JP2012004566A - 二段階ドーピングプロファイルを備えたパワー半導体構成要素 - Google Patents
二段階ドーピングプロファイルを備えたパワー半導体構成要素 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 230000035515 penetration Effects 0.000 claims abstract description 52
- 238000002161 passivation Methods 0.000 claims description 24
- 239000002019 doping agent Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- NHWNVPNZGGXQQV-UHFFFAOYSA-J [Si+4].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O Chemical compound [Si+4].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O NHWNVPNZGGXQQV-UHFFFAOYSA-J 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 229920005591 polysilicon Polymers 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
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Abstract
【解決手段】第1の基本導電率を備えたベース本体および第2の導電率を備えた井戸状領域を有するpn接合を有するパワー半導体構成要素におけるpn接合は、ベース本体の中央に水平に配置され、第1の二段階ドーピングプロファイルを有し、かつ第1の主面からベース本体の中へと第1の浸透深さを有する。さらに、このパワー半導体構成要素は、パワー半導体構成要素の井戸状領域とエッジとの間に配置されたエッジ構造であって、単一段階ドーピングプロファイル、第2の導電率、および第2の浸透深さを備えた複数のフィールドリングを含むエッジ構造を有し、第1の浸透深さは、第2の浸透深さの50%以下である。
【選択図】図1
Description
2 ベース本体
4 pn接合
6 第1の主面
8 第2の主面
10 井戸状領域
18 金属コンタクト層
20 フィールドリング
20a 第1のフィールドリング
32 第1のパッシベーション層
34 第2のパッシベーション層
40 導電性モールド
40a 第1の導電性モールド
42 第1の本体要素
44 第2の本体要素
100 第1の二段階ドーピングプロファイル
102 合計プロファイルの浸透深さ
122 第1の浸透深さ
130 第1のドーピングプロファイルのレベル
142 第2の浸透深さ
200 第2のドーピングプロファイル
202 第2の浸透深さ
500 第2の二段階ドーピングプロファイル
502 浸透深さ
520 第1のプロファイル要素
522 第3の浸透深さ
540 第2のプロファイル要素
542 第4の浸透深さ
Claims (15)
- 少なくとも1つの機能的pn接合(4)を有するパワー半導体構成要素(1)であって、
第1の基本導電率を備えたベース本体(2)と、
第2の導電率を備え、前記ベース本体(2)の中央に水平配置され、第1の二段階ドーピングプロファイル(100)を有し、かつ第1の主面(6)から前記ベース本体(2)への第1の浸透深さ(102)を有する井戸状領域(10)と、
前記井戸状領域(10)と前記パワー半導体構成要素(1)のエッジとの間に配置されたエッジ構造であって、単一段階ドーピングプロファイル、第2の導電率および第2の浸透深さ(202)を備え、前記ベース本体(2)に配置された複数のフィールドリング(20)、これらフィールドリング(20)に付設されたフィールドプレート構造(40)、並びに前記エッジ構造用のパッシベーション(30)を備えて成るエッジ構造と、
を有し、
前記第1の浸透深さ(102)が、前記第2の浸透深さ(202)の50%以下であり、
各フィールドリング(20)に、前記フィールドリング(20)の中央に水平配置された第1の本体要素(42)を有するフィールドプレートとして、導電性モールド(40)が付設され、これら第1の本体要素(42)の間に、第1のパッシベーション層(32)が配置されて、
前記ベース本体(2)から側方に離間され、かつ前記パワー半導体構成要素(1)の前記エッジの方向にて前記付設されたフィールドリング(20)に水平に突き出る少なくとも1つの第2の本体要素(44)を有する、パワー半導体構成要素(1)。 - 第2の本体要素(44)が、前記パワー半導体構成要素(1)の中央の方向にて水平に、前記付設されたフィールドリング(20)を突き出る、請求項1に記載のパワー半導体構成要素。
- 前記井戸状領域(10)における前記第1の主面(6)での第2のドーパント原子の濃度が、1017〜1020cm−2である、請求項1に記載のパワー半導体構成要素。
- 前記井戸状領域(10)の前記二段階ドーピングプロファイル(100)のレベル(130)が、前記第1の浸透深さ(102)の10%〜40%の範囲にあるように構成されている、請求項1に記載のパワー半導体構成要素。
- 第2の導電率の前記井戸状領域(10)の表面上に、金属コンタクト層(18)が配置されている、請求項1に記載のパワー半導体構成要素。
- 前記第1のパッシベーション層(32)の上方に、第2のパッシベーション層(34)が配置されている、請求項1に記載のパワー半導体構成要素。
- 前記第1のパッシベーション層(32)がシリコン酸化物であり、前記第2のパッシベーション層(34)がポリイミドである、請求項6に記載のパワー半導体構成要素。
- 前記第1のパッシベーション層(32)と前記第2のパッシベーション層(34)の間に、シリコン亜硝酸塩から成る層が配置されている、請求項7に記載のパワー半導体構成要素。
- 前記第2のパッシベーション層(34)が、前記導電性モールド(40)を完全に覆う、請求項6に記載のパワー半導体構成要素。
- 前記導電性モールド(40)およびその本体要素(42、44)が、金属またはドープされたポリシリコンを備えて構成される、請求項1に記載のパワー半導体構成要素。
- 前記ベース本体(2)の内部に延び、第3の浸透深さ(502)を有する第1の導電率の第2の二段階ドーピングプロファイル(500)が前記第2の主面(8)から形成され、この第2のドーピングプロファイル(500)の第1のドーピングの前記第3の浸透深さ(502)が、前記ベース本体(2)の横方向範囲の半分の領域にある、請求項1に記載のパワー半導体構成要素。
- 前記第2のプロファイル要素(540)が第4の浸透深さ(542)を有し、前記第2の二段階ドーピングプロファイル(500)における前記第2のプロファイル要素(540)の前記第4の浸透深さ(542)が、前記第1のプロファイル要素(520)の前記第3の浸透深さ(522)の40%〜70%、好ましくは50%〜60%である、請求項11に記載のパワー半導体構成要素。
- 前記第2の二段階ドーピングプロファイル(500)における前記第2のプロファイル要素(540)の前記第4の浸透深さ(542)が、前記ベース本体(2)の横方向範囲の少なくとも20%、好ましくは少なくとも30%である、請求項12に記載のパワー半導体構成要素。
- 前記第1のプロファイル要素(520)によって生成された、前記第1の導電率を備えた前記第2の主面(8)でのドーパント原子の濃度が、前記第2のプロファイル要素(540)によって生成された濃度より少なくとも2桁小さい、請求項11に記載のパワー半導体構成要素。
- 前記第2の主面(8)でのドーパント原子の濃度が、1018〜1021cm−2である、請求項14に記載のパワー半導体構成要素。
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WO2018163872A1 (ja) * | 2017-03-09 | 2018-09-13 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および電子機器 |
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DE102014005879B4 (de) * | 2014-04-16 | 2021-12-16 | Infineon Technologies Ag | Vertikale Halbleitervorrichtung |
DE102018113506B4 (de) * | 2018-06-06 | 2021-12-30 | Semikron Elektronik Gmbh & Co. Kg | Volumentleitfähiges Leistungshalbleiterbauelement mit Homogenisierungsstruktur |
CN109326637B (zh) * | 2018-10-17 | 2021-08-24 | 杭州电子科技大学 | 一种高压功率器件的阶梯结终端扩展结构 |
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JP2008166305A (ja) * | 2006-12-26 | 2008-07-17 | Toyota Motor Corp | 半導体装置 |
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WO2018163872A1 (ja) * | 2017-03-09 | 2018-09-13 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および電子機器 |
US10879348B2 (en) | 2017-03-09 | 2020-12-29 | Sony Semiconductor Solutions Corporation | Semiconductor device and electronic apparatus |
Also Published As
Publication number | Publication date |
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KR101801390B1 (ko) | 2017-11-24 |
CN102290433B (zh) | 2016-04-13 |
DE102010024257B4 (de) | 2020-04-30 |
CN102290433A (zh) | 2011-12-21 |
JP5825866B2 (ja) | 2015-12-02 |
DE102010024257A1 (de) | 2011-12-22 |
EP2398057B1 (de) | 2019-07-24 |
EP2398057A3 (de) | 2013-05-22 |
US20120007223A1 (en) | 2012-01-12 |
EP2398057B8 (de) | 2019-11-20 |
KR20110138174A (ko) | 2011-12-26 |
BRPI1102975A2 (pt) | 2015-03-31 |
US8350366B2 (en) | 2013-01-08 |
EP2398057A2 (de) | 2011-12-21 |
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