MX2007005597A - Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. - Google Patents
Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas.Info
- Publication number
- MX2007005597A MX2007005597A MX2007005597A MX2007005597A MX2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A
- Authority
- MX
- Mexico
- Prior art keywords
- epoxy resin
- block copolymer
- amphiphilic block
- epoxy resins
- peo
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Se describe una composicion epoxica de laminado curable que comprende: (a) una resina epoxica; (b) un copolimero de bloque anfifilico que contiene por lo menos un segmento de bloque miscible en resina epoxica y por lo menos un segmento de bloque no miscible en resina epoxica; en donde el segmento de bloque no miscible comprende por lo menos una estructura de polieter, siempre que la estructura de polieter de dicho segmento de bloque no miscible contenga por lo menos una o mas unidades de monomero de oxido de alquileno teniendo por lo menos cuatro atomos de carbono; de manera que cuando la composicion de resina epoxica se cura, la rigidez de la composicion de resina epoxica curada resultante se incrementa (c) un agente de curacion; y (d) un catalizador de curacion. El copolimero de bloque anfifilico de preferencia es un copolimero de bloque de polieter, tal como un copolimero de dibloque de PEO-PBO o un copolimero de tribloque de PEO-PBO-PEO.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62661104P | 2004-11-10 | 2004-11-10 | |
PCT/US2005/039963 WO2006052727A1 (en) | 2004-11-10 | 2005-11-02 | Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2007005597A true MX2007005597A (es) | 2007-05-23 |
Family
ID=35770865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2007005597A MX2007005597A (es) | 2004-11-10 | 2005-11-02 | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. |
Country Status (16)
Country | Link |
---|---|
US (1) | US7923073B2 (es) |
EP (1) | EP1814948B1 (es) |
JP (1) | JP5248860B2 (es) |
KR (1) | KR101227201B1 (es) |
CN (1) | CN101056933B (es) |
AT (1) | ATE453688T1 (es) |
BR (1) | BRPI0516702A (es) |
CA (1) | CA2582360A1 (es) |
DE (1) | DE602005018680D1 (es) |
ES (1) | ES2337598T3 (es) |
HK (1) | HK1112930A1 (es) |
MX (1) | MX2007005597A (es) |
NO (1) | NO20071727L (es) |
RU (1) | RU2395545C2 (es) |
TW (1) | TWI400296B (es) |
WO (1) | WO2006052727A1 (es) |
Families Citing this family (71)
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BRPI0508158B1 (pt) * | 2004-04-02 | 2015-10-27 | Dow Global Technologies Inc | composição, compósito, composição de revestimento em pó, processo para preparar laminados, processo para preparar compósito, revestimentos, laminados elétricos, cola de fibra de vidro, auxiliares de redução de brilho, encapsulantes |
MX2007005601A (es) * | 2004-11-10 | 2007-05-23 | Dow Global Technologies Inc | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y revestimientos en polvo hechos de las mismas. |
JP4634856B2 (ja) * | 2005-05-12 | 2011-02-16 | 利昌工業株式会社 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
US9096790B2 (en) | 2007-03-22 | 2015-08-04 | Hexion Inc. | Low temperature coated particles comprising a curable liquid and a reactive powder for use as proppants or in gravel packs, methods for making and using the same |
EP2176348B1 (en) | 2007-08-02 | 2017-01-18 | Dow Global Technologies LLC | Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers |
JP5676270B2 (ja) * | 2007-12-10 | 2015-02-25 | アーケマ・インコーポレイテッド | アクリルベースのゴム改質熱硬化組成物 |
EP2229416B1 (en) | 2008-01-08 | 2018-04-04 | Dow Global Technologies LLC | High tg epoxy systems for composite application |
KR101582881B1 (ko) | 2008-04-14 | 2016-01-15 | 블루 큐브 아이피 엘엘씨 | 분말 피복 분야에 유용한 에폭시-이미다졸 촉매 |
EP2110397A1 (de) | 2008-04-16 | 2009-10-21 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierendes Polyurethan-Polymer und dessen Verwendung als Schlagzähigkeitsmodifikator |
US8829101B2 (en) * | 2008-05-16 | 2014-09-09 | Dow Global Technologies Llc | Windmill propeller blade and method of making same |
EP2128182A1 (de) | 2008-05-28 | 2009-12-02 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend einen Beschleuniger mit Heteroatomen |
CN102099402B (zh) * | 2008-07-17 | 2014-06-25 | 陶氏环球技术公司 | 具有改善的韧性的结构复合材料 |
ATE461953T1 (de) | 2008-07-17 | 2010-04-15 | Sika Technology Ag | Haftvermittlerverbindungen für beölten stahl |
EP2145924A1 (de) | 2008-07-18 | 2010-01-20 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierende Reaktionsprodukte und deren Verwendung als Schlagzähigkeitsmodifikator |
EP2182025B1 (de) | 2008-10-31 | 2010-10-06 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzungen einsetzbar als Rohbauklebstoff oder Strukturschaum |
TWI423741B (zh) * | 2009-02-13 | 2014-01-11 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
US20120010329A1 (en) | 2009-02-24 | 2012-01-12 | Hunter Gary A | Curable epoxy resin compositions and cured products therefrom |
BRPI0924000B1 (pt) | 2009-03-09 | 2019-08-06 | Dow Global Technologies Llc | Composição termofixável, produto termofixo e processo para preparar uma composição termofixável |
CN102449019A (zh) | 2009-05-27 | 2012-05-09 | 陶氏环球技术有限责任公司 | 聚合缩水甘油醚活性稀释剂 |
US8969503B2 (en) | 2009-09-22 | 2015-03-03 | Dow Global Technologies Llc | Process for preparing episulfide resins |
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BR112012013527A2 (pt) | 2009-12-09 | 2016-08-02 | Dow Global Technologies Llc | composição de resina epóxi, composição de resina epóxi curável e processo para preparar uma composição de resina epóxi |
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-
2005
- 2005-11-02 MX MX2007005597A patent/MX2007005597A/es active IP Right Grant
- 2005-11-02 EP EP05818062A patent/EP1814948B1/en not_active Not-in-force
- 2005-11-02 AT AT05818062T patent/ATE453688T1/de active
- 2005-11-02 RU RU2007121650/04A patent/RU2395545C2/ru not_active IP Right Cessation
- 2005-11-02 WO PCT/US2005/039963 patent/WO2006052727A1/en active Application Filing
- 2005-11-02 JP JP2007541252A patent/JP5248860B2/ja not_active Expired - Fee Related
- 2005-11-02 DE DE602005018680T patent/DE602005018680D1/de active Active
- 2005-11-02 KR KR1020077010527A patent/KR101227201B1/ko not_active IP Right Cessation
- 2005-11-02 CN CN2005800382698A patent/CN101056933B/zh not_active Expired - Fee Related
- 2005-11-02 ES ES05818062T patent/ES2337598T3/es active Active
- 2005-11-02 CA CA002582360A patent/CA2582360A1/en not_active Abandoned
- 2005-11-02 US US11/663,802 patent/US7923073B2/en not_active Expired - Fee Related
- 2005-11-02 BR BRPI0516702-7A patent/BRPI0516702A/pt not_active IP Right Cessation
- 2005-11-09 TW TW094139243A patent/TWI400296B/zh not_active IP Right Cessation
-
2007
- 2007-04-02 NO NO20071727A patent/NO20071727L/no not_active Application Discontinuation
-
2008
- 2008-02-06 HK HK08101492.3A patent/HK1112930A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1814948A1 (en) | 2007-08-08 |
NO20071727L (no) | 2007-08-08 |
RU2007121650A (ru) | 2008-12-20 |
CN101056933A (zh) | 2007-10-17 |
US7923073B2 (en) | 2011-04-12 |
ES2337598T3 (es) | 2010-04-27 |
KR101227201B1 (ko) | 2013-01-28 |
BRPI0516702A (pt) | 2008-09-16 |
WO2006052727A1 (en) | 2006-05-18 |
US20080213489A1 (en) | 2008-09-04 |
HK1112930A1 (en) | 2008-09-19 |
CN101056933B (zh) | 2012-11-21 |
ATE453688T1 (de) | 2010-01-15 |
CA2582360A1 (en) | 2006-05-18 |
RU2395545C2 (ru) | 2010-07-27 |
TW200624500A (en) | 2006-07-16 |
EP1814948B1 (en) | 2009-12-30 |
DE602005018680D1 (de) | 2010-02-11 |
KR20070084111A (ko) | 2007-08-24 |
JP2008519886A (ja) | 2008-06-12 |
TWI400296B (zh) | 2013-07-01 |
JP5248860B2 (ja) | 2013-07-31 |
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