JP6027945B2 - Electronic control unit - Google Patents

Electronic control unit Download PDF

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Publication number
JP6027945B2
JP6027945B2 JP2013118799A JP2013118799A JP6027945B2 JP 6027945 B2 JP6027945 B2 JP 6027945B2 JP 2013118799 A JP2013118799 A JP 2013118799A JP 2013118799 A JP2013118799 A JP 2013118799A JP 6027945 B2 JP6027945 B2 JP 6027945B2
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heat
substrate
cover
electronic control
heat conductive
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JP2013232654A (en
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板橋　徹
板橋　　徹
牧野　昭伸
昭伸 牧野
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Description

本発明は、例えば車両のエンジンルームなどに配置される電子制御装置に関する。   The present invention relates to an electronic control device disposed in, for example, an engine room of a vehicle.

従来、例えば車両の制御に用いられる電子制御装置（ＥＣＵ）には、演算処理を行うマイコン、外部負荷やセンサなどと接続される入出力回路、これらの回路に電源を供給する電源回路などが、基板上に配置されており、それらは、ケース及びカバーからなる筐体に収容されていた。
上述した回路を構成する電子部品は、その動作により発熱し、これが過度に温度上昇すると部品作動に害を及ぼすので、基板などに伝熱して熱を拡散させることにより、部品温度を低減する方法が知られている。また、図１２に示す様に、特に発熱が大きい電子部品（例えばパワートランジスタの半導体チップ）Ｐ１に関しては、放熱フィンＰ２を用いるなどして、電子部品Ｐ１から発生する熱をケースＰ３側に効率よく散逸させる方法がとられている。 Conventionally, for example, an electronic control unit (ECU) used for vehicle control includes a microcomputer that performs arithmetic processing, an input / output circuit connected to an external load, a sensor, and the like, a power supply circuit that supplies power to these circuits, and the like. They are arranged on a substrate, and they are accommodated in a casing composed of a case and a cover.
The electronic components that make up the circuit described above generate heat due to their operation, and if this rises in temperature excessively, it will harm the operation of the components.Therefore, there is a method for reducing the component temperature by transferring heat to the substrate or the like to diffuse the heat. Are known. Further, as shown in FIG. 12, particularly for an electronic component (eg, a semiconductor chip of a power transistor) P1 that generates a large amount of heat, heat generated from the electronic component P1 is efficiently transferred to the case P3 side by using a heat radiating fin P2. A way to dissipate is taken.

ところが、近年では、電子制御装置の一層の高機能・高能力が求められるようになっており、電子部品Ｐ１の発する熱は増加の一途をたどっている。そのため、これらの発熱する電子部品Ｐ１からより多くの熱を散逸させるために、図１３に示す様に、基板Ｐ４上の電子部品Ｐ１の（詳しくはヒートシンクＰ５の）装着部分に、大きな銅箔Ｐ６を配置し、ＶＩＡホールＰ７を介して、更に広い銅箔Ｐ８などに熱を散逸させる構造が採用されている。   However, in recent years, there has been a demand for higher functionality and higher performance of the electronic control device, and the heat generated by the electronic component P1 is constantly increasing. Therefore, in order to dissipate more heat from these heat generating electronic components P1, as shown in FIG. 13, a large copper foil P6 is attached to the mounting portion of the electronic components P1 (specifically, the heat sink P5) on the substrate P4. And dissipating heat to a wider copper foil P8 or the like through the VIA hole P7.

しかしながら、この方法では、基板Ｐ４上の有効な配線面積が減少するので、結果的に大きな基板Ｐ４が必要であり、コストアップとなってしまう。一方、近年では、電子制御装置の小型化も求められており、それに対応して、半導体集積技術の進歩に伴って部品を小型化したり、多くの回路をＩＣ化したりするなどの方法が採られているが、このことは、電子部品Ｐ１の温度上昇を招くことになる。   However, in this method, the effective wiring area on the substrate P4 is reduced, and as a result, a large substrate P4 is required, resulting in an increase in cost. On the other hand, in recent years, miniaturization of electronic control devices has been demanded, and in response to this, methods such as miniaturization of parts and integration of many circuits into ICs have been adopted with the progress of semiconductor integrated technology. However, this leads to a temperature rise of the electronic component P1.

この対策としては、電力損失の少ない高価な電子部品Ｐ１を用いること、放熱フィンＰ２に部品を搭載すること、基板Ｐ４をある程度大きくして散熱能力を向上することなどが考えられるが、いずれもコストアップに結びつく結果となる。また、これら発熱する電子部品Ｐ１自体を高耐熱とすることも考えられるが、高密度に配置される周辺部品も、基板Ｐ４から伝導する熱により温度上昇するので、基板Ｐ４をある程度大きくするか、周辺部品を高耐熱部品としなければならず、必ずしも好ましくない。   Possible countermeasures include using expensive electronic components P1 with low power loss, mounting components on the heat radiation fins P2, and increasing the heat dissipation capability by enlarging the substrate P4 to some extent. The result is tied up. Further, although it is conceivable that the heat-generating electronic component P1 itself has high heat resistance, peripheral components arranged at high density also rise in temperature due to heat conducted from the substrate P4. The peripheral parts must be high heat-resistant parts, which is not always preferable.

本発明は、前記課題を解決するためになされたものであり、低コストで容易に製造でき、しかも熱を散逸させる能力が高い電子制御装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic control device that can be easily manufactured at low cost and has a high ability to dissipate heat.

請求項１の発明に係る電子制御装置は、（Ａ）発熱する電子部品が所定領域に搭載された樹脂製の材料からなる基板、（Ｂ）開口部を有する箱状のケースと、当該ケースの開口部を閉塞するとともにケースよりも底の浅いカバーとから構成され、前記基板を収容する筐体、（Ｃ）前記筐体内において前記カバー側に設けられ、前記基板の前記所定領域に対応する突出面を有して前記所定領域に向けて突出し、前記カバーと一体に形成された突出部、（Ｄ）前記突出部の前記突出面と前記所定領域において前記突出面に近接する前記基板との間の隙間に配置された柔軟性を有する熱伝導材とを有し、（Ｅ）前記基板の前記カバー側の反搭載面と前記カバーの外周に設けられた結合面とが同一平面で直接押圧されて固定されることにより、前記突出部の前記突出面が前記基板の前記カバー側の反搭載面と平行になっているとともに、前記熱伝導材の配置される前記隙間の間隔の寸法が、前記カバーの底部から前記結合面までの寸法と前記底部から前記突出面までの寸法との差により定まるようになっており、（Ｆ）前記熱伝導材は、柔軟性を有して押圧により形状が変形しており、（Ｇ）さらに、電子部品と一体にモールドされた放熱部材を備え、（Ｈ）放熱部材は、電子部品と基板との間に配置されていることを特徴とする。 The electronic control device according to the invention of claim 1 is: (A) a substrate made of a resin material on which a heat generating electronic component is mounted in a predetermined region; (B) a box-shaped case having an opening; A housing configured to close the opening and have a shallower bottom than the case, and to accommodate the substrate; (C) a protrusion provided on the cover side in the housing and corresponding to the predetermined region of the substrate; A projection having a surface and projecting toward the predetermined region and integrally formed with the cover; (D) between the projection surface of the projection and the substrate adjacent to the projection surface in the predetermined region; of and a thermally conductive material having an arrangement softness in the gap, (E) before SL directly pressed with the cover side of the counter-mounting surface and the coupling surface and the same plane provided on the outer periphery of the cover substrate It is fixedly by Rukoto, the butt Together with the protruding surface parts is parallel and anti-mounting surface of the cover side of the substrate, the dimension of spacing of said gap is disposed in the heat conductive material is, from the bottom of the cover to said coupling surface (F) The heat conducting material has flexibility and is deformed by pressing, and (G) is further determined by the difference between the size and the size from the bottom to the projecting surface. The heat radiation member molded integrally with the electronic component is provided, and (H) the heat radiation member is disposed between the electronic component and the substrate.

本発明によれば、電子部品から熱伝導材とカバーの突出部を介して筐体のカバー側に放熱できるので、放熱性がよく、基板上の他の電子部品への熱の影響を抑制することができる。また、基板上の配線と電子部品の実装面積を高めることもできる。   According to the present invention, since heat can be radiated from the electronic component to the cover side of the housing via the heat conducting material and the protrusion of the cover, the heat dissipation is good and the influence of heat on other electronic components on the substrate is suppressed. be able to. In addition, the mounting area of wiring and electronic components on the substrate can be increased.

また本発明では、基板をカバーに固定するようにしており、基板とカバーの突出部との間の熱伝導材の配置される間隔の寸法精度を容易に確保することができる。   In the present invention, the substrate is fixed to the cover, and the dimensional accuracy of the interval at which the heat conductive material is disposed between the substrate and the protruding portion of the cover can be easily ensured.

実施例１の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 1. FIG. 実施例２の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 2. FIG. 実施例３の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 3. FIG. 実施例３の電子制御装置の移動防止部を示す平面図である。FIG. 10 is a plan view illustrating a movement prevention unit of the electronic control device according to the third embodiment. 実施例４の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 4. FIG. 実施例５の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 5. FIG. 実施例６の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 6. FIG. 実施例７の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 7. FIG. 実施例８の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 8. FIG. 実施例９の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 9. FIG. 実施例１０の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of Example 10. FIG. 従来技術の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of a prior art. 従来技術の電子制御装置を破断して示す説明図である。It is explanatory drawing which fractures | ruptures and shows the electronic control apparatus of a prior art.

以下に本発明の電子制御装置の実施の形態の例（実施例）を説明する。   Examples (embodiments) of the embodiment of the electronic control device of the present invention will be described below.

（実施例１）
ａ）実施例１の電子制御装置を、図１に基づいて説明する。 Example 1
a) The electronic control device of Embodiment 1 will be described with reference to FIG.

図１に示す様に、本実施例における電子制御装置（ＥＣＵ）１は、発熱する電子部品（例えば半導体チップ）３を実装したプリント基板５と、プリント基板５を収容した筐体７とを備えている。筐体７は、例えばアルミニウム等の金属製であり、一方（図の下方）が開放された略四角箱状のケース９と、ケース９の開放側（開口部１１）を閉塞する略四角板状の底の浅いカバー１３とから構成され、ケース９とカバー１３とは、その四隅にて、ネジ１５にて結合されている。   As shown in FIG. 1, an electronic control unit (ECU) 1 in this embodiment includes a printed circuit board 5 on which an electronic component (for example, a semiconductor chip) 3 that generates heat is mounted, and a housing 7 that houses the printed circuit board 5. ing. The casing 7 is made of a metal such as aluminum, for example, and has a substantially square box-like case 9 with one side opened (downward in the figure) and a substantially square plate shape that closes the open side (opening 11) of the case 9. The case 9 and the cover 13 are coupled with screws 15 at the four corners.

この結合時には、プリント基板５は、ケース９とカバー１３とによって挟まれた状態で、プリント基板５を貫くネジ１５により、筐体７に固定されている。従って、プリント基板５におけるカバー１３側の反搭載面５ｂ（電子部品３が搭載される搭載面５ａとは反対の面）と、カバー１３の外周に設けられた結合面１３ａとは、同一平面上に位置することになる。   At the time of this connection, the printed circuit board 5 is fixed to the housing 7 with screws 15 penetrating the printed circuit board 5 while being sandwiched between the case 9 and the cover 13. Accordingly, the anti-mounting surface 5b (the surface opposite to the mounting surface 5a on which the electronic component 3 is mounted) on the cover 13 side of the printed circuit board 5 and the coupling surface 13a provided on the outer periphery of the cover 13 are on the same plane. Will be located.

プリント基板５は、例えばエポキシ等の樹脂製の材料からなり、その搭載面５ａと反搭載面５ｂとプリント基板５の内部に、銅箔からなる熱伝導薄膜層１７ａ、１７ｂ、１７ｃ（１７と総称する）が、平行に複数形成されている。つまり、搭載面５ａと反搭載面５ｂとプリント基板５の内部において、各平面にそれぞれ形成された熱伝導薄膜層１７は、同図の上下方向に分離しているとともに、左右方向にも分離している。従って、各熱伝導薄膜層１７は、それぞれ熱的にも分離している。   The printed circuit board 5 is made of, for example, a resin material such as epoxy, and heat conductive thin film layers 17a, 17b, and 17c (generally 17) are formed of copper foil on the mounting surface 5a, the non-mounting surface 5b, and the printed circuit board 5. Are formed in parallel. That is, in the mounting surface 5a, the anti-mounting surface 5b, and the inside of the printed board 5, the heat conductive thin film layers 17 formed on the respective planes are separated in the vertical direction and also in the horizontal direction. ing. Therefore, each heat conductive thin film layer 17 is also thermally separated.

電子部品３は、リードフレーム１９やボンディングワイヤ２１とともに、樹脂２３によりモールドされている。このモールドされた電子部品３（以下モールド部品２５とも記す）は、その本体部分２５ａが、プリント基板５の搭載面５ａ上に形成された熱伝導薄膜層１７ａに、接着剤により接合されており、リードフレーム１９は、搭載面５ａ上の他の熱伝導薄膜層１７ａにはんだ付けされている。   The electronic component 3 is molded with a resin 23 together with the lead frame 19 and the bonding wire 21. The molded electronic component 3 (hereinafter also referred to as a molded component 25) has a main body portion 25a bonded to a heat conductive thin film layer 17a formed on the mounting surface 5a of the printed circuit board 5 with an adhesive, The lead frame 19 is soldered to another heat conductive thin film layer 17a on the mounting surface 5a.

尚、熱伝導薄膜層１７は、電子部品２３をプリント基板５側に投影した領域と重なるように（即ち投影領域よりも広くなるように）形成されており、そのうち、熱伝導薄膜層１７ａは、モールド部品２５の本体部分２５ａの下端面と同形状であり、熱伝導薄膜層１７ｂ、１７ｃは、電子部品２３をプリント基板５側に投影した形状とほぼ同形状である。   The heat conductive thin film layer 17 is formed so as to overlap with the area where the electronic component 23 is projected on the printed circuit board 5 side (that is, wider than the projected area). The shape is the same as the lower end surface of the main body portion 25a of the mold component 25, and the heat conductive thin film layers 17b and 17c are substantially the same shape as the shape of the electronic component 23 projected onto the printed circuit board 5 side.

カバー１３には、カバー１３の底部１３ｂから電子部品５の搭載位置に向けて突出する突出部２７が、略台形状に設けられており、その先端面２７ａは、プリント基板５の反搭載面５ｂと平行なように平坦に形成されている。尚、このカバー１３は、例えばプレスにより形成されるので、突出部２７の裏側は突出部２７の形状に対応するように凹んでいる。   The cover 13 is provided with a protruding portion 27 that protrudes from the bottom portion 13 b of the cover 13 toward the mounting position of the electronic component 5 in a substantially trapezoidal shape, and the tip end surface 27 a is the anti-mounting surface 5 b of the printed circuit board 5. It is formed flat so as to be parallel to. In addition, since this cover 13 is formed by press, for example, the back side of the protrusion 27 is recessed so as to correspond to the shape of the protrusion 27.

特に、本実施例では、突出部２７の先端面２７ａと、電子部品５の搭載位置（即ち電子部品５の投影領域）に対応するプリント基板５の反搭載面５ｂとの間に、先端面２７ａ及び反搭載面５ｂと接して、柔軟性を有する半固体の熱伝導材２９が配置されている。この熱伝導材２９とは、例えば金属フィラーが含まれたシリコン系のゲル状の樹脂材料からなるものである。   In particular, in this embodiment, the front end surface 27a is located between the front end surface 27a of the protrusion 27 and the counter-mounting surface 5b of the printed circuit board 5 corresponding to the mounting position of the electronic component 5 (that is, the projection area of the electronic component 5). And the semi-solid heat conductive material 29 which has a softness | flexibility is arrange | positioned in contact with the anti-mounting surface 5b. The heat conductive material 29 is made of, for example, a silicon gel resin material containing a metal filler.

また、プリント基板５の反搭載面５ｂのうち、熱伝導材２９と接する表面には、電子部品５の投影領域と同様な形状の熱伝導薄膜層１７ｂが形成されており、その位置に対応するプリント基板５内の熱伝導薄膜層１７ｃも、電子部品５の投影形状と同様に形成されている。   In addition, a heat conductive thin film layer 17b having the same shape as the projection region of the electronic component 5 is formed on the surface of the non-mounting surface 5b of the printed circuit board 5 that is in contact with the heat conductive material 29, and corresponds to the position. The heat conductive thin film layer 17 c in the printed board 5 is also formed in the same manner as the projected shape of the electronic component 5.

尚、熱伝導材は、柔軟性を有する例えば半固体（又はゲル状）であり、押圧されるとその形状が容易に変形するものである。熱伝導材としては、その熱伝導材の熱伝導率が、例えば基板材料のエポキシ樹脂等の樹脂よりも高いシリコン系の材料など使用できるが、この熱伝導率としては、１〜３Ｗ／ｍ・Ｋ程度のものを採用できる。   In addition, a heat conductive material is a semi-solid (or gel shape) which has a softness | flexibility, for example, and when it is pressed, the shape will change easily. As the heat conductive material, for example, a silicon-based material whose heat conductivity is higher than that of a resin such as an epoxy resin as a substrate material can be used. As the heat conductivity, 1 to 3 W / m · About K can be used.

また熱伝導薄膜層としては、熱伝導率が例えば基板材料であるエポキシ樹脂等の樹脂よりも高い例えば銅箔からなる薄膜層を用いることができるが、この熱伝導率としては、銅の３９８Ｗ／ｍ・Ｋ程度のものを採用できる。   Further, as the heat conductive thin film layer, a thin film layer made of, for example, copper foil having a higher heat conductivity than that of a resin such as an epoxy resin, which is a substrate material, can be used. About m · K can be used.

ｂ）本実施例では、電子部品５の搭載位置に対応して、熱伝導薄膜層１７が図の上下方向に順次配置されるとともに、プリント基板５とカバー１３の突出部２７との間に、熱伝導材２７が押圧されて接触するように配置されているので、従来より低コストで、電子部品５に発生した熱を、カバー１３を介して効率よく外部に散逸させることができる。   b) In the present embodiment, the heat conductive thin film layer 17 is sequentially arranged in the vertical direction of the drawing corresponding to the mounting position of the electronic component 5, and between the printed board 5 and the protruding portion 27 of the cover 13, Since the heat conductive material 27 is disposed so as to be pressed and contacted, the heat generated in the electronic component 5 can be efficiently dissipated to the outside through the cover 13 at a lower cost than in the past.

また、本実施例では、プリント基板５はカバー１３に直接に接触して押圧されて固定されるので、プリント基板５とカバー１３の突出部２７との間隔、即ち熱伝導材２９の配置部分の寸法精度を、容易に確保することができる。また、電子部品５の搭載位置に対応した熱伝導薄膜層１７と、その周囲の他の熱伝導薄膜層１７との間は、熱的に分離されているので、プリント基板５を介して周囲に熱が伝わり難いという利点がある。   In this embodiment, the printed circuit board 5 is directly pressed and fixed to the cover 13, so that the distance between the printed circuit board 5 and the protrusion 27 of the cover 13, that is, the portion where the heat conductive material 29 is disposed. The dimensional accuracy can be easily ensured. Further, since the heat conductive thin film layer 17 corresponding to the mounting position of the electronic component 5 and the other heat conductive thin film layer 17 around the heat conductive thin film layer 17 are thermally separated from each other, There is an advantage that heat is not easily transmitted.

尚、熱伝導薄膜層１７の面積を、プリント基板５の搭載面５ａ側よりも反搭載面５ｂ側の方を大きくしてもよい。これにより、一層熱の散逸性が向上する。また、プリント基板５とカバー１３とを直接に接触させるのではなく、その間に、所定の厚みを有するスペーサを配置してもよい。これにより、隙間の調節が可能になる。   The area of the heat conductive thin film layer 17 may be made larger on the side opposite to the mounting surface 5b than on the mounting surface 5a side of the printed circuit board 5. Thereby, the heat dissipation is further improved. Further, the printed circuit board 5 and the cover 13 are not directly brought into contact with each other, and a spacer having a predetermined thickness may be disposed between them. As a result, the gap can be adjusted.

（実施例２）
次に、実施例２の電子制御装置について説明するが、図１の実施例と同様な内容の説明は省略する。 (Example 2)
Next, an electronic control device according to the second embodiment will be described, but description of the same contents as those of the embodiment of FIG. 1 will be omitted.

ａ）実施例２の電子制御装置を、図２に基づいて説明する。図２に示す様に、本実施例における電子制御装置（ＥＣＵ）３１も、図１に示す実施例１と同様に、プリント基板３３をケース３５及びカバー３７にて挟持して固定している。   a) The electronic control device of Embodiment 2 will be described with reference to FIG. As shown in FIG. 2, the electronic control unit (ECU) 31 in the present embodiment also fixes the printed circuit board 33 between the case 35 and the cover 37 in the same manner as in the first embodiment shown in FIG. 1.

プリント基板３３には、その搭載面３３ａ及び反搭載面３３ｂに、電子部品３９の投影形状と同様な形状の熱伝導薄膜層４１ａ、４１ｂが形成されるとともに、両側の熱伝導薄膜層４１ａ、４１ｂを接続するようにＶＩＡホール４３が形成されている。   On the printed circuit board 33, heat conductive thin film layers 41a and 41b having the same shape as the projected shape of the electronic component 39 are formed on the mounting surface 33a and the counter mounting surface 33b, and the heat conductive thin film layers 41a and 41b on both sides are formed. VIA holes 43 are formed so as to connect the two.

尚、ＶＩＡホール４３の内周面には銅の薄膜が形成されており、その内部にははんだ４５が充填されている。また、熱伝導薄膜層４１ａ、４１ｂは、電子部品２３をプリント基板５側に投影した領域と重なるように（即ち投影領域よりも広くなるように）形成されている。   A copper thin film is formed on the inner peripheral surface of the VIA hole 43, and the inside thereof is filled with solder 45. Further, the heat conductive thin film layers 41a and 41b are formed so as to overlap with a region where the electronic component 23 is projected on the printed circuit board 5 side (that is, wider than the projection region).

電子部品３９は、リードフレーム４７、ボンディングワイヤ４９、及び放熱部材（放熱フィン：ヒートシンク）５１とともに、樹脂５３によりモールドされている。このモールド部品５５は、放熱部材５１を介して、はんだ５７により、プリント基板３３の搭載面３３ａの熱伝導薄膜層４１ａに接合されている。   The electronic component 39 is molded with a resin 53 together with a lead frame 47, a bonding wire 49, and a heat radiating member (heat radiating fin: heat sink) 51. The mold component 55 is bonded to the heat conductive thin film layer 41 a on the mounting surface 33 a of the printed circuit board 33 by the solder 57 through the heat radiating member 51.

尚、放熱部材（例えばヒートシンク）としては、熱伝導率が例えばモールド材料の樹脂より高い固体の金属材料を使用できるが、この熱伝導率としては、一般的な合金や金属材料から２０〜４００Ｗ／ｍ・Ｋのものを採用できる。   In addition, as a heat radiating member (for example, heat sink), although a solid metal material whose heat conductivity is higher than resin of a molding material can be used, as this heat conductivity, it is 20-400 W / from a general alloy and metal material. m · K can be used.

カバー３７には、カバー３７の底部３７ａから電子部品５１の搭載位置に向けて突出する突出部５９が設けられており、その突出部５９はカバー３７と一体に中実に形成されている。そして、本実施例でも、突出部５９の先端面５９ａと、（電子部品３９の搭載位置に対応する）プリント基板３３の反搭載面３３ｂとの間に、先端面５９ａと反搭載面３３ｂとに接して、柔軟性を有する半固体の熱伝導材６１が配置されている。   The cover 37 is provided with a protrusion 59 that protrudes from the bottom 37 a of the cover 37 toward the mounting position of the electronic component 51, and the protrusion 59 is formed integrally with the cover 37. Also in this embodiment, the front end surface 59a and the anti-mounting surface 33b are disposed between the front end surface 59a of the protruding portion 59 and the anti-mounting surface 33b of the printed circuit board 33 (corresponding to the mounting position of the electronic component 39). A semi-solid heat conductive material 61 having flexibility is disposed in contact therewith.

ｂ）本実施例においても、実施例１と同様な効果を奏するとともに、特に搭載面３３ａ及び反搭載面３３ｂの両熱伝導薄膜層４１ａ、４１ｂを接続するように、ＶＩＡホール４３が形成されているので、一層熱の散逸性に優れているという効果がある。従って、本実施例は、比較的発熱の大きな電子部品に好適である。   b) In this embodiment, the same effect as that of the first embodiment is obtained, and the VIA hole 43 is formed so as to connect both the heat conductive thin film layers 41a and 41b of the mounting surface 33a and the non-mounting surface 33b. Therefore, there is an effect that heat dissipation is further improved. Therefore, this embodiment is suitable for an electronic component that generates a relatively large amount of heat.

（実施例３）
次に、実施例３の電子制御装置について説明するが、図２に示す実施例２と同様な内容の説明は省略する。 (Example 3)
Next, an electronic control device according to a third embodiment will be described, but the description of the same contents as those of the second embodiment shown in FIG. 2 will be omitted.

ａ）実施例３の電子制御装置を、図３に基づいて説明する。図３に示す様に、本実施例の電子制御装置７０の基本的な構造は、実施例２と同様である。特に本実施例では、カバー７１の突出部７３の先端面７３ａに、熱伝導材７５が周囲に流出することを防止する凸状の移動防止部（枠部）７７を設けている。   a) The electronic control device of Embodiment 3 will be described with reference to FIG. As shown in FIG. 3, the basic structure of the electronic control unit 70 of this embodiment is the same as that of the second embodiment. In particular, in the present embodiment, a convex movement preventing portion (frame portion) 77 that prevents the heat conductive material 75 from flowing out to the surroundings is provided on the distal end surface 73a of the protruding portion 73 of the cover 71.

この移動防止部７７は、図４（ａ）にその平面を示す様に、突出部７３の先端面７３ａの周囲を囲む様に、四角の枠状に形成されたものであり、図３に示す様に、先端面７３ａからプリント基板７９の反搭載面７９ｂ側に向けて突出している。   As shown in FIG. 4A, the movement preventing portion 77 is formed in a square frame shape so as to surround the tip end surface 73a of the projecting portion 73, and is shown in FIG. Similarly, it protrudes from the front end surface 73a toward the side opposite to the mounting surface 79b of the printed circuit board 79.

尚、移動防止部７７は、突出部７３（従ってカバー７１）と一体に成形されたものである。   The movement preventing portion 77 is formed integrally with the protruding portion 73 (therefore, the cover 71).

ｂ）本実施例によっても、実施例２と同様な効果を奏するとともに、先端面７３ａには枠状の移動防止部７７が設けてあるので、熱伝導材７５の流出や脱落を効果的に防止することができ、例えば電子制御装置を縦に配置しても熱伝導材の流出を防止できる。   b) According to the present embodiment, the same effect as in the second embodiment is obtained, and since the frame-shaped movement preventing portion 77 is provided on the distal end surface 73a, it is possible to effectively prevent the heat conduction material 75 from flowing out and falling off. For example, it is possible to prevent the heat conduction material from flowing out even if the electronic control device is arranged vertically.

また、熱伝導材の配置位置の周囲は枠部により囲まれているので、熱伝導材を薄く塗る必要はなく、枠内に熱伝導材を簡単な工程で配置すれば（例えば山状にポッティングすれば）、均一な厚さになる。   In addition, since the periphery of the arrangement position of the heat conductive material is surrounded by the frame portion, it is not necessary to apply the heat conductive material thinly, and if the heat conductive material is arranged in the frame by a simple process (for example, potting in a mountain shape) ) To a uniform thickness.

また、移動防止部７７は、突起部７３と一体に形成されるので、その形成が容易であり、寸法精度も高いという利点がある。尚、熱伝導材７５が、例えばシート状の様なそれほど流動性高くない場合には、例えば図４（ｂ）に示す様に、突出部７３の先端面７３ａの例えば周囲に、部分的に凸部８１を設けてもよい。   Further, since the movement preventing portion 77 is formed integrally with the protruding portion 73, there is an advantage that the formation is easy and the dimensional accuracy is high. In the case where the heat conducting material 75 is not so fluid as in a sheet shape, for example, as shown in FIG. 4B, for example, it partially protrudes around the front end surface 73a of the projecting portion 73. The part 81 may be provided.

また、突出部７３側に移動防止部７７を設けるのではなく、プリント基板７９の反搭載面７９側に、図４と同様な形状の移動防止部を、例えばはんだ付けなどにより設けてもよい。   Further, instead of providing the movement preventing portion 77 on the protruding portion 73 side, a movement preventing portion having the same shape as that in FIG. 4 may be provided on the side opposite to the mounting surface 79 of the printed circuit board 79 by, for example, soldering.

（実施例４）
次に、実施例４の電子制御装置について説明するが、実施例３と同様な内容の説明は省略する。 Example 4
Next, an electronic control device according to a fourth embodiment will be described, but a description of the same contents as those of the third embodiment will be omitted.

ａ）実施例４の電子制御装置を、図５に基づいて説明する。図５に示す様に、本実施例の電子制御装置９０の基本的な構造は、実施例３と同様である。特に本実施例では、カバー９１の突出部９３の先端面９３ａに、多数の凸部９５を設けて、先端面９３ａを凹凸形状とするとともに、（モールド部品９７の搭載位置に対応する）プリント基板９９の反搭載面９９ｂの熱伝導薄膜層１０１上にも、多数の凸部１０３を設けて、熱伝導薄膜層１０１の表面を凹凸形状としている。   a) The electronic control device of Embodiment 4 will be described with reference to FIG. As shown in FIG. 5, the basic structure of the electronic control unit 90 of this embodiment is the same as that of the third embodiment. In particular, in this embodiment, a large number of convex portions 95 are provided on the front end surface 93a of the protruding portion 93 of the cover 91 so that the front end surface 93a has an uneven shape and corresponds to the mounting position of the mold component 97. A large number of convex portions 103 are also provided on the heat conductive thin film layer 101 on the non-mounting surface 99b of 99, so that the surface of the heat conductive thin film layer 101 has an uneven shape.

また、突出部９３の先端面９３ａの凸及び凹と熱伝導薄膜層１０１の凹及び凸が、それぞれ対応するように、即ち凹に対向して凸が配置されるように、表面形状が形成されている。そして、その凹凸形状の突出部９３の先端面９３ａと熱伝導薄膜層１０１との間に、熱伝導材１０５が配置され、それによって、熱伝導材１０５はその断面が蛇行したような状態となるが、熱伝導材１０５の厚みは、ほぼ均一化される。   Further, the surface shape is formed so that the projections and depressions of the distal end surface 93a of the protrusion 93 and the depressions and projections of the heat conductive thin film layer 101 correspond to each other, that is, the projections are arranged to face the depressions. ing. And the heat conductive material 105 is arrange | positioned between the front end surface 93a of the uneven | corrugated shaped protrusion part 93, and the heat conductive thin film layer 101, and, as a result, the heat conductive material 105 will be in the state where the cross section meandered. However, the thickness of the heat conductive material 105 is made substantially uniform.

尚、突起部９３の凸部９５は、突出部９３（従ってカバー９１）と一体に成形されたものであり、プリント基板９９の反搭載面９９ｂ側の凸部１０３は、はんだ付けにより形成されたものである。   The protrusion 95 of the protrusion 93 is formed integrally with the protrusion 93 (and thus the cover 91), and the protrusion 103 on the side opposite to the mounting surface 99b of the printed circuit board 99 is formed by soldering. Is.

ｂ）本実施例においても、実施例３と同様な効果を奏するとともに、熱伝導材１０５は、凹凸形状の突出部９３の先端面９３ａと熱伝導薄膜層１０１との間に挟まれて、その接触面積が大きいので、一層熱散逸性が高いという効果がある。   b) In the present embodiment, the same effect as in the third embodiment is obtained, and the heat conductive material 105 is sandwiched between the tip end surface 93a of the projection 93 having the concavo-convex shape and the heat conductive thin film layer 101. Since the contact area is large, there is an effect of higher heat dissipation.

また、突出部９３の先端面９３ａの凹凸と熱伝導薄膜層１０１の凹凸が互いに入り込んで、突出部９３の先端面９３ａと熱伝導薄膜層１０１との凹凸表面間における距離は均一になるので、熱の伝わり方も均一になる。従って、最小限の熱伝導材１０３で最大の熱の放逸性が得られるという効果がある。しかも、使用する熱伝導材１０３が少量で済むので、コストを低減できるという利点もある。   Moreover, since the unevenness of the tip surface 93a of the protrusion 93 and the unevenness of the heat conductive thin film layer 101 enter each other, the distance between the uneven surface of the tip surface 93a of the protrusion 93 and the heat conductive thin film layer 101 becomes uniform. The way of heat transfer is also uniform. Therefore, there is an effect that the maximum heat dissipation property can be obtained with the minimum heat conductive material 103. In addition, since only a small amount of the heat conductive material 103 is used, there is an advantage that the cost can be reduced.

（実施例５）
次に、実施例５の電子制御装置について説明するが、実施例１乃至３と同様な内容の説明は省略する。 (Example 5)
Next, an electronic control device according to a fifth embodiment will be described, but a description of the same contents as those of the first to third embodiments will be omitted.

ａ）実施例５の電子制御装置を、図６に基づいて説明する。図６に示す様に、本実施例の電子制御装置１１０は、実施例３とは異なり、電子部品１１１を収容したモールド部品１１３の本体部分１１３ａは、プリント基板１１５に接しておらず、プリント基板１１５にはＶＩＡホールが形成されていない。   a) An electronic control device of Example 5 will be described with reference to FIG. As shown in FIG. 6, the electronic control device 110 according to the present embodiment is different from the third embodiment in that the main body portion 113 a of the mold component 113 that houses the electronic component 111 is not in contact with the printed circuit board 115. No VIA hole is formed in 115.

つまり、本実施例では、モールド部品１１３は、ケース１１７側ではなくカバー１１９側に配置されている。そして、放熱部材１２１は、プリント基板１１５側ではなく、カバー１１９側に配置されており、この放熱部材１２１とカバー１１９の突出部１２３との間に、熱伝導材１２５が配置されている。   That is, in the present embodiment, the mold component 113 is disposed on the cover 119 side, not on the case 117 side. The heat dissipating member 121 is disposed not on the printed board 115 side but on the cover 119 side, and a heat conducting material 125 is disposed between the heat dissipating member 121 and the protruding portion 123 of the cover 119.

また、カバー１１９の突出部１２３の先端面１２３ａには、上述した枠状の移動防止部１２７が形成されている。   Further, the above-described frame-shaped movement preventing portion 127 is formed on the front end surface 123 a of the protruding portion 123 of the cover 119.

ｂ）本実施例は、実施例１〜４とは、モールド部品１１３の配置位置が逆であり、熱伝導材１２５はプリント基板のモールド部品１１３の搭載面側、カバー１１９側に配置されている。これにより、基板を介することなく、電子部品から熱伝導材を介して筐体側に放熱できるので、放熱性がよく、基板上の他の電子部品への熱の影響を抑制することができる。また、基板上の配線と電子部品の実装面積を高めることもできる。また、モールド部品１１３の本体部分１１３ａが、直接にプリント基板１１５に接していないので、プリント基板１１５側に熱が伝わり難く、一層高い熱散逸性を有している。   b) In this embodiment, the arrangement position of the mold component 113 is opposite to that of the first to fourth embodiments, and the heat conductive material 125 is arranged on the mounting surface side of the mold component 113 of the printed board and on the cover 119 side. . Thereby, since heat can be radiated from the electronic component to the housing side via the heat conducting material without using the substrate, heat dissipation is good, and the influence of heat on other electronic components on the substrate can be suppressed. In addition, the mounting area of wiring and electronic components on the substrate can be increased. Further, since the main body portion 113a of the mold part 113 is not in direct contact with the printed circuit board 115, heat is not easily transmitted to the printed circuit board 115 side, and the heat dissipation is further enhanced.

また、モールド部品１１３の放熱部材１２１は、プリント基板１１５側ではなく、カバー１１９側に配置されており、これにより効率よく放熱を行うことができる。   Further, the heat radiating member 121 of the mold component 113 is disposed not on the printed circuit board 115 side but on the cover 119 side, so that heat can be efficiently radiated.

また、移動防止部１２７により、熱伝導材１２５の流出も防止することができる。尚、本実施例では、突起部１２３側に移動防止部１２７を設けたが、放熱部材１２１側に同様な移動防止部を設けてもよい。   In addition, the movement preventing unit 127 can prevent the heat conductive material 125 from flowing out. In this embodiment, the movement preventing part 127 is provided on the protruding part 123 side, but a similar movement preventing part may be provided on the heat radiating member 121 side.

（実施例６）
次に、実施例６の電子制御装置について説明するが、実施例１と同様な内容の説明は省略する。 (Example 6)
Next, an electronic control device according to a sixth embodiment will be described, but the description of the same contents as those of the first embodiment will be omitted.

ａ）実施例６の電子制御装置を、図７に基づいて説明する。図７に示す様に、本実施例の電子制御装置１３０は、実施例５と同様なプリント基板１３１、モールド部品１３３及び（プレス加工にて形成した）カバー１３５を備えている。   a) The electronic control device of Embodiment 6 will be described with reference to FIG. As shown in FIG. 7, the electronic control device 130 of the present embodiment includes a printed circuit board 131, a mold component 133, and a cover 135 (formed by press working) similar to those of the fifth embodiment.

また、本実施例では、実施例４の様に、カバー１３５の突出部１３７の先端面１３７ａに、多数の凸部１３９を設けて、先端面１３７ａを凹凸形状とするとともに、プリント基板１３１の反搭載面１３１ｂの熱伝導薄膜層１４１上にも、多数の凸部１４３を設けて、熱伝導薄膜層１４１の表面を凹凸形状としている。   Further, in the present embodiment, as in the fourth embodiment, a large number of convex portions 139 are provided on the front end surface 137a of the protruding portion 137 of the cover 135 so that the front end surface 137a has an uneven shape, and the printed circuit board 131 is counteracted. A large number of convex portions 143 are also provided on the heat conductive thin film layer 141 on the mounting surface 131b so that the surface of the heat conductive thin film layer 141 has an uneven shape.

また、突出部１３７の先端面１３７ａの凸及び凹と熱伝導薄膜層１４１の凹及び凸が、それぞれ対応するように形成され、凹凸形状の突出部１３７の先端面１３７ａと熱伝導薄膜層１４１の表面との間に、熱伝導材１４５が配置されている。   In addition, the projections and depressions of the tip surface 137a of the protrusion 137 and the recesses and projections of the heat conductive thin film layer 141 are formed so as to correspond to each other. A heat conductive material 145 is arranged between the surface.

尚、突起部１３７の凸部１３９は、突出部１３７（従ってカバー１３５）と一体に成形されたものであり、プリント基板１３１の反搭載面１３１ｂ側の凸部１４３は、はんだ付けにより形成されたものである。   The protrusion 139 of the protrusion 137 is formed integrally with the protrusion 137 (and thus the cover 135), and the protrusion 143 on the side opposite to the mounting surface 131b of the printed circuit board 131 is formed by soldering. Is.

ｂ）本実施例においても、実施例４と同様な効果を奏する。   b) In the present embodiment, the same effects as in the fourth embodiment are obtained.

また、突起部１３７の凸部１３９は、突出部１３７（従ってカバー１３５）と一体に成形され、プリント基板１３１の反搭載面１３１ｂ側の凸部１４３は、はんだ付けにより形成されるので、どちらも、本来必要な作業と材料により実施することができる。つまり、追加コストを必要とせずに、放熱能力を改善できるという効果がある。   Further, the convex portion 139 of the protruding portion 137 is formed integrally with the protruding portion 137 (and therefore the cover 135), and the convex portion 143 on the side opposite to the mounting surface 131b of the printed circuit board 131 is formed by soldering. It can be carried out with the necessary work and materials. In other words, there is an effect that the heat dissipation capability can be improved without requiring an additional cost.

（実施例７）
次に、実施例７の電子制御装置について説明するが、実施例１と同様な内容の説明は省略する。 (Example 7)
Next, an electronic control device according to a seventh embodiment will be described, but a description of the same contents as those of the first embodiment will be omitted.

ａ）実施例７の電子制御装置を、図８に基づいて説明する。図８に示す様に、本実施例の電子制御装置１５０は、実施例１と同様なプリント基板１５１及びモールド部品１５３等を備えている。特に、本実施例では、カバー１５５に突出部を形成せず、カバー１５５とプリント基板１５１の反搭載面１５１ｂとの間に、固体のＳＭＤ（表面実装部材）である熱伝導部材１５７を配置するとともに、熱伝導部材１５７とカバー１５５との間に熱伝導材１５９を配置したものである。   a) The electronic control unit of Example 7 will be described with reference to FIG. As shown in FIG. 8, the electronic control device 150 of this embodiment includes a printed circuit board 151 and a mold component 153 that are the same as those of the first embodiment. In particular, in this embodiment, no protrusion is formed on the cover 155, and a heat conducting member 157 that is a solid SMD (surface mount member) is disposed between the cover 155 and the non-mounting surface 151b of the printed circuit board 151. In addition, a heat conductive material 159 is disposed between the heat conductive member 157 and the cover 155.

尚、固体の熱伝導部材としては、熱伝導率が例えば基板材料のエポキシ樹脂等の樹脂より高い金属材料を使用できるが、この熱伝導率としては、一般的な合金や金属材料から２０〜４００Ｗ／ｍ・Ｋのものを採用できる。   In addition, although a metal material whose heat conductivity is higher than resin, such as an epoxy resin of a board | substrate material, can be used as a solid heat conductive member, as this heat conductivity, it is 20-400W from a general alloy and metal material. / M · K can be used.

熱伝導部材１５７は、プリント基板１５１の反搭載面１５１ｂ上に（電子部品１６１の搭載位置に対応して）形成された熱伝導薄膜層１６１に、はんだ１６３により接合されている。また、そのカバー１５５側の先端面１５７ａには、多数の凸部１６５を設けて、先端面１５７ａを凹凸形状としている。   The heat conductive member 157 is joined to the heat conductive thin film layer 161 formed on the non-mounting surface 151 b of the printed board 151 (corresponding to the mounting position of the electronic component 161) by solder 163. The front end surface 157a on the cover 155 side is provided with a large number of convex portions 165 so that the front end surface 157a has an uneven shape.

一方、熱伝導部材１５７と対向するカバー１５５の表面にも、同様に、多数の凸部１６７を設けて、カバー１５５表面を凹凸形状としている。尚、熱伝導部材１５７の凸部１６５は、熱伝導部材１５７と一体に（又ははんだ付けにより）成形されたものであり、カバー１５５側の凸部１６７もカバー１５５と一体に成形されたものである。   On the other hand, the surface of the cover 155 facing the heat conducting member 157 is similarly provided with a large number of convex portions 167 so that the surface of the cover 155 has an uneven shape. The convex portion 165 of the heat conducting member 157 is formed integrally with the heat conducting member 157 (or by soldering), and the convex portion 167 on the cover 155 side is also formed integrally with the cover 155. is there.

ｂ）本実施例においても、実施例１と同様な効果を奏するとともに、熱伝導材１５９を上下の凹凸形状の表面により挟み込むので、熱を効率よく熱伝導部材１５７からカバー１５５側に伝えることができるので、周辺部品の加熱を最小限に抑えることができる。   b) In the present embodiment, the same effects as in the first embodiment are obtained, and the heat conductive material 159 is sandwiched between the upper and lower uneven surfaces, so that heat can be efficiently transferred from the heat conductive member 157 to the cover 155 side. As a result, heating of peripheral components can be minimized.

また、熱伝導材１５９を上下の凹凸形状の表面により挟み込むので、実施例４と同様に、放熱性等に優れているという利点がある。   In addition, since the heat conductive material 159 is sandwiched between the upper and lower concave and convex surfaces, there is an advantage that heat dissipation is excellent as in the fourth embodiment.

（実施例８）
次に、実施例８の電子制御装置について説明するが、実施例５と同様な内容の説明は省略する。 (Example 8)
Next, although the electronic control apparatus of Example 8 is demonstrated, description of the content similar to Example 5 is abbreviate | omitted.

ａ）まず、実施例８の電子制御装置を、図９に基づいて説明する。図９に示す様に、本実施例の電子制御装置１７０は、実施例５と同様に、モールド部品１７１は、ケース１７３側ではなくカバー１７５側に配置されている。   a) First, an electronic control device according to an eighth embodiment will be described with reference to FIG. As shown in FIG. 9, in the electronic control device 170 according to the present embodiment, as in the fifth embodiment, the molded component 171 is disposed on the cover 175 side, not on the case 173 side.

つまり、本実施例では、放熱部材１７７は、プリント基板１７９側ではなく、カバー１７５側に配置されており、この放熱部材１７７とカバー１７５の突出部１８１との間に、熱伝導材１８３が配置されている。特に本実施例では、カバー１７５の突出部１８１の先端面１８１ａには、多数の凸部１８５が設けられ、それにより、先端面１８１ａが凹凸形状とされている。   That is, in the present embodiment, the heat radiating member 177 is disposed not on the printed board 179 side but on the cover 175 side, and the heat conductive material 183 is disposed between the heat radiating member 177 and the protruding portion 181 of the cover 175. Has been. In particular, in this embodiment, the front end surface 181a of the protrusion 181 of the cover 175 is provided with a large number of convex portions 185, whereby the front end surface 181a has an uneven shape.

尚、この凸部１８５は、カバー１７５と一体に成形される。   The convex portion 185 is formed integrally with the cover 175.

ｂ）本実施例は、実施例５と同様に、モールド部品１７１の本体部分１７１ａが、直接にプリント基板１７９に接していないので、プリント基板１７９側に熱が伝わり難く、一層高い熱散逸性を有している。   b) Similar to the fifth embodiment, the main body portion 171a of the mold component 171 is not in direct contact with the printed circuit board 179, and thus heat is not easily transmitted to the printed circuit board 179 side. Have.

また、突出部１８１の先端面１８１ａには、多数の凸部１８５が形成されているので、接触面積が広く、放熱効率が高いという利点がある。尚、本実施例では、突起部１８１側に凸部１８５を設けたが、放熱部材１７７側に同様な凸部を多数設けてもよい。   Further, since a large number of convex portions 185 are formed on the tip end surface 181a of the protruding portion 181, there are advantages that the contact area is wide and the heat radiation efficiency is high. In this embodiment, the convex portion 185 is provided on the protruding portion 181 side, but many similar convex portions may be provided on the heat radiating member 177 side.

（実施例９）
次に、実施例９の電子制御装置について説明するが、実施例４と同様な内容の説明は省略する。 Example 9
Next, an electronic control device according to a ninth embodiment will be described, but description of the same contents as those of the fourth embodiment will be omitted.

ａ）まず、実施例９の電子制御装置を、図１０に基づいて説明する。図１０に示す様に、本実施例の電子制御装置１９０は、実施例４と同様な、モールド部品１９１、プリント基板１９３及び（突出部１９５を有する）カバー１９７などを備えている。   a) First, the electronic control unit of Embodiment 9 will be described with reference to FIG. As shown in FIG. 10, the electronic control device 190 according to the present embodiment includes a mold component 191, a printed board 193, a cover 197 (having a protruding portion 195), and the like, similar to the fourth embodiment.

特に本実施例では、プリント基板１９３の反搭載面１９３ｂ側に（電子部品１９９の搭載位置に対向して）形成された熱伝導薄膜層２０１を備えるとともに、その熱伝導薄膜層２０１の表面に、熱伝導材２０３の外周を囲むように、カバー１９７の突出部１９５側に向かって突出する移動防止部２０５を備えている。   In particular, in this embodiment, the heat conductive thin film layer 201 formed on the side opposite to the mounting surface 193b of the printed circuit board 193 (opposite the mounting position of the electronic component 199) is provided, and on the surface of the heat conductive thin film layer 201, A movement preventing portion 205 that protrudes toward the protruding portion 195 of the cover 197 is provided so as to surround the outer periphery of the heat conducting material 203.

この移動防止部２０５は、はんだにより形成されており、熱伝導薄膜層２０５の外周に沿って（従って突起部１９５の外周と同形状）、四角枠状に形成されている。   The movement preventing portion 205 is formed of solder, and is formed in a rectangular frame shape along the outer periphery of the heat conductive thin film layer 205 (therefore, the same shape as the outer periphery of the protruding portion 195).

ｂ）本実施例では、熱伝導材２０３の周囲に移動防止部２０５が形成されているので、熱伝導材２０３が流れ出ることを防止することができる。   b) In this embodiment, since the movement preventing portion 205 is formed around the heat conducting material 203, it is possible to prevent the heat conducting material 203 from flowing out.

つまり、熱伝導材２０３として、粘性のある半流体状のものを用いる場合に、熱伝導材２０３を薄く塗りつける必要がなく、例えば熱伝導材２０３を、配置する空間の容積より多めにポッティングし、プリント基板１９３とカバー１９７とを組み合わせればよい。即ち、この組み合わせの際には、熱伝導材２０３が外部に流れ出す前に、この形状で囲まれた範囲に充填された後に、余分な分だけ押し出されるため、簡単な作業で確実な塗布が可能になる。   In other words, when a viscous semi-fluid material is used as the heat conducting material 203, it is not necessary to apply the heat conducting material 203 thinly. For example, the heat conducting material 203 is potted more than the volume of the space to be arranged, What is necessary is just to combine the printed circuit board 193 and the cover 197. That is, in this combination, before the heat conductive material 203 flows out to the outside, after being filled in the range surrounded by this shape, it is pushed out by an excessive amount, so that reliable application is possible with simple operations. become.

更には、電子制御装置１９０が、縦方向に配置された場合でも、移動防止部２０５が熱伝導材２０３の移動を防止するので、熱伝導材２０３が流出することがない。   Furthermore, even when the electronic control unit 190 is arranged in the vertical direction, the movement preventing unit 205 prevents the heat conducting material 203 from moving, so that the heat conducting material 203 does not flow out.

（実施例１０）
次に、実施例１０の電子制御装置について説明するが、実施例６と同様な内容の説明は省略する。 (Example 10)
Next, although the electronic control apparatus of Example 10 is demonstrated, description of the content similar to Example 6 is abbreviate | omitted.

ａ）まず、実施例１０の電子制御装置を、図１１に基づいて説明する。図１１に示す様に、本実施例の電子制御装置２１０は、実施例７とほぼ同様に、モールド部品２１１及びプリント基板２１３等を備えている。尚、プリント基板２１３にＶＩＡホール２１５が設けられている点は異なる。   a) First, the electronic control unit of Embodiment 10 will be described with reference to FIG. As shown in FIG. 11, the electronic control device 210 according to the present embodiment includes a molded component 211, a printed circuit board 213, and the like, as in the seventh embodiment. The printed board 213 is different in that a VIA hole 215 is provided.

本実施例では、カバー２１６に突出部を形成せず、カバー２１６とプリント基板２１３の反搭載面２１３ｂとの間に、固体のＳＭＤ（表面実装部材）である熱伝導部材２１７を配置するとともに、熱伝導部材２１７とカバー２１６との間に熱伝導材２１９を配置している。   In the present embodiment, a protrusion is not formed on the cover 216, and a heat conducting member 217 that is a solid SMD (surface mounting member) is disposed between the cover 216 and the non-mounting surface 213b of the printed circuit board 213, and A heat conductive material 219 is disposed between the heat conductive member 217 and the cover 216.

熱伝導部材２１７は、プリント基板２１３の反搭載面２１３ｂ上に（電子部品２２１の搭載位置に対応して）形成された熱伝導薄膜層２２３に、はんだ２２５により接合されている。また、熱伝導部材２１７の先端面２１７ａには、熱伝導材２１９の周囲を囲む様に移動防止部２２７が設けられている。   The heat conductive member 217 is joined to the heat conductive thin film layer 223 formed on the non-mounting surface 213b of the printed board 213 (corresponding to the mounting position of the electronic component 221) by solder 225. Further, a movement preventing portion 227 is provided on the front end surface 217 a of the heat conducting member 217 so as to surround the periphery of the heat conducting material 219.

つまり、移動防止部２２７は、熱伝導部材２１７の周囲に沿って、熱伝導部材２１７側からカバー２１６側に向かって突出するように枠状に設けられた凸部である。尚、移動防止部２２７は、熱伝導部材２１７と一体に成形されたものである。   That is, the movement prevention unit 227 is a convex portion provided in a frame shape so as to protrude from the heat conductive member 217 side toward the cover 216 side along the periphery of the heat conductive member 217. The movement preventing unit 227 is formed integrally with the heat conducting member 217.

ｂ）本実施例においても、実施例７と同様に、熱伝導部材２１７を配置することにより、高い放熱特性を得ることができる。特に本実施例では、熱伝導部材２１７側に移動防止部２２７を設けているので、熱伝導部材２１７の配置を自由に変更しても、カバー２１６の設計を変更することなく共通のカバー２１６を使用することができる（即ち標準化が可能である）。よって、多様な製品に、同一の筐体を使用できるので、コストダウンに大きく寄与することができる。   b) In the present embodiment, similarly to the seventh embodiment, by disposing the heat conducting member 217, high heat dissipation characteristics can be obtained. In particular, in this embodiment, since the movement preventing portion 227 is provided on the heat conducting member 217 side, the common cover 216 can be formed without changing the design of the cover 216 even if the arrangement of the heat conducting member 217 is freely changed. Can be used (ie standardized). Therefore, the same housing can be used for various products, which can greatly contribute to cost reduction.

尚、本実施例以外に、例えばＶＩＡホール２１５を設けずに、基板内部の電子部品２２１の搭載位置に対応する箇所に、熱伝導薄膜層を設けてもよく、基板表面や基板内部の熱伝導薄膜層を熱的に分離してもよい。尚、本発明は上記した実施例になんら限定されるものではなく、種々の態様で実施しうることはいうまでもない。   In addition to this embodiment, for example, without providing the VIA hole 215, a heat conductive thin film layer may be provided at a location corresponding to the mounting position of the electronic component 221 inside the substrate, and the heat conduction inside the substrate surface or inside the substrate may be provided. The thin film layer may be thermally separated. Needless to say, the present invention is not limited to the above-described embodiments, and can be implemented in various modes.

例えば、前記各実施例では、筐体をケース及びカバーにより構成したが、それ以外の第３の部材を組み合わせてもよく、ケース及びカバーは、同様な大きさでもよい。   For example, in each of the embodiments described above, the casing is configured by a case and a cover, but a third member other than that may be combined, and the case and the cover may have the same size.

１、３１、７０、９０、１１０、１３０、１５０、１７０、１９０、２１０・・電子制御装置（ＥＣＵ）
３、３９、１１１、１６１、１９９、２２１・・電子部品
５、３３、７９、９９、１１５、１３１、１５１、１７９、１９３、２１３・・プリント基板
７・・筐体
９、３５・・ケース
１３、３７、７１、９１、１１９、１３５、１５５、１７５、１９７、２１６・・カバー
２７、５９、７３、９３、１２３、１３７、１８１、１９５・・突出部
７７、８１、１２７、２０５、２２７・・移動防止部
２５、５５、９７、１１３、１３３、１５３、１７１、１９１、２１１・・モールド部品
１７ａ、１７ｂ、１７ｃ、４１ａ、４１ｂ、１４１、１６１、２０１、２２３・・熱伝導薄膜層
２９、６１、１０５、１２５、１４５、１５９、１８３、２０３、２１９・・熱伝導材
１５７、２１７・・熱伝導部材 1, 31, 70, 90, 110, 130, 150, 170, 190, 210 .. Electronic control unit (ECU)
3, 39, 111, 161, 199, 221 .. Electronic parts 5, 33, 79, 99, 115, 131, 151, 179, 193, 213 .. Printed circuit board 7 .. Case 9, 35 .. Case 13 37, 71, 91, 119, 135, 155, 175, 197, 216 ... Cover 27, 59, 73, 93, 123, 137, 181, 195 ... Projection 77, 81, 127, 205, 227・ Move prevention part 25, 55, 97, 113, 133, 153, 171, 191, 211 ・ ・ Mold parts 17a, 17b, 17c, 41a, 41b, 141, 161, 201, 223 ・ ・ Heat conductive thin film layer 29, 61, 105, 125, 145, 159, 183, 203, 219 ... Heat conducting material 157, 217 ... Heat conducting member

Claims (5)

発熱する電子部品（３、３９、１９９）が所定領域に搭載された樹脂製の材料からなる基板（５、３３、７９、９９、１３１、１９３）、
開口部（１１）を有する箱状のケース（９、３５）と、当該ケースの開口部を閉塞するとともにケースよりも底の浅いカバー（１３、３７、７１、９１、１３５、１９７）とから構成され、前記基板を収容する筐体（７）、
前記筐体内において前記カバー側に設けられ、前記基板の前記所定領域に対応する突出面（２７ａ、５９ａ、７３ａ、９３ａ、１３７ａ）を有して前記所定領域に向けて突出し、前記カバーと一体に形成された突出部（２７、５９、７３、９３、１３７、１９５）、
前記突出部の前記突出面と前記所定領域において前記突出面に近接する前記基板との間の隙間に配置された柔軟性を有する熱伝導材（２９、６１、１０５、１４５、２０３）とを有し、
前記基板の前記カバー側の反搭載面（５ｂ、３３ｂ、７９ｂ、９９ｂ、１３１ｂ、１９３ｂ）と前記カバーの外周に設けられた結合面（１３ａ）とが同一平面で直接押圧されて固定されることにより、前記突出部の前記突出面が前記基板の前記カバー側の反搭載面と平行になっているとともに、前記熱伝導材の配置される前記隙間の間隔の寸法が、前記カバーの底部（１３ｂ、３７ａ）から前記結合面までの寸法と前記底部から前記突出面までの寸法との差により定まるようになっており、
前記熱伝導材は、柔軟性を有して押圧により形状が変形しており、
さらに、前記電子部品と一体にモールドされた放熱部材（５１）を備え、
前記放熱部材は、前記電子部品と前記基板との間に配置されていることを特徴とする電子制御装置。 A substrate (5, 33, 79, 99, 131, 193) made of a resin material on which heat-generating electronic components (3, 39, 199) are mounted in a predetermined area;
A box-shaped case (9, 35) having an opening (11) and a cover (13, 37, 71, 91, 135, 197) that closes the opening of the case and has a shallower bottom than the case A housing (7) for accommodating the substrate,
Provided on the cover side in the housing, has a protruding surface (27a, 59a, 73a, 93a, 137a) corresponding to the predetermined area of the substrate, protrudes toward the predetermined area, and is integrated with the cover Formed protrusions (27, 59, 73, 93, 137, 195),
A flexible heat conductive material (29, 61, 105, 145, 203) disposed in a gap between the protruding surface of the protruding portion and the substrate adjacent to the protruding surface in the predetermined region; And
An anti-mounting surface (5b, 33b, 79b, 99b, 131b, 193b) on the cover side of the substrate and a coupling surface (13a) provided on the outer periphery of the cover are directly pressed and fixed on the same plane. Accordingly, the projecting surface of the projecting portion is parallel to the anti-mounting surface of the substrate on the cover side, and the size of the gap between the thermal conductive materials is set to the bottom portion of the cover (13b). 37a) to the coupling surface and the dimension from the bottom to the protruding surface,
The heat conducting material has flexibility and is deformed by pressing,
Furthermore, a heat radiating member (51) molded integrally with the electronic component is provided,
The electronic control device according to claim 1, wherein the heat dissipating member is disposed between the electronic component and the substrate. 前記放熱部材は、外部に露出するようにモールドされており、かつ、前記基板に接していることを特徴とする請求項１に記載の電子制御装置。   The electronic control device according to claim 1, wherein the heat dissipation member is molded so as to be exposed to the outside and is in contact with the substrate. 前記放熱部材において外部に露出した放熱面は、はんだを介して前記基板に接続されていることを特徴とする請求項２に記載の電子制御装置。   The electronic control device according to claim 2, wherein a heat radiating surface exposed to the outside of the heat radiating member is connected to the substrate via a solder. 前記突出部の突出面に対向する対向面は、前記基板の前記電子部品の搭載面と反対側の前記基板の面に配置された熱伝導薄膜層であることを特徴とする請求項１〜３のいずれかに記載の電子制御装置。   The opposing surface opposite to the protruding surface of the protruding portion is a thermally conductive thin film layer disposed on the surface of the substrate opposite to the mounting surface of the electronic component of the substrate. The electronic control apparatus in any one of. 前記基板は前記ケースと前記カバーとによって挟まれた状態でネジにより前記筐体に固定されていることを特徴とする請求項１〜４のいずれかに記載の電子制御装置。 The electronic control device according to claim 1, wherein the substrate is fixed to the housing with a screw in a state of being sandwiched between the case and the cover .
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