JP2014212187A - シート - Google Patents
シート Download PDFInfo
- Publication number
- JP2014212187A JP2014212187A JP2013087144A JP2013087144A JP2014212187A JP 2014212187 A JP2014212187 A JP 2014212187A JP 2013087144 A JP2013087144 A JP 2013087144A JP 2013087144 A JP2013087144 A JP 2013087144A JP 2014212187 A JP2014212187 A JP 2014212187A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- adhesive
- wafer
- supplied
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 claims abstract description 58
- 239000000853 adhesive Substances 0.000 claims abstract description 57
- 239000005871 repellent Substances 0.000 claims abstract 2
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 230000002940 repellent Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003851 corona treatment Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 polyethylene vinyl chloride Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Adhesive Tapes (AREA)
Abstract
【解決手段】上面に供給された接着剤18を介して板状物11が貼着されるシート10であって、該シート10上に供給された該接着剤18が山状になるように該シート10の少なくとも接着剤18が供給される面が撥接着剤性を有する。
【選択図】図4
Description
11 半導体ウエーハ
12a 被貼着面
14 フッ素樹脂コーティング
16 支持台
18 接着剤
20 プレス装置
22 保持テーブル
24 吸引保持部
28 吸引源
30 紫外線ランプ
Claims (3)
- 上面に供給された接着剤を介して板状物が貼着されるシートであって、
該シート上に供給された該接着剤が山状になるように該シートの少なくとも接着剤が供給される面が撥接着剤性を有することを特徴とするシート。 - 前記シートは、該シート上に供給された該接着剤が山状になるような撥接着剤性を有する材質で構成されている請求項1記載のシート。
- 前記接着剤は紫外線の照射によって硬化する紫外線硬化樹脂から構成され、
前記シートは紫外線を透過する請求項1又は2記載のシート。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013087144A JP6288935B2 (ja) | 2013-04-18 | 2013-04-18 | シート |
TW103108731A TW201446925A (zh) | 2013-04-18 | 2014-03-12 | 片材 |
KR1020140040359A KR102116585B1 (ko) | 2013-04-18 | 2014-04-04 | 시트 |
CN201410138818.XA CN104108063B (zh) | 2013-04-18 | 2014-04-08 | 片材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013087144A JP6288935B2 (ja) | 2013-04-18 | 2013-04-18 | シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014212187A true JP2014212187A (ja) | 2014-11-13 |
JP6288935B2 JP6288935B2 (ja) | 2018-03-07 |
Family
ID=51705154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013087144A Active JP6288935B2 (ja) | 2013-04-18 | 2013-04-18 | シート |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6288935B2 (ja) |
KR (1) | KR102116585B1 (ja) |
CN (1) | CN104108063B (ja) |
TW (1) | TW201446925A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017224670A (ja) * | 2016-06-14 | 2017-12-21 | 株式会社ディスコ | 保護部材形成装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004503631A (ja) * | 2000-06-15 | 2004-02-05 | バイエル アクチェンゲゼルシャフト | 高温下で改良剪断強度を有する感圧接着剤 |
JP2006066625A (ja) * | 2004-08-26 | 2006-03-09 | Nec Corp | ベアチップ実装装置、ベアチップ実装方法及びシート |
JP2008194886A (ja) * | 2007-02-09 | 2008-08-28 | Nippon Shokubai Co Ltd | 表面保護フィルム |
JP2011119578A (ja) * | 2009-12-07 | 2011-06-16 | Disco Abrasive Syst Ltd | 貼着装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203827A (ja) * | 2000-12-28 | 2002-07-19 | Lintec Corp | 半導体ウエハの裏面研削方法 |
JP2005206664A (ja) * | 2004-01-21 | 2005-08-04 | Nitto Denko Corp | 半導体封止用樹脂組成物 |
JP4954663B2 (ja) * | 2005-10-17 | 2012-06-20 | 東京エレクトロン株式会社 | 貼り合せ装置 |
JP5089370B2 (ja) | 2007-12-21 | 2012-12-05 | 株式会社ディスコ | 樹脂被覆方法および装置 |
JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
JP5324212B2 (ja) * | 2008-12-26 | 2013-10-23 | 株式会社ディスコ | 樹脂被覆方法および樹脂被覆装置 |
EP2416633A1 (de) * | 2010-08-04 | 2012-02-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Verfahren ur Festlegung und/oder Einbettung eines elektronischen Bauteils sowie Kleber zur Verwendung in einem derartigen Verfahren |
-
2013
- 2013-04-18 JP JP2013087144A patent/JP6288935B2/ja active Active
-
2014
- 2014-03-12 TW TW103108731A patent/TW201446925A/zh unknown
- 2014-04-04 KR KR1020140040359A patent/KR102116585B1/ko active IP Right Grant
- 2014-04-08 CN CN201410138818.XA patent/CN104108063B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004503631A (ja) * | 2000-06-15 | 2004-02-05 | バイエル アクチェンゲゼルシャフト | 高温下で改良剪断強度を有する感圧接着剤 |
JP2006066625A (ja) * | 2004-08-26 | 2006-03-09 | Nec Corp | ベアチップ実装装置、ベアチップ実装方法及びシート |
JP2008194886A (ja) * | 2007-02-09 | 2008-08-28 | Nippon Shokubai Co Ltd | 表面保護フィルム |
JP2011119578A (ja) * | 2009-12-07 | 2011-06-16 | Disco Abrasive Syst Ltd | 貼着装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017224670A (ja) * | 2016-06-14 | 2017-12-21 | 株式会社ディスコ | 保護部材形成装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201446925A (zh) | 2014-12-16 |
KR102116585B1 (ko) | 2020-05-28 |
KR20140125295A (ko) | 2014-10-28 |
JP6288935B2 (ja) | 2018-03-07 |
CN104108063A (zh) | 2014-10-22 |
CN104108063B (zh) | 2019-01-01 |
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