JP2015092722A - イヤフォン - Google Patents
イヤフォン Download PDFInfo
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- JP2015092722A JP2015092722A JP2014262196A JP2014262196A JP2015092722A JP 2015092722 A JP2015092722 A JP 2015092722A JP 2014262196 A JP2014262196 A JP 2014262196A JP 2014262196 A JP2014262196 A JP 2014262196A JP 2015092722 A JP2015092722 A JP 2015092722A
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/20—Circuits for coupling gramophone pick-up, recorder output, or microphone to receiver
- H04B1/202—Circuits for coupling gramophone pick-up, recorder output, or microphone to receiver by remote control
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
- H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
- H04R1/2846—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
- H04R1/2849—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
- H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1016—Earpieces of the intra-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2420/00—Details of connection covered by H04R, not provided for in its groups
- H04R2420/07—Applications of wireless loudspeakers or wireless microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
- H04R2460/11—Aspects relating to vents, e.g. shape, orientation, acoustic properties in ear tips of hearing devices to prevent occlusion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- Headphones And Earphones (AREA)
Abstract
【解決手段】イヤフォン100は、並列になった反応性及び抵抗性要素を含む第1音響チャンバ114と、音響振動子(駆動部116)によって第1音響チャンバから隔離された第2音響チャンバ112と、装着者の耳の耳甲介から装置を支持し、かつ、装着者の耳の耳孔内に第2音響チャンバを伸ばしているハウジングと、を含む。クッション106は第1の材料と第2の材料とを含み、第1領域102と第2領域104とに形成される。第1領域は人間の耳の耳甲介に適合するための形状に形成された外装面を形成する。第2領域は人間の耳の耳孔に適合するための形状に形成された外装面を形成する。第1領域及び第2領域はイヤフォンに適合するための形状に形成された内装面をともに形成する。第1の材料は内装面に隣接した体積を占有する。第2の材料は第1の材料と第1及び第2の外装面との間の体積を占有する。
【選択図】図3A
Description
第1の穴は装着者の耳の中に伸びている壁の先端に位置しており、かつ第2の穴は、装置が装着者の耳の中に配置されている場合に、第2音響チャンバを自由空間に連結するように配置され、ダンパは第1の穴を横断して配置され、第1の穴よりも小さい直径を持った第3の穴を形成している。
12 耳孔
14 耳甲介
16 耳珠
18 対珠
100 イヤフォン
102 第1領域
104 第2領域
106 クッション
111 外部カバー
112 後部チャンバ
113、115 シェル
114 前部チャンバ
116 駆動部
117 内部スペーサ
118 音響抵抗要素
120 圧力平衡穴(PEQ)
122 (反応性)ポート
124 (抵抗性)ポート
126 延伸部
202 プラグ
204 回路ハウジング
206 コード
500 均等化回路
510 出力抵抗
512 入力電源
702 後部カバー
810 外部領域
812 内部領域
Claims (7)
- 第1の材料と第2の材料とを含み、第1の領域と第2の領域とに形成されたクッションにおいて、
前記第1の領域は、人間の耳の耳甲介に適合するように形成された第1の外装面を形成し、
前記第2の領域は、人間の耳の耳孔に適合するように形成された第2の外装面を形成しており、
前記第1および第2の領域はともに、前記クッションをイヤフォンの音響要素に連結するように形成された内装面を形成し、
前記第1の材料は、前記内装面に隣接した第1の体積を占有し、
前記第2の材料は、前記第1の体積と前記第1および第2の外装面との間の第2の体積を占有し、
前記第1および第2の材料は、異なった硬さであることを特徴とするクッション。 - 前記第1の材料は、ショア硬度Aスケールで、およそ3〜12の範囲の硬さを有していることを特徴とする、請求項1に記載のクッション。
- 前記第1の材料は、ショア硬度Aスケールで、およそ8の硬さを有していることを特徴とする、請求項2に記載のクッション。
- 前記第2の材料は、ショア硬度Aスケールで、およそ30〜90の範囲の硬さを有していることを特徴とする、請求項1に記載のクッション。
- 前記第2の材料は、ショア硬度Aスケールで、およそ40の硬さを有していることを特徴とする、請求項4に記載のクッション。
- 前記第1の領域が、前記第2の材料よりも硬い硬度を有するように、前記第1の体積が、第1の領域内に延在することを特徴とする、請求項1に記載のクッション。
- 前記第1の体積が、前記クッションを前記イヤフォンに保持するために、リング型部分を備えることを特徴とする、請求項1に記載のクッション。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/428,057 US7916888B2 (en) | 2006-06-30 | 2006-06-30 | In-ear headphones |
US11/428,057 | 2006-06-30 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013226468A Division JP5678160B2 (ja) | 2006-06-30 | 2013-10-31 | イヤフォン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015092722A true JP2015092722A (ja) | 2015-05-14 |
JP6121982B2 JP6121982B2 (ja) | 2017-04-26 |
Family
ID=38521318
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007172828A Active JP5537765B2 (ja) | 2006-06-30 | 2007-06-29 | イヤフォン |
JP2013083141A Active JP5676677B2 (ja) | 2006-06-30 | 2013-04-11 | イヤフォン |
JP2013226468A Active JP5678160B2 (ja) | 2006-06-30 | 2013-10-31 | イヤフォン |
JP2014262196A Active JP6121982B2 (ja) | 2006-06-30 | 2014-12-25 | イヤフォン |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007172828A Active JP5537765B2 (ja) | 2006-06-30 | 2007-06-29 | イヤフォン |
JP2013083141A Active JP5676677B2 (ja) | 2006-06-30 | 2013-04-11 | イヤフォン |
JP2013226468A Active JP5678160B2 (ja) | 2006-06-30 | 2013-10-31 | イヤフォン |
Country Status (4)
Country | Link |
---|---|
US (2) | US7916888B2 (ja) |
EP (4) | EP1874080A3 (ja) |
JP (4) | JP5537765B2 (ja) |
CN (1) | CN101188873B (ja) |
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JP2013158047A (ja) | 2013-08-15 |
JP5676677B2 (ja) | 2015-02-25 |
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