JP2012256792A - Heat dissipation structure - Google Patents

Heat dissipation structure Download PDF

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JP2012256792A
JP2012256792A JP2011130208A JP2011130208A JP2012256792A JP 2012256792 A JP2012256792 A JP 2012256792A JP 2011130208 A JP2011130208 A JP 2011130208A JP 2011130208 A JP2011130208 A JP 2011130208A JP 2012256792 A JP2012256792 A JP 2012256792A
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heat
heat dissipation
gap
dissipation structure
heat sink
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Shuichi Ninomiya
秀一 二宮
Takayuki Ishii
崇之 石井
Keitaro Hino
啓太郎 日野
Takeshi Hasegawa
剛 長谷川
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Toshiba Corp
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Toshiba Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation structure capable of achieving excellent thermal characteristics against electronic components, a uniform contact pressure of electronic components against a substrate, and excellent maintainability of electronic components.SOLUTION: The heat dissipation structure 10 includes: a heat dissipation sheet 12 disposed on a heat radiation surface 1b of a heating member 1 to be in contact therewith; a heat sink 14 disposed above a reverse face 12a of the heat dissipation sheet through a clearance; and a heat transfer material 16 provided in a clearance between the heat dissipation sheet and the heat sink to have flowability.

Description

本発明の実施形態は、例えば、ＢＧＡ(Ball Grid Array)を裏面に有するＦＰＧＡ(Field Programmable Gate Array)などの比較的高温になり易い電子部品の放熱構造に関する。   Embodiments of the present invention relate to a heat dissipation structure for an electronic component that tends to be relatively hot, such as an FPGA (Field Programmable Gate Array) having a BGA (Ball Grid Array) on the back surface.

一般に、電子部品の放熱構造として、電子部品との間に放熱シートを挟んでヒートシンクを重ねた構造が知られている。放熱シートは、電子部品の放熱面に接触するとともにヒートシンクに接触し、電子部品の熱をヒートシンクに伝えて放熱させる。放熱性を高めるため、放熱シートは、熱伝導率が高い材料を用いて、できるだけ薄く形成することが望ましい。   2. Description of the Related Art Generally, as a heat dissipation structure for an electronic component, a structure in which a heat sink is stacked with a heat dissipation sheet interposed between the electronic component and the electronic component is known. The heat dissipating sheet contacts the heat dissipating surface of the electronic component and also contacts the heat sink, and transmits heat of the electronic component to the heat sink to dissipate heat. In order to improve heat dissipation, it is desirable to form the heat dissipation sheet as thin as possible using a material having high thermal conductivity.

また、放熱性を考慮して、放熱シートを電子部品の放熱面とヒートシンクの両方に密着させるため、通常は、電子部品の放熱面に放熱シートを押し付けるようにヒートシンクが取り付けられる。このため、例えば、電子部品が、その裏面に半球状のバンプをマトリックス状に有するタイプの電子部品（ＦＰＧＡなど）である場合、ヒートシンクによって放熱シートを電子部品に押し付けると、バンプが潰れて基板との間で接触不良を生じてしまう可能性がある。   In consideration of heat dissipation, the heat sink is usually attached to both the heat radiating surface of the electronic component and the heat sink so that the heat radiating sheet is pressed against the heat radiating surface of the electronic component. For this reason, for example, when the electronic component is a type of electronic component (FPGA or the like) having hemispherical bumps in a matrix on the back surface, if the heat dissipation sheet is pressed against the electronic component by a heat sink, the bumps are crushed and the substrate There is a possibility that poor contact occurs between the two.

さらに、半球状のバンプを有する電子部品を基板に実装する場合、実装高さに固体差を生じ易いため、ヒートシンクと電子部品の実装面との間の隙間が変動し易い。この変動する隙間を埋めるため、弾力性のある放熱シートを間に挟む方法が考えられるが、やわらかい放熱シートは、一般に、熱によって溶け易く、基板を汚してしまう可能性がある。その上、バンプの基板電極に対する押し付け力にバラつきを生じてしまう。   Further, when an electronic component having hemispherical bumps is mounted on a substrate, the mounting height tends to cause a solid difference, so that the gap between the heat sink and the mounting surface of the electronic component is likely to vary. In order to fill this fluctuating gap, a method of sandwiching an elastic heat radiating sheet can be considered, but a soft heat radiating sheet is generally easily melted by heat and may contaminate the substrate. In addition, the pressing force of the bump against the substrate electrode varies.

特開２００５−１４２２９２号公報JP 2005-142292 A

例えば、ＢＧＡを裏面に有するＦＰＧＡにおいて、その放熱面に放熱シートを介してヒートシンクを押し付けると、ＢＧＡが基板に押し付けられて電気的な接触不良を生じる可能性がある。このため、放熱面とヒートシンクとの間にある程度の隙間を設けて弾力性のある放熱シートを挟む方法が考えられるが、ＢＧＡと基板電極との間の接触圧が不均一になるとともに、熱により放熱シートが溶けて基板が汚れる可能性がある。   For example, in an FPGA having a BGA on the back surface, if a heat sink is pressed against the heat radiating surface via a heat radiating sheet, the BGA may be pressed against the substrate, resulting in poor electrical contact. For this reason, a method of providing a certain amount of clearance between the heat radiation surface and the heat sink and sandwiching an elastic heat radiation sheet can be considered, but the contact pressure between the BGA and the substrate electrode becomes non-uniform, The heat dissipation sheet may melt and the substrate may become dirty.

よって、電子部品に対する良好な放熱特性を有し、基板に対する電子部品の接触圧を均一にでき、電子部品のメンテナンス性に優れた放熱構造の開発が望まれている。   Therefore, it is desired to develop a heat dissipation structure that has good heat dissipation characteristics for electronic components, can make the contact pressure of electronic components to a substrate uniform, and is excellent in maintainability of electronic components.

実施形態に係る放熱構造は、発熱部材の放熱面に接触して配置された放熱シートと、この放熱シートの裏面に隙間を介して配置されたヒートシンクと、流動性を有する状態で放熱シートとヒートシンクの間の隙間に供給された伝熱材と、を有する。   The heat dissipating structure according to the embodiment includes a heat dissipating sheet disposed in contact with the heat dissipating surface of the heat generating member, a heat sink disposed on the back surface of the heat dissipating sheet via a gap, and a heat dissipating sheet and a heat sink in a fluid state. And a heat transfer material supplied to the gap between the two.

図１は、第１の実施形態に係る放熱構造を示す概略図である。FIG. 1 is a schematic diagram illustrating a heat dissipation structure according to the first embodiment. 図２は、第２の実施形態に係る放熱構造を示す概略図である。FIG. 2 is a schematic view showing a heat dissipation structure according to the second embodiment. 図３は、第３の実施形態に係る放熱構造を示す概略図である。FIG. 3 is a schematic view showing a heat dissipation structure according to the third embodiment. 図４は、他の実施形態に係る放熱構造を示す概略図である。FIG. 4 is a schematic view showing a heat dissipation structure according to another embodiment.

以下、図面を参照しながら実施形態について詳細に説明する。
図１には、第１の実施形態に係る放熱構造１０の概略図を示してある。
本実施形態において、発熱部材としての電子部品１は、例えば、基板２の実装面２ａに対向する裏面１ａにＢＧＡ(Ball Grid Array)３を有するＦＰＧＡ(Field Programmable Gate Array)１である。ＦＰＧＡ１は、現場で回路を書き換え可能なＬＳＩであり、ＢＧＡ３は、半田の表面張力によって半球状に形成された電極（バンプ）である。 Hereinafter, embodiments will be described in detail with reference to the drawings.
FIG. 1 shows a schematic view of a heat dissipation structure 10 according to the first embodiment.
In the present embodiment, the electronic component 1 as a heat generating member is, for example, an FPGA (Field Programmable Gate Array) 1 having a BGA (Ball Grid Array) 3 on the back surface 1 a facing the mounting surface 2 a of the substrate 2. The FPGA 1 is an LSI that can rewrite a circuit in the field, and the BGA 3 is an electrode (bump) formed in a hemispherical shape by the surface tension of the solder.

放熱構造１０は、ＦＰＧＡ１の基板２から離間した放熱面１ｂに接触して配置される放熱シート１２を有する。放熱シート１２は、ＦＰＧＡ１の放熱面１ｂより一回り大きいサイズを有する。また、本実施形態の放熱シート１２は、熱により溶けることの無い比較的硬いシートである。   The heat dissipation structure 10 includes a heat dissipation sheet 12 disposed in contact with the heat dissipation surface 1b spaced from the substrate 2 of the FPGA 1. The heat radiation sheet 12 has a size that is slightly larger than the heat radiation surface 1b of the FPGA 1. Further, the heat dissipation sheet 12 of the present embodiment is a relatively hard sheet that does not melt by heat.

また、放熱構造１０は、放熱シート１２のＦＰＧＡ１から離間した裏面１２ａ側に隙間Ｓを介して配置されるヒートシンク１４を有する。ヒートシンク１４は、比較的軽量で熱伝導率の高いアルミニウムや銅などの金属によって形成されている。本実施形態では、比較的接着剤が剥がれ易いアルミニウム製のヒートシンク１４を用いている。   Further, the heat dissipation structure 10 includes a heat sink 14 disposed via a gap S on the back surface 12a side away from the FPGA 1 of the heat dissipation sheet 12. The heat sink 14 is formed of a metal such as aluminum or copper having a relatively light weight and high thermal conductivity. In the present embodiment, the heat sink 14 made of aluminum, which is relatively easy to peel off the adhesive, is used.

さらに、放熱構造１０は、放熱シート１２の裏面１２ａとヒートシンク１４との間の隙間Ｓを埋める伝熱材１６を有する。本実施形態の伝熱材１６は、固まる前の状態、すなわち伝熱材１６を隙間Ｓに供給するとき、流動性を有するとともに、固まった後の状態で弾性を有する接着剤１６である。言い換えると、この接着剤１６は、潰すと広がる程度の流動性を有するものである。この接着剤１６として、例えば、ＡＩテクノロジー社のエポキシペースト接着剤（型番：ＭＥ７１５５）が用いられる。   Furthermore, the heat dissipation structure 10 includes a heat transfer material 16 that fills the gap S between the back surface 12 a of the heat dissipation sheet 12 and the heat sink 14. The heat transfer material 16 of the present embodiment is an adhesive 16 that has fluidity when it is supplied into the gap S before it is solidified, that is, when it is solidified, and has elasticity in a state after it is solidified. In other words, the adhesive 16 has such a fluidity as to spread when crushed. As the adhesive 16, for example, an epoxy paste adhesive (model number: ME7155) manufactured by AI Technology is used.

この放熱構造１０を組み立てる場合、基板２の実装面２ａに実装したＦＰＧＡ１の放熱面１ｂ上に放熱シート１２を載せて、ジェル状の接着剤１６を介してヒートシンク１４を重ねる。そして、ヒートシンク１４をネジ１８によって基板２に締結固定する。締結箇所は、ＦＰＧＡ１の外側である。   When assembling the heat radiating structure 10, the heat radiating sheet 12 is placed on the heat radiating surface 1 b of the FPGA 1 mounted on the mounting surface 2 a of the substrate 2, and the heat sink 14 is overlapped via the gel adhesive 16. Then, the heat sink 14 is fastened and fixed to the substrate 2 with screws 18. A fastening location is the outside of FPGA1.

この放熱構造において、仮に、接着剤１６を用いない場合を想定すると、ＦＰＧＡ１の放熱経路を確保するため、放熱シート１２をＦＰＧＡ１の放熱面１ｂに押し付けるようにヒートシンク１４を基板２に締結固定する必要がある。この場合、ＦＰＧＡ１のＢＧＡ３に比較的大きな圧力が作用し、ＦＰＧＡ１と基板電極（図示省略）との間の電気的な接続状態が悪化する可能性がある。   In this heat dissipation structure, assuming that the adhesive 16 is not used, it is necessary to fasten and fix the heatsink 14 to the substrate 2 so as to press the heat dissipation sheet 12 against the heat dissipation surface 1b of the FPGA1 in order to secure the heat dissipation path of the FPGA1. There is. In this case, a relatively large pressure acts on the BGA 3 of the FPGA 1, and the electrical connection state between the FPGA 1 and the substrate electrode (not shown) may be deteriorated.

これに対し、本実施形態のように、放熱シート１２とヒートシンク１４との間の隙間Ｓに接着剤１６を設けることで、ＦＰＧＡ１のＢＧＡ３に過大な圧力が作用することを防止できる。つまり、本実施形態の接着剤１６は、固まった後、弾性を有するものであるため、ＦＰＧＡ１の放熱経路を確保した上で、ＢＧＡ３に作用する不所望な応力を吸収するダンパーとして機能する。   On the other hand, it is possible to prevent an excessive pressure from acting on the BGA 3 of the FPGA 1 by providing the adhesive 16 in the gap S between the heat dissipation sheet 12 and the heat sink 14 as in the present embodiment. That is, since the adhesive 16 of the present embodiment has elasticity after being hardened, the adhesive 16 functions as a damper that absorbs an undesired stress acting on the BGA 3 while ensuring a heat dissipation path of the FPGA 1.

このため、特に、この放熱構造１０を航空機などの移動体に搭載するＦＰＧＡ１に取り付けた場合、機体から伝わる振動を接着剤１６で吸収することができ、ＦＰＧＡ１の動作の信頼性を確保することができる。   For this reason, particularly, when the heat dissipation structure 10 is attached to the FPGA 1 mounted on a moving body such as an aircraft, vibration transmitted from the airframe can be absorbed by the adhesive 16, and the reliability of the operation of the FPGA 1 can be ensured. it can.

また、本実施形態によると、接着剤１６を隙間Ｓに配置したことで、ＦＰＧＡ１の実装高さの変動による寸法誤差などを吸収することができ、放熱構造１０の寸法精度を高めることができ、その上、ＢＧＡ３に作用する圧力のバラつきも無くすことができる。つまり、この場合、接着剤１６は、隙間Ｓの大きさやＢＧＡ３に作用する圧力をコントロール可能なインターフェースマテリアルとして機能することになる。   Further, according to the present embodiment, by arranging the adhesive 16 in the gap S, it is possible to absorb a dimensional error due to a variation in the mounting height of the FPGA 1, and to improve the dimensional accuracy of the heat dissipation structure 10, In addition, variations in pressure acting on the BGA 3 can be eliminated. That is, in this case, the adhesive 16 functions as an interface material that can control the size of the gap S and the pressure acting on the BGA 3.

さらに、本実施形態によると、接着剤１６を隙間Ｓに配置したことで、放熱シート１２とヒートシンク１４を熱的に結合することができ、ＦＰＧＡ１の放熱性を高めることができる。特に、ＦＰＧＡ１の放熱面１ｂに段差を有する場合など、放熱面１ｂの段差に沿って変形する放熱シート１２とヒートシンク１４との間の不均一な隙間Ｓを接着剤１６で満たすことができ、放熱面１ｂの形状に係わらず放熱性を高めることができる。   Furthermore, according to the present embodiment, by disposing the adhesive 16 in the gap S, the heat dissipation sheet 12 and the heat sink 14 can be thermally coupled, and the heat dissipation of the FPGA 1 can be enhanced. In particular, when the heat radiating surface 1b of the FPGA 1 has a step, the adhesive 16 can fill the non-uniform gap S between the heat radiating sheet 12 and the heat sink 14 deformed along the step of the heat radiating surface 1b. The heat dissipation can be enhanced regardless of the shape of the surface 1b.

その上、例えば、ＦＰＧＡ１の交換や修理が必要な場合など、メンテナンス性を向上させることができる。つまり、見方を変えると、ＦＰＧＡ１の放熱面１ｂには接着剤１６が直接接触することがなく放熱シート１２が介在されているため、接着剤１６がＦＰＧＡ１に付着する心配が無く、基板２の実装面２ａが接着剤１６で汚れる心配も無い。この場合、放熱シート１２は、汚れ防止カバーとして機能することになる。   In addition, for example, when the FPGA 1 needs to be replaced or repaired, the maintainability can be improved. That is, from a different perspective, the adhesive 16 is not in direct contact with the heat radiating surface 1b of the FPGA 1, and the heat radiating sheet 12 is interposed. There is no worry that the surface 2a is stained with the adhesive 16. In this case, the heat dissipation sheet 12 functions as a dirt prevention cover.

さらに見方を変えると、弾性を有する接着剤１６を隙間Ｓに配置することで、放熱シート１２にダンピング機能を持たせる必要がなくなり、熱によって溶け易い柔らかい放熱シート１２を用いる必要も無くなる。このため、溶けた放熱シート１２によって基板２が汚れる心配も無くなる。   In other words, by disposing the elastic adhesive 16 in the gap S, there is no need to give the heat radiating sheet 12 a damping function, and there is no need to use a soft heat radiating sheet 12 that is easily melted by heat. For this reason, there is no fear that the substrate 2 is soiled by the melted heat dissipation sheet 12.

よって、ＦＰＧＡ１の交換や修理が必要な場合などには、容易にヒートシンク１４を取り外してＦＰＧＡ１を基板２から取り外すことができ、その際に、基板２の実装面２ａやＦＰＧＡ１自体の汚れをきれいにする必要もなくなり、メンテナンス性を向上させることができる。   Therefore, when the FPGA 1 needs to be replaced or repaired, the heat sink 14 can be easily removed and the FPGA 1 can be removed from the substrate 2. At this time, the mounting surface 2 a of the substrate 2 and the FPGA 1 itself are cleaned. It is no longer necessary, and maintenance can be improved.

図２には、第２の実施形態に係る放熱構造２０の概略図を示してある。この放熱構造２０は、上述した第１の実施形態の放熱構造１０と略同じ構造を有するため、ここでは上述した第１の実施形態と同様に機能する構成要素には同一符号を付してその詳細な説明を省略する。   In FIG. 2, the schematic of the heat dissipation structure 20 which concerns on 2nd Embodiment is shown. Since this heat dissipation structure 20 has substantially the same structure as the heat dissipation structure 10 of the first embodiment described above, the same reference numerals are given to components that function in the same manner as in the first embodiment described above. Detailed description is omitted.

本実施形態の放熱構造２０は、ヒートシンク１４を貫通した孔１４ａを有する。この孔１４ａは、ヒートシンク１４の略中央で、接着剤１６に対向する位置に設けられている。そして、この孔１４ａは、接着剤１６を隙間Ｓから逃がすために設けられている。本実施形態では、１つの孔１４ａを設けたが、ヒートシンク１４を貫通する複数の孔を設けても良い。また、孔１４ａの形状や大きさは、電子部品１の種類やヒートシンク１４の厚さなどに応じて適当な値に設定される。   The heat dissipation structure 20 of the present embodiment has a hole 14 a that penetrates the heat sink 14. The hole 14 a is provided at a position facing the adhesive 16 in the approximate center of the heat sink 14. The hole 14a is provided to allow the adhesive 16 to escape from the gap S. In the present embodiment, one hole 14a is provided, but a plurality of holes penetrating the heat sink 14 may be provided. Further, the shape and size of the hole 14 a are set to appropriate values according to the type of the electronic component 1 and the thickness of the heat sink 14.

この放熱構造２０を組み立てる場合、基板２の実装面２ａに実装したＦＰＧＡ１の放熱面１ｂ上に放熱シート１２を載せて、ジェル状の接着剤１６を介してヒートシンク１４を重ねる。そして、ヒートシンク１４をネジ１８によって基板２に締結固定する。締結箇所は、ＦＰＧＡ１の外側である。   When assembling the heat radiating structure 20, the heat radiating sheet 12 is placed on the heat radiating surface 1 b of the FPGA 1 mounted on the mounting surface 2 a of the substrate 2, and the heat sink 14 is overlapped with the gel adhesive 16. Then, the heat sink 14 is fastened and fixed to the substrate 2 with screws 18. A fastening location is the outside of FPGA1.

ヒートシンク１４を基板２に締結すると、ヒートシンク１４が基板２に近づいて接着剤１６が潰される。このとき、接着剤１６は、流動性を有するため、隙間Ｓに沿って広がるとともに、ヒートシンク１４の孔１４ａを介して逃げようとする。つまり、このとき、孔１４ａは、隙間Ｓに供給された余分な接着剤１６を流出させるよう機能し、接着剤１６に作用する圧力を逃がすことで、ＦＰＧＡ１の基板２に対する押し付け圧力を一定にする。   When the heat sink 14 is fastened to the substrate 2, the heat sink 14 approaches the substrate 2 and the adhesive 16 is crushed. At this time, since the adhesive 16 has fluidity, it spreads along the gap S and tries to escape through the hole 14 a of the heat sink 14. That is, at this time, the hole 14a functions to flow out the excess adhesive 16 supplied to the gap S, and by releasing the pressure acting on the adhesive 16, the pressing pressure of the FPGA 1 against the substrate 2 is made constant. .

この結果、接着剤１６がＦＰＧＡ１の放熱面１ｂに均一に濡れ広がるとともに、隙間Ｓが接着剤１６で満たされ、放熱シート１２とヒートシンク１４との間の熱的な結合状態を良好にすることができ、放熱性を向上させることができる。また、孔１４ａの作用により、ＦＰＧＡ１のＢＧＡ３に過大な圧力が作用することを防止することができ、電気的な接続安定性を維持できる。   As a result, the adhesive 16 spreads evenly on the heat radiating surface 1 b of the FPGA 1, and the gap S is filled with the adhesive 16 to improve the thermal coupling between the heat radiating sheet 12 and the heat sink 14. It is possible to improve heat dissipation. Further, the action of the hole 14a can prevent an excessive pressure from acting on the BGA 3 of the FPGA 1, and the electrical connection stability can be maintained.

また、このヒートシンク１４の孔１４ａは、隙間Ｓに供給した接着剤１６の量を目視確認するための覘き孔としての機能も有する。特に、ＦＰＧＡ１の放熱面１ｂの４角に対向する位置にそれぞれ孔１４ａを設けることで、放熱面１ｂの全体に接着剤１６が濡れ広がっているか否かを確認することができ、接着剤１６を放熱面１ｂ全体に確実に塗布することができる。   In addition, the hole 14a of the heat sink 14 also has a function as a hole for visually confirming the amount of the adhesive 16 supplied to the gap S. In particular, by providing the holes 14a at positions opposite to the four corners of the heat radiation surface 1b of the FPGA 1, it is possible to confirm whether or not the adhesive 16 has spread over the entire heat radiation surface 1b. It can apply | coat to the whole heat radiating surface 1b reliably.

さらに、本実施形態によると、隙間Ｓに供給する接着剤１６の適切な量を調べるため、ヒートシンク１４の孔１４ａを介してノギスなどを挿入して隙間Ｓの大きさを予め調べることもできる。   Furthermore, according to the present embodiment, in order to examine an appropriate amount of the adhesive 16 to be supplied to the gap S, the size of the gap S can be examined in advance by inserting a caliper or the like through the hole 14a of the heat sink 14.

図３には、第３の実施形態に係る放熱構造３０の概略図を示してある。この放熱構造３０は、上述した第２の実施形態の放熱構造２０と略同じ構造を有するため、ここでは上述した第２の実施形態と同様に機能する構成要素には同一符号を付してその詳細な説明を省略する。   In FIG. 3, the schematic of the thermal radiation structure 30 which concerns on 3rd Embodiment is shown. Since the heat dissipation structure 30 has substantially the same structure as the heat dissipation structure 20 of the above-described second embodiment, the same reference numerals are given to components that function in the same manner as the above-described second embodiment, and Detailed description is omitted.

本実施形態の放熱構造３０は、放熱シート１２のＦＰＧＡ１から離間した裏面１２ａに、押し潰された接着剤１６がはみ出すのを防止する流出防止枠１２ｂを備えている。この流出防止枠１２ｂは、放熱シート１２と異なる材料、或いは同じ材料で形成されており、放熱シート１２の周縁に沿って貼り付けられている。   The heat dissipation structure 30 of the present embodiment includes an outflow prevention frame 12b that prevents the crushed adhesive 16 from protruding on the back surface 12a spaced from the FPGA 1 of the heat dissipation sheet 12. The outflow prevention frame 12 b is formed of a material different from or the same as that of the heat dissipation sheet 12, and is attached along the periphery of the heat dissipation sheet 12.

この放熱構造３０を組み立てる場合、基板２の実装面２ａに実装したＦＰＧＡ１の放熱面１ｂ上に、流出防止枠１２ｂを備えた放熱シート１２を載せて、ジェル状の接着剤１６を流出防止枠１２ｂの内側に供給する。そして、この接着剤１６を介して、ヒートシンク１４を放熱シート１２の上に重ねる。そして、ヒートシンク１４をネジ１８によって基板２に締結固定する。   When assembling the heat dissipation structure 30, the heat dissipation sheet 12 including the outflow prevention frame 12 b is placed on the heat dissipation surface 1 b of the FPGA 1 mounted on the mounting surface 2 a of the substrate 2, and the gel adhesive 16 is applied to the outflow prevention frame 12 b. Supply inside. Then, the heat sink 14 is overlaid on the heat radiating sheet 12 through the adhesive 16. Then, the heat sink 14 is fastened and fixed to the substrate 2 with screws 18.

この場合、ヒートシンク１４によって押し潰された接着剤１６は、放熱シート１２の裏面１２ａに沿って濡れ広がり、流出防止枠１２ｂで堰き止められる。これにより、接着剤１６が基板２の実装面２ａに付着してしまう不具合を防止することができ、メンテナンス性を向上させることができる。   In this case, the adhesive 16 crushed by the heat sink 14 spreads wet along the back surface 12a of the heat dissipation sheet 12, and is dammed by the outflow prevention frame 12b. Thereby, the malfunction which the adhesive agent 16 adheres to the mounting surface 2a of the board | substrate 2 can be prevented, and maintainability can be improved.

また、第２の実施形態の孔１４ａと組み合わせて使用することで、流出防止枠１２ｂによって堰き止められた接着剤１６を孔１４ａから逃がすことができ、接着剤１６の圧力を一定に維持できる。   Further, by using in combination with the hole 14a of the second embodiment, the adhesive 16 blocked by the outflow prevention frame 12b can be released from the hole 14a, and the pressure of the adhesive 16 can be maintained constant.

以上述べた少なくともひとつの実施形態の放熱構造によれば、放熱シート１２とヒートシンク１４との間の隙間Ｓに流動性を有する伝熱材１６を供給することにより、電子部品１の放熱性を高めることができ、電子部品１の基板２に対する接触圧をコントロールすることができ、メンテナンス性を向上させることができる。   According to the heat dissipation structure of at least one embodiment described above, the heat dissipation property of the electronic component 1 is improved by supplying the heat transfer material 16 having fluidity to the gap S between the heat dissipation sheet 12 and the heat sink 14. The contact pressure of the electronic component 1 with respect to the substrate 2 can be controlled, and the maintainability can be improved.

いくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれると同様に、特許請求の範囲に記載された発明とその均等の範囲に含まれるものである。   Although several embodiments have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

例えば、上述した実施形態では、ＢＧＡ３を有するＦＰＧＡ１に取り付けた放熱構造について説明したが、これに限らず、他の電子部品に取り付ける放熱構造に本発明を適用しても良い。   For example, in the above-described embodiment, the heat dissipation structure attached to the FPGA 1 having the BGA 3 has been described. However, the present invention is not limited thereto, and the present invention may be applied to a heat dissipation structure attached to another electronic component.

また、上述した実施形態では、１つの電子部品１に１つのヒートシンク１４を取り付けた場合について説明したが、これに限らず、複数の電子部品１に共通の１つのヒートシンクを取り付ける場合にも、本発明の放熱構造を適用することができる。   In the above-described embodiment, the case where one heat sink 14 is attached to one electronic component 1 has been described. However, the present invention is not limited thereto, and the present invention is applicable to the case where one heat sink common to a plurality of electronic components 1 is attached. The heat dissipation structure of the invention can be applied.

この場合、例えば、図４に示すように、個々の電子部品１ごとに分割した放熱板４２を割り当てて、複数の放熱板４２を１つの金属フレーム４４に脱着自在に取り付けて、全ての放熱板４２の裏面４２ａに接触するようにヒートシンク１４を取り付ける。この場合、接着剤１６を逃がすための孔４３は、各放熱板４２に設ける。   In this case, for example, as shown in FIG. 4, a heat radiating plate 42 divided for each electronic component 1 is allocated, and a plurality of heat radiating plates 42 are detachably attached to one metal frame 44, and all the heat radiating plates are attached. The heat sink 14 is attached so as to be in contact with the back surface 42a of 42. In this case, a hole 43 for allowing the adhesive 16 to escape is provided in each heat sink 42.

これにより、電子部品１の点検や交換作業時において、他のメンテナンスを必要としない電子部品の放熱板４２を取り外すことなく作業できる。   Thereby, at the time of inspection and replacement work of the electronic component 1, the work can be performed without removing the heat sink 42 of the electronic component that does not require other maintenance.

１…ＦＰＧＡ（電子部品）、１ａ…裏面、１ｂ…放熱面、２…基板、２ａ…実装面、３…ＢＧＡ（バンプ）、１０、２０、３０、４０…放熱構造、１２…放熱シート、１２ａ…裏面、１２ｂ…流出防止枠、１４…ヒートシンク、１４ａ…孔、１６…接着剤（伝熱材）、１８…ネジ、４２…放熱板、４２ａ…裏面、４３…孔、４４…金属フレーム。   DESCRIPTION OF SYMBOLS 1 ... FPGA (electronic component), 1a ... Back surface, 1b ... Heat radiation surface, 2 ... Board, 2a ... Mounting surface, 3 ... BGA (bump) 10, 20, 30, 40 ... Heat radiation structure, 12 ... Heat radiation sheet, 12a ... back surface, 12b ... outflow prevention frame, 14 ... heat sink, 14a ... hole, 16 ... adhesive (heat transfer material), 18 ... screw, 42 ... heat sink, 42a ... back surface, 43 ... hole, 44 ... metal frame.

Claims (10)

発熱部材の放熱面に接触して配置される放熱シートと、
上記放熱面から離間した上記放熱シートの裏面側に隙間を介して配置されるヒートシンクと、
流動性を有する状態で上記隙間を埋めるように供給され、上記放熱シートの熱を上記ヒートシンクに伝える伝熱材と、
を有する放熱構造。 A heat dissipating sheet disposed in contact with the heat dissipating surface of the heat generating member;
A heat sink disposed via a gap on the back side of the heat dissipation sheet spaced from the heat dissipation surface;
A heat transfer material that is supplied so as to fill the gap in a state having fluidity, and transfers heat of the heat dissipation sheet to the heat sink,
A heat dissipation structure. 上記伝熱材は、上記隙間を埋めた状態で弾性を有する請求項１の放熱構造。   The heat dissipation structure according to claim 1, wherein the heat transfer material has elasticity in a state in which the gap is filled. 上記ヒートシンクは、上記隙間から上記流動性を有する状態の伝熱材を逃がすための孔を有する請求項１の放熱構造。   The heat dissipation structure according to claim 1, wherein the heat sink has a hole for allowing the heat transfer material having the fluidity to escape from the gap. 上記隙間から上記流動性を有する状態の伝熱材がはみ出すのを防止する流出防止枠をさらに有する請求項１の放熱構造。   The heat dissipation structure according to claim 1, further comprising an outflow prevention frame that prevents the heat transfer material having the fluidity from protruding from the gap. 上記ヒートシンクは、上記隙間から上記流動性を有する状態の伝熱材を逃がすための孔を有する請求項４の放熱構造。   The heat dissipation structure according to claim 4, wherein the heat sink has a hole for allowing the heat transfer material having the fluidity to escape from the gap. 上記伝熱材は、上記隙間を埋めた状態で経時的に固まる接着剤である請求項１の放熱構造。   The heat dissipation structure according to claim 1, wherein the heat transfer material is an adhesive that hardens with time in a state in which the gap is filled. 上記接着剤は、経時的に固まった後、弾性を有する請求項６の放熱構造。   The heat dissipation structure according to claim 6, wherein the adhesive has elasticity after solidifying over time. 上記発熱部材は、基板の配線に電気的に接続する半球状のバンプを有する請求項１の放熱構造。   The heat dissipation structure according to claim 1, wherein the heat generating member has a hemispherical bump electrically connected to the wiring of the substrate. 発熱部材の放熱面に隙間を介して配置されるヒートシンクと、
流動性を有する状態で上記隙間に供給され、上記発熱部材の熱を上記ヒートシンクに伝える伝熱材と、を有し、
上記ヒートシンクは、上記隙間から上記流動性を有する状態の伝熱材を逃がすための孔を有する放熱構造。 A heat sink disposed on the heat radiating surface of the heat generating member via a gap,
A heat transfer material that is supplied to the gap in a state having fluidity and transmits heat of the heat generating member to the heat sink;
The heat sink is a heat dissipation structure having a hole for allowing the heat transfer material having the fluidity to escape from the gap. 上記隙間から上記流動性を有する状態の伝熱材がはみ出すのを防止する流出防止枠をさらに有する請求項９の放熱構造。   The heat dissipation structure according to claim 9, further comprising an outflow prevention frame that prevents the heat transfer material having the fluidity from protruding from the gap.
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016036013A (en) * 2014-07-31 2016-03-17 株式会社デンソー Electronic device and drive apparatus using the same, and manufacturing method of electronic device
WO2016185687A1 (en) * 2015-05-20 2016-11-24 Ricoh Company, Ltd. Electronic device and heat spreader
JP2018195633A (en) * 2017-05-15 2018-12-06 富士通株式会社 Electronic device
JP2020014003A (en) * 2019-08-26 2020-01-23 株式会社リコー Electronic equipment and heat spreader
JP2020025095A (en) * 2018-07-31 2020-02-13 積水化学工業株式会社 FPGA array
JP2020049713A (en) * 2018-09-25 2020-04-02 富士ゼロックス株式会社 Image formation device and substrate
JP7512020B2 (en) 2018-07-31 2024-07-08 積水化学工業株式会社 FPGA Array

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032348A (en) * 1983-08-03 1985-02-19 Hitachi Ltd Semiconductor device having cooling structure
JPS6084848A (en) * 1983-10-17 1985-05-14 Hitachi Ltd Semiconductor device
JPH11163231A (en) * 1997-11-25 1999-06-18 Mitsubishi Electric Corp Semiconductor device with heat sink
JP2001077569A (en) * 1999-09-02 2001-03-23 Matsushita Electric Ind Co Ltd Radiating structure
JP2002093962A (en) * 2000-09-11 2002-03-29 Internatl Business Mach Corp <Ibm> Heat sink for electronic components, electronic component device, electric circuit device and computer
JP2010153934A (en) * 2010-04-07 2010-07-08 Fujitsu Ltd Semiconductor unit and cooling device, and method for manufacturing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032348A (en) * 1983-08-03 1985-02-19 Hitachi Ltd Semiconductor device having cooling structure
JPS6084848A (en) * 1983-10-17 1985-05-14 Hitachi Ltd Semiconductor device
JPH11163231A (en) * 1997-11-25 1999-06-18 Mitsubishi Electric Corp Semiconductor device with heat sink
JP2001077569A (en) * 1999-09-02 2001-03-23 Matsushita Electric Ind Co Ltd Radiating structure
JP2002093962A (en) * 2000-09-11 2002-03-29 Internatl Business Mach Corp <Ibm> Heat sink for electronic components, electronic component device, electric circuit device and computer
JP2010153934A (en) * 2010-04-07 2010-07-08 Fujitsu Ltd Semiconductor unit and cooling device, and method for manufacturing the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9999159B2 (en) 2014-07-31 2018-06-12 Denso Corporation Electronic device, drive apparatus having the electronic device and manufacturing method of the electronic device
JP2016036013A (en) * 2014-07-31 2016-03-17 株式会社デンソー Electronic device and drive apparatus using the same, and manufacturing method of electronic device
KR102113678B1 (en) 2015-05-20 2020-05-22 가부시키가이샤 리코 Electronic devices and heat spreaders
WO2016185687A1 (en) * 2015-05-20 2016-11-24 Ricoh Company, Ltd. Electronic device and heat spreader
JP2016219599A (en) * 2015-05-20 2016-12-22 株式会社リコー Electronic equipment and heat spreader
KR20170137869A (en) * 2015-05-20 2017-12-13 가부시키가이샤 리코 Electronic devices and heat spreaders
CN107637187A (en) * 2015-05-20 2018-01-26 株式会社理光 Electronic installation and radiator
US10524389B2 (en) 2015-05-20 2019-12-31 Ricoh Company, Ltd. Electronic device and heat spreader
JP2018195633A (en) * 2017-05-15 2018-12-06 富士通株式会社 Electronic device
JP2020025095A (en) * 2018-07-31 2020-02-13 積水化学工業株式会社 FPGA array
JP7512020B2 (en) 2018-07-31 2024-07-08 積水化学工業株式会社 FPGA Array
JP2020049713A (en) * 2018-09-25 2020-04-02 富士ゼロックス株式会社 Image formation device and substrate
JP2020014003A (en) * 2019-08-26 2020-01-23 株式会社リコー Electronic equipment and heat spreader

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