JP2012019102A - 信号伝送回路及び多層基板 - Google Patents
信号伝送回路及び多層基板 Download PDFInfo
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- JP2012019102A JP2012019102A JP2010156116A JP2010156116A JP2012019102A JP 2012019102 A JP2012019102 A JP 2012019102A JP 2010156116 A JP2010156116 A JP 2010156116A JP 2010156116 A JP2010156116 A JP 2010156116A JP 2012019102 A JP2012019102 A JP 2012019102A
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- Prior art keywords
- multilayer substrate
- ground
- semiconductor
- inner layer
- signal transmission
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【課題】多層基板に半導体を取り付けた場合であっても、良好な回路特性を維持することが可能な信号伝送回路及びこの回路に用いられる多層基板を提供する。
【解決手段】信号伝送回路は、半導体、多層基板及び放熱板グランドを具備する。多層基板は、前記半導体を取り付けるための孔が形成される多層基板であって、前記半導体と接続する伝送路と、前記多層基板の内層に位置する導体層に形成される内層グランドと、前記孔の内壁のうち前記内層グランドから前記多層基板の一方の表面までの内壁にメッキ加工してなるメッキ部と、前記表面に位置する導体層に形成され、前記内層グランドと前記メッキ部により接続する外層グランドとを備える。放熱板グランドは、前記外層グランドに取り付けられ、前記半導体を接地させる。
【選択図】図1
Description
20…多層基板
21…外層GND
22−1,22−2…誘電体層
23…内層GND
24,24−2,24−3,24−4,24−5…伝送路
25…BVH
26…メッキ部
27…貫通スルーホール
28…IVH
30…半導体
Claims (6)
- 信号の入出力用の第1の接続端子とグランドに接続可能な第2の接続端子とを備える半導体と、
前記半導体を取り付けるための孔が形成される多層基板であって、前記第1の接続端子と接続する伝送路と、前記多層基板の内層に位置する導体層に形成される内層グランドと、前記孔の内壁のうち前記内層グランドから前記多層基板の一方の表面までの内壁にメッキ加工してなるメッキ部と、前記表面に位置する導体層に形成され、前記内層グランドと前記メッキ部により接続する外層グランドとを備える多層基板と、
前記外層グランドに取り付けられ、前記第2の接続端子が接続される放熱板グランドと
を具備することを特徴とする信号伝送回路。 - 前記内層グランドと、前記外層グランドとは、複数のBVH(Blind Via Hale)によりさらに接続されることを特徴とする請求項1記載の信号伝送回路。
- 前記半導体には、大電力かつ高周波の信号を増幅することを特徴とする請求項1記載の信号伝送回路。
- 半導体を取り付けるための孔が形成される多層基板において、
前記半導体の接続端子と接続する伝送路と、
前記多層基板の内層に位置する導体層に形成される内層グランドと、
前記孔の内壁のうち前記内層グランドから前記多層基板の一方の表面までの内壁にメッキ加工してなるメッキ部と、
前記表面に位置する導体層に形成され、前記内層グランドと前記メッキ部により接続する外層グランドと
を具備することを特徴とする多層基板。 - 前記内層グランドと、前記外層グランドとは、複数のBVH(Blind Via Hale)によりさらに接続されることを特徴とする請求項4記載の多層基板。
- 前記半導体には、大電力かつ高周波の信号を増幅することを特徴とする請求項4記載の多層基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010156116A JP5740107B2 (ja) | 2010-07-08 | 2010-07-08 | 信号伝送回路及び多層基板 |
EP11173312A EP2405722A1 (en) | 2010-07-08 | 2011-07-08 | Signal transmission circuit and multilayer board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010156116A JP5740107B2 (ja) | 2010-07-08 | 2010-07-08 | 信号伝送回路及び多層基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012019102A true JP2012019102A (ja) | 2012-01-26 |
JP5740107B2 JP5740107B2 (ja) | 2015-06-24 |
Family
ID=44461966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010156116A Expired - Fee Related JP5740107B2 (ja) | 2010-07-08 | 2010-07-08 | 信号伝送回路及び多層基板 |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2405722A1 (ja) |
JP (1) | JP5740107B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9647134B2 (en) | 2013-05-21 | 2017-05-09 | Japan Display Inc. | Thin-film transistor and method for manufacturing the same |
KR101892456B1 (ko) * | 2017-08-30 | 2018-09-03 | 주식회사 디에이피 | 차량용 레이더 안테나 피시비 제조 방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5765174B2 (ja) * | 2011-09-30 | 2015-08-19 | 富士通株式会社 | 電子装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669662A (ja) * | 1992-08-13 | 1994-03-11 | Matsushita Electric Works Ltd | 多層プリント配線板 |
JPH11289029A (ja) * | 1998-04-02 | 1999-10-19 | Fujitsu Ltd | 半導体装置のプラスチックパッケージ |
JP2006222159A (ja) * | 2005-02-08 | 2006-08-24 | Mitsubishi Electric Corp | 高出力増幅回路 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6818477B2 (en) * | 2001-11-26 | 2004-11-16 | Powerwave Technologies, Inc. | Method of mounting a component in an edge-plated hole formed in a printed circuit board |
US6713792B2 (en) * | 2002-01-30 | 2004-03-30 | Anaren Microwave, Inc. | Integrated circuit heat sink device including through hole to facilitate communication |
US20030213619A1 (en) * | 2002-05-14 | 2003-11-20 | Denzene Quentin S. | Ground discontinuity improvement in RF device matching |
CN101803184A (zh) * | 2007-09-21 | 2010-08-11 | 日本电气株式会社 | 大功率放大器,无线发射器,无线收发器以及用于安装大功率放大器的方法 |
-
2010
- 2010-07-08 JP JP2010156116A patent/JP5740107B2/ja not_active Expired - Fee Related
-
2011
- 2011-07-08 EP EP11173312A patent/EP2405722A1/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669662A (ja) * | 1992-08-13 | 1994-03-11 | Matsushita Electric Works Ltd | 多層プリント配線板 |
JPH11289029A (ja) * | 1998-04-02 | 1999-10-19 | Fujitsu Ltd | 半導体装置のプラスチックパッケージ |
JP2006222159A (ja) * | 2005-02-08 | 2006-08-24 | Mitsubishi Electric Corp | 高出力増幅回路 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9647134B2 (en) | 2013-05-21 | 2017-05-09 | Japan Display Inc. | Thin-film transistor and method for manufacturing the same |
KR101892456B1 (ko) * | 2017-08-30 | 2018-09-03 | 주식회사 디에이피 | 차량용 레이더 안테나 피시비 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
EP2405722A1 (en) | 2012-01-11 |
JP5740107B2 (ja) | 2015-06-24 |
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