JP2013513694A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物 Download PDFInfo
- Publication number
- JP2013513694A JP2013513694A JP2012543162A JP2012543162A JP2013513694A JP 2013513694 A JP2013513694 A JP 2013513694A JP 2012543162 A JP2012543162 A JP 2012543162A JP 2012543162 A JP2012543162 A JP 2012543162A JP 2013513694 A JP2013513694 A JP 2013513694A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- divinylarene dioxide
- composition
- resin composition
- dioxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
- C08G65/223—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
Description
実施例1〜8は、表I及びIIにそれぞれ示されている濃度でのDVBDO−95又はDVBDO−80とD.E.R.383エポキシ樹脂のブレンドであり、比較例A及びBはDVBDO−95又はDVBDO−80を含まない。
DVBDO−95(「エポキシ1」)と5質量%、10質量%、15質量%及び17質量%のエチルスチレン(ES)との混合物を、構成成分をジャーに入れて約25℃で混合することにより調製した。DVBDO−95と各混合物の部分を次に化学量論的量のD.E.H.20エポキシ硬化剤と混合し、以下のスケジュールを使用して硬化させて、それぞれ実施例9〜11並びに比較例C及びDを得た:50℃で60分間の後に60℃、90℃、100℃、110℃、120℃、150℃、180℃、210℃及び240℃でそれぞれ30分間。表IIIは、使用した成分の量と、外観、硬化後の損失質量、比重、得られた熱硬化物の比重の差(%)を示す。
DVBDO−95中に10質量%のD.E.R.383エポキシ樹脂を含む混合物を調製した(エポキシ2)。エポキシ2と5質量%、10質量%、15質量%及び17質量%のエチルスチレン(ES)との混合物を下記のとおり調製した。各混合物の部分を上記のように化学量論的量のD.E.H.20エポキシ硬化剤と混合し、硬化させて、それぞれ実施例12〜14及び比較例E及びFを得た。表IVは、使用した成分の量と、外観、硬化後の損失質量、比重、得られた熱硬化物の比重の差(%)を示す。
実施例12〜14及び比較例E及びFを25℃でバイアル内に24時間放置した。得られた硬化物を、外観とモルフォロジーについて観察した(表V)。
実施例9〜11及び比較例C及びDのエポキシ成分とESとをTGAにより分析して表VIに示すようにT−5の値を求めた。
DVBDO−95中に10質量%のD.E.R.383エポキシ樹脂を含む配合物及びD.E.R.383エポキシ樹脂のみの配合物を化学量論的量のAncamine DL−50(Air Products,Inc.製の変性メチレンジアニリン硬化剤)により完全に硬化させた。得られた熱硬化物の特性を表VIIに示す。
Claims (16)
- ジビニルアレーンジオキシドを含むエポキシ樹脂組成物であって、前記ジビニルアレーンジオキシドが約15質量%未満のスチレン系不純物濃度を有するエポキシ樹脂組成物。
- 損失質量5質量%の温度が約83℃を超える、請求項1に記載のエポキシ樹脂組成物。
- (a)請求項1に記載のジビニルアレーンジオキシドと(b)成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂とのブレンドを含むエポキシ樹脂組成物。
- 少なくとも約11日間の結晶化抵抗を有する、請求項3に記載のエポキシ樹脂組成物。
- (i)請求項3に記載のエポキシ樹脂ブレンド組成物と(ii)少なくとも1種の硬化剤とを含む硬化性エポキシ樹脂組成物。
- 使用によって、硬化後に得られる硬化した製品の比重の変化が約2.2%未満である、請求項5に記載の硬化性エポキシ樹脂組成物。
- ジビニルアレーンジオキシドがジビニルベンゼンジオキシドである、請求項1、3又は5に記載の組成物。
- 前記ジビニルアレーンジオキシドの濃度が約1質量%〜約99質量%である、請求項1、3又は5に記載の組成物。
- 成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂である成分(b)が、多官能性アルコール、フェノール類、脂環式カルボン酸、芳香族アミン若しくはアミノフェノール類とエピクロロヒドリンとの反応生成物、又はそれらの混合物を含む、請求項3に記載の組成物。
- 成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂の濃度が約1質量%〜約99質量%である、請求項3又は5に記載の組成物。
- 前記硬化剤が酸無水物、カルボン酸、アミン化合物、又はそれらの混合物を含む、請求項5に記載の組成物。
- 前記硬化剤の濃度が約0.1質量%〜約90質量%である、請求項5に記載の組成物。
- 硬化触媒を含み、当該硬化触媒の濃度が約0.1質量%〜約20質量%である、請求項5に記載の組成物。
- 前記硬化触媒が、アミン部分、ホスフィン部分、複素環式窒素部分、アンモニウム部分、ホスホニウム部分、アルソニウム部分、スルホニウム部分、又はそれらの混合体を含む、請求項13に記載の組成物。
- (a)請求項1に記載のジビニルアレーンジオキシドと(b)成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂とをブレンドすることを含むエポキシ樹脂組成物の製造方法。
- (i)請求項3に記載のエポキシ樹脂ブレンド組成物と(ii)少なくとも1種の硬化剤とを混合することを含む、硬化性エポキシ樹脂組成物の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26794709P | 2009-12-09 | 2009-12-09 | |
US61/267,947 | 2009-12-09 | ||
PCT/US2010/058695 WO2011071745A1 (en) | 2009-12-09 | 2010-12-02 | Epoxy resin compositions |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015146610A Division JP2015212399A (ja) | 2009-12-09 | 2015-07-24 | エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013513694A true JP2013513694A (ja) | 2013-04-22 |
JP2013513694A5 JP2013513694A5 (ja) | 2014-01-23 |
Family
ID=43858785
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012543162A Withdrawn JP2013513694A (ja) | 2009-12-09 | 2010-12-02 | エポキシ樹脂組成物 |
JP2015146610A Pending JP2015212399A (ja) | 2009-12-09 | 2015-07-24 | エポキシ樹脂組成物 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015146610A Pending JP2015212399A (ja) | 2009-12-09 | 2015-07-24 | エポキシ樹脂組成物 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120238711A1 (ja) |
EP (1) | EP2510042A1 (ja) |
JP (2) | JP2013513694A (ja) |
KR (1) | KR20120114295A (ja) |
CN (1) | CN102666649A (ja) |
BR (1) | BR112012013527A2 (ja) |
TW (1) | TW201130876A (ja) |
WO (1) | WO2011071745A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014520172A (ja) * | 2011-05-13 | 2014-08-21 | ダウ グローバル テクノロジーズ エルエルシー | 絶縁配合物 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112012032981A2 (pt) * | 2010-06-25 | 2016-11-22 | Dow Global Technologies Llc | composição de resina epóxi curável livre de diluente para preparar um compósito, processo para preparar uma composição ou sistema de resina curável, livre de diluente, produto compósito curado e processo para preparar produto compósito curado |
EP2773682A4 (en) * | 2011-11-01 | 2015-04-29 | Dow Global Technologies Llc | LIQUID EPOXY RESIN FORMULATIONS |
JP2014532794A (ja) * | 2011-11-08 | 2014-12-08 | ダウ グローバル テクノロジーズ エルエルシー | 硬化性組成物 |
JP2017538820A (ja) * | 2014-12-23 | 2017-12-28 | ダウ グローバル テクノロジーズ エルエルシー | 処理済み多孔質材料 |
KR102344683B1 (ko) | 2017-09-04 | 2021-12-30 | 삼성디스플레이 주식회사 | 표시 장치용 차폐 잉크층 및 그 제조 방법 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009119513A1 (ja) * | 2008-03-27 | 2009-10-01 | 新日鐵化学株式会社 | エポキシ樹脂組成物及び硬化物 |
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US2924580A (en) * | 1957-08-08 | 1960-02-09 | Union Carbide Corp | Divinyl benzene dioxide compositions |
US2912389A (en) * | 1957-08-08 | 1959-11-10 | Union Carbide Corp | Polymers of divinylbenzene dioxide |
US2982752A (en) | 1958-04-25 | 1961-05-02 | Union Carbide Corp | Composition comprising a polyepoxide and divinylbenzene dioxide |
US3455967A (en) * | 1965-09-23 | 1969-07-15 | Dow Chemical Co | Synthesis of aromatic epoxides from benzylic sulfonium salts |
US4925901A (en) | 1988-02-12 | 1990-05-15 | The Dow Chemical Company | Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds |
US5135993A (en) | 1990-09-11 | 1992-08-04 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
GB9411367D0 (en) | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
AU711786B2 (en) * | 1997-05-16 | 1999-10-21 | National Starch And Chemical Investment Holding Corporation | Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers |
US6153719A (en) | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
US6632893B2 (en) | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
US6572971B2 (en) | 2001-02-26 | 2003-06-03 | Ashland Chemical | Structural modified epoxy adhesive compositions |
US6632860B1 (en) | 2001-08-24 | 2003-10-14 | Texas Research International, Inc. | Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener |
GB0212062D0 (en) | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
US7163973B2 (en) | 2002-08-08 | 2007-01-16 | Henkel Corporation | Composition of bulk filler and epoxy-clay nanocomposite |
US6887574B2 (en) | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
EP1753772B1 (en) | 2004-05-28 | 2016-12-28 | Blue Cube IP LLC | Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
MX2007005597A (es) | 2004-11-10 | 2007-05-23 | Dow Global Technologies Inc | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. |
US8048819B2 (en) | 2005-06-23 | 2011-11-01 | Momentive Performance Materials Inc. | Cure catalyst, composition, electronic device and associated method |
EP2198332A4 (en) * | 2007-09-06 | 2011-11-30 | 3M Innovative Properties Co | LIGHT CONDUCTOR WITH LIGHT EXTRACTION STRUCTURES FOR PROVIDING REGIONAL CONTROL OF LIGHT OUTPUT |
WO2010077483A1 (en) * | 2008-12-30 | 2010-07-08 | Dow Global Technologies Inc. | Process for preparing divinylarene dioxides |
JP5478603B2 (ja) * | 2009-03-05 | 2014-04-23 | 新日鉄住金化学株式会社 | エポキシ樹脂組成物 |
WO2010113784A1 (ja) * | 2009-03-31 | 2010-10-07 | 新日鐵化学株式会社 | エポキシ樹脂、エポキシ樹脂組成物及び硬化物 |
JP5778684B2 (ja) * | 2009-11-04 | 2015-09-16 | ダウ グローバル テクノロジーズ エルエルシー | ジビニルアレーンジオキシドの製造方法 |
TW201136973A (en) * | 2009-11-23 | 2011-11-01 | Dow Global Technologies Llc | Toughened epoxy resin formulations |
-
2010
- 2010-12-02 JP JP2012543162A patent/JP2013513694A/ja not_active Withdrawn
- 2010-12-02 WO PCT/US2010/058695 patent/WO2011071745A1/en active Application Filing
- 2010-12-02 CN CN2010800563389A patent/CN102666649A/zh active Pending
- 2010-12-02 BR BR112012013527A patent/BR112012013527A2/pt not_active IP Right Cessation
- 2010-12-02 KR KR1020127017666A patent/KR20120114295A/ko active IP Right Grant
- 2010-12-02 US US13/510,316 patent/US20120238711A1/en not_active Abandoned
- 2010-12-02 EP EP10787657A patent/EP2510042A1/en not_active Withdrawn
- 2010-12-08 TW TW099142729A patent/TW201130876A/zh unknown
-
2015
- 2015-07-24 JP JP2015146610A patent/JP2015212399A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009119513A1 (ja) * | 2008-03-27 | 2009-10-01 | 新日鐵化学株式会社 | エポキシ樹脂組成物及び硬化物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014520172A (ja) * | 2011-05-13 | 2014-08-21 | ダウ グローバル テクノロジーズ エルエルシー | 絶縁配合物 |
Also Published As
Publication number | Publication date |
---|---|
BR112012013527A2 (pt) | 2016-08-02 |
JP2015212399A (ja) | 2015-11-26 |
KR20120114295A (ko) | 2012-10-16 |
EP2510042A1 (en) | 2012-10-17 |
US20120238711A1 (en) | 2012-09-20 |
TW201130876A (en) | 2011-09-16 |
WO2011071745A1 (en) | 2011-06-16 |
CN102666649A (zh) | 2012-09-12 |
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