JP2015212399A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物 Download PDFInfo
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- JP2015212399A JP2015212399A JP2015146610A JP2015146610A JP2015212399A JP 2015212399 A JP2015212399 A JP 2015212399A JP 2015146610 A JP2015146610 A JP 2015146610A JP 2015146610 A JP2015146610 A JP 2015146610A JP 2015212399 A JP2015212399 A JP 2015212399A
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- epoxy resin
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- divinylarene dioxide
- resin composition
- dioxide
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 158
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 132
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 132
- YDIZFUMZDHUHSH-UHFFFAOYSA-N 1,7-bis(ethenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical compound C12OC2C=CC2(C=C)C1(C=C)O2 YDIZFUMZDHUHSH-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 30
- 239000003054 catalyst Substances 0.000 claims abstract description 28
- 239000012535 impurity Substances 0.000 claims abstract description 26
- -1 divinyl arene Chemical class 0.000 claims abstract description 22
- 239000000047 product Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 11
- 230000005484 gravity Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000002425 crystallisation Methods 0.000 claims description 9
- 230000008025 crystallization Effects 0.000 claims description 9
- 150000001412 amines Chemical group 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- 150000004982 aromatic amines Chemical class 0.000 claims description 3
- VUEDNLCYHKSELL-UHFFFAOYSA-N arsonium Chemical group [AsH4+] VUEDNLCYHKSELL-UHFFFAOYSA-N 0.000 claims description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 3
- 125000005496 phosphonium group Chemical group 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 7
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical compound C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 51
- 229920001187 thermosetting polymer Polymers 0.000 description 25
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 19
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 10
- 238000009472 formulation Methods 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 8
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 7
- 238000005266 casting Methods 0.000 description 7
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 150000002118 epoxides Chemical class 0.000 description 5
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical group 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- MTCBLMPRPUTXHZ-UHFFFAOYSA-N n-(oxomethylidene)nitramide Chemical group [O-][N+](=O)N=C=O MTCBLMPRPUTXHZ-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000006384 oligomerization reaction Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 0 *C1(*)OC1(*)CC1(*)OC1(*)N Chemical compound *C1(*)OC1(*)CC1(*)OC1(*)N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- UZXQULFXZDNGSO-UHFFFAOYSA-N 1-but-1-enyl-7-oxabicyclo[4.1.0]hepta-2,4-diene Chemical compound C1=CC=CC2(C=CCC)C1O2 UZXQULFXZDNGSO-UHFFFAOYSA-N 0.000 description 1
- ILSRXKFYTXYKJS-UHFFFAOYSA-N 2,4-bis(ethenyl)-3,6-dioxatetracyclo[6.4.0.02,4.05,7]dodeca-1(12),8,10-triene Chemical compound C=CC12OC1(C=C)C1=CC=CC=C1C1C2O1 ILSRXKFYTXYKJS-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- GLPDXGJXUWGMQJ-UHFFFAOYSA-N 4-ethenyl-7-(4-ethenylphenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical compound C(=C)C1=CC=C(C=C1)C12C(C3C(C=C1)(C=C)O3)O2 GLPDXGJXUWGMQJ-UHFFFAOYSA-N 0.000 description 1
- BWHLFAZDBDUSDO-UHFFFAOYSA-N 6-ethenyl-1-ethyl-7-oxabicyclo[4.1.0]hepta-2,4-diene Chemical compound C1=CC=CC2(CC)C1(C=C)O2 BWHLFAZDBDUSDO-UHFFFAOYSA-N 0.000 description 1
- 241001120493 Arene Species 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- HZZUMXSLPJFMCB-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;acetate Chemical compound CC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 HZZUMXSLPJFMCB-UHFFFAOYSA-M 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- OHQOKJPHNPUMLN-UHFFFAOYSA-N n,n'-diphenylmethanediamine Chemical class C=1C=CC=CC=1NCNC1=CC=CC=C1 OHQOKJPHNPUMLN-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
- C08G65/223—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
Description
実施例1〜8は、表I及びIIにそれぞれ示されている濃度でのDVBDO−95又はDVBDO−80とD.E.R.383エポキシ樹脂のブレンドであり、比較例A及びBはDVBDO−95又はDVBDO−80を含まない。
DVBDO−95(「エポキシ1」)と5質量%、10質量%、15質量%及び17質量%のエチルスチレン(ES)との混合物を、構成成分をジャーに入れて約25℃で混合することにより調製した。DVBDO−95と各混合物の部分を次に化学量論的量のD.E.H.20エポキシ硬化剤と混合し、以下のスケジュールを使用して硬化させて、それぞれ実施例9〜11並びに比較例C及びDを得た:50℃で60分間の後に60℃、90℃、100℃、110℃、120℃、150℃、180℃、210℃及び240℃でそれぞれ30分間。表IIIは、使用した成分の量と、外観、硬化後の損失質量、比重、得られた熱硬化物の比重の差(%)を示す。
DVBDO−95中に10質量%のD.E.R.383エポキシ樹脂を含む混合物を調製した(エポキシ2)。エポキシ2と5質量%、10質量%、15質量%及び17質量%のエチルスチレン(ES)との混合物を下記のとおり調製した。各混合物の部分を上記のように化学量論的量のD.E.H.20エポキシ硬化剤と混合し、硬化させて、それぞれ実施例12〜14及び比較例E及びFを得た。表IVは、使用した成分の量と、外観、硬化後の損失質量、比重、得られた熱硬化物の比重の差(%)を示す。
実施例12〜14及び比較例E及びFを25℃でバイアル内に24時間放置した。得られた硬化物を、外観とモルフォロジーについて観察した(表V)。
実施例9〜11及び比較例C及びDのエポキシ成分とESとをTGAにより分析して表VIに示すようにT−5の値を求めた。
DVBDO−95中に10質量%のD.E.R.383エポキシ樹脂を含む配合物及びD.E.R.383エポキシ樹脂のみの配合物を化学量論的量のAncamine DL−50(Air Products,Inc.製の変性メチレンジアニリン硬化剤)により完全に硬化させた。得られた熱硬化物の特性を表VIIに示す。
[態様1]
ジビニルアレーンジオキシドを含むエポキシ樹脂組成物であって、前記ジビニルアレーンジオキシドが約15質量%未満のスチレン系不純物濃度を有するエポキシ樹脂組成物。
[態様2]
損失質量5質量%の温度が約83℃を超える、上記態様1に記載のエポキシ樹脂組成物。
[態様3]
(a)上記態様1に記載のジビニルアレーンジオキシドと(b)成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂とのブレンドを含むエポキシ樹脂組成物。
[態様4]
少なくとも約11日間の結晶化抵抗を有する、上記態様3に記載のエポキシ樹脂組成物。
[態様5]
(i)上記態様3に記載のエポキシ樹脂ブレンド組成物と(ii)少なくとも1種の硬化剤とを含む硬化性エポキシ樹脂組成物。
[態様6]
使用によって、硬化後に得られる硬化した製品の比重の変化が約2.2%未満である、上記態様5に記載の硬化性エポキシ樹脂組成物。
[態様7]
ジビニルアレーンジオキシドがジビニルベンゼンジオキシドである、上記態様1、3又は5に記載の組成物。
[態様8]
前記ジビニルアレーンジオキシドの濃度が約1質量%〜約99質量%である、上記態様1、3又は5に記載の組成物。
[態様9]
成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂である成分(b)が、多官能性アルコール、フェノール類、脂環式カルボン酸、芳香族アミン若しくはアミノフェノール類とエピクロロヒドリンとの反応生成物、又はそれらの混合物を含む、上記態様3に記載の組成物。
[態様10]
成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂の濃度が約1質量%〜約99質量%である、上記態様3又は5に記載の組成物。
[態様11]
前記硬化剤が酸無水物、カルボン酸、アミン化合物、又はそれらの混合物を含む、上記態様5に記載の組成物。
[態様12]
前記硬化剤の濃度が約0.1質量%〜約90質量%である、上記態様5に記載の組成物。
[態様13]
硬化触媒を含み、当該硬化触媒の濃度が約0.1質量%〜約20質量%である、上記態様5に記載の組成物。
[態様14]
前記硬化触媒が、アミン部分、ホスフィン部分、複素環式窒素部分、アンモニウム部分、ホスホニウム部分、アルソニウム部分、スルホニウム部分、又はそれらの混合体を含む、上記態様13に記載の組成物。
[態様15]
(a)上記態様1に記載のジビニルアレーンジオキシドと(b)成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂とをブレンドすることを含むエポキシ樹脂組成物の製造方法。
[態様16]
(i)上記態様3に記載のエポキシ樹脂ブレンド組成物と(ii)少なくとも1種の硬化剤とを混合することを含む、硬化性エポキシ樹脂組成物の製造方法。
Claims (16)
- ジビニルアレーンジオキシドを含むエポキシ樹脂組成物であって、前記ジビニルアレーンジオキシドが約15質量%未満のスチレン系不純物濃度を有するエポキシ樹脂組成物。
- 損失質量5質量%の温度が約83℃を超える、請求項1に記載のエポキシ樹脂組成物。
- (a)請求項1に記載のジビニルアレーンジオキシドと(b)成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂とのブレンドを含むエポキシ樹脂組成物。
- 少なくとも約11日間の結晶化抵抗を有する、請求項3に記載のエポキシ樹脂組成物。
- (i)請求項3に記載のエポキシ樹脂ブレンド組成物と(ii)少なくとも1種の硬化剤とを含む硬化性エポキシ樹脂組成物。
- 使用によって、硬化後に得られる硬化した製品の比重の変化が約2.2%未満である、請求項5に記載の硬化性エポキシ樹脂組成物。
- ジビニルアレーンジオキシドがジビニルベンゼンジオキシドである、請求項1、3又は5に記載の組成物。
- 前記ジビニルアレーンジオキシドの濃度が約1質量%〜約99質量%である、請求項1、3又は5に記載の組成物。
- 成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂である成分(b)が、多官能性アルコール、フェノール類、脂環式カルボン酸、芳香族アミン若しくはアミノフェノール類とエピクロロヒドリンとの反応生成物、又はそれらの混合物を含む、請求項3に記載の組成物。
- 成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂の濃度が約1質量%〜約99質量%である、請求項3又は5に記載の組成物。
- 前記硬化剤が酸無水物、カルボン酸、アミン化合物、又はそれらの混合物を含む、請求項5に記載の組成物。
- 前記硬化剤の濃度が約0.1質量%〜約90質量%である、請求項5に記載の組成物。
- 硬化触媒を含み、当該硬化触媒の濃度が約0.1質量%〜約20質量%である、請求項5に記載の組成物。
- 前記硬化触媒が、アミン部分、ホスフィン部分、複素環式窒素部分、アンモニウム部分、ホスホニウム部分、アルソニウム部分、スルホニウム部分、又はそれらの混合体を含む、請求項13に記載の組成物。
- (a)請求項1に記載のジビニルアレーンジオキシドと(b)成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂とをブレンドすることを含むエポキシ樹脂組成物の製造方法。
- (i)請求項3に記載のエポキシ樹脂ブレンド組成物と(ii)少なくとも1種の硬化剤とを混合することを含む、硬化性エポキシ樹脂組成物の製造方法。
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JP2014532794A (ja) * | 2011-11-08 | 2014-12-08 | ダウ グローバル テクノロジーズ エルエルシー | 硬化性組成物 |
US10335976B2 (en) * | 2014-12-23 | 2019-07-02 | Dow Global Technologies Llc | Treated porous material |
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US20120238711A1 (en) | 2012-09-20 |
TW201130876A (en) | 2011-09-16 |
WO2011071745A1 (en) | 2011-06-16 |
BR112012013527A2 (pt) | 2016-08-02 |
CN102666649A (zh) | 2012-09-12 |
JP2013513694A (ja) | 2013-04-22 |
EP2510042A1 (en) | 2012-10-17 |
KR20120114295A (ko) | 2012-10-16 |
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