JP2014508827A - 間隙充填用スウェリングテープ - Google Patents
間隙充填用スウェリングテープ Download PDFInfo
- Publication number
- JP2014508827A JP2014508827A JP2013551910A JP2013551910A JP2014508827A JP 2014508827 A JP2014508827 A JP 2014508827A JP 2013551910 A JP2013551910 A JP 2013551910A JP 2013551910 A JP2013551910 A JP 2013551910A JP 2014508827 A JP2014508827 A JP 2014508827A
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- JP
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- Prior art keywords
- acrylate
- meth
- base material
- material layer
- gap filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000008961 swelling Effects 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000012530 fluid Substances 0.000 claims abstract description 25
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 127
- 239000010410 layer Substances 0.000 claims description 125
- 239000000463 material Substances 0.000 claims description 88
- -1 acrylate compound Chemical class 0.000 claims description 59
- 239000000203 mixture Substances 0.000 claims description 39
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 18
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
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- 150000002513 isocyanates Chemical class 0.000 description 4
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
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- 239000000654 additive Substances 0.000 description 3
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- 238000006243 chemical reaction Methods 0.000 description 3
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- 238000005227 gel permeation chromatography Methods 0.000 description 3
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
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- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
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- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
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- AJKNNUJQFALRIK-UHFFFAOYSA-N 1,2,3-trifluorobenzene Chemical compound FC1=CC=CC(F)=C1F AJKNNUJQFALRIK-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
基材層の長さ方向への変形率=(L2−L1)/L1×100
1.基材層の長さ方向の変形率の測定
基材層を横の長さが10mmであり、縦の長さが50mmになるように切断し、試験片を製造する。製造された試験片をカーボネート系電解質に含浸させ、密封した状態で常温で1日間放置した後、電解質から取り出して、上記試験片の縦方向の長さを測定した後、下記数式Aによって基材層の長さ方向の変形率を測定する。
長さ方向の変形率=(L2−L1)/L1×100
スウェリングテープを横の長さが25mmであり、縦の長さが200mmになるように切断し、試験片を製造する。試験片を粘着層を媒介でガラス板に2kgのゴムローラーを使用して付着し、常温で2時間程度保管する。その後、引張試験機器を使用して5mm/secの剥離速度及び180度の剥離角度でスウェリングテープを剥離しながら剥離力を測定する。
実施例及び比較例で製造された電池を常温で1日間保管した後、電池を分解し、電極組立体を取り出し、電極組立体に付着していたスウェリングテープの状態を評価し、下記基準によって立体形状具現性能を評価する。
〈立体形状具現性能評価基準〉
○:スウェリングテープの立体形状が観察される。
△:スウェリングテープの立体形状が観察されない。
×:スウェリングテープの立体形状が観察されず、テープが電極組立体から剥離される。
スウェリングテープの間隙充填能は、上記の場合、電極組立体の流動防止特性を評価する方法で評価することができる。上記方式には、例えば、残振動評価方式と残衝撃評価方式が存在する。残振動評価方式では、UN38.3規格の振動実験方法によって行われ、評価後に電池が電源無感になれば、流動による端子の切断として判断する。残衝撃評価方式は、8角円柱内に電池を入れ、回転させて所定時間経過した後、電池が電源無感になれば、流動による端子の切断として判断する。上記方式によって評価したスウェリングテープの間隙充填能は、下記の基準によって評価する。
〈間隙充填能評価基準〉
○:残振動評価及び残衝撃評価後に電池の電源が測定される。
△:残振動評価または残衝撃評価後に電池の電源が測定されるが、抵抗が10%以上増加する。
×:残振動評価または残衝撃評価後に電池の電源が測定されない。
ブタンジオールポリオールとメチレンジフェニルジイソシアネートを上記ポリオールのヒドロキシ基と上記ジイソシアネートのイソシアネート基の当量比が約1:1になるように含む組成物をT−ダイ(die)で厚さが約40μmになるようにフィルムを形成した後、硬化させて基材を製造した。上記製造された基材の長さ方向の変形率は約100%であった。
ウレタンアクリレート40重量部と希釈剤としてイソボルニルアクリレート(IBOA)70重量部を配合し、光開始剤(イルガキュア−184、1−ヒドロキシシクロヘキシルフェニルケトン)0.5重量部をさらに添加、混合及び脱泡し、組成物を製造した。製造された組成物を厚さが約40μmになるようにポリエステル離型フィルム上にバーコーターを利用してコーティングした。酸素との接触を防止するためにコーティング層上にポリエステル離型フィルムを覆った後、メタルハライドランプを利用して光量が800mJ/cm2になるようにUV−A領域の光を照射し、組成物を硬化させて基材層を製造した。製造された基材層の長さ方向の変形率は、約43%であった。
エポキシアクリレート60重量部、イソボルニルアクリレート(IBOA)38重量部及びアクリル酸2重量部を配合し、上記に光開始剤(イルガキュア−184、1−ヒドロキシシクロヘキシルフェニルケトン)1.2重量部をさらに投入、混合及び脱泡し、組成物を製造した。製造された組成物を厚さが約40μmになるようにポリエステル離型フィルム上にバーコーターを利用してコーティングした。酸素との接触を防止するためにコーティング層上にポリエステル離型フィルムを覆った後、メタルハライドランプを利用して光量が800mJ/cm2になるようにUV−A領域の光を照射し、基材層を製造した。製造された基材層の長さ方向の変形率は、約11%であった。
GPCで測定した数平均分子量Mnが70,000のセルロースアセテートプロピオネート(cellulose acetate propionate)化合物を含む原料をT−ダイ(die)で厚さが約40μm程度の基材層に成形した。製造された基材層の長さ方向の変形率は、約20%であった。
スウェリングテープの製造
製造例1で製造したウレタン系基材層(厚さ:40μm)の一面にイソシアネート架橋剤で架橋されたアクリル粘着樹脂を含むアクリル系粘着層としてガラス板に対する剥離力が1,900gf/25mmであり、厚さが15μmである粘着層を形成し、スウェリングテープを製造した。
陰極、陽極及びセパレータを含むゼリーロール形状の電極組立体(断面直径:17.2mm)の外周の約50%の面積を覆うようにスウェリングテープを付着し、上記組立体を円筒状のカン(断面直径:17.5mm)に挿入した。次いで、上記カンの内部にカーボネート系電解質を注入し、密封し、電池を完成した。
スウェリングテープの製造時に基材層を下記表1のように変更し、実施例1と同一の組成に基盤する粘着層を使用し、且つその粘着層のガラスに対する剥離力が下記表1のように示されるように変更したことを除いて、実施例1と同一にスウェリングテープ及び電池を製造した。
51a、51b スウェリングテープ
52 カン
53 電極組立体
101 立体形状を具現する前のスウェリングテープ
102 立体形状を具現したスウェリングテープ
103、104 間隙を形成している対象
201 基材層
202 粘着層
Claims (14)
- 流体と接触すれば長さ方向に変形し、ウレタン結合、エステル結合またはエーテル結合を含むか、またはセルロースエステル化合物を含む基材層と;前記基材層の一面に前記基材層の長さ方向と平行な方向に形成されている粘着層と;を含む間隙充填用スウェリングテープ。
- 流体と接触時に長さ方向と垂直する方向に高さが0.001mm〜2.0mmである立体構造を形成する、請求項1に記載の間隙充填用スウェリングテープ。
- 基材層は、下記一般式1による長さ方向への変形率が10%以上である、請求項1に記載の間隙充填用スウェリングテープ:
[一般式1]
長さ方向への変形率=(L2−L1)/L1×100
前記一般式1でL1は、前記基材層が流体と接触する前の初期長さであり、L2は、常温または60℃で前記基材層を流体と24時間接触させた後に測定した前記基材層の長さである。 - 基材層は、活性エネルギー線重合性アクリレート化合物及びラジカル重合性希釈剤を含む組成物のキャスト層である、請求項1に記載の間隙充填用スウェリングテープ。
- 活性エネルギー線重合性アクリレート化合物は、ウレタンアクリレート、エポキシアクリレート、ポリエステルアクリレートまたはポリエーテルアクリレートである、請求項4に記載の間隙充填用スウェリングテープ。
- ラジカル重合性希釈剤は、アルキル(メタ)アクリレート;アルコキシ基を有する(メタ)アクリレート、アリサイクリック基を有する(メタ)アクリレート;芳香族基を有する(メタ)アクリレート;ヘテロ環を有する(メタ)アクリレート;及び多官能性アクリレートよりなる群から選択された1つ以上を含む、請求項4に記載の間隙充填用スウェリングテープ。
- 組成物は、活性エネルギー線硬化型アクリレート化合物30重量部〜99重量部及びラジカル重合性希釈剤1重量部〜70重量部を含む、請求項4に記載の間隙充填用スウェリングテープ。
- 基材層は、熱可塑性ポリウレタンを含む、請求項1に記載の間隙充填用スウェリングテープ。
- 基材層は、ポリオール及びイソシアネート化合物を含む組成物のキャスト層である、請求項1に記載の間隙充填用
スウェリングテープ。 - 基材層は、セルロースアセテート樹脂またはセルロースアルキレート樹脂を含む、請求項1に記載の間隙充填用スウェリングテープ。
- 粘着層は、間隙を形成するいずれか1つの対象またはガラス板に対して、5mm/secの剥離角度及び180度の剥離速度で測定した常温での剥離力が100gf/25mm以上である、請求項1に記載の間隙充填用スウェリングテープ。
- 粘着層は、アクリル粘着剤、ウレタン粘着剤、エポキシ粘着剤、シリコーン粘着剤またはゴム粘着剤を含む、請求項1に記載の間隙充填用スウェリングテープ。
- 第1基板及び前記第1基板から離隔されている第2基板によって形成された間隙を充填する方法であって、第1基板または第2基板に請求項1に記載のスウェリングテープの粘着層を付着させ、前記スウェリングテープの基材層を流体と接触させて前記基材層を長さ方向に変形させることを含む間隙充填方法。
- 第1及び第2基板のいすれか一方は、電極組立体であり、他方は、前記組立体を収納するカンである、請求項13に記載の間隙充填方法。
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