and then the lead is placed on the lead groove, wherein the liner The groove corresponds to the LED chip adhered to the chip adhesive board, and the UV-curable rubber mixed with the light-conducting heat-conductive filler and the phosphor is poured into the liner groove by a robot, and the mixed light is guided by the UV curing machine. Light-curing curing of the thermally conductive filler and the phosphor, so that the LED chip is embedded in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor;
  • step C Connect the chip, use a vacuum coating machine to plate the conductive material on the P and N poles of each adjacent LED chip in step B and the lead, and then solidify the conductive material to electrically connect the LED chip and the lead wire. ;
  • the package mold is made of a light transmissive material, the light transmissive material comprises PP, PE, silicone or glass, and the package mold is provided with a package groove, and the package mold is Fixed and stuck in step B
  • the package groove corresponds to the liner hole, and a robot is used to inject the light-guided heat-conductive filler and the phosphor-curable UV-curable glue into the package tank, and then the UV curing machine is used.
  • the mixed light-guided thermally conductive filler and the UV-cured adhesive of the phosphor are photocured to form a semi-finished product, and the liner mold and the package mold are further separated.
  • step E Fix the semi-finished product in step D on the mold base, and use the laser cutting machine to cut and separate according to the actual set shape, which is a finished product, and the shape thereof may be a circle, a star shape, an elliptical shape or a heart shape and various other shapes. .
  • step C the LED chip and the lead wire can also be electrically connected by means of a conductive adhesive or a bonding wire.
  • the lining die has at least one lining groove, and the lining groove can be formed into various shapes such as a circle, a star shape, an elliptical shape or a heart shape and various other shapes.
  • the package mold has at least one package groove, and the package hole can be formed into various shapes such as a circle, a star shape, an elliptical shape or a heart shape, and other various shapes.
  • the curing time of the UV curing machine is 1-100 seconds.
  • the conductive material comprises aluminum, copper, gold, silver, tin, AZO, ATO or ITO.
  • the light-conducting and thermally conductive filler of the UV-curable adhesive of the light-conducting thermally conductive filler and the phosphor comprises nanometer or micron-sized alumina, magnesia, zinc oxide, cerium oxide, silicon oxide, glass powder. One or more.
  • the light-guided thermally conductive filler UV-curing adhesive of the mixed light-conducting thermally conductive filler and the phosphor comprises a component per unit mass: 5-60% of the modified acrylic oligomer; 10-70% of the acrylic monomer; photoinitiator 2-5%; auxiliaries 0-1%; light-guided thermally conductive filler 5-30%.
  • the mixed light-guided thermally conductive filler UV-curable adhesive specifically uses a unit mass percentage of the following components: modified acrylic oligomer 10%; acrylic monomer 60%; photoinitiator 3%; 1% of the agent; light-guided thermal conductive filler 26%.
  • the modified acrylic oligomer includes: an epoxy acrylate oligomer, a tertiary amine co-initiator oligomer, a pure acrylate oligomer, a silicone acrylate oligomer, and a fat.
  • an epoxy acrylate oligomer e.g., an epoxy acrylate oligomer, a tertiary amine co-initiator oligomer, a pure acrylate oligomer, a silicone acrylate oligomer, and a fat.
  • One or more of a group of urethane acrylate oligomers, aromatic urethane acrylate oligomers, polyester acrylate oligomers, and amine modified polyester acrylate oligomers e.g., an epoxy acrylate oligomer, a tertiary amine co-initiator oligomer, a pure acrylate oligomer, a silicone acrylate oligomer,
  • the acrylic monomer includes one or more of a monofunctional monomer, a difunctional monomer, a trifunctional monomer, and a polyfunctional monomer.
  • the photoinitiator includes: 2-isopropylthioxanthone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, 2-benzyl -2-dimethylamino-1-(4-morpholinylphenyl)butanone, 2-trimethylbenzoyl-diphenylphosphine oxide, 4- Trimethylbenzoyl-diphenylphosphine oxide, 6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1- One or more of phenylacetone, 4-benzoyl-4'-methyldiphenyl sulfide, and 1-hydroxycyclohexyl phenyl ketone.
  • the auxiliary agent includes one or more of a silane coupling agent, a titanate coupling agent, a wetting agent, an antifoaming agent, a thickener, an antioxidant, an anti-yellowing agent, and an anti-settling agent. .
  • the light-conducting thermally conductive filler comprises one or more of aluminum oxide, magnesium oxide, zinc oxide, cerium oxide, silicon oxide, and glass powder of nanometer or micrometer order.
  • the mixed light-guided thermally conductive filler and the UV-curable adhesive of the phosphor have better thermal conductivity and can effectively replace the fixing and heat dissipation of the substrate.
  • the lead wire When the invention is used, only the lead wire needs to be inserted into the power source to emit light. Since the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor is used instead of the lining plate, the LED chip emits light without being hindered by the substrate, so Achieve full-circumference effect.
  • the light source structure is very simple, which is conducive to mass production
  • the LED chip encapsulated in the UV-curable adhesive of the mixed light-conducting heat-conductive filler and the phosphor can achieve the full-circumference illumination effect without the barrier of the conventional substrate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
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Abstract

一种LED全周光光源及其制作方法。该LED全周光光源制作步骤包括放置芯片（3）、黏芯片（3）、制作混合导光导热填料及荧光粉的UV固化胶衬板（1）、连通芯片（3）、封装。LED全周光光源包括一衬板层（1）、两条引线（5）和一封装层（2）。衬板层（1）上设有至少两个LED芯片（3），LED芯片（3）的P、N极裸露在衬板层（1）外，LED芯片（3）间电性连接。引线一端设于衬板层（1）内，与LED芯片（3）电性连接，引线另一端延伸至衬板层（1）外。封装层（2）覆盖在衬板层（1)上方。LED芯片（3）和引线（5）设于衬板层（1）和封装层（2）间。衬板层（1）、封装层（2）为混合导光导热填料及荧光粉的UV固化胶。该LED全周光光源结构简单、生产组装简便、成本低廉、发光面广并可随意设置不同形状。

Description

一种LED全周光光源及其制作方法 技术领域
本发明涉及LED灯源领域，尤指一种LED全周光光源及其制作方法。
背景技术
传统灯泡的耗电高，已不符节约能源的要求，且对于环保所产生的问题也日益严重，因此，现阶段则发展发光二极管(LED) 的照明技术代替传统灯泡，以达成节约能源以及解决环保问题的目的。
通常，LED灯源是将LED芯片放置在基板预定的放置位置上，芯片放置前先在放置的位子点上固晶胶，并在150℃-180℃高温下烘烤至少60分钟，使LED芯片固定在基板上；然后焊进行线工序，将金线一端焊接在芯片的P、N极上，另一端焊接在基板上；再使用环氧树脂或矽胶进行封装并在150℃高温下烘烤至少4小时；之后利用环氧树脂将上述固化有LED芯片的金属基板与散热器连接，再将整个电路板用螺丝固定于更大的散热器上。
此LED灯源存在以下缺点：1.生产组装工艺繁琐，时间长，且灯源的结构复杂，不利于批量生产；2.基板受限于电路板平面设计影响，局限了LED 灯具的形状规格，使LED 灯具的形状规格单一，发光面的空间较小；3.LED芯片的封装都需要提供对应LED芯片放置的基板，增加成本，且阻挡了部分光源。
发明内容
为解决上述问题，本发明提供一种结构简单、生产组装简便、成本低廉、发光面广并可随意设置不同形状的LED全周光光源及其制作方法，其能有效地解决现有LED光源中结构复杂、生产组装工序繁琐、生产成本高的问题。
为实现上述目，本发明采用的技术方案是：一种LED全周光光源，包括：
一衬板层，所述的衬板层上设有至少两个LED芯片，所述的LED芯片的P、N极裸露在所述衬板层外，所述LED芯片间电性连接；
两条引线，所述引线一端设于所述衬板层内，与所述LED芯片电性连接，所述引线另一端延伸至衬板层外；
一封装层，所述封装层覆盖在所述衬板层上方，所述的LED芯片和引线设于衬板层和封装层间；其中所述衬板层、封装层为混合导光导热填料及荧光粉的UV固化胶。
其中，所述LED芯片和引线通过真空镀膜或导电胶层或焊线的方式电性连接。
一种LED全周光光源的制作方法，包括以下步骤：
A.放置芯片，提供一种芯片黏板、定芯机；所述芯片黏板表面贴有局部黏性胶带并固定在所述定芯机的一侧，所述定芯机设有机械手；所述定芯机通过机械手将LED芯片放置在所述芯片黏板表面的局部黏性胶带的局部黏性部位；
B.制作混合导光导热填料及荧光粉的UV固化胶衬板，提供一种衬板模，所述衬板模由透光性材料制成，所述透光性材料包括PP、PE、矽胶或玻璃，所述衬板模设有衬板槽和引线槽，将所述衬板模固定并紧贴在所述芯片黏板上，然后将引线放置在所述引线槽上，其中衬板槽与粘黏在芯片黏板上的LED芯片相对应，利用机械手将混合导光导热填料及荧光粉的UV固化胶灌注在所述衬板槽内，再用UV固化机将所述混合导光导热填料及荧光粉的UV固化胶光固化，使所述LED芯片嵌入在所述混合导光导热填料及荧光粉的UV固化胶内；
C.连通芯片，使用真空镀膜机将导电材料镀覆在步骤B中的各相邻LED芯片的P、N极上和引线上，再将所述导电材料固化，使LED芯片和引线电性连接；
D.封装，提供一种封装模，所述封装模由透光性材料制成，所述透光性材料包括PP、PE、矽胶或玻璃，所述封装模设有封装槽，将封装模固定并紧贴在步骤B 中的衬板模上，所述封装槽对应在所述衬板孔上，使用机械手将混合导光导热填料及荧光粉的UV固化胶灌注在所述封装槽内，再用UV固化机将所述混合导光导热填料及荧光粉的UV固化胶光固化，形成半成品，再将所述衬板模、封装模拆分。
E.将步骤D中的半成品固定在模架上，使用激光切割机依据实际设定形状进行切割分离即为成品。
其中，步骤C中，LED芯片和所述引线还可以通过导电胶或焊线的方式电性连接。
其中，步骤B中，所述衬板模至少有一个衬板槽。
其中，步骤D中，所述封装模至少有一个封装槽。
其中，步骤B、D中，UV固化机的固化时间为1-100秒。
其中，步骤B、D中，混合导光导热填料及荧光粉的UV固化胶的导光导热填料包括纳米或微米级的氧化铝,氧化镁,氧化锌,氧化钇,氧化硅,玻璃粉末中的一种或多种。
本发明的有益效果在于：
1.灯源结构非常简单，有利于大批量化的生产；
2.直接利用混合导光导热填料及荧光粉的UV固化胶作为衬板和封装层，具有较好的导热导光性，可以代替基板的使用，节省了成本；
3.不受基板形状构造的限定，可根据不同场合的使用需要，做成各种各样的灯源形状，增加美观度；
4.封装在混合导光导热填料及荧光粉的UV固化胶内的LED芯片由于没有了基板的阻挡，可达到全周光的照射效果。
附图说明
图1 是本发明的结构示意图；
图2 是本发明的封装示意图；
图3 是本发明成品示意图；
图4 是本发明另一实施例成品示意图；
具体实施方式
通过具体实施例对本发明作进一步说明。
实施例1
请参阅图1-4所示，其显示了本发明之较佳实施例的具体结构，一种LED全周光光源，包括：一衬板层1，所述衬板层1上设有至少两个LED芯片3，所述的LED芯片3的P、N极裸露在所述衬板层1外，所述LED芯片3间电性连接；两条引线5，所述的引线5一端设于所述衬板层1内，与所述LED芯片3电性连接，所述引线的另一端延伸至衬板层1外；一封装层2，所述封装层2覆盖在所述衬板层1上方，所述的LED芯片3和引线5设于衬板层1和封装层2间；其中所述衬板层1、封装层2为混合导光导热填料及荧光粉的UV固化胶。
具体地，所述LED芯片3和引线5通过真空镀膜或导电胶层或焊线的方式电性连接。
所述衬板层1、封装层2可做成各种不同的形状如图3所示，成品的形状为正方形，如图4所示，成品的形状为椭圆形。
实施例2
本发明的具体制作工艺如下：
A.放置芯片，提供一种芯片黏板、定芯机；所述芯片黏板表面贴有局部黏性胶带并固定在所述定芯机的一侧，所述定芯机设有机械手；所述定芯机通过机械手将LED芯片放置在所述芯片黏板表面的局部黏性胶带的局部黏性部位；
B.制作混合导光导热填料及荧光粉的UV固化胶衬板，提供一种衬板模，所述衬板模由透光性材料制成，所述透光性材料包括PP、PE、矽胶或玻璃，所述衬板模设有衬板槽和引线槽，将所述衬板模固定并紧贴在所述芯片黏板上，然后将引线放置在所述引线槽上，其中衬板槽与粘黏在芯片黏板上的LED芯片相对应，利用机械手将混合导光导热填料及荧光粉的UV固化胶灌注在所述衬板槽内，再用UV固化机将所述混合导光导热填料及荧光粉的UV固化胶光固化，使所述LED芯片嵌入在所述混合导光导热填料及荧光粉的UV固化胶内；
C.连通芯片，使用真空镀膜机将导电材料镀覆在步骤B中的各相邻LED芯片的P、N极上和引线上，再将所述导电材料固化，使LED芯片和引线电性连接；
D.封装，提供一种封装模，所述封装模由透光性材料制成，所述透光性材料包括PP、PE、矽胶或玻璃，所述封装模设有封装槽，将封装模固定并紧贴在步骤B 中的衬板模上，所述封装槽对应在所述衬板孔上，使用机械手将混合导光导热填料及荧光粉的UV固化胶灌注在所述封装槽内，再用UV固化机将所述混合导光导热填料及荧光粉的UV固化胶光固化，形成半成品，再将所述衬板模、封装模拆分。
E.将步骤D中的半成品固定在模架上，使用激光切割机依据实际设定形状进行切割分离即为成品,其形状可以为圆形,星形、椭圆形或心形及其他各种形状。
其中，步骤C中，LED芯片和所述引线还可以通过导电胶或焊线的方式电性连接。
其中，步骤B中，所述衬板模至少有一个衬板槽，所述衬板槽可以做成各种不同的形状如圆形、星形、椭圆形或心形及其他各种形状。
其中，步骤D中，所述封装模至少有一个封装槽，所述封装孔可以做成各种不同的形状如圆形、星形、椭圆形或心形及其他各种形状。
其中，步骤B、D中，UV固化机的固化时间为1-100秒。
其中，步骤C中，导电材料包括铝、铜、金、银、锡、AZO、ATO或ITO。
其中，步骤B、D中，混合导光导热填料及荧光粉的UV固化胶的导光导热填料包括纳米或微米级的氧化铝,氧化镁,氧化锌,氧化钇,氧化硅,玻璃粉末中的一种或多种。
本发明中，混合导光导热填料及荧光粉的导光导热填料UV固化胶包括单位质量百分比的成分为：改性丙烯酸齐聚物5-60%；丙烯酸单体10-70%；光引发剂2-5%；助剂0-1%；导光导热填料5-30%。
作为一种较优的实施方案，所述混和导光导热填料UV固化胶具体采用单位质量百分比的成分如下：改性丙烯酸齐聚物10%；丙烯酸单体60%；光引发剂3%；助剂1%；导光导热填料26%。
具体而言，所述的改性丙烯酸齐聚物包括有：环氧丙烯酸酯齐聚物、三级胺共引发剂齐聚物、纯丙烯酸酯齐聚物、有机硅丙烯酸酯齐聚物、脂肪族聚氨酯丙烯酸酯齐聚物、芳香族聚氨酯丙烯酸酯齐聚物、聚酯丙烯酸酯齐聚物、胺改质聚酯类丙烯酸酯齐聚物中的一种或多种。
所述的丙烯酸单体包括有：单官能基单体、双官能基单体、三官能基单体、多官能基单体中的一种或多种。
所述的光引发剂包括有：2-异丙基硫杂蒽酮、2-甲基-1-(4-甲硫基苯基)-2-吗啉基-1-丙酮、2-苄基-2-二甲基氨基-1-(4-吗啉苯基)丁酮、2-三甲基苯甲酰基-二苯基氧化膦、4- 三甲基苯甲酰基- 二苯基氧化膦、6- 三甲基苯甲酰基- 二苯基氧化膦、2-羟基-2-甲基-1- 苯基丙酮、4-苯甲酰基-4′-甲基二苯硫醚、1-羟基环己基苯基甲酮中的一种或多种。
所述的助剂包括有：硅烷偶联剂、钛酸酯偶联剂、润湿剂、消泡剂、增稠剂、抗氧化剂、抗黄变剂、防沉剂中的一种或多种。
所述导光导热填料包括有纳米或微米级的氧化铝、氧化镁、氧化锌、氧化钇、氧化硅、玻璃粉中的一种或多种。
所述混合导光导热填料及荧光粉的UV固化胶具有较好的导热导光性，能有效地代替基板的固定和散热作用。
所混合导光导热填料及荧光粉的UV固化胶的述制作方法：
取单位质量百分比的改性丙烯酸齐聚物10%、丙烯酸单体60%、光引发剂3%、助剂1%、导光导热填料26%至搅拌机搅拌，使各种组分充分混合，搅拌时间为5-30分钟；搅拌完成后，再将物料转移至三辊研磨机，将物料充分研磨分散，研磨时间为5-30分钟，即可成品。
本发明使用时，仅需将所述引线***至电源，即可发光，由于使用混合导光导热填料及荧光粉的UV固化胶代替衬板，因此，LED芯片发光不受基板的阻碍，因此可达到全周光的效果。
本发明的有益效果在于：
1.灯源结构非常简单，有利于大批量化的生产；
2.直接利用混合导光导热填料及荧光粉的UV固化胶作为衬板和封装层，具有较好的导热导光性，可以代替基板的使用，节省了成本；
3.不受基板形状构造的限定，可根据不同场合的使用需要，做成各种各样的灯源形状，增加美观度；
4.封装在混合导光导热填料及荧光粉的UV固化胶内的LED芯片由于没有了传统基板的阻挡，可达到全周光的照射效果。
以上实施方式仅仅是对本发明的优选实施方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通工程技术人员对本发明的技术方案作出的各种变形和改进，均应落入本发明的权利要求书确定的保护范围内。

Claims (8)

  1. 一种LED全周光光源，其特征在于，包括：
    一衬板层，所述的衬板层上设有至少两个LED芯片，所述的LED芯片的P、N极裸露在所述衬板层外，所述LED芯片间电性连接；
    两条引线，所述引线一端设于所述衬板层内，与所述LED芯片电性连接，所述引线另一端延伸至衬板层外；
    一封装层，所述封装层覆盖在所述衬板层上方，所述的LED芯片和引线设于衬板层和封装层间；其中所述衬板层、封装层为混合导光导热填料及荧光粉的UV固化胶。
  2. 根据权利要求1所述的一种LED全周光光源，其特征在于，所述LED芯片和引线通过真空镀膜或导电胶层或焊线的方式电性连接。
  3. 一种LED全周光光源的制作方法，其特征在于，包括以下步骤：
    A.放置芯片，提供一种芯片黏板、定芯机；所述芯片黏板表面贴有局部黏性胶带并固定在所述定芯机的一侧，所述定芯机设有机械手；所述定芯机通过机械手将LED芯片放置在所述芯片黏板表面的局部黏性胶带的局部黏性部位；
    B.制作混合导光导热填料及荧光粉的UV固化胶衬板，提供一种衬板模，所述衬板模由透光性材料制成，所述透光性材料包括PP、PE、矽胶或玻璃，所述衬板模设有衬板槽和引线槽，将所述衬板模固定并紧贴在所述芯片黏板上，然后将引线放置在所述引线槽上，其中衬板槽与粘黏在芯片黏板上的LED芯片相对应，利用机械手将混合导光导热填料及荧光粉的UV固化胶灌注在所述衬板槽内，再用UV固化机将所述混合导光导热填料及荧光粉的UV固化胶光固化，使所述LED芯片嵌入在所述混合导光导热填料及荧光粉的UV固化胶内；
    C.连通芯片，使用真空镀膜机将导电材料镀覆在步骤B中的各相邻LED芯片的P、N极上和引线上，使LED芯片和引线电性连接；或使用印刷机将导电胶印在步骤B中的各相邻LED芯片的P、N极上和引线上，再将所述导电材料固化，使LED芯片和引线电性连接；或使用焊线机将金属线焊在步骤B中的各相邻LED芯片的P、N极上和引线上，使LED芯片和引线电性连接；
    D.封装，提供一种封装模，所述封装模由透光性材料制成，所述透光性材料包括PP、PE、矽胶或玻璃，所述封装模设有封装槽，将封装模固定并紧贴在步骤B 中的衬板模上，所述封装槽对应在所述衬板孔上，使用机械手将混合导光导热填料及荧光粉的UV固化胶灌注在所述封装槽内，再用UV固化机将所述混合导光导热填料及荧光粉的UV固化胶光固化，形成半成品，再将所述衬板模、封装模拆分。
    E.将步骤D中的半成品固定在模架上，使用激光切割机依据实际设定形状进行切割分离即为成品。
  4. 根据权利要3所述的一种LED全周光光源的制作方法，其特征在于，步骤B中，所述衬板模至少有一个衬板槽。
  5. 根据权利要3所述的一种LED全周光光源的制作方法，其特征在于，步骤D中，所述封装模至少有一个封装槽。
  6. 根据权利要3所述的一种LED全周光光源的制作方法，其特征在于，步骤B和D中，UV固化机的固化时间为1-100秒。
  7. 根据权利要3所述的一种LED全周光光源的制作方法，其特征在于，步骤C中，导电材料包括铝、铜、金、银、锡、AZO、ATO或ITO。
  8. 根据权利要3所述的一种LED全周光光源的制作方法，其特征在于，步骤B和D中，混合导光导热填料及荧光粉的UV固化胶的导光导热填料包括纳米或微米级的氧化铝,氧化镁,氧化锌,氧化钇,氧化硅,玻璃粉中的一种或多种。
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